●
Supplier : Samsung Electro-Mechanics
●
Samsung P/N :
CL21B474KBFVPNE
●
Product : Multi-Layer Ceramic Capacitor
●
Description :
CAP, 470
㎋
, 50V, ±10%, X7R, 0805
●
AEC-Q200 Qualified
A. Dimension
● Dimension
B. Samsung Part Number
CL 21 B K B F V P N E
①②③ ⑤⑥⑦⑧⑨⑩⑪
①
Series Samsung Multi-Layer Ceramic Capacitor
②
Size (inch code) L : 2.00±0.10
㎜
W :
1.25±0.10
㎜
③
Dielectric X7R
⑧
Inner Electrode Ni
④
Capacitance Termination Soft Termination
⑤
Capacitance ±10% Plating Sn 100% (Pb Free)
Tolerance
⑨
Product Automotive
⑥
Rated Voltage ⑩Special Code Normal
⑦
Thickness 1.25±0.10
㎜
⑪
Packaging Embossed Type, 7" Reel
C. Reliability Test and Judgement Condition
Test Items
High Temperature Appearance : No abnormal exterior appearance Unpowered, 1000 hours @ Max. Temperature
Exposure Capacitance Change : Within±10% Initial Measurement
*2
Tan δ : 3.0% max. Final Measurement
*3
IR :
More than 10000
or 500
×
㎌
Whichever is smaller
Temperature Cycling Appearance : No abnormal exterior appearance 1000 Cycles
Capacitance Change : Within±10% Initial Measurement
*2
Tan δ : 3.0% max. Final Measurement
*3
IR :
More than 10000
or 500
×
㎌
1 cycle condition : -55+0/-3℃(30±3min) → Room Temp. (1min)
Whichever is smaller → 125+3/-0
℃
(30±3min) → Room Temp. (1min)
Destructive Physical No Defects or abnormalities Per EIA 469
Analysis
Humidity Bias Appearance : No abnormal exterior appearance 1000 hours 85℃/85% RH, Rated Voltage and 1.3~1.5V,
Capacitance Change : Within±12.5% Add 100㏀ resistor
Tan δ : 3.5% max. Initial Measurement
*2
IR :
More than 500㏁ or 25㏁×㎌Final Measurement
*4
Whichever is smaller The charge/discharge current is less than 50㎃.
High Temperature Appearance : No abnormal exterior appearance 1000 hours @ 125
℃
, 200% Rated Voltage,
Operating Life Capacitance Change : Within±12.5% Initial Measurement
*2
Tan δ : 3.5% max. Final Measurement
*4
IR :
More than 1000
or 50
×
㎌
The charge/discharge current is less than 50㎃.
Whichever is smaller
T 1.25±0.10
㎜
BW 0.50+0.20/-0.30
㎜
474
④
0805
470
㎋
50V
Performance Test Condition
W 1.25±0.10
㎜
Specification of Automotive MLCC
(Reference Sheet)
Size 0805 inch
L 2.00±0.10
㎜
External Visual No abnormal exterior appearance Microscope
Physical Dimension Within the specified dimensions Using The calipers
Mechanical Shock Appearance : No abnormal exterior appearance Three shocks in each direction should be applied along
Capacitance Change : Within±10% 3 mutually perpendicular axes of the test specimen (18 shocks)
Tan δ : 2.5% max.
IR :
More than 10000
or 500
×
㎌
Whichever is smaller Initial Measurement
*2
Final Measurement
*5
Vibration Appearance : No abnormal exterior appearance 5g's for 20min., 12 cycles each of 3 orientations,
Capacitance Change : Within±10% Use 8" × 5" PCB 0.031" Thick 7 secure points on one long side
Tan δ : 2.5% max. and 2 secure points at corners of opposite sides. Parts mounted
IR :
More than 10000
or 500
×
㎌
within 2" from any secure point. Test from 10~2000㎐.
Whichever is smaller Initial Measurement
*2
Final Measurement
*5
Resistance to Appearance : No abnormal exterior appearance Preheating : 150℃ for 60~120sec.
