2010 Microchip Technology Inc. DS41302D
PIC12F609/615/617
PIC12HV609/615
Data Sheet
8-Pin, Flash-Based 8-Bit
CMOS Microcontrollers
*8-bit, 8-pin Devices Protected by Microchip’s Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U.S. and
foreign patents and applications may be issued or pending.
DS41302D-page 2 2010 Microchip Technology Inc.
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intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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2010 Microchip Technology Inc. DS41302D-page 3
PIC12F609/615/617/12HV609/615
High-Performance RISC CPU:
• Only 35 Instructions to Lea rn:
- All single-cycle instructions except branches
• Ope rati ng Speed:
- DC – 20 MHz oscillator/clock input
- DC – 200 ns instruction cycle
• Interrupt Capability
• 8-Level Deep Hardware Stack
• Direct, Indirect and Relative Addressing modes
S pecial Microcontroller Features:
• Precision Internal Oscillator:
- Factory calibrated to ±1%, typical
- Softwa re selectable frequency: 4 MHz or
8 MHz
• Power-Saving Sleep mode
• Volt a ge Range:
- PIC12F609/615/617: 2.0V to 5.5V
- PIC12HV609/615: 2.0V to user defined
maximum (see note)
• Indus tri al and Extended Tem pe ratu r e Range
• Power-on Reset (P OR)
• Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
• Brown-out Reset (BOR)
• Watchdog Timer (WDT) with independent
Oscillator for Reliable Operation
• Multiplexed Master Clear with Pull-up/Input Pin
• Programmable Code Protection
• High Endurance Flash:
- 10 0,000 write Flash endurance
- F lash r etention: > 40 y ears
• Self Read/ Write Program Memory (PIC12F617
only)
Low-Power Features:
• Standby Current:
- 50 nA @ 2.0V, typical
• Ope rati ng Curren t:
-11A @ 32 kHz, 2.0V, typical
-260A @ 4 MHz, 2.0V, typical
• Watchdog Timer Current:
-1A @ 2.0V, typical
Note: Voltage across the shunt regulator should
not exceed 5V.
Peripheral Feat ures:
• Shunt Voltage Regulator (PIC12HV609/615 only):
- 5 volt regulati on
- 4 mA to 50 mA shunt range
• 5 I/O Pins and 1 Input Only
• High Current Source/Sink for Direct LED Drive
- Interrupt-on-pin change or pins
- Individually programmable weak pull-ups
• Analog Comparator mo dule with:
- One analog comparator
- Programmable on-chip voltage reference
(CVREF) module (% of VDD)
- Comparator inputs and output externally
accessible
- Built-In Hysteresis (software selectable)
• Timer0: 8-Bit Timer/Counter with 8-Bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Timer1 Gate (cou nt enab le )
- Option to use OSC1 and OSC2 in LP mode
as Timer1 oscillator if INTOSC mode
selected
- Option to use system clock as Timer1
• In-C ircuit Seri al Prog ram mingTM (ICSPTM) via Two
Pins
PIC12F615/617/HV615 ONLY:
• Enhanced Capture, Compare, PWM module:
- 1 6-bit Capture, max. resolution 12.5 ns
- Compare, max. resolution 200 ns
- 10-bit PWM with 1 or 2 output channels, 1
output channel programmable “dead time,”
max. frequency 20 kHz, auto-shutdown
• A/D Converter:
- 10-bit resolution and 4 channels, samples
internal voltage references
• Timer2: 8-Bit Timer/Counter with 8-Bit Period
Register, Prescaler and Postscaler
8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC12F609/615/617/12HV609/615
DS41302D-page 4 2010 Microchip Technology Inc.
8-Pin Diagram, PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN)
TABLE 1: PIC12F609/HV609 PIN SUMMARY (PDIP, SOIC, MSOP, DFN)
Device
Program
Memory Data Me mo ry Self Read/
Self Write I/O 10-bit A/D
(ch) Comparators ECCP Timers
8/16-bit Voltage Range
Flash
(words) SRAM (bytes)
PIC12F609 1024 64 —50 1 —1/1 2.0V-5.5V
PIC12HV609 1024 64 —50 1 —1/1 2.0V-user defined
PIC12F615 1024 64 —5 4 1 YES 2/1 2.0V-5.5V
PIC12HV615 1024 64 —5 4 1 YES 2/1 2.0V-u ser defined
PIC12F617 2048 128 YES 5 4 1 YES 2/1 2.0V-5.5V
I/O Pin Comparators Timer Interrupts Pull-ups Basic
GP0 7CIN+ —IOC YICSPDAT
GP1 6 CIN0- — IOC Y ICSPCLK
GP2 5COUT T0CKI INT/IOC Y —
GP3(1) 4— —IOC Y(2) MCLR/VPP
GP4 3CIN1- T1G IOC YOSC2/CLKOUT
GP5 2 — T1CKI IOC Y OSC1/CLKIN
— 1 — — — — VDD
—8— ——— VSS
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
45
6
7
8
PIC12F609/
HV609
VSS
GP0/CIN+/ICSPDAT
GP1/CIN0-/ICSPCLK
GP2/T0CKI/INT/COUT
VDD
GP5/T1CKI/OSC1/CLKIN
GP4/CIN1-/T1G/OSC2/CLKOUT
GP3/MCLR/VPP
2010 Microchip Technology Inc. DS41302D-page 5
PIC12F609/615/617/12HV609/615
8-Pin Diagram, PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN)
TABLE 2: PIC12F615/617/HV615 PIN SUMMARY (PDIP, SOIC, MSOP, DFN)
I/O Pin Analog Comparator
sTimer CCP Interrupts Pull-ups Basic
GP0 7AN0 CIN+ —P1B IOC YICSPDAT
GP1 6 AN1 CIN0- — — IOC Y ICSPCLK/VREF
GP2 5AN2 COUT T0CKI CCP1/P1A INT/IOC Y —
GP3(1) 4— — T1G*— IOCY
(2) MCLR/VPP
GP4 3AN3 CIN1- T1G P1B* IOC YOSC2/CLKOUT
GP5 2 — — T1CKI P1A* IOC Y OSC1/CLKIN
— 1 — — — — — — VDD
—8 — — — — — — VSS
* Alternate pin function.
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
45
6
7
8
PIC12F615/
617/HV615
VSS
GP0/AN0/CIN+/P1B/ICSPDAT
GP1/AN1/CIN0-/VREF/ICSPCLK
GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
VDD
GP5/T1CKI/P1A*/OSC1/CLKIN
GP4/AN3/CIN1-/T1G/P1B*/OSC2/CLKOUT
GP3/T1G*/MCLR/VPP
* Alternate pin function.
