MEMSIC MMC3316xMT Rev.B Page 1 of 15 10/8/2012
±16 Gauss 3-axis Magnetic
Sensor, With I2C Interface
MMC3316xMT
FEATURES
Fully integrated 3-axis magnetic sensor
and electronic circuits requiring fewer
external components
Superior Dynamic Range and Accuracy:
±16G FSR with 14bit operation
2 mG/LSB Resolution
2 mG RMS noise
Enables heading accuracy <1º
Small, Low profile package
2.0x2.0x1.0mm
SET/RESET function
Allows for elimination of error due to
Null Field output change over
temperature
Clears the sensors of residual
magnetization resulting from strong
external fields
Low power consumption (100µA @ 7Hz)
1µA (max) power down function
I2C Slave, FAST (≤400 KHz) mode
1.62V~3.6V wide power supply operation
supported, 1.8V I/O compatibility.
RoHS compliant
APPLICATIONS :
Electronic Compass
GPS Navigation Assist
Position Sensing
DESCRIPTION:
The MMC3316xMT is a complete 3-axis magnetic
sensor with on-chip signal processing and integrated
I2C bus. The device can be connected directly to a
microprocessor, eliminating the need for A/D
converters or timing resources. It can measure
magnetic fields within the full scale range of 16
Gauss, with 2mG/LSB resolution and 2mG rms noise,
enabling heading accuracies of <1 degree in electronic
compass applications.
Contact Memsic for access to advanced calibration
and tilt-compensation algorithms.
An integrated SET/RESET function provides for the
elimination of error due to Null Field output change
with temperature. In addition it clears the sensors of
any residual magnetic polarization resulting from
exposure to strong external magnets. The
SET/RESET function can be performed for each
measurement or periodically as the specific application
requires.
The MMC3316xMT is packaged in a small low profile
LGA package (2.0 x 2.0 x 1.0 mm,) and with an
operating temperature rang from -40C to +85C.
The MMC3316xMT provides an I2C digital output with
400 KHz, fast mode operation.
Information furnished by MEMSIC is believed to be accurate and reliable.
However, no responsibility is assumed by MEMSIC for its use, or for any
infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or
patent rights of MEMSIC.
MEMSIC, Inc.
One Technology Drive, Suite 325, Andover, MA01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
FUNCTIONAL BLOCK DIAGRAM
Signal Path X
Signal Path Y
Bridge
Regulator
Bridge bias
Bandgap
Reference
ADC Reference
Generator
Timing Generation
Magnetize Controller
Fuses, Control Logic,
Factory Interface
I2C Interface
Measured Data
X-axis
Sensor
Y-axis
Sensor
Signal Path Z
Z-axis
Sensor
MEMSIC MMC3316xMT Rev.B Page 2 of 15 10/8/2012
SPECIFICATIONS: (Measurements @ 25C, unless otherwise noted; VDA = VDD= 1.8V unless otherwise specified)
Conditions
Min
Typ
Max
Units
Total applied field
16
Gauss
VDA
1.621
1.8
3.6
V
VDD (I2C interface)
1.621
1.8
3.6
V
5.0
mS
7 measurements/second
60
100
160
µA
0.01
1.0
µA
-40
85
C
-55
125
C
±16 Gauss
1.0
%FS
3 sweeps across ±16 Gauss
0.5
%FS
3 sweeps across ±16 Gauss
0.5
%FS
1.0
3.0
degrees
2.0
5.0
%
2.0
mGauss
14
bits
0.5
1.0
degrees
100
Hz
16 Gauss
-10
+10
%
16 Gauss
460
512
564
counts/Gauss
-40~85C
16 Gauss
1100
ppm/C
16 Gauss
-0.2
+0.2
Gauss
8090
8192
8294
counts
Delta from 25C
16 Gauss
0.4
mGauss/C
25
Gauss
10000
Gauss
Note: 1. 1.62V is the minimum operation voltage, or VDA / VDD should not be lower than 1.62V.
2. Power consumption is proportional to how many measurements performed per second, for example, at one
measurement per second, the power consumption will be 100µA /7=14µA .
