16 Gauss 3-axis Magnetic Sensor, With I2C Interface MMC3316xMT Signal Path X Y-axis Sensor Signal Path Y Z-axis Sensor Signal Path Z Bridge Regulator Bandgap Reference ADC Reference Generator Timing Generation I2C Interface Magnetize Controller Fuses, Control Logic, Factory Interface FUNCTIONAL BLOCK DIAGRAM Contact Memsic for access to advanced calibration and tilt-compensation algorithms. APPLICATIONS : Electronic Compass GPS Navigation Assist Position Sensing DESCRIPTION: The MMC3316xMT is a complete 3-axis magnetic sensor with on-chip signal processing and integrated 2 I C bus. The device can be connected directly to a microprocessor, eliminating the need for A/D converters or timing resources. It can measure magnetic fields within the full scale range of 16 Gauss, with 2mG/LSB resolution and 2mG rms noise, enabling heading accuracies of <1 degree in electronic compass applications. Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its use, or for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of MEMSIC. MEMSIC MMC3316xMT Rev.B X-axis Sensor Measured Data Fully integrated 3-axis magnetic sensor and electronic circuits requiring fewer external components Superior Dynamic Range and Accuracy: 16G FSR with 14bit operation 2 mG/LSB Resolution 2 mG RMS noise Enables heading accuracy <1 Small, Low profile package 2.0x2.0x1.0mm SET/RESET function Allows for elimination of error due to Null Field output change over temperature Clears the sensors of residual magnetization resulting from strong external fields Low power consumption (100A @ 7Hz) 1A (max) power down function I2C Slave, FAST (400 KHz) mode 1.62V~3.6V wide power supply operation supported, 1.8V I/O compatibility. RoHS compliant Bridge bias FEATURES An integrated SET/RESET function provides for the elimination of error due to Null Field output change with temperature. In addition it clears the sensors of any residual magnetic polarization resulting from exposure to strong external magnets. The SET/RESET function can be performed for each measurement or periodically as the specific application requires. The MMC3316xMT is packaged in a small low profile LGA package (2.0 x 2.0 x 1.0 mm,) and with an operating temperature rang from -40C to +85C. 2 The MMC3316xMT provides an I C digital output with 400 KHz, fast mode operation. MEMSIC, Inc. One Technology Drive, Suite 325, Andover, MA01810, USA Tel: +1 978 738 0900 Fax: +1 978 738 0196 www.memsic.com Page 1 of 15 10/8/2012 SPECIFICATIONS: (Measurements @ 25C, unless otherwise noted; VDA = VDD= 1.8V unless otherwise specified) Parameter Field Range (Each Axis) Supply Voltage Conditions Sensitivity Change Over Temperature Null Field Output VDA VDD (I C interface) 1.62 1 1.62 1 1.8 1.8 7 measurements/second 60 0.01 -40 -55 100 16 Gauss 1.0 3 sweeps across 16 Gauss 3 sweeps across 16 Gauss 0.5 0.5 1.0 2.0 2.0 14 0.5 100 16 Gauss 16 Gauss -40~85C 16 Gauss 16 Gauss Null Field Output Change Over 4 Temperature Disturbing Field Maximum Exposed Field Typ Max 16 Total applied field 2 Supply Voltage rising time 2 Supply Current Power Down Current Operating Temperature Storage Temperature Linearity Error (Best fit straight line) Hysteresis Repeatability Error Alignment Error Transverse Sensitivity Total RMS Noise Output resolution 3 Heading accuracy Bandwidth Sensitivity Min -10 460 -0.2 8090 512 1100 8192 Gauss 3.6 3.6 5.0 160 1.0 85 125 3.0 5.0 1.0 +10 564 +0.2 8294 0.4 Delta from 25C 16 Gauss Units V V mS A A C C %FS %FS %FS degrees % mGauss bits degrees Hz % counts/Gauss ppm/C Gauss counts mGauss/C 25 10000 Gauss Gauss Note: 1. 