PIC12F609/615/617/12HV609/615
DS41302D-page 6 2010 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ......................................................................................................................................................................... 7
2.0 Memory Organization.................................................. ...... .... ............... .... ............. ...... .......... ...... ...... ......... ...... ...... ...... ..... ...... .. 11
3.0 Flash Program Memory Self Read/Self Write Control (PIC12F617 only).................... .... .. ....... .... .... .. .... ....... ............................ 27
4.0 Oscillator Module ....................................................................................................................................................................... 37
5.0 I/O Port ...................................................................................................................................................................................... 43
6.0 Timer0 Module .......................................................................................................................................................................... 53
7.0 Timer1 Module with Gate Control .............................................................................................................................................. 57
8.0 Timer2 Module (PIC12F615/617/HV615 only) .......................................................................................................................... 65
9.0 Comparator Module ................................................................................................................................................................... 67
10.0 Analog-to-Digital Converter (ADC) Module (PIC12F615/617/HV615 only) .............. .... .. ......... .... .... .. .... ......... ........................... 79
11.0 Enhanced Capture/Compare/PWM (With Auto-Shutdown and Dead Band) Module (PIC12F615/617/HV615 only) ............... 89
12.0 Special Features of the CPU ............. .......... ........... .......... ................................ .......... ............................................................. 107
13.0 Voltage Regulator .................................................................................................................................................................... 127
14.0 Instr u ction Set Su mma ry ..... ........... .......... ........... ..................... .......... ..................... ............................................................... 129
15.0 Development Support ....................................... ......... .. .... .. .... ....... .... .. .... .. ......... .. .... .. .... ......................................................... 139
16.0 Electrical Specifications ........................................................................................................................................................... 143
17.0 DC and AC Characteristics Graphs and Tables ........................................................................ .... .......................................... 171
18.0 Pack a ging Information ... .......... ........... .......... ..................... ..................... ........... ..................................................................... 195
Appendix A: Data Sheet Revision History ............................................................. ........... .... ...... ....................................................... 203
Appendix B: Migrating from other PIC® Devices ........................ ........... .......... ........... .......... ........... ...... ..................... .......... ............. 203
Index................................................................................................................................................................................................. 205
The Micro chip Web Site ......... ............................... ........... ..................... ..................... .......... ............................................................. 209
Customer Change Notification Service ....................................................... ...... ................. ........ ....................................................... 209
Customer Support ............................................................................................................................................................................. 209
Reader Response ............................................................................................................................................................................. 210
Product Identification System ............................................................................................................................................................ 211
Worldwide Sa les and Service ............ ........... .......... ........... .......... ........... .......... ........... .......... ... ........................................................ 212
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2010 Microchip Technology Inc. DS41302D-page 7
PIC12F609/615/617/12HV609/615
1.0 DEVICE OVERVIEW
The PIC12F609/615/617/12HV609/615 devices are
covered by this data sheet. They are available in 8-pin
PDIP, SOIC, MSOP and DFN packages.
Block Diagrams and pinout descriptions of the devices
are as follows:
• PIC12F609/HV609 (Figure 1-1, Table 1-1)
• PIC12F615/617/HV615 (Figure 1-2, Table 1-2)
FIGURE 1-1: PIC12F 60 9/HV609 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
and Reference
T1G VDD
Block
CIN+
CIN0-
CIN1-
COUT
Comparator Voltage Reference
Absolute V oltage Reference
Shunt Regulator
(PIC12HV609 only)
PIC12F609/615/617/12HV609/615
DS41302D-page 8 2010 Microchip Technology Inc.
FIGURE 1-2: PIC12F615/617/HV615 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes and
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
VREF
and Reference
T1G VDD
Timer2
Block Shunt Regulator
(PIC12HV615 only)
Analog-To-Digital Converter
AN0
AN1
AN2
AN3
CIN+
CIN0-
CIN1-
COUT
ECCP
CCP1/P1A
P1B
P1A*
P1B*
Comparator Voltage Reference
Absolute V oltage Reference
* Altern ate pin func ti on.
** For the PIC12F617 only.
T1G*
2K X 14* *
and
128 Bytes**
2010 Microchip Technology Inc. DS41302D-page 9
PIC12F609/615/617/12HV609/615
TABLE 1-1: PIC12F609/HV609 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
GP0/CIN+/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN+ AN — Comparator non-inverting input
ICSPDAT S T C MOS Serial Programm ing Data I/O
GP1/CIN0-/ICSPCLK GP1 TTL CMOS General purpose I/O with prog. pull-up and int errupt -on-c hange
CIN0- AN —Comparator inverting input
ICSPCLK ST — Serial Programm ing Clock
GP2/T0CKI/INT/COUT GP2 ST CMOS General purpose I/O with prog. pull-up and interrupt-on-change
T0CKI ST — Timer0 clock input
INT ST — External Interrupt
COUT — CMOS Comparator output
GP3/MCLR/VPP GP3 TTL — General purpose input with interrupt-on-change
MCLR ST — Master Clear w/internal pull-up
VPP HV — Programming voltage
GP4/CIN1-/T1G/OSC2/
CLKOUT GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN1- AN —Comparator inverting input
T1G ST — Timer1 gate (count enable)
OSC2 — XTAL Crystal/Resonator
CLKOUT — CMOS FOSC/4 output
GP5/T1CKI/OSC1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
T1CKI ST — Timer1 clock input
OSC1 XTAL — Crystal/Resonator
CLKIN ST — External clock input/RC oscillator connection
VDD VDD Power — Positive supply
VSS VSS Power — Ground reference
Legend: AN=A nalog input or output CMOS= CMOS com patible input or output HV= High Voltage
ST=Schmitt Trigger input with CMOS levels TTL = TTL compatible input XTAL=Crystal
PIC12F609/615/617/12HV609/615
DS41302D-page 10 2010 Microchip Technology Inc.