Solder Heat Capacitance Change : Within±10% Solder pot : 260±5℃, 10±1sec.
Tan δ : 2.5% max. Initial Measurement
*2
IR :
More than 10000㏁ or 500㏁×㎌Final Measurement
*5
Whichever is smaller
ESD Appearance : No abnormal exterior appearance AEC-Q200-002 or ISO/DIS10605
Capacitance Change : Within±10% Initial Measurement
*2
Tan δ : 2.5% max. Final Measurement
*4
IR :
More than 10000
or 500
×
㎌
Whichever is smaller
Solderability 95% of the terminations is to be soldered a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
evenly and continuously b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
Electrical Capacitance : Within specified tolerance *A capacitor prior to measuring the capacitance is heat treated at
Characterization Tan δ : 2.5% max. 150 +0/-10 ℃ for 1 hour and maintained in ambient air for 24±2hrs
IR(25℃) : More than 10000
or 500
×
The Capacitance,Tan δ should be measured at 25℃,
Whichever is smaller 1
±10% 1.0±0.2Vrms
IR(125
℃
) : More than 1000
㏁
or 10
×
I.R should be measured with a DC voltage not exceeding
Whichever is smaller Rated Voltage @25
℃
, @125
℃
for 60~120sec.
Dielectric Strength Dielectric Strength : 250% of the rated voltage for 1~5sec.
Board Flex Appearance : No abnormal exterior appearance Bending to the limit, 3㎜for 60sec.
*1
Capacitance Change : Within±10% Initial Measurement
*2
Final Measurement
*5
Terminal Appearance : No abnormal exterior appearance 18N, for 60±1sec.
Strength(SMD) Capacitance Change : Within±10% Initial Measurement
*2
Final Measurement
*5
Beam Load Destruction value should be exceed 20N Beam speed : 0.5±0.05
㎜
/sec.
Temperature X7R
Characteristic From -55
℃
to 125
℃
, Capacitance change should be within ±15%
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260 +0/-5℃, 30sec. Max ), Meet IPC/JEDEC J-STD-020 D Standard
*1
The figure indicates typical specification. Please refer to individual specifications.
*2
Initial measurement : Perform a heat treatment at 150 +0/-10℃ for one hour after soldering process.
and then let sit for 24±2 hours at room temperature. Perform the initial measurement.
*3
Final measurement : Let sit for 24±2 hours at room temperature after test conclusion, then measure.
*4
Final measurement : Perform a heat treatment at 150 +0/-10℃ for one hour after soldering process.
and then let sit for 24±2 hours at room temperature. Perform the initial measurement.
*5
Final measurement : Let measure within 24 hours at room temperature after test conclusion.
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.
Peak value Duration Wave Velocity
1500G 0.5㎳Half sine 4.7㎧
Performance Test Condition
D. Recommended TEST PCB
( Adhesive strength of termination)
Size code
Size (mm)
a
b
c
02
0.4 × 0.2
0.17
0.20
0.26
03
0.6 × 0.3
0.30
0.30
0.30
05
1.0. × 0.5
0.55
0.40
0.50
10
1.6 × 0.8
1.00
1.00
1.20
21
2.0 × 1.25
1.40
1.20
1.65
31
3.2 × 1.6
1.40
2.20
2.00
32
3.2 × 2.5
1.40
2.20
2.90
43
4.5 × 3.2
1.75
3.50
3.70
55
5.7 × 5.0
1.75
4.50
5.60
(Substrate for bending strength test) (Substrate for Reliability test)
Size code
Size (mm)
a
b
c
d
e
02
0.4 × 0.2
0.2
0.6
0.2
5.0
5.5
03
0.6 × 0.3
0.3
0.9
0.3
5.0
5.5
05
1.0 × 0.5
0.4
1.5
0.5
5.0
5.5
10
1.6 × 0.8
1.0
3.0
1.2
5.0
5.5
21
2.0 × 1.25
1.2
4.0
1.65
5.0
5.5
31
3.2 × 1.6
2.2
5.0
2.0
5.0
5.5
32
3.2 × 2.5
2.2
5.0
2.9
5.0
5.5
43
4.5 × 3.2
3.5
7.0
3.7
5.0
5.5
55
5.7 × 5.0
4.5
8.0
5.6
5.0
5.5
☞ Material : Glass epoxy substrate ☞ Thickness : T=1.6 ㎜ (T= 0.8 ㎜ for 03/05)
☞ : Copper foil (T=0.035 ㎜) ☞ : Solder resist
☞ Caution : Abnormality can occur if lead-based solder (KSD 6704) with 3% silver is used.