3. MEMSIC product is with low noise and enables users to utilize heading accuracy to be 0.5 degree typical
and 1.0degree maximum when using MEMSIC‟s proprietary software or algorithm
4. The error can be eliminated by using SET and RESET to determine the true Null Field output for each
measurement.
MEMSIC MMC3316xMT Rev.B Page 3 of 15 10/8/2012
I2C INTERFACE I/O CHARACTERISTICS (VDD=1.8V)
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Logic Input Low Level
VIL
-0.5
0.3* VDD
V
Logic Input High Level
VIH
0.7*VDD
VDD
V
Hysteresis of Schmitt input
Vhys
0.2
V
Logic Output Low Level
VOL
0.4
V
Input Leakage Current
Ii
0.1VDD<Vin<0.9VDD
-10
10
µA
SCL Clock Frequency
fSCL
0
400
kHz
START Hold Time
tHD;STA
0.6
µS
START Setup Time
tSU;STA
0.6
µS
LOW period of SCL
tLOW
1.3
µS
HIGH period of SCL
tHIGH
0.6
µS
Data Hold Time
tHD;DAT
0
0.9
µS
Data Setup Time
tSU;DAT
0.1
µS
Rise Time
tr
From VIL to VIH
0.3
µS
Fall Time
tf
From VIH to VIL
0.3
µS
Bus Free Time Between STOP and
START
tBUF
1.3
µS
STOP Setup Time
tSU;STO
0.6
µS
Timing Definition
SDA
SCL
tf
tr
tLOW
tHD;STA
tHD;DAT
tHIGH
tSU;DAT
tSU;STA
tHD;STA
Sr
S
tSU;STO
tSP
S
P
tf
tr
tBUF
MEMSIC MMC3316xMT Rev.B Page 4 of 15 10/8/2012
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (VDD) ………………...-0.5 to +3.6V
Storage Temperature ……….……-55C to +125C
Maximum Exposed Field ………………..10000 Gauss
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; the functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect the
device‟s reliability.
Pin Description: LGA Package
Pin
Name
Description
I/O
1
VDA
Power Supply
P
2
Vpp
Factory Use Only, Leave Open
NC
3
TEST
Factory Use Only, Leave
Open/No Connection
NC
4
C+
Short together
I
5
C-
I
6
CAP
Connect to External Capacitor
I
7
SCL
Serial Clock Line for I2C bus
I
8
VDD
Power Supply for I2C bus
P
9
SDA
Serial Data Line for I2C bus
I/O
10
VSA
Connect to Ground
P
All parts are shipped in tape and reel packaging with
9000pcs per 13” reel or 3000pcs per 7” reel.
Caution: ESD (electrostatic discharge) sensitive
device.
Ordering Guide:
MMC3316xMT
Marking illustration:
6
7
8
502
XXX
1
2
3
45
9
10
++
+
“Number” means the 1st two digits of the 1st line in the
marking. The 3rd digit in the 1st line represents Year Code
（2 stands for 2012）, the 2nd line represents Lot Number.
Small circle indicates pin one (1).
THEORY:
The anisotropic magnetoresistive (AMR) sensors are
special resistors made of permalloy thin film deposited
on a silicon wafer. During manufacturing, a strong
magnetic field is applied to the film to orient its
magnetic domains in the same direction, establishing
a magnetization vector. Subsequently, an external
magnetic field applied perpendicularly to the sides of
the film causes the magnetization to rotate and
change angle. This effect causes the film‟s resistance
to vary with the intensity of the applied magnetic field.
The MEMSIC AMR sensor is incorporated into a
Wheatstone bridge configuration to maximize Signal to
Noise ratio. A change in magnetic field produces a
proportional change in differential voltage across the
Wheatstone bridge.
However, the influence of a strong magnetic field
(more than 25 Gausses) in any direction could upset,
or flip, the polarity of the film, thus changing the sensor
characteristics. A strong restoring magnetic field must
be applied momentarily to restore, or set, the sensor
characteristics. The MEMSIC magnetic sensor has an
on-chip magnetically coupled strap: a SET/RESET
strap pulsed with a high current, to provide the
restoring magnetic field.