TABLE 1-2: PIC12F615/617/HV615 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
GP0/AN0/CIN+/P1B/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN0 AN — A/ D Channel 0 input
CIN+ AN — Comparator non-inverting input
P1B — CMOS PWM output
ICSPDAT S T C MOS Serial Programm ing Data I/O
GP1/AN1/CIN0-/VREF/ICSPCLK GP1 TTL C MOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN1 AN — A/ D Channel 1 input
CIN0- AN —Comparator inverting input
VREF AN — Ext ernal Voltage Reference for A/D
ICSPCLK ST — Serial Programm ing Clock
GP2/AN2/T0CKI/INT/COUT/CCP1/
P1A GP2 ST CMO S General purpose I/O with prog. pull-up and interrupt-on-
change
AN2 AN — A/ D Channel 2 input
T0CKI ST — Timer0 clock input
INT ST — External Interrupt
COUT — CMOS Comparator output
CCP1 ST CMOS Capt ure input/Compare input/PWM output
P1A — CMOS PWM output
GP3/T1G*/MCLR/VPP GP3 TTL — General purpose input with interrupt-on-change
T1G* ST — Timer1 gate (count enable), alternate pin
MCLR ST — Master Clear w/internal pull-up
VPP HV — Programming voltage
GP4/AN3/CIN1-/T1G/P1B*/OSC2/
CLKOUT GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN3 AN — A/ D Channel 3 input
CIN1- AN —Comparator inverting input
T1G ST — Timer1 gate (count enable)
P1B* — CMOS PWM output, alternate pin
OSC2 — XTAL Crystal/Resonator
CLKOUT — CMOS FOSC/4 output
GP5/T1CKI/P1A*/OSC 1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
T1CKI ST — Timer1 clock input
P1A* — CMOS PWM output, alternate pin
OSC1 XTAL — Crystal/Resonator
CLKIN ST — External clock input/RC oscillator connection
VDD VDD Power — Positive supply
VSS VSS Power — Ground reference
* Alternate pin function.
Legend: A N=Analog in put or output CMOS= C MO S com patible input or output HV= High Voltage
ST=Schmitt Trigger input with CMOS levels TTL =TTL compatible input XTAL=Crystal
2010 Microchip Technology Inc. DS41302D-page 11
PIC12F609/615/617/12HV609/615
2.0 MEMORY ORGANIZATION
2.1 Program Memory Organization
The PIC12F609/615/617/12HV609/615 has a 13-bit
program counter capable of addressing an 8K x 14
progra m mem ory sp a ce. On ly the fi rst 1 K x 14 (0 000 h-
03FFh) for the PIC12F609/615/12HV609/615 is
physically implemented. For the PIC12F617, the first
2K x 14 (0000h-07FFh) is physically implemented.
Accessing a location above these boundaries will
cause a wrap-around within the first 1K x 14 space for
PIC12F609/615/12HV609/615 devices, and within the
first 2K x 14 space for the PIC12F617 device. The
Reset vector is at 0000h and the interrupt vector is at
0004h (see Figure 2-1).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC12F609/615/12HV609/615
FIGURE 2-2: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC12F617
2.2 Data Memory Organization
The data memory (see Figure 2-3) is partitioned into two
banks, which contain the General Purpose Registers
(GPR) and the Special Function Registers (SFR). The
Special Function Registers are located in the first 32
locations of each bank. Register locations 40h-7Fh in
Bank 0 are General Purpose Registers, implemented as
static RAM. For the PIC12F617, the register locations
20h-7Fh in Bank 0 and A0h-EFh in Bank 1 are general
purpose registers implemented as Static RAM. Register
locations F0h-FFh in Bank 1 point to addresses 70h-7Fh
in Bank 0. All other RAM is unimplemented and returns
‘0’ when read. The RP0 bit of the STATUS register is the
bank select bit.
RP0
0Bank 0 is selected
1Bank 1 is selected
PC<12:0>
13
0000h
0004h
0005h
03FFh
0400h
1FFFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Wraps to 0000h-03FFh
Note: The IRP and RP1 bits of the STATUS
register are reserved and should always be
maint ained as ‘0’s.
PC<12:0>
13
0000h
0004h
0005h
07FFh
Stack Level 1
Stack Level 8
Re set Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
On-Chip
Program
Memory
Wraps to 0000h-07FF h 0800h
1FFFh
PIC12F609/615/617/12HV609/615
DS41302D-page 12 2010 Microchip Technology Inc.
2.2.1 GENERAL PURPOSE REGISTER
FILE
The register file is organized as 64 x 8 in the
PIC12F609/615/12HV609/615, and as 128 x 8 in the
PIC12F617. Each register is accessed, either directly
or indirectly, through the File Select Register (FSR)
(see Section 2.4 “Indirect Addressing, INDF and
FSR Registers” ).
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the “core” are described in this section.
Those related to the operation of the peripheral features
are described in the section of that peripheral feature.
FIGURE 2-3: DATA MEMORY MAP OF
THE PIC12F60 9/HV 609
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented da ta memory locations, read as ‘0’.
Note 1: Not a physical register.
General
File
Address File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ANSEL
Accesses 70h-7Fh F0h
VRCON
CMCON0
OSCTUNE
40h
3Fh
CMCON1
EFh
T1CON
Purpose
Registers
64 Bytes
Accesses 70h-7Fh
6Fh
70h
2010 Microchip Technology Inc. DS41302D-page 13
PIC12F609/615/617/12HV609/615
FIGURE 2-4: DATA MEMORY MAP OF
THE PIC12F615/617/HV615
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented da ta memory locations, read as ‘0’.
Note 1: Not a physical register.
2: Used for the PIC12F617 only.
File
Address File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ADRESH
ADCON0
ADRESL
ANSEL
Accesses 70h-7Fh F0h
TMR2
T2CON
CCPR1L
CCPR1H
CCP1CON
PWM1CON
ECCPAS
VRCON
CMCON0
OSCTUNE
PR2
40h
3Fh
CMCON1
EFh
APFCON
General
Purpose
Registers
64 Bytes
Acc esses 70h-7Fh
6Fh
70h
PMCON1
(2)
PMCON2
(2)
PMADRL
(2)
PMADRH
(2)
PMDATL
(2)
PMDATH
(2)
General
Purpose
Registers
96 Bytes from
20h-7Fh(2) Unimplemented for
PIC12F615/HV615
General
Purpose
Registers
32 Bytes(2)
Unimplemented for
PIC12F615/HV615
BFh
C0h
PIC12F609/615/617/12HV609/615
DS41302D-page 14 2010 Microchip Technology Inc.
TABLE 2-1: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 115
01h TMR0 Timer0 Module’s Register xxxx xxxx 53, 115
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 115
03h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 18, 115
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 115
05h GPIO —— GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 43, 115
06h —Unimplemented — —
07h —Unimplemented — —
08h —Unimplemented — —
09h —Unimplemented — —
0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 115
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 2 0, 115
0Ch PIR1 — — — —CMIF——TMR1IF---- 0--0 22, 115
0Dh —Unimplemented — —
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 115
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 115
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 6 2, 115
11h —Unimplemented — —
12h —Unimplemented — —
13h —Unimplemented — —
14h —Unimplemented — —
15h —Unimplemented — —
16h —Unimplemented — —
17h —Unimplemented — —
18h —Unimplemented — —
19h VRCON CMVREN —VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116
1Ah CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 72, 116
1Bh — — — — —
1Ch CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 73, 116
1Dh —Unimplemented — —
1Eh —Unimplemented — —
1Fh —Unimplemented — —
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: Read only register.