d
e
a
c
b
MLCC Product Manual
1. Packaging
This specification applies to taping of MLCC
When customers require, the specification may be changed under the agreement.
1-1. Figure
1-2. Quantity
[unit:pcs]
Type
Size Code
Inch(mm)
Chip
Thickness
Taping Type
Pitch
Plastic
7 inches reel
Plastic
10 inches reel
Plastic
13 inches reel
MLCC
0402 (01005)
0.2 mm
PAPER
2mm
20k
-
100K
0603 (0201)
0.3 mm
PAPER
2mm
10K
-
50K
1005 (0402)
0.5 mm
PAPER
2mm
10K
-
50K
1608 (0603)
0.8 mm
PAPER
4mm
4K
10K
15K / 10K
2012 (0805)
T≤0.85 mm
PAPER
4mm
4K
10K
15K / 10K
T≥1.0 mm
EMBOSSED
4mm
2K
6K
10K
3216 (1206)
T≤0.85 mm
PAPER
4mm
4K
10K
10K
T≥1.0 mm
EMBOSSED
4mm
2K
4K
10K
3225 (1210)
T≤1.6 mm
EMBOSSED
4mm
2K
4K
10K
T≥2.0 mm
EMBOSSED
4mm
1K
4K
4K
4520 (1808)
T≤1.6 mm
EMBOSSED
8mm
2k
-
8k
T≥2.0 mm
EMBOSSED
8mm
1k
-
4k
4532 (1812)
T≤2.0 mm
EMBOSSED
8mm
-
-
4K
T>2.0 mm
EMBOSSED
8mm
-
-
2K
5750 (2220)
T≥2.5 mm
EMBOSSED
8mm
-
-
2K
Empty section 200mm
Chip mounting section
Empty section 280mm
Leading 240mm
Paper or Embossed tape
Cover tape
Reel
Start
END
Unreeling
MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard (Paper) Tape: 4mm Pitch
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t
0603
(1608)
1.00
±0.10
1.90
±0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
0805
(2012)
1.55
±0.10
2.30
±0.10
1206
(3216)
2.05
±0.10
3.60
±0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard (Paper) Tape: 2mm Pitch
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t
01005
(0402)
0.25
±0.02
0.46
±0.02
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0.25
±0.02
0201
(0603)
0.38
±0.03
0.68
±0.03
0.35
±0.03
0402
(1005)
0.62
±0.05
1.12
±0.05
0.60
±0.05
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
0.37
±0.03
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
MLCC Product Manual
1-3-3. Embossed (Plastic) Tape
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t1
t0
01005
(0402)
0.23
±0.02
0.45
±0.02
4.00
±0.05
1.80
±0.02
0.90
±0.05
1.00
±0.02
1.00
±0.02
2.00
±0.03
φ0.80
±0.04
0.35
Below
0.50
Below
015008
(05025)
0.32
±0.03
0.58
±0.03
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0603
(1608)
1.05
±0.15
1.90
±0.15
4.00
±0.10
φ1.50
+0.10
/-0
2.92
Below
0.60
Below
0805
(2012)
1.45
±0.20
2.30
±0.20
1206
(3216)
1.90
±0.20
3.50
±0.20
1210
(3225)
2.80
±0.20
3.60
±0.20
1808
(4520)
2.30
±0.20
4.90
±0.20
12.0
±0.30
5.60
±0.05
8.00
±0.10
3.80
Below
1812
(4532)
3.60
±0.20
4.90
±0.20
2220
(5750)
5.50
±0.20
6.20
±0.20
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
8.00
±0.30
3.50
±0.05
4.00
±0.10
2.50
Below
0306
(0816)
1.10
±0.20
1.90
±0.20
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
MLCC Product Manual
1-3-4. Reel Size
[unit:mm]
Symbol
Tape Width
A
B
C
D
E
W
t
7”Reel
4mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
5±0.5
1.2±0.2
8mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
10±1.5
0.9±0.2
12mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
13±0.5
1.2±0.2
10”Reel
8mm
φ258±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
13”Reel
8mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
12mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
13±0.5
2.2±0.2
1-4. Cover Tape Peel-off Force
1-4-1. Peel-off Force
10 g.f ≤ peel-off force ≤ 70 g.f
1-4-2. Measurement Method
-Taping Packaging design : Packaging design follows IEC 60286-3 standard.