Number
5x
Part number
50
MMC33160MT
51
MMC33161MT
52
MMC33162MT
53
MMC33163MT
54
MMC33164MT
55
MMC33165MT
56
MMC33166MT
57
MMC33167MT
Address code: 0~7
Code
7bit I2C Address
0
0110000b
1
0110001b
2
0110010b
3
0110011b
4
0110100b
5
0110101b
6
0110110b
7
0110111b
Package type:
Code
Type
T
LGA10
RoHS compliant
Performance Grade:
Code
Performance Grade
M
Temp compensated
MEMSIC MMC3316xMT Rev.B Page 5 of 15 10/8/2012
PIN DESCRIPTIONS:
VDA – This is the supply input for the circuits and the
magnetic sensor. The DC voltage should be between
1.62 and 3.6 volts. A 1uF by-pass capacitor is strongly
recommended.
VSA – This is the ground pin for the magnetic sensor.
SDA – This pin is the I2C serial data line, and operates
in FAST (400 KHz) mode.
SCL– This pin is the I2C serial clock line, and operates
in FAST (400 KHz) mode.
VDD – This is the power supply input for the I2C bus,
and is 1.8V compatible can be 1.62V to 3.6V.
TEST – Factory use only, Leave Open/No Connection.
CAP –Connect a 4.7uF low ESR (typically smaller than
0.2ohm) ceramic capacitor.
VPP – Factory use only, Leave Open
C+, C- –Short together.
EXTERNAL CAPACITOR CONNECTION
(Top View)
HARDWARE DESIGN CONSIDERATION
Provide adequate separation distance from
permanent magnets or devices which contain
permanent magnets. The disturbing magnetic field
plus the magnetic field to be measured must be
within the measurement range of the device
(±16Gauss).
Provide adequate distance from current carrying
traces. Do not route current carrying traces under
the sensor.
Do not cover the sensor with magnetized material,
for example, shield box, LCD, or battery.
If there is a magnetized part on the top side of the
PCB, do not place the sensor in the same location
on the bottom side. Examples are batteries,
speakers, vibrators or steel components.
Please refer to MEMSIC application note: AN-200-20-
0018 (MEMSIC Magnetic Sensor Hardware Design
Layout Guideline for Electronic Device).
POWER CONSUMPTION
The MEMSIC magnetic sensor consumes 100µA
(typical) at 1.8V with 7 measurements per second. The
current is proportional to the number of measurements
per second. For example, if only 2 measurements per
second are performed, the current will be
100*2/7=28µA.
I2C INTERFACE DESCRIPTION
A slave mode I2C circuit has been implemented into
the MEMSIC magnetic sensor as a standard interface
for customer applications. The A/D converter and
MCU functionality have been added to the MEMSIC
sensor, thereby increasing ease-of-use, and lowering
power consumption, footprint and total solution cost.
The I2C (or Inter IC bus) is an industry standard bi-
directional two-wire interface bus. A master I2C device
can operate READ/WRITE controls to an unlimited
number of devices by device addressing. The
MEMSIC magnetic sensor operates only in a slave
mode, i.e. only responding to calls by a master device.
I2C BUS CHARACTERISTICS
I2C Bus
Rp
Rp
SDA (Serial Data Line)
SCL (Serial Clock Line)
DEVICE 1
DEVICE 2
VDD
1.0uF
Power II
Power I
4.7uF
10uF
CAP
C-
C+
TEST
VPP
SCL
VDD
SDA
VSA
VDA
MEMSIC MMC3316xMT Rev.B Page 6 of 15 10/8/2012
The two wires in the I2C bus are called SDA (serial
data line) and SCL (serial clock line). In order for a
data transfer to start, the bus has to be free, which is
defined by both wires in a HIGH output state. Due to
the open-drain/pull-up resistor structure and wired
Boolean “AND” operation, any device on the bus can
pull lines low and overwrite a HIGH signal. The data
on the SDA line has to be stable during the HIGH
period of the SCL line. In other words, valid data can
only change when the SCL line is LOW.
Note: Rp selection guide: 4.7Kohm for a short I2C bus
length (less than 4inches), and 10Kohm for a bus
length less than 2inches.