1.62V is the minimum operation voltage, or VDA / VDD should not be lower than 1.62V. 2. Power consumption is proportional to how many measurements performed per second, for example, at one measurement per second, the power consumption will be 100A /7=14A . 3. MEMSIC product is with low noise and enables users to utilize heading accuracy to be 0.5 degree typical and 1.0degree maximum when using MEMSICs proprietary software or algorithm 4. The error can be eliminated by using SET and RESET to determine the true Null Field output for each measurement. MEMSIC MMC3316xMT Rev.B Page 2 of 15 10/8/2012 2 I C INTERFACE I/O CHARACTERISTICS (VDD=1.8V) Parameter Symbol Test Condition Min. Typ. Max. Unit Logic Input Low Level VIL -0.5 0.3* VDD V Logic Input High Level VIH 0.7*VDD VDD V Hysteresis of Schmitt input Vhys 0.2 Logic Output Low Level VOL Input Leakage Current Ii SCL Clock Frequency fSCL START Hold Time tHD;STA 0.6 S START Setup Time tSU;STA 0.6 S LOW period of SCL tLOW 1.3 S HIGH period of SCL tHIGH 0.6 S Data Hold Time tHD;DAT 0 Data Setup Time tSU;DAT 0.1 Rise Time tr From VIL to VIH 0.3 S Fall Time tf From VIH to VIL 0.3 S Bus Free Time Between STOP and START STOP Setup Time tBUF 1.3 S tSU;STO 0.6 S 0.1VDD<Vin<0.9VDD V 0.4 V -10 10 A 0 400 kHz 0.9 S S SDA tf tLOW tr tSU;DAT tf tHD;STA tSP tr tBUF SCL tHD;STA S tHD;DAT tHIGH tSU;STA Sr tSU;STO P S Timing Definition MEMSIC MMC3316xMT Rev.B Page 3 of 15 10/8/2012 *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the devices reliability. Marking illustration: 1 2 3 10 9 5 XX 02 X ABSOLUTE MAXIMUM RATINGS* Supply Voltage (VDD) .....................-0.5 to +3.6V Storage Temperature ................-55C to +125C Maximum Exposed Field ....................10000 Gauss 8 4 5 Pin Description: LGA Package Pin 1 2 3 Name VDA Vpp TEST 4 5 6 7 8 9 10 C+ CCAP SCL VDD SDA VSA Description Power Supply Factory Use Only, Leave Open Factory Use Only, Leave Open/No Connection Short together Connect to External Capacitor Serial Clock Line for I2C bus Power Supply for I2C bus Serial Data Line for I2C bus Connect to Ground I/O P NC NC I I I I P I/O P All parts are shipped in tape and reel packaging with 9000pcs per 13" reel or 3000pcs per 7" reel. Caution: ESD (electrostatic discharge) sensitive device. Ordering Guide: MMC3316xMT Number 5x 50 51 52 53 54 55 56 57 + + + 7 6 Part number MMC33160MT MMC33161MT MMC33162MT MMC33163MT MMC33164MT MMC33165MT MMC33166MT MMC33167MT st st "Number" means the 1 two digits of the 1 line in the rd st marking. The 3 digit in the 1 line represents Year Code nd 2 stands for 2012, the 2 line represents Lot Number. Small circle indicates pin one (1). THEORY: Package type: Code T Type LGA10 RoHS compliant Performance Grade: Code Performance Grade M Temp compensated Address code: 0~7 2 Code 7bit I C Address 0 0110000b 1 0110001b 2 0110010b 3 0110011b 4 0110100b 5 0110101b 6 0110110b 7 0110111b MEMSIC MMC3316xMT Rev.B The anisotropic magnetoresistive (AMR) sensors are special resistors made of permalloy thin film deposited on a silicon wafer. During manufacturing, a strong magnetic field is applied to the film to orient its magnetic domains in the same direction, establishing a magnetization vector. Subsequently, an external magnetic field applied perpendicularly to the sides of the film causes the magnetization to rotate and change angle. This effect causes the films resistance to vary with the intensity of the applied magnetic field. The MEMSIC AMR sensor is incorporated into a Wheatstone bridge configuration to maximize Signal to Noise ratio. A change in magnetic field produces a proportional change in differential voltage across the Wheatstone bridge. However, the influence of a strong magnetic field (more than 25 Gausses) in any direction could upset, or flip, the polarity of the