2010 Microchip Technology Inc. DS41302D-page 15
PIC12F609/615/617/12HV609/615
TABLE 2-2: PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Val ue on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
01h TMR0 Timer0 Module’s Register xxxx xxxx 53, 116
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 116
03h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 18, 116
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
05h GPIO —— GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 43, 116
06h —Unimplemented — —
07h —Unimplemented — —
08h —Unimplemented — —
09h —Unimplemented — —
0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 20, 116
0Ch PIR1 — ADIF CCP1IF —CMIF—TMR2IFTMR1IF-00- 0-00 22, 116
0Dh —Unimplemented — —
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 116
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57, 116
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 62, 116
11h TMR2(3) Timer2 Module Register 0000 0000 65, 116
12h T2CON(3) — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 66, 116
13h CCPR1L(3) Capture/Compare/PWM Register 1 Low Byte XXXX XXXX 90, 116
14h CCPR1H(3) Capture/Compare/PWM Register 1 High Byte XXXX XXXX 90, 116
15h
CCP1CON
(3)
P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 89, 116
16h
PWM1CON
(3)
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 105,
116
17h ECCPAS(3) ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 102,
116
18h —Unimplemented — —
19h VRCON CMVREN —VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 76, 116
1Ah CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 72, 116
1Bh — — — — —
1Ch CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 73, 116
1Dh —Unimplemented — —
1Eh
ADRESH
(2, 3)
Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx 85, 116
1Fh ADCON0
(3)
ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 84, 116
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: Read only register.
3: PIC12F615/617/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 16 2010 Microchip Technology Inc.
TABLE 2-3: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
81h OPTION_RE
GGPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 19, 116
82h PCL Program Coun ter’s (PC) Least Significa nt Byt e 0000 0000 25, 116
83h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 18, 116
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
85h TRISIO —— TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 44, 116
86h —Unimplemented — —
87h —Unimplemented — —
88h —Unimplemented — —
89h —Unimplemented — —
8Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116
8Ch PIE1 — — — —CMIE——TMR1IE---- 0--0 21, 116
8Dh —Unimplemented — —
8Eh PCON — — — — — —PORBOR ---- --qq 23, 116
8Fh —Unimplemented — —
90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116
91h —Unimplemented — —
92h —Unimplemented — —
93h —Unimplemented — —
94h —Unimplemented — —
95h WPU(2) ——WPU5WPU4— WPU2 WPU1 WPU0 --11 -111 46, 116
96h IOC —— IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116
97h —Unimplemented — —
98h —Unimplemented — —
99h —Unimplemented — —
9Ah —Unimplemented — —
9Bh —Unimplemented — —
9Ch —Unimplemented — —
9Dh —Unimplemented — —
9Eh —Unimplemented — —
9Fh ANSEL — — — —ANS3— ANS1 ANS0 ---- 1-11 45, 117
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is ‘1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
2010 Microchip Technology Inc. DS41302D-page 17
PIC12F609/615/617/12HV609/615
TABLE 2-4: PIC12F615/617/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 25, 116
81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 19, 116
82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 25, 116
83h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 18, 116
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 25, 116
85h TRISIO —— TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 44, 116
86h —Unimplemented — —
87h —Unimplemented — —
88h —Unimplemented — —
89h —Unimplemented — —
8Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 25, 116
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 20, 116
8Ch PIE1 — ADIE CCP1IE —CMIE— TMR2IE TMR1IE -00- 0-00 21, 116
8Dh —Unimplemented — —
8Eh PCON — — — — — —PORBOR ---- --qq 23, 116
8Fh —Unimplemented — —
90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 41, 116
91h —Unimplemented — —
92h PR2 Timer2 Module Period Register 1111 1111 65, 116
93h APFCON — — — T1GSEL —— P1BSEL P1ASEL ---0 --00 21, 116
94h —Unimplemented — —
95h WPU(2) ——WPU5WPU4— WPU2 WPU1 WPU0 --11 -111 46, 116
96h IOC —— IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 46, 116
97h —Unimplemented — —
98h PMCON1(7) — — — — — WREN WR RD ---- -000 29
99h PMCON2(7) Program Memory Control Register 2 (not a physical register). ---- ---- —
9Ah PMADRL(7) PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 28
9Bh PMADRH(7) — — — — — PMADRH2 PMADRH1 PMADRH0 ---- -000 28
9Ch PMDATL(7) PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 28
9Dh PMDATH(7) — — Pr ogr am Memo ry Data Register High By te. --00 0000 28
9Eh ADRESL
(5, 6)
Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx 85, 117
9Fh ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 45, 117
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is ‘1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
5: Read only register.
6: PIC12F 615/617/ H V6 15 onl y.
7: PIC12F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 18 2010 Microchip Technology Inc.
2.2.2.1 STATUS Register
The S TATUS regi ste r, sho wn in Regis ter 2-1, co nt ains:
• the arithmetic s tatus of the ALU
• the Reset status
• the bank select bits for data memory (RAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabl ed. These bit s are set or clea red according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For exam ple, CLRF STATUS, will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits, see the Section 14.0
“Instruction Set Summary”.
Note 1: Bits IRP and RP1 of the STATUS register
are not used by the PIC12F609/615/617/
12HV609/615 and should be maintained
as clear. Use of these bits is not recom-
mended, since this may affect upward
compatibility with future products.
2: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction. See the SUBLW and SUBWF
instructions for examples.
REGISTER 2-1: STAT US: STATUS REGISTER
Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD ZDCC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: This bit is reserved and should be maintained as ‘0’
bit 6 RP1: This bit is reserved and should be maintained as ‘0’
bit 5 RP0: Register Bank Select bit (used for direct addressing)
1 = Bank 1 (80h – FFh)
0 = Bank 0 (00h – 7Fh)
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is
reversed.
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rot ate (RRF, RLF) in structions , this b it is loaded with eithe r the hi gh-order or low-orde r
bit of the source register.
2010 Microchip Technology Inc. DS41302D-page 19
PIC12F609/615/617/12HV609/615
2.2.2.2 OPTION Register
The OPTION register is a readable and writable
register, which contains various control bits to
configure:
• Timer0/WDT prescaler
• Extern al GP2 /INT interrup t
•Timer0
• Weak pull-ups on GPIO
Note: To achieve a 1:1 prescaler assignment for
Timer0, assign the prescaler to the WDT
by setting PSA bit to ‘1’ of the OPTION
register. See Section 6.1.3 “Software
Programmable Prescaler”.
