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DESCRIPTION
The PS2566-1 is optically coupled isolators containing GaAs light emitting diodes and an NPN silicon darlington
connected phototransistor.
The PS2566-1 is in a plastic DIP (Dual In-line Package) and the PS2566L-1 is lead bending type (Gull-wing) for
surface mount.
The PS2566L1-1 is lead bending type for long creepage distance.
The PS2566L2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• AC input response
• High Isolation voltage (BV = 5 000 Vr.m.s.)
• High current transfer ratio (CTR = 2 000% TYP.)
• High-speed switching (tr, tf = 100
µ
s TYP.)
• Ordering number of taping product: PS2566L-1-E3, E4, F3, F4, PS2566L2-1-E3, E4
• Safety standards
• UL approved: File No. E72422
• CSA approved: No. CA 101391
• BSI approved: No. 7112/7420
• SEMKO approved: No. 303059
• NEMKO approved: No. P03200272
• DEMKO approved: No. 312341
• FIMKO approved: No. FI 10620
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Telephone/FAX.
• FA/OA equipment
• Programmable logic controller
DATA SHEET
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
HIGH ISOLATION VOLTAGE
AC INPUT, DARLINGTON TRANSISTOR TYPE
MULTI PHOTOCOUPLER SERIES −NEPOC Series−
The mark shows major revised points.
Document No. PN10237EJ03V0DS (3rd edition)
Date Published March 2006 CP(K)
Printed in Japan
PHOTOCOUPLER
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
NEC Compound Semiconductor Devices, Ltd. 1991, 2006
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type (New package)
PS2566-1
3.5±0.3
4.15±0.43.2±0.4
2.54
1.25±0.15
0.50±0.10
0.25
M
4.6±0.35
6.5±0.5
0 to 15˚
7.62
0.25
+0.1
–0.05
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
DIP Type
PS2566-1
4.6±0.5
6.5±0.5
3.5±0.3
4.15±0.43.3±0.5
2.54
1.25±0.15 0.50±0.10
0.25
M
0 to 15˚
7.62
0.25
+0.1
–0.05
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
Data Sheet PN10237EJ03V0DS
2
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Lead Bending Type (New package)
PS2566L-1
0.25
M
4.6±0.35
6.5±0.5
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
Lead Bending Type
PS2566L-1
4.6±0.5
6.5±0.5
0.25
M
3.5±0.3
2.54
1.25±0.15
0.15
0.9±0.25
9.60±0.4
0.25
+0.1
–0.05
0.1
+0.1
–0.05
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
Data Sheet PN10237EJ03V0DS 3
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Lead Bending Type For Long Creepage Distance (New Package)
PS2566L1-1
0 to 15˚
0.25
+0.1
–0.05
10.16
2.54
0.25 M
0.50±0.1
1.25±0.15
3.85
±0.4
3.15
±0.35
3.5
±0.3 6.5±0.5
4.6±0.35
12
43
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
Lead Bending Type For Long Creepage Distance
PS2566L1-1
10.16
0.25
+0.1
–0.05
0 to 15˚
4.6±0.5
6.5±0.5
3.5±0.3
3.15±0.35 3.85±0.4
2.54
1.25±0.15
0.50±0.10
0.25
M
TOP VIEW
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
4. Collector
12
43
Data Sheet PN10237EJ03V0DS
4
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Lead Bending Type For Long Creepage Distance (Gull-Wing) (New Package)
PS2566L2-1
0.25 M
0.25
2.54
1.25±0.15
3.5±0.3
6.5±0.5
4.6±0.35
12
43
11.8
+0.2
–0.5
0.25
+0.1
–0.05
0.25±0.2
0.9±0.25
10.16
TOP VIEW
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
12
43
Lead Bending Type For Long Creepage Distance (Gull-Wing)
PS2566L2-1
4.6±0.5
6.5±0.5
3.5±0.3
2.54 0.25
1.25±0.15
0.25
M
0.9±0.25
0.25
+0.1
–0.05
10.16
11.8
+0.2
–0.5
0.25±0.2
TOP VIEW
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
4. Collector
12
43
Data Sheet PN10237EJ03V0DS 5
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