film, thus changing the sensor characteristics. A strong restoring magnetic field must be applied momentarily to restore, or set, the sensor characteristics. The MEMSIC magnetic sensor has an on-chip magnetically coupled strap: a SET/RESET strap pulsed with a high current, to provide the restoring magnetic field. Page 4 of 15 10/8/2012 PIN DESCRIPTIONS: VDA - This is the supply input for the circuits and the magnetic sensor. The DC voltage should be between 1.62 and 3.6 volts. A 1uF by-pass capacitor is strongly recommended. VSA - This is the ground pin for the magnetic sensor. 2 SDA - This pin is the I C serial data line, and operates in FAST (400 KHz) mode. 2 SCL- This pin is the I C serial clock line, and operates in FAST (400 KHz) mode. 2 VDD - This is the power supply input for the I C bus, and is 1.8V compatible can be 1.62V to 3.6V. (16Gauss). Provide adequate distance from current carrying traces. Do not route current carrying traces under the sensor. Do not cover the sensor with magnetized material, for example, shield box, LCD, or battery. If there is a magnetized part on the top side of the PCB, do not place the sensor in the same location on the bottom side. Examples are batteries, speakers, vibrators or steel components. Please refer to MEMSIC application note: AN-200-200018 (MEMSIC Magnetic Sensor Hardware Design Layout Guideline for Electronic Device). TEST - Factory use only, Leave Open/No Connection. POWER CONSUMPTION CAP -Connect a 4.7uF low ESR (typically smaller than 0.2ohm) ceramic capacitor. The MEMSIC magnetic sensor consumes 100A (typical) at 1.8V with 7 measurements per second. The current is proportional to the number of measurements per second. For example, if only 2 measurements per second are performed, the current will be 100*2/7=28A. VPP - Factory use only, Leave Open C+, C- -Short together. 2 EXTERNAL CAPACITOR CONNECTION I C INTERFACE DESCRIPTION Power I A slave mode I C circuit has been implemented into the MEMSIC magnetic sensor as a standard interface for customer applications. The A/D converter and MCU functionality have been added to the MEMSIC sensor, thereby increasing ease-of-use, and lowering power consumption, footprint and total solution cost. 2 Power II VDA VSA SDA VDD 2 VPP The I C (or Inter IC bus) is an industry standard bi2 directional two-wire interface bus. A master I C device can operate READ/WRITE controls to an unlimited number of devices by device addressing. The MEMSIC magnetic sensor operates only in a slave mode, i.e. only responding to calls by a master device. SCL 1.0uF 2 I C BUS CHARACTERISTICS TEST C+ C- VDD CAP 10uF 4.7uF Rp Rp SDA (Serial Data Line) SCL (Serial Clock Line) (Top View) HARDWARE DESIGN CONSIDERATION Provide adequate separation distance from permanent magnets or devices which contain permanent magnets. The disturbing magnetic field plus the magnetic field to be measured must be within the measurement range of the device MEMSIC MMC3316xMT Rev.B Page 5 of 15 DEVICE 1 DEVICE 2 2 I C Bus 10/8/2012 2 The two wires in the I C bus are called SDA (serial data line) and SCL (serial clock line). In order for a data transfer to start, the bus has to be free, which is defined by both wires in a HIGH output state. Due to the open-drain/pull-up resistor structure and wired Boolean "AND" operation, any device on the bus can pull lines low and overwrite a HIGH signal. The data MEMSIC MMC3316xMT Rev.B on the SDA line has to be stable during the HIGH period of the SCL line. In other words, valid data can only change when the SCL line is LOW. 2 Note: Rp selection guide: 4.7Kohm for a short I C bus length (less than 4inches), and 10Kohm for a bus length less than 2inches. Page 