1. General description
The TFF1012HN is an integrated downconverter for use in Low Noise Block (LNB)
convertors in a 10 .7 GHz to 12.75 GHz Ku band satellite receiver system.
2. Features and benefits
Low current consumption integrated pre-amplifier, mixer, buffer amplifier and
PLL synthesizer
Flat gain over frequency
Single 5 V supply pin
Low cost 25 MHz crystal
Crystal controlled LO frequency generation
Switched LO frequency (9.75 GHz and 10.6 GHz)
Low phase noise
Low spurious
Low external com p on e nt count
Alignment-free concept
ESD protection on all pins
3. Applications
Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2)
4. Quick reference data
TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
Rev. 1 — 10 October 2013 Product data sheet
'+94)1
Table 1. Quick reference data
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage RF input and IF output AC coupled [1] 4.5 5 5.5 V
ICC supply current RF input and IF output AC coupled [1] -52- mA
NFSSB single sideband noise figure - 9 - dB
fi(RF) RF input frequency low band 10.7 - 11.7 GHz
high band 11.7 - 12.75 GHz
Gconv conversion gain measured at low band fIF = 1450 MHz and
high band fIF =1625MHz -30- dB
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 2 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
[1] DC values.
5. Ordering information
6. Block diagram
s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB
s22 output reflection coefficient fo(IF) = 950 MHz to 2150 MHz; Z0=75-10 - dB
IP3ooutput third-order intercept point carrier power = 10 dBm (measured at output) - 17.5 - dBm
Table 1. Quick reference data …continued
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TFF1012HN DHVQFN16 plastic dual in-line compatible thermal enhanced ve ry thin quad flat
package; no leads;16 terminals; body 2.5 3.5 0. 85 mm SOT763-1
Fig 1. TFF1012HN block diagram
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TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 3 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
7. Functional diagram
8. Pinning information
8.1 Pinning
8.2 Pin description
Fig 2. Functional diagram
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Table 3. Pin description
Symbol Pin Description
GND 0 ground (exposed die pad)
RF_GND3 1 RF ground. Connect this pin to the exposed die pad landing.
RF_GND1 2 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
n.c. 3 not connected. Connect to RF on PCB. [1]
RF 4 RF input.
RF_GND2 5 RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 4 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
[1] The distance between the outer edges of pin 2 and 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50 line on
RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1012HN.
9. Limiting values
10. Recommended operating conditions
[1] For a 10.75 GHz LO frequency, select high band and use a crystal with frequency 10.75 GHz / 424 = 25.353774 MHz.
GND1 6 Ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
n.c. 7 not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.
LF 8 Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).
VREG 9 Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via
pin 7.
HB 10 High band / low band selection. Connect this pin to the tone detector or to a logic signal.
XO2 11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).
XO1 12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).
GND2 13 Ground. Connect this pin to the exposed die pad landing.
IF 14 IF output
IF_GND 15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.
VCC 16 Supply voltage
Table 3. Pin description …continued
Symbol Pin Description
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +6 V
VI(HB) input voltage on pin HB 0.5 +6 V
Tstg storage temperature 40 +125 C
Table 5. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 5 5.5 V
VI(HB) input voltage on pin HB 0 - 5.5 V
Tamb ambient temperature 40 +25 +85 C
Z0characteristic impedance - 50 -
fi(RF) RF input frequency low band 10.7 - 11.7 GHz
high band 11.7 - 12.75 GHz
fLO LO frequency low band - 9.75 - GHz
high band [1] -10.6- GHz
fo(IF) IF output frequency low band 0.95 - 1.95 GHz
high band 1.1 - 2.15 GHz
CL(xtal) crystal load capacitance - 10 - pF
ESR equivalent series resistance - - 40
fxtal crystal frequency - 25 - MHz
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 5 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
11. Thermal characteristics
12. Characteristics
[1] DC values.
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case 35 K/W
Table 7. Characteristics
VCC = 5 V; Tamb = 25
C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICC supply current RF input and IF output AC coupled [1] -52- mA
n(itg) integrated phase noise density integration offset frequency =
10kHzto13MHz;
loop bandwidth = crossover bandwidth
-1.4- RMS
NFSSB single sideband noise figure measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz -9- dB
Gconv conversion gai n measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz -30- dB
Gconv conversion gain variation over whole IF band - 2.0 - dB
in every 36 MHz band - 0.5 - dB
s11 input reflection coefficient fi(RF) = 10.7 GHz to 12.7 GHz - 10 - dB
s22 output reflection coefficient fo(IF) = 950 MHz to 2150 MHz; Z0=75-10 - dB
IP3ooutput third-order intercept point carrier power is 10 dBm (measured at
the output) - 17.5 - dBm
PL(1dB) output power at 1 dB gain compression - 6 - dBm
VIL(HB) LOW-level input voltage on pin HB - - 0.8 V
VIH(HB) HIGH-level input voltage on pin HB 2.0 - - V
Rpd(HB) pull-down resistance on pin HB 80 110 140 k
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 6 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
13. Application information
Fig 4. Application diag ra m of TFF 101 2HN
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Table 8. List of netnames
See Figure 4.
Netname Description
GH Gate voltage of 1st stage LNA. Horizontal polarization
DH Drain voltage of 1st stage LNA. Horizontal polarization
GV Gate voltage of 1st stage LNA. Vertical polarization
DV Drain voltage of 1st stage LNA. Vertical polarization
G2 Gate voltage of 2nd stage LNA
D2 Drain voltage of 2nd stage LNA
HB High band oscillator supply control
LB Low band oscillator supply control
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 7 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
Fig 5. LNB system block diagram with TFF1012HN
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TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 8 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
14. Package outline
Fig 6. Package outline SOT763-1
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TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 9 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
15. Abbreviations
16. Revision history
Table 9. Abbreviations
Acronym Description
CPW CoPlanar Waveguide
DVB-S Digital Video Broadcasting by Satellite
DVB-S2 Digital Video Broadcasting - Satellite - Second generation
ESD ElectroStatic Discharge
IF Intermediate Frequency
Ku band K-under band
LO Local Oscillator
PFD Phase Frequency Detector
pHEMT Pseudomorphic High Electron Mobil ity Transistor
PLL Phase-Locked Loop
V/T Voltage / Tone
XO Crystal Oscillator
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TFF1012HN v.1 20131010 Product data sheet - -
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 10 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental ,
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replacement of any products or rework charges) whether or not such
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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damage. NXP Semiconductors and its suppliers accept no liability for
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applications and ther efore such inclu sion and/or use is at the cu stomer’s own
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Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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NXP Semiconductors does not accept any liabili ty related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the obj ective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
TFF1012HN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 10 October 2013 11 of 12
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
Export control — This document as well as the item(s) described herein
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Non-automotive qualified products — Unless this data sheet expressly
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the product is not suitable for aut omo tive use. It i s neit her qua lif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
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liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors TFF1012HN
Integrated mixer oscillator PLL for satellite LNB
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 October 2013
Document identifier: TFF1012HN
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
8 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
8.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Recommended operating conditions. . . . . . . . 4
11 Thermal characteristics . . . . . . . . . . . . . . . . . . 5
12 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
13 Application information. . . . . . . . . . . . . . . . . . . 6
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
18 Contact information. . . . . . . . . . . . . . . . . . . . . 11
19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