(IEC 60286-3 Packaging of components for automatic handling - parts 3)
* If the static electricity of SMT process causes any problems, please contact us.
MLCC Product Manual
1-5. BOX Package
1-5-1. Packaging Label
REEL & Box Type
Label includes the information as below.
1) Chip size
2) Temperature Characteristics
3) Nominal Capacitance
4) Model Name
5) LOT Number & Reel Number
6) Q’ty
1-5-2. Box Packaging
1) Double packaging with the paper type of inner box and outer box.
2) Avoid any damages during transportation by car, airplane and ship.
3) Remark information of contents on inner box and outer box
※ If special packaging is required, please contact us.
1-5-3. 7" Box Packaging
[ Unit : mm ]
- Inner Box (7" x 5 REEL ) - Inner Box (7" x 10 REEL)
- Outer Box (7" x 20 REEL) - Outer Box (7" x 60 REEL)
MLCC Product Manual
1-5-4. 13” Box Packaging
- Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL)
1-6. Chip Weight
Size(L/W)
Inch(mm)
Size(T)
(mm)
Thickness
Code
Temp.
Weight
(mg/pc)
0402
(1005)
0.50
5
X7*
1.606
0.60
6
X7*
3.288
0.50
5
C0G
1.181
0603
(1608)
0.80
8
X7*
6.492
0.80
8
C0G
4.600
0805
(2012)
0.60
6
X7*
8.670
0.85
C
X7*
13.338
1.25
F
X7*
19.526
1.25
Q
X7*
23.200
0.60
6
C0G
8.253
0.85
C
C0G
9.827
1.25
F
C0G
16.737
1206
(3216)
1.15
P
X7*
35.860
1.60
H
X7*
55.045
1.60
K
X7*
55.045
1210
(3225)
2.00
I
X7*
111.670
2.50
J
X7*
142.335
2.50
V
X7*
195.049
The weight of product is typical value per size, for more details, please contact us.
MLCC Product Manual
2. Product Characteristic Data
2-1. Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change.
Due to the fact that the capacitance may be subject to change with the measured voltage and
frequency, it is highly recommended to measure the capacitance based on the following
conditions.
2-1-1. Measure Capacitance with Voltage and Frequency Specified in this Document.
Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,
please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance
range.
[The voltage and frequency condition according to MLCC the capacitance range]
◆ Class I
Capacitance
Frequency
Voltage
≤ 1,000 pF
1 MHz ± 10%
0.5 ~ 5 Vrms
> 1,000 pF
1 kHz ± 10%
◆ Class II
Capacitance
Frequency
Voltage
≤ 10 ㎌
1 kHz ± 10%
1.0 ± 0.2 Vrms
> 10 ㎌
120 Hz ± 20%
0.5 ± 0.1 Vrms
Exception*
1 kHz ± 10%
0.5 ± 0.1 Vrms
Capacitance shall be measured after the heat treatment of 150+0/-10℃
for 1hr, leaving at room temperature for 24±2hr. (Class II)
2-1-2. It is Recommended to use Measurement Equipment with the ALC (Auto Level Control) Option.