6 of 15 10/8/2012 REGISTER MAP: Register Name Xout Low Xout High Yout Low Yout High Zout Low Zout High Status Internal control 0 Internal control 1 Product ID 0 R0 R1 R2 R3 Product ID 1 Address 00H 01H 02H 03H 04H 05H 06H 07H 08H 10H 1CH 1DH 1EH 1FH 20H Description Xout LSB Xout MSB Yout LSB Yout MSB Zout LSB Zout MSB Device status Control register 0 Control register 1 Product ID Factory used register Factory used register Factory used register Factory used register Product ID Register Details: Xout High, Xout Low Xout Low Addr: 00H Reset Value Mode 7 6 5 4 3 2 1 0 Xout[7:0] Xout[7:0] R 7 6 Xout High Addr: 01H Reserved Reset Value 2h0 Mode 14bits X-axis output, unsigned format. 5 4 3 2 Xout[13:8] Xout[13:8] 1 0 R Yout High, Yout Low Yout Low Addr: 02H Reset Value Mode 7 6 5 4 3 2 1 0 Yout[7:0] Yout[7:0] R 7 6 Yout High Addr: 03H Reserved Reset Value 2h0 Mode 14bits Y-axis output, unsigned format. 5 4 3 2 Yout[13:8] Yout[13:8] 1 0 R Zout High, Zout Low Zout Low Addr: 04H Reset Value Mode 7 6 7 6 Zout High Addr: 05H Reserved Reset Value 2h0 Mode 14bits Z-axis output, unsigned format. MEMSIC MMC3316xMT Rev.B 5 4 3 2 1 0 Zout[7:0] Zout[7:0] R 5 4 3 2 Zout[13:8] Zout[13:8] 1 0 R Page 7 of 15 10/8/2012 Status: Device Status Addr: 06H 7 6 Pump On NVW_Rd Done 4 3 5h0 Reset Value Mode Bit Name Meas Done 5 Reserved 2 NVM_Rd Done 0 1 Pump On 0 0 Meas Done 0 R Description Indicates measurement event is completed. This bit should be checked before reading the output Indicates the charge pump status Indicates the chip was able to successfully read its memory. Internal Control 0: Control Register 0 Addr: 07H Reset Value Mode Bit Name TM Cont Mode On CM Freq0 CM Freq1 No Boost SET RESET 7 6 5 4 3 2 1 0 reserved RESET SET No Boost CM Freq1 CM Freq0 TM 0 W 0 W 0 W 0 W 0 W 0 W Cont Mode On 0 W 0 W Description Take measurement, set 1 will initiate measurement. Writing "1" will enable the Continuous Measurement Mode. These bits determine how often the chip will take measurements in Continuous Measurement Mode. CM Freq1 CM Freq0 Frequency 0 0 50Hz 0 1 20Hz 1 0 20Hz 1 1 1Hz Factory-use Register, fixed to "0" Writing "1" will set the sensor by passing a large current through Set/Reset Coil Writing "1" will reset the sensor by passing a large current through Set/Reset Coil at a reversed direction Internal Control 1: Control Register 1 Addr: 08H Reset Value Mode Bit Name FSR0 FSR1 Res Sel0 Res Sel1 Filt Time Sel0 Filt Time Sel1 7 6 Reserved 2h0 W W 5 4 3 2 1 0 Filt Time Sel1 0 W Filt Time Sel0 0 W Res Sel1 Res Sel0 FSR1 FSR0 0 W 0 W 0 W 0 W Description Factory-use Register Factory-use Register Factory-use Register MEMSIC MMC3316xMT Rev.B Page 8 of 15 10/8/2012 R0, R1, R2, R3 R0 Addr: 1CH Reset Value Mode 7 6 5 4 3 Factory-use Register Factory-use Register R 2 1 0 R1 Addr: 1DH Reset Value Mode 7 6 5 4 3 Factory-use Register Factory-use Register R 2 1 0 R2 Addr: 1EH Reset Value Mode 7 6 5 4 3 Factory-use Register Factory-use Register R 2 1 0 R3 Addr: 1FH Reset Value Mode 7 6 5 4 3 Factory-use Register Factory-use Register R 2 1 0 Product ID 0: 7 6 5 Product ID 0 Addr: 10H Product ID0[2:0] Reset Value X X X Mode R R R 2 XXX: I C address code. 4 R 3 2 1 Factory-use Register Factory-use Register R R R 0 R Product ID 1: Product ID 1 Addr: 20H Reset Value Mode 7 6 5 0 R 0 R 0 R MEMSIC MMC3316xMT Rev.B 4 3 Product ID 1[7:0] 0 0 R R Page 9 of 15 2 1 0 1 R 0 R 1 R 10/8/2012 DATA TRANSFER POWER STATE A data transfer is started with a "START" condition and ended with a "STOP" condition. A "START" condition is defined by a HIGH to LOW transition on the SDA line while SCL line is HIGH. A "STOP" condition is defined by a LOW to HIGH transition on the SDA line 2 while the SCL