REGISTER 2-2: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of GP2/INT pin
0 = Interrupt on falling edge of GP2/INT pin
bit 5 T0CS: Timer0 Clock Sou rce Select b it
1 = Transition on GP2/T 0CKI pin
0 = Internal instruction cycle clo ck (FOSC/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on hig h-to -low transitio n on GP 2/T0 CKI pin
0 = Increment on low-to-high transition on GP2/T0CKI pin
bit 3 PSA: Prescaler Assig nme nt bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TIMER0 RATE WDT RATE
PIC12F609/615/617/12HV609/615
DS41302D-page 20 2010 Microchip Technology Inc.
2.2.2.3 INTCON Register
The INTCON register is a readable and writable
register, which cont ains the various enabl e and flag bits
for TMR0 register ove rflo w, GPIO change a nd external
GP2/INT pin interrupts.
Note: Interru pt flag bi ts are s et when an interrupt
conditi on occ urs, regar dless o f the s tate of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GIE PEIE T0IE INTE GPIE T0IF INTF GPIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 T0IE: Timer0 Overflow Interru pt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: GP2/INT External Interrupt Enable bit
1 = Enables the GP2/INT external interrupt
0 = Disables the GP2/INT external interrupt
bit 3 GPIE: GPIO Change Interrupt Enable bit(1)
1 = Enables the GPIO change interrupt
0 = Disables the GPIO change interrupt
bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2)
1 = Timer0 register has overflowed (must be cleared in software)
0 = Timer0 register did not overflow
bit 1 INTF: GP2/INT External Interrupt Flag bit
1 = The GP2/INT external interrupt occurred (must be cleared in software)
0 = The GP2/INT external interrupt did not occur
bit 0 GPIF: GPIO Change Interrupt Flag bit
1 = When at least one of the GPIO <5:0> pins changed state (must be cleared in software)
0 = None of the GPIO <5:0> pins have changed state
Note 1: IOC register must also be enabled.
2: T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before
clearing T0IF bit.
2010 Microchip Technology Inc. DS41302D-page 21
PIC12F609/615/617/12HV609/615
2.2.2.4 PIE1 Register
The PIE1 register contains the Peripheral Interrupt
Enable bits, as shown in Register 2-4.
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
—ADIE
(1) CCP1IE(1) —CMIE —TMR2IE
(1) TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit(1)
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 CCP1IE: CCP1 Interrupt Enable bit(1)
1 = Enables the CCP1 interrupt
0 = Disabl es the CCP 1 interrupt
bit 4 Unimplemented: Read as ‘0’
bit 3 CMIE: Comp ara tor Interr upt Enable bit
1 = Enables the Comparator interrupt
0 = Disables the Comparator interrupt
bit 2 Unimplemented: Read as ‘0’
bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit(1)
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
PIC12F609/615/617/12HV609/615
DS41302D-page 22 2010 Microchip Technology Inc.
2.2.2.5 PIR1 Register
The PIR1 regist er cont ain s the P eriphera l Interr upt flag
bits, as shown in Register 2-5.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate in terr upt f lag bits ar e cle ar prior
to enabling an interrupt.
REGISTER 2-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
—ADIF
(1) CCP1IF(1) —CMIF —TMR2IF
(1) TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIF: A/D Interrupt Flag bit(1)
1 = A/D conversion complete
0 = A/D conversion has not completed or has not been started
bit 5 CCP1IF: CCP1 Interrupt Flag bit(1)
Capt ure mo de:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
bit 4 Unimplemented: Read as ‘0’
bit 3 CMIF: Comparator Interrupt Flag bit
1 = Comparator output has changed (must be cleared in software)
0 = Comparator output has not changed
bit 2 Unimplemented: Read as ‘0’
bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit(1)
1 = Timer2 to PR2 match occurred (must be cleared in software)
0 = Timer2 to PR2 match has not occurred
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Time r1 register ov erflowed (mus t be cleared in software)
0 = Time r1 has not overflowed
Note 1: PIC12F615/617/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
2010 Microchip Technology Inc. DS41302D-page 23
PIC12F609/615/617/12HV609/615
2.2.2.6 PCON Register
The Power Control (PCON) register (see Table 12-2)
cont ains flag bit s to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Watchdog Timer Reset (WDT)
• External MCLR Reset
The PCON reg ister also controls the software enable of
the BOR.
The PCON register bits are shown in Register 2-6.
REGISTER 2-6: PCON: POWER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0(1)
— — — — — —PORBOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0’
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: Reads as ‘0’ if Brown-out Reset is disabled.
PIC12F609/615/617/12HV609/615
DS41302D-page 24 2010 Microchip Technology Inc.
2.2.2.7 APFCON Register
(PIC12F615/617/HV615 only)
The Alternat e Pin Fun ct ion Control (APFC ON) reg is ter
is used to steer specific peripheral input and output
functions between different pins. For this device, the
P1A, P1B and Timer1 Gate functions can be moved
between different pins.
The APFCON register bits are shown in Register 2-7.
REGISTER 2-7: APFCON:ALTERNATE PIN FUNCTION REGISTER(1)
U-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
— — — T1GSEL —— P1BSEL P1ASEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 T1GSEL: TMR1 Input Pin Select bit
1 = T1G function is on GP3/T1G(2)/MCLR/VPP
0 = T1G function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
bit 3-2 Unimplemented: Read as ‘0’
bit 1 P1BSEL: P1B Output Pin Select bit
1 = P1B function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
0 = P1B function is on GP0/AN0/CIN+/P1B/ICSPDAT
bit 0 P1ASEL: P1A Output Pin Select bit
1 = P1A function is on GP5/T1CKI/P1A(2)/OSC1/CLKIN
0 = P1A function is on GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
Note 1: PIC12F615/617/HV615 only.
2: Alternate pin funct ion .
2010 Microchip Technology Inc. DS41302D-page 25
PIC12F609/615/617/12HV609/615
2.3 PCL and PCLATH
The Program Counte r (PC) is 13 bit s wide. The lo w byte
comes from the PCL register, which is a readable and
writable register . The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 2-5 shows the two
situations for the loading of the PC. The upper example
in Figure 2-5 shows how the PC is loaded on a write to
PCL (PCLATH<4:0> PCH). The lower example in
Figure 2-5 show s how the PC is loaded during a CALL or
GOTO instructi on (PC L ATH<4:3> PCH).
FIGURE 2-5: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
content s of th e PCLATH register. This allows the enti re
contents of the program counter to be changed by
writing the desire d upper 5 bit s to the PCLATH regi ster .
When the lower 8 bits are written to the PCL register,
all 13 bits of the program counter will change to the
values contained in the PCLATH register and those
being written to the PCL register.
