1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC817)
2. Package resin : UL flammability grade (94V-0)
■ Features
■ Agency approvals/Compliance
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
■ Applications
DIP 16pin (4-channel)
General Purpose
Photocoupler
1. 16pin DIP 4-channnel package
2. Double transfer mold package (ldeal for Flow Solder-
ing)
3. High collector-emitter voltage (VCEO : 80V)
4. Current transfer ratio (CTR : MIN. 50% at IF=5mA,
VCE=5V)
5. Several CTR ranks available
6. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
7. Lead-free and RoHS directive compliant
■ Description
PC847XJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-channel package, available in
SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
1Sheet No.: D2-A03202EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC847XJ0000F
Series
∗1-channel package type is also available.
(model No. PC817XJ0000F Series)
PC847XJ0000F Series
PC817
PC817
PC817
PC817
7.62±0.3
19.82±0.5
3.5±0.5 6.5±0.5
0.6±0.2
1.2±0.3
Date code
2.54±0.25
0.26±0.1
Epoxy resin 1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.35
±0.25
1234 5 6 7 8
11 1013141516 12
9
Factory identification
mark
Anode mark
■ Internal Connection Diagram
2
Sheet No.: D2-A03202EN
■ Outline Dimensions (Unit : mm)
PC817
PC817
PC817
PC817
7.62±0.3
θθ
θ : 0 to 13˚
19.82±0.5
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
0.5±0.1
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
Anode mark Factory identification
mark
Date code
2.54±0.25
1234 5 6 7 8
11 1013141516 12
9
Anode
Cathode
Emitter
Collector
16 15 14 13 12 11 10 9
1 3 5 7
2 4 6 8
911 13 15
10 12 14 16
1 2 3 4 5 6 7 8
1. Through-Hole [ex. PC847XJ0000F]
2. SMT Gullwing Lead-Form [ex. PC847XIJ000F]
PC847XJ0000F Series
Product mass : approx. 0.9g
Product mass : approx. 1.0g
Plating material : SnCu (Cu : TYP. 2%)
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.
3
repeats in a 20 year cycle
Sheet No.: D2-A03202EN
PC847XJ0000F Series
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A03202EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Peak forward voltage
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Transfer
charac-
teristics
Collector current
Collector-emitter saturation voltage
Isolation resistance
MIN.
−
−
−
−
2.5
6
−
5×1010
−
−
TYP.
1.2
−
30
−
−
−
−
0.1
1×1011
4
3
MAX.
1.4
3.0
250
100
−
−
30.0
0.2
−
18
18
Unit
V
V
V
V
pF
nA
mA
V
Ω
µs
µs
Symbol
VF
VFM
Ct
ICEO
BVCEO
BVECO
IC
VCE (sat)
tr
tf
RISO
Response time Rise time
Fall time
Input
Output
IF=20mA
IFM=0.5A
V=0, f=1kHz
Reverse current −−10 µAIRVR=4V
VCE=50V, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
80
IF=5mA, VCE=5V
DC500V, 40 to 60%RH
VCE=2V, IC=2mA, RL=100Ω
Cutt-off frequency −80 −kHzfCVCE=5V, IC=2mA, RL=100Ω, −3dB
Floating capacitance −0.6 1.0 pFCfV=0, f=1MHz
IF=20mA, IC=1mA
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
Rating
50
1
70
Reverse voltage VVR6
80
6
50
150
200
−30 to +100
−55 to +125
260
5.0 kV
4
PC847XJ0000F Series
Sheet No.: D2-A03202EN
■ Model Line-up
IC [mA]
(I
F
=5mA, V
CE
=5V, T
a
=25˚C)
2.5 to 30.0
4.0 to 13.0
PC847XJ0000F
PC847X5J000F
Through-Hole
6.5 to 20.0PC847X6J000F
10.0 to 30.0PC847X7J000F
4.0 to 20.0PC847X8J000F
6.0 to 30.0PC847X9J000F
4.0 to 30.0PC847X0J000F
Sleeve
25pcs/sleeve
PC847XIJ000F
PC847XI5J00F
PC847XI6J00F
PC847XI7J00F
PC847XI8J00F
PC847XI9J00F
PC847XI0J00F
SMT Gullwing
Model No.