line is held HIGH. All data transfer in I C system are 8-bits long. Each byte has to be followed by an acknowledge bit. Each data transfer involves a total of 9 clock cycles. Data is transferred starting with the most significant bit (MSB). MEMSIC MR Sensor will enter power down mode automatically after data acquisition is finished. After a START condition, the master device calls a specific slave device by sending its 7-bit address with th the 8 bit (LSB) indicating that either a READ or WRITE operation will follow, [1] for READ and [0] for WRITE. The MEMSIC device 7-bit device address is [0110xxx] where the three LSBs are pre-programmed into the MMC3316xMT by the factory and they are indicated on the package as shown in the previous section "Package Marking Illustration". A total of 8 different addresses can be pre-programmed into 2 MEMSIC device by the factory. This variation of I C address avoids a potential address conflict, either by ICs from other manufacturers or by other MEMSIC devices on the same bus The initial addressing of the slave is always followed by the master writing the number of the slave register to be read or written, so this initial addressing always indicates a WRITE operation by sending [0110xxx1]. After being addressed, the MEMSIC device being called should respond by an "Acknowledge" signal by pulling SDA line LOW. Subsequent communication bytes can either be: a) the data to be written to the device register, or b) Another START condition followed by the device address indicating a READ operation [0110xxx0], and then the master reads the register data. Multiple data bytes can be written or read to numerically sequential registers without the need of another START condition. Data transfer is terminated by a STOP condition or another START condition. Two detailed examples of communicating with the MEMSIC device are listed below for the actions of acquiring a magnetic field measurement and magnetizing the sensor. VDA OFF(0V) VDD OFF(0V) OFF(0V) 1.62~3.6V 1.62~3.6V OFF(0V) 1.62~3.6V 1.62~3.6V Power State OFF(0V), no power consumption OFF(0V), power consumption is less than 1uA. Power consumption is not predictable, not recommended state. Normal operation mode, device will enter into power down mode automatically after data acquisition is finished EXAMPLE MEASUREMENT First cycle: A START condition is established by the Master Device followed by a call to the slave address [0110xxx] with the eighth bit held low to indicate a WRITE request. Note: [xxx] is determined by factory programming and a total of 8 different addresses are available. Second cycle: After an acknowledge signal is received by master device (MEMSIC device pulls SDA line low th during 9 SCL pulse), the master device sends the address of Control Register 0 or [00000111] as the target register to be written. The MEMSIC device th should acknowledge at the end (9 SCL pulse, SCL pulled low). Third cycle: The Master device writes to the Internal Control Register 0 the code [00000001] as a wake-up call to initiate a data acquisition. The MEMSIC device should send an Acknowledge. A STOP condition indicates the end of the write operation. Fourth cycle: The Master device sends a START command followed by the MEMSIC devices seven bit address, and finally the eighth bit set low to indicate a WRITE. An Acknowledge should be send by the MEMSIC device in response. Fifth cycle: The Master device sends the MEMSIC devices Status Register [00000110] as the address to read. Sixth cycle: The Master device sends a START command followed by the MEMSIC devices seven bit address, and finally the eighth bit set high to indicate a READ. An Acknowledge should be send by