A comput ed GOTO is a ccom pli shed by a ddi ng a n offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFF to 0x00 in the middle of
the ta ble, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the target location within the table.
For more information refer to Application Note AN556,
“Implementing a Table Read” (DS00556).
2.3.2 STACK
The PIC12F609/615/617/12HV609/615 Family has an
8-level x 13-bit wide hardware stack (see Figure 2-1).
The stack space is not part of either program or data
spac e and th e S t ack Point er is not readable or writ able.
The PC is PUSHed onto the stack when a CALL
instruc tion is exec uted or an interru pt causes a bra nch.
The st ack i s POPed in th e even t of a RETURN, RETLW
or a RETFIE instruction execution. PCLATH is not
affected by a PUSH or POP operation.
The st ack operates as a circular buffer. This means th at
af ter the st ack ha s be en PUSHed ei ght time s, th e nin th
push ove rwr ites the va lu e that was s tored fro m the firs t
push. The tenth p us h ov erw ri tes the second push (and
so on).
2.4 Indirect Addressing, INDF and
FSR Registers
The INDF register is no t a physica l register . Addr essing
the INDF register will caus e indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
Register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register indirectly
results in a no operation (although Status bits may be
affected). An effective 9-bit address is obtained by
concatenating the 8-bit FSR and the IRP bit of the
STATUS register, as shown in Figure 2-6.
A simple program to clear RAM location 40h-7Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1: INDIRECT ADDRES SING
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
ALU Result
GOTO, CALL
OPCODE <10:0>
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
PCL as
Destination
Note 1: There are no Status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interr upt add res s.
MOVLW 0x40 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR,7 ;all done?
GOTO NEXT ;no clear next
CONTINUE ;yes continue
PIC12F609/615/617/12HV609/615
DS41302D-page 26 2010 Microchip Technology Inc.
FIGURE 2-6: DIRECT/INDIRECT ADDRESS ING PIC12F609/615/617/12HV609/615
Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear.
2: Accesses in this area are mirrored back into Bank 0 and Bank 1.
Data
Memory
Indirect Addre ssingDirect Addressing
Bank Select Location Select
RP1(1) RP0 6 0
From Opcode IRP(1) File Select Register
70
Bank Select Location Select
00 01 10 11 180h
1FFh
00h
7Fh
Bank 0 Bank 1 Bank 2 Bank 3
NOT USED(2)
For memory map detail, see Figure 2-3.
2010 Microchip Technology Inc. DS41302D-page 27
PIC12F609/615/617/12HV609/615
3.0 FLASH PROGRAM MEMORY
SELF READ/SELF WRITE
CONTROL (FOR PIC12F617
ONLY)
The Flash program memory is readable and writable
during norma l operation (full VDD range). This memo ry
is not directly mapped in the register file space.
Instead, it is indirectly addressed through the Special
Function Registers (see Registers 3-1 to 3-5). There
are six SFRs used to read and write this memory:
•PMCON1
•PMCON2
•PMDATL
•PMDATH
• PMADRL
• PMADRH
When interfacing the program memory block, the
PMDATL and PMDATH registe rs for m a two-b yte word
which holds the 14-bit data for read/write, and the
PMADRL and PMADRH registers form a two-byte
word which holds the 13-bit address of the Flash loca-
tion being accessed. These devices have 2K words of
program Flash with an address range from 0000h to
07FFh.
The program memory allows single word read and a
by four word write. A four word write automatically
erases the row of the location and writes the new data
(erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range
of the device for byte or word operations.
When the device is code-protected, the CPU may
continue to read and write the Flash program me mory.
Depending on the settings of the Flash Program
Memory Enable (WRT<1:0>) bits, the device may or
may not be able to write certain blocks of the program
memory, however, reads of the program memory are
allowed.
When the Flash program memory Code Protection
(CP) bit in the Configuration Word register is enabled,
the program memory is code-protected, and the
device programmer (ICSP™) cannot access data or
program memory .
3.1 PMADRH and PMADRL Registers
The PMADRH and PMADRL registers can address up
to a maximum of 8K words of program memory.
When selecting a program address value, the Most
Significant Byte (MSB) of the address is written to the
PMADRH register and the Least Significant Byte
(LSB) is written to the PMADRL register.
3.2 PMCON1 and PMCON2 Registers
PMCON1 is the control register for the data program
memory acces ses.
Control bits RD and WR initiate read and write,
resp ectivel y. These bi ts cannot be cleared, only set in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental premature
termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear.
PMCON2 is not a physic al reg is ter. Reading PMCON2
will read all ‘0’s. The PMCON2 register is used
exclusively in the Flash memory write sequence.
PIC12F609/615/617/12HV609/615
DS41302D-page 28 2010 Microchip Technology Inc.
REGISTER 3-1: PMDATL: PROGRAM MEMORY DATA REGISTER
REGISTER 3-2: PMADRL: PROGRAM MEMORY ADDRESS REGISTER
REGISTER 3-3: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
REGISTER 3-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMDATL<7:0>: 8 Least Significant Address bits to Write or Read from Program Memory
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMADRL<7:0>: 8 Least Significant Address bits for Program Memory Read/Write Operation
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 PMDATH<5:0>: 6 Most Significant Data bits from Program Memory
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — — PMADRH2 PMADRH1 PMADRH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 3 Unimplemented: Read as ‘0’
bit 2-0 PMADRH<2:0>: Specifies the 3 Most Significant Address bits or high bits for program memory reads.
2010 Microchip Technology Inc. DS41302D-page 29
PIC12F609/615/617/12HV609/615
REGISTER 3-5: PMCON1 – PROGRAM MEMORY CONTROL REGISTER 1 (ADDRESS: 93h)
U-1 U-0 U-0 U-0 U-0 R/W-0 R/S-0 R/S-0
— — — — —WRENWR RD
bit 7 bit 0
bit 7 Unimplemented: Read as ‘1’
bit 6-3 Unimplemented: Read as ‘0’
bit 2 WREN: Program Memory Write Enable bit
1 = Allo ws write cycles
0 = Inhibits write to the EEPROM
bit 1 WR: Write Control bit
1 = Initiate s a w ri te c yc le t o pro gram me mo ry. (The bit is cle ared by hard w are when write is co mplete. The
WR bit can only be set (not cleared) in software.)
0 = Write cycle to the Flash memory is complete
bit 0 RD: Read Control bit
1 = Initiate s a prog ram m em ory read (T he read t ak es on e cy cl e. The R D is c lea red i n h ardware; the RD bi t
can only be set (not cleared) in software).