Lead Form
Package
5
Please contact a local SHARP sales representative to inquire about production status.
PC847XJ0000F Series
Sheet No.: D2-A03202EN
Fig.6 Current Transfer Ratio vs. Forward
Current
Duty ratio
Pulse width≤100µs
Ta=25˚C
10
100
10−310−210−1
Peak forward current IFM (mA)
1
10 000
1 000
Fig.5 Peak Forward Current vs. Duty Ratio
6
PC847XJ0000F Series
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
50
40
30
20
10
−30 0 25 50 55 75 100 125
Fig.1 Forward Current vs. Ambient
Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
100
80
70
60
40
20
−30 0 25 50 55 75 100 125
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Total Power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Current transfer ratio CTR (%)
Forward current IF (mA)
0.1 1 10
0
800
700
600
500
400
300
200
100
VCE=5V
Ta=25˚C
Sheet No.: D2-A03202EN
Collector-emitter saturation voltage VCE (sat) (V)
Forward current IF (mA)
0
0
1
2
3
4
5
510
6
15
7mA
1mA
3mA
5mA
IC=0.5mA
Ta=25˚C
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
806040200−30 100
10−5
10−6
10−7
10−8
10−9
10−10
10−11
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
VCE=50V
Fig.11 Collector Dark Current vs. Ambient
Temperature
Relative current transfer ratio (%)
0
150
100
50
−40 0−20 20 40 60 80 100
Ambient temperature Ta (˚C)
IF=1mA,VCE=5V
IF=5mA,VCE=5V
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
Collector-emitter saturation voltage V
CE (sat)
(V)
IF=20mA
IC=1mA
Ambient temperature Ta (˚C)
−40 0−20 20 40 60 80 100
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
PC847XJ0000F Series
50˚C 25˚C
0˚C
0 0.5 1 1.5 2 2.5 3 3.5
10
100
1
−25˚C
Ta=75˚C
Forward current IF (mA)
Forward voltage VF (V)
Fig.7 Forward Current vs. Forward Voltage
0
0
5
1
10
15
20
25
30
23456789
20mA
10mA
5mA
Collector current IC (mA)
Collector-emitter voltage VCE (V)
IF=30mA
PC (MAX.)
Ta=25˚C
Fig.8 Collector Current vs. Collector-emitter
Voltage
Sheet No.: D2-A03202EN
Frequency f (kHz)
−20
0
1
−10
10010
1kΩ
100Ω
Voltage gain Av (dB)
RL=10kΩ
VCE=5V
IC=2mA
Ta=25˚C
Fig.15 Frequency Response
VCC
RLOutput
Please refer to the conditions in Fig.15.
RD
Fig.16 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
PC847XJ0000F Series
VCC
tf
tr
ts
90%
10%
td
Output
Input
RL
Input OutputRD
Please refer to the conditions in Fig.13.
VCE
Fig.14 Test Circuit for Response Time
0.01 0.1 1 10
10
0.1
1
100
Response time (µs)
VCE=2V
IC=2mA
Ta=25˚C
ts
td
tf
tr
Load resistance RL (kΩ)
Fig.13 Response Time vs. Load Resistance
Sheet No.: D2-A03202EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
● Design guide
● Recommended Foot Print (reference)
(Unit : mm)
PC847XJ0000F Series
2.2
2.54 2.54 2.54 2.54 2.54 2.54 2.54
1.7
8.2
Sheet No.: D2-A03202EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC847XJ0000F Series
Sheet No.: D2-A03202EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
● Presence of ODC
11
PC847XJ0000F Series
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
Sheet No.: D2-A03202EN
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
■ Package specification
12
(Unit : mm)
12.0
6.7
5.8
10.8
520
±2
PC847XJ0000F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
13
Sheet No.: D2-A03202EN
■ Important Notices
PC847XJ0000F Series
[E189]