the MEMSIC device in response. MEMSIC MMC3316xMT Rev.B Page 10 of 15 10/8/2012 Seventh cycle: The Master device cycles the SCL line. This causes the Status Register data to appear on SDA line. Continuously read the Status Register until the Meas Done bit is set to 1. Forth cycle: The Master device writes to the MEMSIC devices Internal Control 0 register the code [00100000] as a wake-up call to initiate a SET action. MEMSIC device should send an Acknowledge. Eighth cycle: The Master device sends a START command followed by the MEMSIC devices seven bit address, and finally the eighth bit set low to indicate a WRITE. An Acknowledge should be send by the MEMSIC device in response. Fifth cycle: The Master device writes to the MEMSIC devices Internal Control 0 register the code [00000000] to stop the SET action. MEMSIC device should send an Acknowledge. Ninth cycle: The Master device sends a [00000000] (Xout LSB register address) as the register address to read. Tenth cycle: The Master device calls the MEMSIC th devices address with a READ (8 SCL cycle SDA line high). An Acknowledge should be send by the MEMSIC device in response. Eleventh cycle: Master device continues to cycle the SCL line, and each consecutive byte of data from the X, Y and Z registers should appear on the SDA line. The internal memory address pointer automatically moves to the next byte. The Master device acknowledges each. Thus: Eleventh cycle: LSB of X channel. A minimum of 50ms wait should be provided to allow the MEMSIC device to finish its preparation for RESET action.** Sixth cycle: Master device writes to the MEMSIC devices Internal Control 0 register the code [01000000] as a wake-up call to initiate a RESET action. The MEMSIC device should send an Acknowledge.** Seventh cycle: The Master device writes to the MEMSIC devices Internal Control 0 register the code [00000000] to stop the RESET action. MEMSIC device should send an Acknowledge. A minimum of 50uS wait should be given to MEMSIC device to finish RESET action before taking a measurement. Eighth cycle: Master device writes to internal MEMSIC device memory the code "[00000001]" to start a take measurement. Twelfth cycle: MSB of X channel. Thirteenth cycle: LSB of Y channel. Note *: The SET preparation action is only required when the part is inactive for a long time (typically >5secends). Fourteenth cycle: MSB of Y channel. Fifteenth cycle: LSB of Z channel. Note **: The RESET action can be skipped for most of the applications Sixteenth cycle: MSB of Z channel. Master ends communications by NOT sending an Acknowledge and also follows with a STOP command. USING SET/RESET TO CALIBRATE NULL FIELD OUTPUT EXAMPLE OF SET/RESET First cycle: A START condition is established by the Master Device followed by a call to the slave address [0110xxx] with the eighth bit held low to indicate a WRITE request. Note: [xxx] is determined by factory programming and a total of 8 different addresses are available. Second cycle: After an acknowledge signal is received by the master device (The MEMSIC device pulls the th SDA line low during the 9 SCL pulse), the master device sends [00000111] as the target address (Internal Control Register 0). The MEMSIC device th should acknowledge at the end (9 SCL pulse). The integrated SET and RESET functions of the MMC3316xMT enables the user to remove error associated with Offset change as a function of temperature, thereby enabling more precise heading measurements over a wider temperature than competitive technologies. The SET and RESET functions effectively flip the magnetic sensing polarity of the sensing elements of the device. The following procedure and description show how these functions can be used to obtain the most accurate magnetic field information. H is the applied magnetic field and Offset is the Null Field output Third cycle: The Master device writes to the MEMSIC devices Internal Control Register the code [00000001] to prepare for SET action.