MARKING EXAMPLE
2566
NL601
J
Assembly Lot
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
No. 1 pin
Mark
Package
New PKG
Standard PKG
Made in Japan Made in Taiwan
N601
L
L
Data Sheet PN10237EJ03V0DS
6
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style Safety Standard
Approval
Application Part
Number *1
PS2566-1 PS2566-1-A Pb-Free Magazine case 100 pcs Standard products PS2566-1
PS2566L-1 PS2566L-1-A (UL, CSA, BSI,
PS2566L1-1 PS2566L1-1-A NEMKO, SEMKO,
PS2566L2-1 PS2566L2-1-A DEMKO, FIMKO
PS2566L-1-E3 PS2566L-1-E3-A Embossed Tape 1 000 pcs/reel approved)
PS2566L-1-E4 PS2566L-1-E4-A
PS2566L-1-F3 PS2566L-1-F3-A Embossed Tape 2 000 pcs/reel
PS2566L-1-F4 PS2566L-1-F4-A
PS2566L2-1-E3 PS2566L2-1-E3-A Embossed Tape 1 000 pcs/reel
PS2566L2-1-E4 PS2566L2-1-E4-A
PS2566-1-V PS2566-1-V-A Magazine case 100 pcs
DIN EN60747-5-2
PS2566L-1-V PS2566L-1-V-A
(VDE0884 Part2)
PS2566L1-1-V PS2566L1-1-V-A
approved products
PS2566L2-1-V PS2566L2-1-V-A (option)
PS2566L-1-V-E3 PS2566L-1-V-E3-A Embossed Tape 1 000 pcs/reel
PS2566L-1-V-E4 PS2566L-1-V-E4-A
PS2566L-1-V-F3 PS2566L-1-V-F3-A Embossed Tape 2 000 pcs/reel
PS2566L-1-V-F4 PS2566L-1-V-F4-A
PS2566L2-1-V-E3
PS2566L2-1-V-E3-A
Embossed Tape 1 000 pcs/reel
PS2566L2-1-V-E4
PS2566L2-1-V-E4-A
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet PN10237EJ03V0DS 7
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) IF 80 mA
Power Dissipation Derating
∆
PD/°C 1.5 mW/°C
Power Dissipation PD 150 mW
Peak Forward Current*1 IFP 1 A
Transistor Collector to Emitter Voltage VCEO 40 V
Emitter to Collector Voltage VECO 6 V
Collector Current IC 200 mA
Power Dissipation Derating
∆
PC/°C 2.0 mW/°C
Power Dissipation PC 200 mW
Isolation Voltage*2 BV 5 000 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +150 °C
*1 PW = 100
µ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10237EJ03V0DS
8
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = ±10 mA 1.17 1.4 V
Terminal Capacitance Ct V = 0 V, f = 1.0 MHz 100 pF
Transistor Collector to Emitter Dark
Current
ICEO VCE = 40 V, IF = 0 mA 400 nA
Coupled Current Transfer Ratio
(IC/IF)
CTR IF = ±1 mA, VCE = 2 V 200 2 000 %
CTR Ratio*1 CTR1/
CTR2
IF = 1 mA, VCE = 2 V 0.3 1.0 3.0
Collector Saturation
Voltage
VCE (sat) IF = ±1 mA, IC = 2 mA 1.0 V
Isolation Resistance RI-O VI-O = 1.0 kVDC 1011 Ω
Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF
Rise Time*2 tr VCC = 10 V, IC = 10 mA, RL = 100 Ω 100
µ
s
Fall Time*2 tf 100
*1 CTR1 = IC1/IF1, CTR2 = IC2/IF2
IF1
IF2
IC1
IC2
VCE
*2 Test circuit for switching time
V
CC
V
OUT
R
L
= 100 Ω
50 Ω
I
F
Pulse Input
PW = 1 ms
Duty Cycle = 1/10
Data Sheet PN10237EJ03V0DS 9
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
150
100
50
02550
75 100 125 150
10
1
100
1000
10 000
–50 –25 0 25 50 75 100
0.2
0.5
1
5
10
200
50
0.4
100
0.6 0.8 1.0 1.2 1.4 1.6
10 mA
5 mA
1 mA
0.5 mA
I
F
= 0.1 mA
0.2 mA
1.5 mW/˚C
V
CE
= 2 V
5 V
10 V
24 V
40 V
–1.0
80
–1.5
–40
–80
–60
0–0.5 0.5 1.51.0
0
–20
40
20
60
0.5
0.1
1
5
10
50
100
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
0˚C
–25˚C
–55˚C
+60˚C
+25˚C
T
A
= +100˚C
Diode Power Dissipation PD (mW)
Transistor Power Dissipation PC (mW)
Ambient Temperature T
A
(˚C)
Forward Current IF (mA)
Forward Voltage V
F
(V)
Collector to Emitter Dark Current ICEO (nA)
Collector Saturation Voltage V
CE(sat)
(V)
Ambient Temperature T
A
(˚C)
Ambient Temperature T
A
(˚C)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
Collector Current IC (mA) Forward Current IF (mA)
Forward Voltage V
F
(V)
FORWARD CURRENT vs.