The Reason is that when Capacitance or Measurement Frequency is high, the output Voltage of
Measurement Equipment can be lower than the Setting Voltage due to the Equipment limitation.
Note that when Capacitance or Measurement Frequency is excessively high, the Measurement
Equipment may show ALC off Warning and provide a lower Output voltage than the Setting
Voltage even with ALC Option selected. It is necessary to ensure the output voltage of
Measurement Equipment is the Same as the Setting Voltage before Measuring Capacitance.
MLCC Product Manual
2-1-3. Capacitance Value of High Dielectric Constant (Class II) MLCC Changes with Applied AC and DC
Voltage. Therefore, it is Necessary to take into Account MLCC’s AC voltage Characteristics and DC-
Bias voltage Characteristics when Applying MLCC to the Actual Circuit.
2-1-4. The Capacitance is in Compliance with the EIA RS-198-1-F-2002.
2-2. Tan δ (DF)
2-2-1. An ideal MLCC’s Energy Loss is Zero, but Real MLCC has Dielectric Loss and Resistance Loss of
Electrode. DF (Dissipation Factor) is Defined as the Ratio of Loss Energy to Stored Energy and
Typically Being Calculated as Percentage.
2-2-2. Quality Factor (Q factor) is defined as the Ratio of Stored Energy to Loss Energy.
The Equation can be described as 1/DF. Normally the loss Characteristic of Class I MLCC is
Presented in Q, since the DF value is so small whereas the loss Characteristic of Class II MLCC is
Presented in DF.
2-2-3. It is Recommended to use Class I MLCC for Applications to Require Good Linearity and Low Loss
Such as Coupling Circuit, Filter Circuit and Time Constant Circuit.
2-3. Insulation Resistance
Ceramic Dielectric has a Low Leakage Current with DC Voltage due to the High Insulating
Properties. lnsulation Resistance is Defined as the Ratio of a Leakage Current to DC Voltage.
2-3-1. When Applying DC Voltage to MLCC, a Charging Current and a Leakage Current Flow Together at
the Initial Stage of Measurement. While the Charging Current Decreases, and Insulation Resistance
(IR) in MLCC is Saturated by Time. Therefore, Insulation Resistance Shall be Measured 1 minute
after Applying the Rated Voltage.
2-4. Capacitance Aging
The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance
value over time. It is also necessary to consider the aging characteristic with voltage and
temperature characteristics when Class II MLCC is used in circuitry.
MLCC Product Manual
2-4-1. In General, Aging Causes Capacitance to Decrease Linearly with the log of Time as Shown in the
Following Graph. Please Check with SEMCO for more Details, Since the Value may Vary Between
Different Models.
2-4-2. After Heat Treatment (150 °C, 1hour), the Capacitance Decreased by Aging is Recovered, so Aging
Should be Considered Again from the Time of Heat Treatment.
[ Example of Capacitance Aging ]
* Sample : C0G, X7R, X5R
2-5. Temperature Characteristics of Capacitance (TCC)
Please consider temperature characteristics of capacitance since the electrical characteristics such as
capacitance changes which is caused by a change in ceramic dielectric constant by temperature.
2-5-1. It is Necessary to Check the Values Specified in Section “C. Reliability test Condition–Temperature
Characteristics” for the Temperature and Capacitance Change Range of MLCC.
[ Example of Temperature Characteristics (X5R) ] [ Example of Bias TCC ]
* Sample : 10uF, Rated voltage 6.3V * Sample : 10uF, Rated voltage 6.3V
MLCC Product Manual
2-5-2. When Selecting MLCC, it is Necessary to Consider the Heat Characteristics of a System, Room
Temperature and TCC of MLCC, since the Applied Temperature may Change the Capacitance of
MLCC.
2-5-3. In Addition, Bias TCC of MLCC Should be taken into Account when DC Voltage is applied to MLCC.
2-6. Self-heating Temperature
It is necessary to design the system, with considering self-heating generated by the ESR
(Equivalent Series Resistance) of MLCC when AC voltage or pulse voltage is applied to MLCC.