* 1) Perform a SET. This sets the internal magnetization of the sensing resistors in the direction of the SET field. A minimum of 50ms wait should be provided to allow the MEMSIC device to finish its preparation for the SET action.* 2) Perform a MEASUREMENT. This measurement will contain not only the sensors response to the external magnetic field, H, but also the Offset; in other words, MEMSIC MMC3316xMT Rev.B Page 11 of 15 10/8/2012 Output1 = +H + Offset 3) 4) Perform a RESET. This resets the internal magnetization of the sensing resistors in the direction of the RESET field, which is opposite to o the SET field (180 opposed). Perform a MEASUREMENT. This measurement will contain both the sensors response to the external field and also the Offset. In other words, Output2 = -H + Offset 5) Finally, calculate H by subtracting the two measurements and dividing by 2, MEMSIC MMC3316xMT Rev.B This procedure effectively eliminates the Offset from the measurement and therefore any changes in the Offset over temperature. Time between the Set/Measure and RESET/Measure operation needs to be kept as short as possible to minimize error induced by the applied magnetic field changing between the two operations. Note: To calculate and store the offset; add the two measurements and divide by 2. This calculated offset value can be subtracted from subsequent measurements to obtain H directly from each measurement. Page 12 of 15 10/8/2012 OPERATING TIMING VDD I2C T M top tFM tM M Magnetize T Take measurement R Read data R tTM T R tTM T M R tTM T tM R tTM Repeat T & R Wait the device ready for next operation Operating Timing Diagram Parameter Symbol Min. Typ. Max. Unit Time to operate device after Vdd valid top 5.0 mS Wait time from power on to SET/RESET command tFM 100 mS Time to finish SET tM1 50 mS Time to finish RESET tM2 50 mS Time to measure magnetic field tTM 10 mS STORAGE CONDITIONS Temperature: Humidity: Period: <30 <60%RH 1 year (after delivery) Moisture Sensitivity Level: 3 Bake Prior to Reflow: storage period more than 1 year, or humidity indicator card reads >60% at 235 Bake Procedure: refer to J-STD-033 Bake to Soldering: <1 week under 30/60%RH condition MEMSIC MMC3316xMT Rev.B Page 13 of 15 10/8/2012 SOLDERING RECOMMENDATIONS MEMSIC magnetic sensor is capable of withstanding an MSL3 / 260 solder reflow. Following is the reflow profile: 300 260Max 250 pe Slo Max Gradient 2.8/s 200 2 195 180 Max /s Package Surface Temp() 260Peak Temperature For 10s 180 150 100 100 50 50 0 0 50 100 150 200 250 300 350 400 450 Time(s) Note: Reflow is limited by 2 times The second reflow cycle should be applied after device has cooled down to 25C (room temperature) This is the reflow profile for Pb free process The peak temperature on the sensor surface should be limited under 260C for 10 seconds. Solder pastes reflow recommendation can be followed to get the best SMT quality. If the part is mounted manually, please ensure the temperature could not exceed 260C for 10 seconds. MEMSIC MMC3316xMT Rev.B Page 14 of 15 10/8/2012 PACKAGE DRAWING (LGA package) (BOTTOM VIEW) 10X0.260.05 8 7 6 502 XXX 1 2 3 SDA VSA VDD VDA SCL VPP CAP TEST 4 5 C- 2.00.1 10 9 1.520.05 10X0.30.05 (TOP VIEW) Pin 1 marking C+ 3X0.52 1.560.05 10.05 (SIDE VIEW) 2.00.1 LAND PATTERN VSA SDA VPP TEST VDD SCL C+ C- CAP 2.00.1 VDA 1.520.05 10X0.350.05 10X0.30.05 3X0.52 1.560.05 2.00.1 MEMSIC MMC3316xMT Rev.B Page 15 of 15 10/8/2012