MEMSIC MMC3316xMT Rev.B Page 7 of 15 10/8/2012
REGISTER MAP:
Register Name
Address
Description
Xout Low
00H
Xout LSB
Xout High
01H
Xout MSB
Yout Low
02H
Yout LSB
Yout High
03H
Yout MSB
Zout Low
04H
Zout LSB
Zout High
05H
Zout MSB
Status
06H
Device status
Internal control 0
07H
Control register 0
Internal control 1
08H
Control register 1
Product ID 0
10H
Product ID
R0
1CH
Factory used register
R1
1DH
Factory used register
R2
1EH
Factory used register
R3
1FH
Factory used register
Product ID 1
20H
Product ID
Register Details:
Xout High, Xout Low
Xout Low
7
6
5
4
3
2
1
0
Addr: 00H
Xout[7:0]
Reset Value
Xout[7:0]
Mode
R
Xout High
7
6
5
4
3
2
1
0
Addr: 01H
Reserved
Xout[13:8]
Reset Value
2‟h0
Xout[13:8]
Mode
R
14bits X-axis output, unsigned format.
Yout High, Yout Low
Yout Low
7
6
5
4
3
2
1
0
Addr: 02H
Yout[7:0]
Reset Value
Yout[7:0]
Mode
R
Yout High
7
6
5
4
3
2
1
0
Addr: 03H
Reserved
Yout[13:8]
Reset Value
2‟h0
Yout[13:8]
Mode
R
14bits Y-axis output, unsigned format.
Zout High, Zout Low
Zout Low
7
6
5
4
3
2
1
0
Addr: 04H
Zout[7:0]
Reset Value
Zout[7:0]
Mode
R
Zout High
7
6
5
4
3
2
1
0
Addr: 05H
Reserved
Zout[13:8]
Reset Value
2‟h0
Zout[13:8]
Mode
R
14bits Z-axis output, unsigned format.
MEMSIC MMC3316xMT Rev.B Page 8 of 15 10/8/2012
Status:
Device Status
7
6
5
4
3
2
1
0
Addr: 06H
Reserved
NVM_Rd
Done
Pump
On
Meas
Done
Reset Value
5‟h0
0
0
0
Mode
R
Bit Name
Description
Meas Done
Indicates measurement event is completed. This bit should be checked before
reading the output
Pump On
Indicates the charge pump status
NVW_Rd
Done
Indicates the chip was able to successfully read its memory.
Internal Control 0:
Control
Register 0
7
6
5
4
3
2
1
0
Addr: 07H
reserved
RESET
SET
No
Boost
CM
Freq1
CM
Freq0
Cont
Mode
On
TM
Reset Value
0
0
0
0
0
0
0
0
Mode
W
W
W
W
W
W
W
W
Bit Name
Description
TM
Take measurement, set „1‟ will initiate measurement.
Cont Mode On
Writing “1” will enable the Continuous Measurement Mode.
CM Freq0
These bits determine how often the chip will take measurements in Continuous
Measurement Mode.
CM Freq1
CM Freq0
Frequency
0
0
50Hz
0
1
20Hz
1
0
20Hz
1
1
1Hz
CM Freq1
No Boost
Factory-use Register, fixed to “0”
SET
Writing “1” will set the sensor by passing a large current through Set/Reset Coil
RESET
Writing “1” will reset the sensor by passing a large current through Set/Reset Coil at
a reversed direction
Internal Control 1:
Control
Register 1
7
6
5
4
3
2
1
0
Addr: 08H
Reserved
Filt
Time
Sel1
Filt
Time
Sel0
Res
Sel1
Res
Sel0
FSR1
FSR0
Reset Value
2‟h0
0
0
0
0
0
0
Mode
W
W
W
W
W
W
W
W
Bit Name
Description
FSR0
Factory-use Register
FSR1
Res Sel0
Factory-use Register
Res Sel1
Filt Time Sel0
Factory-use Register
Filt Time Sel1
MEMSIC MMC3316xMT Rev.B Page 9 of 15 10/8/2012
R0, R1, R2, R3
R0
7
6
5
4
3
2
1
0
Addr: 1CH
Factory-use Register
Reset Value
Factory-use Register
Mode
R
R1
7
6
5
4
3
2
1
0
Addr: 1DH
Factory-use Register
Reset Value
Factory-use Register
Mode
R
R2
7
6
5
4
3
2
1
0
Addr: 1EH
Factory-use Register
Reset Value
Factory-use Register
Mode
R
R3
7
6
5
4
3
2
1
0
Addr: 1FH
Factory-use Register
Reset Value
Factory-use Register
Mode
R
Product ID 0:
Product ID 0
7
6
5
4
3
2
1
0
Addr: 10H
Product ID0[2:0]
Factory-use Register
Reset Value
X
X
X
Factory-use Register
Mode
R
R
R
R
R
R
R
R
XXX: I2C address code.