2-6-1. When MLCC is used in an AC Voltage or Pulse Voltage Circuit, self-heating is Generated when AC
or Pulse Current flows through MLCC. Short-circuit may be Occurred by the Degradation of MLCC’s
Insulating properties.
2-6-2. The Reliability of MLCC may be Affected by MLCC Being used in an AC Voltage or Pulse Voltage
Circuit, even the AC Voltage or the Pulse Voltage is within the Range of Rated Voltage.
Therefore, make sure to check the Following Conditions.
1) The Surface Temperature of MLCC Must Stay Within the Maximum Operating Temperature after
AC or Pulse Voltage is applied.
2) The Rise in Increase by Self-heating of MLCC Must not Exceed 20℃
[ Example of Ripple current ]
* Sample : X5R 10uF, Rated voltage 6.3V
MLCC Product Manual
2-7. DC & AC Voltage Characteristics
It is required to consider voltage characteristics in the circuit since the capacitance value of high
dielectric constant MLCC(Class II) is changed by applied DC & AC voltage.
2-7-1. Please Ensure the Capacitance Change is Within the Allowed Operating Range of a System. In
Particular, when High Dielectric Constant Type MLCC (Class II) is used in Circuit with Narrow
allowed
Capacitance Tolerance, a System Should be Designed with Considering DC Voltage, Temperature
Characteristics and Aging Characteristics of MLCC.
[ Example of DC Bias characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
2-7-2. It is Necessary to Consider the AC Voltage Characteristics of MLCC and the AC Voltage of
a System,
Since the Capacitance Value of High Dielectric Constant Type MLCC (Class II) Varies with the
Applied AC voltage.
[ Example of AC voltage characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
MLCC Product Manual
2-8. Impedance Characteristic
Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a
current (I) when a voltage (V) is applied. It is defined as the ratio of the voltage to the current
(Z=V/I). Impedance extends the concept of resistance to AC circuits and is a complex number
consisting of the real part of resistance (R) and the imaginary part of reactance (X) as Z=R+jX.
Therefore, it is required to design circuit with consideration of the impedance characteristics of
MLCC based on the frequency ( Z = R + jX )
2-8-1. MLCC Operates as a Capacitor in the low Frequency and its Reactance (XC) Decreases as
Frequency
increases ( X_C=1/j2πfC ) where f is frequency and C is capacitance.
The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency mainly comes
from the loss of its dielectric material.
2-8-2. MLCC operates as an inductor in the high frequency and the inductance of MLCC is called ESL
(Equivalent Series Inductance). The reactance (XL) of MLCC in the high frequency increases as
frequency increases ( X_L=j2πf∙ESL ). The resistance (ESR) of MLCC in the high frequency mainly
comes from the loss of its electrode metal.
2-8-3. SRF (Self Resonant Frequency) of MLCC is the frequency where its capacitive reactance (XC) and
inductive reactance(XL) cancel each other and the impedance of MLCC has only ESR at SRF.
2-8-4. The impedance of MLCC can be measured by a network analyzer or an impedance analyzer.
When using the network analyzer, please note that the small-signal input may lead to the
impedance of low capacitance caused by the AC voltage characteristic of MLCC.
[ Example of Impedance characteristics ]
* Sample : X5R 1uF, Rated voltage 6.3V
MLCC Product Manual
3. Electrical & Mechanical Caution
3-1. Derating
MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test
are labeled as “derated MLCC.” For this type of MLCC, the voltage and temperature should be
derated as shown in the following graph for the equivalent life time of a normal MLCC with the
test voltage at 150% of the rated voltage in the high temperature resistance test.
3-1-1. The Derated MLCC Should be Applied with the Derating Voltage and Temperature as Shown in
the Following Graph.
3-1-2. The “Temperature of MLCC” in the X-axis of the Graph Below Indicates the Surface Temperature
of MLCC Including self-heating effect. The “Voltage Derating Ratio” in the Y-axis of the Graph
Below gives the Maximum Operating Voltage of MLCC with Reference to the Maximum Voltage
(Vmax) as Defined in Section “3-2. Applied Voltage.”