0 = Does not initiate a Flash memory read
Legend:
R = Readable bit W = Writable bi t U = Unimplemented bit, read as ‘0’
-n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown
PIC12F609/615/617/12HV609/615
DS41302D-page 30 2010 Microchip Technology Inc.
3.3 Reading the Flash Program
Memory
To read a program memory location, the user must
write two bytes of the address to the PMADRL and
PMADRH registers, and then set control bit RD
(PMCON1<0>). Once the read control bit is set, the
program memory Flash controller will use the second
instruc tion cy cle af ter to r ead the dat a. Thi s caus es the
second instruction immediately following the “BSF
PMCON1,RD” instruction to be ignored. The data is
available in the very next cycle in the PMDATL and
PMDATH registers; it can be read as two bytes in the
following instructions. PMDATL and PMDATH regis-
ters will hold this value until another read or until it is
written to by the user (during a write operation).
EXAMPLE 3-1: FLASH PROGRAM READ
BANKSEL PM_ADR ; Change STATUS bits RP1:0 to select bank with PMADRL
MOVLW MS_PROG_PM_ADDR ;
MOVWF PMADRH ; MS Byte of Program Address to read
MOVLW LS_PROG_PM_ADDR ;
MOVWF PMADRL ; LS Byte of Program Address to read
BANKSEL PMCON1 ; Bank to containing PMCON1
BSF PMCON1, RD ; PM Read
NOP ; First instruction after BSF PMCON1,RD executes normally
NOP ; Any instructions here are ignored as program
; memory is read in second cycle after BSF PMCON1,RD
;
BANKSEL PMDATL ; Bank to containing PMADRL
MOVF PMDATL, W ; W = LS Byte of Program PMDATL
MOVF PMDATH, W ; W = MS Byte of Program PMDATL
2010 Microchip Technology Inc. DS41302D-page 31
PIC12F609/615/617/12HV609/615
FIGURE 3-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,RD
Executed here INSTR (PC + 1)
Executed here NOP
Executed here
PC PC + 1 PMADRH,PMADRL PC+3 PC + 5
Flash ADDR
RD bit
INSTR (PC) PMDATH,PMDATL INSTR (PC + 3)
PC + 3 PC + 4
INSTR (PC + 4)
INSTR (PC + 1)
INSTR (PC - 1)
Executed here INSTR (PC + 3)
Executed here INSTR (PC + 4)
Execut ed her e
Flash DATA
PMDATH
PMDATL
Register
PMRHLT
PIC12F609/615/617/12HV609/615
DS41302D-page 32 2010 Microchip Technology Inc.
3.4 Writing the Flash Program
Memory
A word of the Flash program memory may only be
written to if the word is in an unprotected segment of
memory.
Flash program memory must be written in four-word
blocks. See Figure 3- 2 and Figure 3-3 for more details.
A block consists of four words with sequential
addresses, with a lower boundary defined by an
address, where PMADRL<1:0> = 00. All block writes to
program memory are done as 16-word erase by four-
word write operations. The write operation is edge-
aligned and cannot occur across boundaries.
To write program data, it must first be loaded into the
buffer registers (see Figure 3-2). This is accomplished
by first writin g the de stina tion ad dress to PMADR L and
PMADRH and then writing the data to PMDATL and
PMDATH. After the address and data have been set
up, then the following sequence of events must be
executed:
1. Write 55h, then AAh, to PMCON2 (Flash
program ming sequence ).
2. Set the WR c ont rol bit of the PMCON1 regis ter.
All four buffer register locations should be written to
with correct data. If less than four words are being
written to in the block of four words, then a read from
the program memory location(s) not being written to
must be performed. This takes the data from the
program location(s) not being written and loads it into
the PMDATL and PMDATH registers. Then the
sequence of events to transfer data to the buffer
registers must be executed.
To transfer data from the buffer registers to the program
memory, the PMADRL and PMADRH must point to the
last location in the four-word block (PMADRL<1:0> =
11). Then the following sequence of events must be
executed:
1. Write 55h, then AAh, to PMCON2 (Flash pro-
gramming sequence).
2. Set control bit WR of the PMCON1 register to
begin the write operation.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011). When the write is performed on the last
word (PMADRL<1:0> = 11), a block of sixte en words i s
auto matical ly eras ed and th e conte nt of th e four -word
buffer registers are written into the program memory.
After th e “BSF PMCON1,WR” inst r uct i on , th e p roc es so r
requires two cycles to set up the erase/write operation.
The us er m us t p la ce two NOP instructions after the WR
bit is set. Sinc e dat a is being written to bu ffe r regis ters,
the writing of the first three words of the block appears
to occur immediately. The processor will halt internal
operations for the typical 4 ms, only during the cycle in
which the erase takes place (i.e., the last word of the
sixteen-word block erase). This is not Sleep mode as
the clocks and peripherals will continue to run. After
the four-word write cycle, the processor will resume
operation with the third instruction after the PMCON1
write instruction. The above sequence must be
repeated for the higher 12 words.
3.5 Protection Against Spurious Write
There are conditions when the device should not write
to the program memory. To protect against spurious
writes, various mechanisms have been built in. On
power-up, WREN is c lea red. Als o, the Pow e r-up Timer
(64 ms duration) prevents program memory writes.
The write initiate sequence and the WREN bit help
prevent an accidental write during brown-out, power
glitch or software malfunction.
3.6 Operation During Code-Protect
When the device is code-protected, the CPU is able to
read and write unscrambled data to the program
memory. The test mode access is disabled.
3.7 Operation During Write Protect
When the program memory is write-protected, the
CPU can read and execute from the program memory.
The portions of program memory that are write pro-
tect ed ca n be modi fie d by th e CPU usi ng t he PM CON
registers, but the protected program memory cannot
be modified using ICSP mode.
2010 Microchip Technology Inc. DS41302D-page 33
PIC12F609/615/617/12HV609/615
FIGURE 3-2: BLOCK WRITES TO 2K FLASH PROGRAM MEMORY
FIGURE 3-3: FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION
14 14 14 14
Program Memory
Buffer Register
PMADRL<1:0> = 00
Buffer Register
PMADRL <1:0 > = 01
Buffer Register
PMADRL <1:0 > = 10
Buffer Register
PMADRL<1:0> = 11
PMDATLPMDATH
75 07 0
68
First word of block
to be written
If at a new row
to Flash
automatically
after this word
is wr itten
are transferred
Flash are eras ed,
then four buffers
sixteen words of
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,WR
Executed her e INSTR (PC + 1)
Executed here
PC + 1
Flash
INSTR PMDATH,PMDATL INSTR (PC+3)
INSTR
NOP
Executed here
Flash
Flash
PMWHLT
WR bit
Processor halted
PM Write Time
PMADRH,PMADRL PC + 3 PC + 4
INSTR (PC + 3)
Executed here
ADDR
DATA
Memory
Location
ignored
read
PC + 2
INSTR (PC+2)
(INSTR (PC + 2)
NOP
Executed here
(PC) (PC + 1)
PIC12F609/615/617/12HV609/615
DS41302D-page 34 2010 Microchip Technology Inc.