Product ID 1:
Product ID 1
7
6
5
4
3
2
1
0
Addr: 20H
Product ID 1[7:0]
Reset Value
0
0
0
0
0
1
0
1
Mode
R
R
R
R
R
R
R
R
MEMSIC MMC3316xMT Rev.B Page 10 of 15 10/8/2012
DATA TRANSFER
A data transfer is started with a “START” condition and
ended with a “STOP” condition. A “START” condition
is defined by a HIGH to LOW transition on the SDA
line while SCL line is HIGH. A “STOP” condition is
defined by a LOW to HIGH transition on the SDA line
while the SCL line is held HIGH. All data transfer in I2C
system are 8-bits long. Each byte has to be followed
by an acknowledge bit. Each data transfer involves a
total of 9 clock cycles. Data is transferred starting with
the most significant bit (MSB).
After a START condition, the master device calls a
specific slave device by sending its 7-bit address with
the 8th bit (LSB) indicating that either a READ or
WRITE operation will follow, [1] for READ and [0] for
WRITE. The MEMSIC device 7-bit device address is
[0110xxx] where the three LSB‟s are pre-programmed
into the MMC3316xMT by the factory and they are
indicated on the package as shown in the previous
section “Package Marking Illustration”. A total of 8
different addresses can be pre-programmed into
MEMSIC device by the factory. This variation of I2C
address avoids a potential address conflict, either by
ICs from other manufacturers or by other MEMSIC
devices on the same bus
The initial addressing of the slave is always followed
by the master writing the number of the slave register
to be read or written, so this initial addressing always
indicates a WRITE operation by sending [0110xxx1].
After being addressed, the MEMSIC device being
called should respond by an “Acknowledge” signal by
pulling SDA line LOW. Subsequent communication
bytes can either be:
a) the data to be written to the device register, or
b) Another START condition followed by the
device address indicating a READ operation
[0110xxx0], and then the master reads the
register data.
Multiple data bytes can be written or read to
numerically sequential registers without the need of
another START condition. Data transfer is terminated
by a STOP condition or another START condition.
Two detailed examples of communicating with the
MEMSIC device are listed below for the actions of
acquiring a magnetic field measurement and
magnetizing the sensor.
POWER STATE
MEMSIC MR Sensor will enter power down mode
automatically after data acquisition is finished.
VDA
VDD
Power State
OFF(0V)
OFF(0V)
OFF(0V), no power
consumption
OFF(0V)
1.62~3.6V
OFF(0V), power
consumption is less than
1uA.
1.62~3.6V
OFF(0V)
Power consumption is
not predictable, not
recommended state.
1.62~3.6V
1.62~3.6V
Normal operation mode,
device will enter into
power down mode
automatically after data
acquisition is finished
EXAMPLE MEASUREMENT
First cycle: A START condition is established by the
Master Device followed by a call to the slave address
[0110xxx] with the eighth bit held low to indicate a
WRITE request. Note: [xxx] is determined by factory
programming and a total of 8 different addresses are
available.
Second cycle: After an acknowledge signal is received
by master device (MEMSIC device pulls SDA line low
during 9th SCL pulse), the master device sends the
address of Control Register 0 or [00000111] as the
target register to be written. The MEMSIC device
should acknowledge at the end (9th SCL pulse, SCL
pulled low).
Third cycle: The Master device writes to the Internal
Control Register 0 the code [00000001] as a wake-up
call to initiate a data acquisition. The MEMSIC device
should send an Acknowledge.
A STOP condition indicates the end of the write
operation.