[Example of derating graph for derated MLCC]
* Vmax ≤ Derated Voltage
* Only the Derating marked models
MLCC Product Manual
3-2. Applied Voltage
The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications.
3-2-1. Cautions by Types of Voltage Applied to MLCC
· For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should
not exceed the rated voltage of MLCC.
· For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage
should not exceed the rated voltage of MLCC.
· Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of
MLCC.
[Types of Voltage Applied to the Capacitor]
DC Voltage
AC Voltage
DC+AC Voltage 1
DC+AC Voltage 2
DC+Pulse Voltage
3-2-2. Effect of EOS (Electrical Overstress)
· Electrical Overstress such as a surge voltage or EOS can cause damages to MLCC, resulting in
the electrical short failure caused by the dielectric breakdown in MLCC.
· Down time of MLCC is varied with the applied voltage and the room temperature and a
dielectric shock caused by EOS can accelerate heating on the dielectric. Therefore, it can bring
about a failure of MLCC in a market at the early stage.
· Please use caution not to apply excessive electrical overstress including spike voltage MLCC when
preparing MLCC for testing or evaluating.
(1) Surge
When the overcurrent caused by surge is applied to MLCC, the influx of current into MLCC can
induce the overshooting phenomenon of voltage as shown in the graph below and result in the
electrical short failure in MLCC. Therefore, it is necessary to be careful to prevent the influx of
surge current into MLCC.
(2) ESD (Electrostatic Discharge)
Since the voltage of the static electricity is very high but the quantity of electric charge is small
compared to the surge, ESD can cause damage to MLCC with low capacitance as shown in the
MLCC Product Manual
following graph, whereas surge with lots of electric charge quantity can cause damages to even
high capacitance MLCC.
[ Example of Surge applied to MLCC ] [ Example of ESD applied to MLCC ]
* Simulation for ESD 8kV
3-3. Vibration
Please check the types of vibration and shock, and the status of resonance.
Manage MLCC not to generate resonance and avoid any kind of impact to terminals.
When MLCC is used in a vibration environment, please make sure to contact us for the situation
and consider special MLCC such as Soft-term, etc.
3-4. Shock
Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC
Do not use a dropped MLCC to avoid any quality and reliability deterioration.
When piling up or handling printed circuit boards, do not hit MLCC with the corners of a PCB to
prevent cracks or any other damages to the MLCC.
3-5. Piezo-electric Phenomenon
MLCC may generate a noise due to vibration at specific frequency when using the high dielectric
constant MLCC (Class Ⅱ) at AC or Pulse circuits.
MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks.
MLCC Product Manual
4. Process of Mounting and Soldering
4-1. Mounting
4-1-1. Mounting Position
It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress
is applied.
Not recommended Recommended
4-1-2. Cautions During Mounting Near the Cutout
Please take the following measures to effectively reduce the stress generated from the cutting of
PCB. Select the mounting location shown below, since the mechanical stress is affected by a
location and a direction of MLCC mounted near the cutting line.
4-1-3. Cautions During Mounting Near Screw
If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque.
Mount MLCC as far from the screw holes as possible.
Not recommended Recommended
MLCC Product Manual
4-2. Caution before Mounting
4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from
the reel.
4-2-2. Check the capacitance characteristics under actual applied voltage.
4-2-3. Check the mechanical stress when actual process and equipment is in use.
4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.
Heat treatment must be done prior to measurement of capacitance.
4-2-5. Check the solderability of MLCC that has passed shelf life before use.
4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
4-3. Cautions during Mounting with Mounting (pick-and-place) Machines
4-3-1. Mounting Head Pressure
Excessive pressure may cause cracks in MLCC.
It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.
Additional conditions must be set for both thin film and special purpose MLCC.
4-3-2. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before
mounting on the other side due to the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
4-3-3. Suction Nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of
the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during
positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and
mounting claw should be conducted.