FORWARD VOLTAGE
150
100
50
02550
75 100 125 150
2 mW/˚C
200
Remark The graphs indicate nominal characteristics.
Data Sheet PN10237EJ03V0DS
10
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
1.4
25
1.2
1.0
0.8
0.6
0.4
0.2
–50 0–25 50 75 100
8 000
0
1 000
2 000
3 000
4 000
5 000
6 000
7 000
VCE = 2 V
0.1 0.5 1 5 10 30
1 000
500
100
50
10
5
2
100
50 500 1 k 5 k
V
CC
= 5 V,
I
C
= 2 mA,
CTR = 2 280%
t
f
500
50
1 k300
10
100
1 000
5 000
10 000
5 k 10 k 50 k
1 500
2 000
2 500
3 000
0
500
1 000
V
CE
= 2 V
50 10010 500
V
CC
= 5 V,
I
F
= 1 mA,
CTR = 2 280%
t
d
t
s
30 500 100 k
t
f
t
s
t
r
t
d
t
r
0
20
40
60
80
100
120
140
160
246810
5 mA
2 mA
1 mA
I
F
= 0.5 mA
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 1 mA, V
CE
= 2 V
Forward Current I
F
(mA)
Ambient Temperature T
A
(˚C)
Load Resistance R
L
(Ω)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
Load Resistance R
L
(Ω)
Switching Time t ( s)
µ
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
Switching Time t ( s)
µ
Forward Current I
F
( A)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
µ
Collector Current IC (mA)
Collector to Emitter Voltage V
CE
(V)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
Sample A
B
C
DSample A
B
C
D
Remark The graphs indicate nominal characteristics.
Data Sheet PN10237EJ03V0DS 11
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
10 10
2
10
3
10
4
10
5
10
6
0.6
0
0.2
0.4
0.8
1.0
1.2
T
A
= 25
o
C
T
A
= 60
o
C
510
0.2 0.5 1 2 20 50 100 200
I
F
= 1 mA,
V
CE
= 2 V
–20
–15
–10
–5
0
R
L
= 100 Ω
Time (Hr)
CTR (Relative Value)
LONG TERM CTR DEGRADATION
Frequency f (kHz)
Normalized Gain G
V
FREQUENCY RESPONSE
I
F
= 1 mA (TYP.)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10237EJ03V0DS
12
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
TAPING SPECIFICATIONS (UNIT : mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
PS2566L-1-E3 PS2566L-1-E4
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
φ
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
254±2.0
80.0±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10237EJ03V0DS 13
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Tape Direction
PS2566L-1-F3 PS2566L-1-F4
Outline and Dimensions (Tape)
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
4.0±0.1
0.4
5.3±0.1
8.0±0.1
7.5±0.1
16.0±0.3
10.3±0.1
1.5
+0.1
–0
Outline and Dimensions (Reel)
Packing: 2 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
100±1.0
2.0±0.5
φ
φ
15.9 to 19.4
Outer edge of
flange
21.5±1.0
17.5±1.0
Data Sheet PN10237EJ03V0DS
14
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Tape Direction
PS2565L2-1-E3 PS2565L2-1-E4
Outline and Dimensions (Tape)
2.05±0.1
2.0±0.1
4.0±0.1 1.55±0.1
1.75±0.1
4.4±0.2
12.35±0.15
0.38
11.5±0.1
24.0±0.3
6.6±0.2
12.0±0.1
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
29.5±1.0
25.5±1.0
23.9 to 27.4
Outer edge of
flange
Data Sheet PN10237EJ03V0DS 15
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10237EJ03V0DS
16
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10237EJ03V0DS 17
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter Symbol Speck Unit
Application classification (DIN VDE 0109)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN IEC 68 Teil 1/09.80) 55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.2 × UIORM, Pd < 5 pC
UIORM
Upr
890
1 068
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices test)
Upr = 1.6 × UIORM, Pd < 5 pC
Upr 1 424 Vpeak
Highest permissible overvoltage UTR 8 000 Vpeak
Degree of pollution (DIN VDE 0109) 2
Clearance distance > 7.0 mm
Creepage distance > 7.0 mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1) CTI 175
Material group (DIN VDE 0109) III a
Storage temperature range Tstg –55 to +150 °C
Operating temperature range TA –55 to +100 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = 175°C (Tsi)
Tsi
Isi
Psi
Ris MIN.
175
400
700
109
°C
mA
mW
Ω
Data Sheet PN10237EJ03V0DS
18
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
M8E 00. 4 - 0110
The information in this document is current as of March, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
Data Sheet PN10237EJ03V0DS 19
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504
NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
For further information, please contact
PS2566-1,PS2566L-1,PS2566L1-1,PS2566L2-1