Fourth cycle: The Master device sends a START
command followed by the MEMSIC device‟s seven bit
address, and finally the eighth bit set low to indicate a
WRITE. An Acknowledge should be send by the
MEMSIC device in response.
Fifth cycle: The Master device sends the MEMSIC
device‟s Status Register [00000110] as the address to
read.
Sixth cycle: The Master device sends a START
command followed by the MEMSIC device‟s seven bit
address, and finally the eighth bit set high to indicate a
READ. An Acknowledge should be send by the
MEMSIC device in response.
MEMSIC MMC3316xMT Rev.B Page 11 of 15 10/8/2012
Seventh cycle: The Master device cycles the SCL line.
This causes the Status Register data to appear on
SDA line. Continuously read the Status Register until
the Meas Done bit is set to „1‟.
Eighth cycle: The Master device sends a START
command followed by the MEMSIC device‟s seven bit
address, and finally the eighth bit set low to indicate a
WRITE. An Acknowledge should be send by the
MEMSIC device in response.
Ninth cycle: The Master device sends a [00000000]
(Xout LSB register address) as the register address to
read.
Tenth cycle: The Master device calls the MEMSIC
device‟s address with a READ (8th SCL cycle SDA line
high). An Acknowledge should be send by the
MEMSIC device in response.
Eleventh cycle: Master device continues to cycle the
SCL line, and each consecutive byte of data from the
X, Y and Z registers should appear on the SDA line.
The internal memory address pointer automatically
moves to the next byte. The Master device
acknowledges each. Thus:
Eleventh cycle: LSB of X channel.
Twelfth cycle: MSB of X channel.
Thirteenth cycle: LSB of Y channel.
Fourteenth cycle: MSB of Y channel.
Fifteenth cycle: LSB of Z channel.
Sixteenth cycle: MSB of Z channel.
Master ends communications by NOT sending an
„Acknowledge‟ and also follows with a „STOP‟
command.
EXAMPLE OF SET/RESET
First cycle: A START condition is established by the
Master Device followed by a call to the slave address
[0110xxx] with the eighth bit held low to indicate a
WRITE request. Note: [xxx] is determined by factory
programming and a total of 8 different addresses are
available.
Second cycle: After an acknowledge signal is received
by the master device (The MEMSIC device pulls the
SDA line low during the 9th SCL pulse), the master
device sends [00000111] as the target address
(Internal Control Register 0). The MEMSIC device
should acknowledge at the end (9th SCL pulse).
Third cycle: The Master device writes to the MEMSIC
device‟s Internal Control Register the code [00000001]
to prepare for SET action.*
A minimum of 50ms wait should be provided to allow
the MEMSIC device to finish its preparation for the
SET action.*
Forth cycle: The Master device writes to the MEMSIC
device‟s Internal Control 0 register the code [00100000]
as a wake-up call to initiate a SET action. MEMSIC
device should send an Acknowledge.
Fifth cycle: The Master device writes to the MEMSIC
device‟s Internal Control 0 register the code [00000000]
to stop the SET action. MEMSIC device should send
an Acknowledge.
A minimum of 50ms wait should be provided to allow
the MEMSIC device to finish its preparation for RESET
action.**
Sixth cycle: Master device writes to the MEMSIC
device‟s Internal Control 0 register the code [01000000]
as a wake-up call to initiate a RESET action. The
MEMSIC device should send an Acknowledge.**
Seventh cycle: The Master device writes to the
MEMSIC device‟s Internal Control 0 register the code
[00000000] to stop the RESET action. MEMSIC device
should send an Acknowledge.
A minimum of 50uS wait should be given to MEMSIC
device to finish RESET action before taking a
measurement.
Eighth cycle: Master device writes to internal MEMSIC
device memory the code “[00000001]” to start a take
measurement.
Note *: The SET preparation action is only required
when the part is inactive for a long time
(typically >5secends).
Note **: The RESET action can be skipped for most of
the applications
USING SET/RESET TO CALIBRATE NULL FIELD
OUTPUT
The integrated SET and RESET functions of the
MMC3316xMT enables the user to remove error
associated with Offset change as a function of
temperature, thereby enabling more precise heading
measurements over a wider temperature than
competitive technologies. The SET and RESET
functions effectively flip the magnetic sensing polarity
of the sensing elements of the device.
The following procedure and description show how
these functions can be used to obtain the most
accurate magnetic field information.
H is the applied magnetic field and Offset is the Null
Field output
1) Perform a SET. This sets the internal
magnetization of the sensing resistors in the
direction of the SET field.
2) Perform a MEASUREMENT. This measurement
will contain not only the sensors response to the
external magnetic field, H, but also the Offset; in
other words,
MEMSIC MMC3316xMT Rev.B Page 12 of 15 10/8/2012
Output1 = +H + Offset
3) Perform a RESET. This resets the internal
magnetization of the sensing resistors in the
direction of the RESET field, which is opposite to
the SET field (180o opposed).
4) Perform a MEASUREMENT. This measurement
will contain both the sensors response to the
external field and also the Offset. In other words,
Output2 = -H + Offset
5) Finally, calculate H by subtracting the two
measurements and dividing by 2,
This procedure effectively eliminates the Offset from
the measurement and therefore any changes in the
Offset over temperature.
Time between the Set/Measure and RESET/Measure
operation needs to be kept as short as possible to
minimize error induced by the applied magnetic field
changing between the two operations.
Note: To calculate and store the offset; add the two
measurements and divide by 2. This calculated offset
value can be subtracted from subsequent
measurements to obtain H directly from each
measurement.
MEMSIC MMC3316xMT Rev.B Page 13 of 15 10/8/2012
OPERATING TIMING
Operating Timing Diagram
Parameter
Symbol
Min.
Typ.
Max.
Unit
Time to operate device after Vdd valid
top
5.0
mS
Wait time from power on to SET/RESET
command
tFM
100
mS
Time to finish SET
tM1
50
mS
Time to finish RESET
tM2
50
mS
Time to measure magnetic field
tTM
10
mS
STORAGE CONDITIONS
Temperature: <30℃
Humidity: <60%RH
Period: 1 year (after delivery)
Moisture Sensitivity Level: 3
Bake Prior to Reflow: storage period more than 1 year, or humidity indicator card reads >60% at 23±5℃
Bake Procedure: refer to J-STD-033
Bake to Soldering: <1 week under 30℃/60%RH condition
VDD
M
T
R
T
R
T
R
M
T
R
tFM
top
I2C
tM
tTM
tM
tTM
tTM
tTM
M
T
R
Magnetize
Take measurement
Read data
Repeat T & R
Wait the device ready for next operation
MEMSIC MMC3316xMT Rev.B Page 14 of 15 10/8/2012
SOLDERING RECOMMENDATIONS
MEMSIC magnetic sensor is capable of withstanding an MSL3 / 260℃ solder reflow. Following is the reflow profile:
Max Gradient 2.8℃/s
260℃Peak Temperature For 10s
100
260Max
195
180180
50
Package Surface Temp(℃)
Time(s)
300 350 400 450250200150100500
300
250
200
150
100
50
0
Slope 2℃/s Max
Note:
Reflow is limited by 2 times
The second reflow cycle should be applied after device has cooled down to 25C (room temperature)
This is the reflow profile for Pb free process
The peak temperature on the sensor surface should be limited under 260C for 10 seconds.
Solder paste‟s reflow recommendation can be followed to get the best SMT quality.
If the part is mounted manually, please ensure the temperature could not exceed 260C for 10 seconds.
MEMSIC MMC3316xMT Rev.B Page 15 of 15 10/8/2012
PACKAGE DRAWING (LGA package)
10X0.3±0.05
10X0.26±0.05
2.0±0.1
3X0.52
1.56±0.05
2.0±0.1
1.52±0.05
SCL
VDD
CAP
C-
TEST
VDA
VPP
1±0.05
(BOTTOM VIEW)
(TOP VIEW)
Pin 1 marking
(SIDE VIEW)
502
XXX
1
2
3
5
4C+
VSASDA
6
7
8
10 9
LAND PATTERN
10X0.35±0.05
10X0.3±0.05
2.0±0.1
3X0.52
1.56±0.05
2.0±0.1
SCL
VDD
CAP
C-
C+
VSA SDA
VPP
VDA
TEST
1.52±0.05