An example of the complete four-word write sequence
is shown in Example 3-2. The initial address is loaded
into the PMADRH and PMADRL register pair; the eight
words of data are loaded using indirect addressing.
EXAMPLE 3-2: W RITING TO FLASH PROGRAM MEMORY
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; This write routine assumes the following:
; A valid starting address (the least significant bits = '00')
; is loaded in ADDRH:ADDRL
; ADDRH, ADDRL and DATADDR are all located in data memory
;
BANKSEL PMADRH
MOVF ADDRH,W ; Load initial address
MOVWF PMADRH ;
MOVF ADDRL,W ;
MOVWF PMADRL ;
MOVF DATAADDR,W ; Load initial data address
MOVWF FSR ;
LOOP MOVF INDF,W ; Load first data byte into lower
MOVWF PMDATL ;
INCF FSR,F ; Next byte
MOVF INDF,W ; Load second data byte into upper
MOVWF PMDATH ;
INCF FSR,F ;
BANKSEL PMCON1
BSF PMCON1,WREN ; Enable writes
BCF INTCON,GIE ; Disable interrupts (if using)
BTFSC INTCON,GIE ; See AN576
GOTO $-2
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; Required Sequence
MOVLW 55h ; Start of required write sequence:
MOVWF PMCON2 ; Write 55h
MOVLW 0AAh ;
MOVWF PMCON2 ; Write 0AAh
BSF PMCON1,WR ; Set WR bit to begin write
NOP ; Required to transfer data to the buffer
NOP ; registers
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
BCF PMCON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts (comment out if not using interrupts)
BANKSEL PMADRL
MOVF PMADRL, W
INCF PMADRL,F ; Increment address
ANDLW 0x03 ; Indicates when sixteen words have been programmed
SUBLW 0x03 ; 0x0F = 16 words
; 0x0B = 12 words
; 0x07 = 8 words
; 0x03 = 4 words
BTFSS STATUS,Z ; Exit on a match,
GOTO LOOP ; Continue if more data needs to be written
2010 Microchip Technology Inc. DS41302D-page 35
PIC12F609/615/617/12HV609/615
TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PROGRAM MEMORY
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
PMCON1 —— — — —WRENWR RD---- -000 ---- -000
PMCON2 Program Memory Control Register 2 (not a physical register) ---- ---- ---- ----
PMADRL PMADRL7 PMADRL6 PMADRL5 PMADRL4 PMADRL3 PMADRL2 PMADRL1 PMADRL0 0000 0000 0000 0000
PMADRH — — — — — PMADRH2 PMADRH1 PMADRH0 ---- -000 ---- -000
PMDATL PMDATL7 PMDATL6 PMDATL5 PMDATL4 PMDATL3 PMDATL2 PMDATL1 PMDATL0 0000 0000 0000 0000
PMDATH —— PMDATH5 PMDATH4 PMDATH3 PMDATH2 PMDATH1 PMDATH0 --00 0000 --00 0000
Legend: x = unknown , u = unchanged, — = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by Program Memory module.
PIC12F609/615/617/12HV609/615
DS41302D-page 36 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 37
PIC12F609/615/617/12HV609/615
4.0 OSCILLATOR M ODU LE
4.1 Overview
The Oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 4-1
illustrates a block diagram of the Oscillator module.
Clock sources can be configured from external
oscilla tors, quartz crystal resonators , ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured with a choice of
two selectable speeds: internal or external system clock
source.
The Os cillator mod ule can be c onfigured in one of eig ht
clock modes.
3. EC – External clock with I/O on O SC2/CLKOU T.
4. LP – 32 kHz Low-Power Crystal mode.
5. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode.
6. HS – High Gain Crystal or Ceramic Resonator
mode.
7. RC – External Resistor-Capacitor (RC) with
FOSC/4 output on OSC2/CLKOUT.
8. RCIO – External Resistor-Capacitor (RC) with
I/O on OSC2/CLKOUT.
9. INTOSC – Internal oscillator with FOSC/4 output
on OSC2 and I/O on OSC1/CLKIN.
10. INTOSCIO – Internal oscillator with I/O on
OSC1/CLKIN and OSC2/CLKOUT.
Clock Source modes are configured by the FOSC<2:0>
bits in the Configuration Word register (CONFIG). The
Internal Oscillator module provides a selectable
system clock mode of either 4 MHz (Postscaler) or
8 MHz (INTOSC).
FIGURE 4-1: PIC ® MCU CLOCK SOURCE BLOCK DIAGRAM
(CPU and Peripherals)
OSC1
OSC2
Sleep
External Oscillator
LP, XT, HS, RC, RCIO, EC
System Clock
MUX
FOSC<2:0>
(Configuration Word Register)
Internal Oscillator
INTOSC
8 MHz
Postscaler
4 MHz
INTOSC
IOSCFS<7>
PIC12F609/615/617/12HV609/615
DS41302D-page 38 2010 Microchip Technology Inc.
4.2 Clock Source Modes
Clock Source modes can be classified as external or
internal.
• Extern al C lock m odes re ly on exte rnal c ircuitry fo r
the clock source. Examples are: Oscillator mod-
ules (EC mode), quartz crystal resonators or
ceramic resonators (LP, XT and HS modes) and
Resistor-Capacitor (RC) mode circuits.
• Internal clock sources are contained internally
within the Oscillator module. The Oscillator
module has two selectable clock frequencies:
4 M Hz and 8 MHz
The syste m cl oc k can be selec ted betw ee n ex tern al or
internal clock sources via the FOSC<2:0> bits of the
Configuration Word register.
4.3 External Clock Modes
4.3.1 OSCILLATOR START-UP TIMER
(OST)
If the Oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
cryst al res onator o r ce ramic res onator, has st arte d and
is providing a stable system clock to the Oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 4-1.
TABLE 4-1: OSCILLATOR DELAY EXAMPLES
4.3.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 4-2 shows the pin
connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 4-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Switch From Switch To Frequency Oscillator Delay
Sleep/POR INTOSC 125 kHz to 8 MHz Oscillator Warm-Up Delay (TWARM)
Sleep/POR EC, RC DC – 20 MHz 2 instructi on cycles
Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST)
OSC1/CLKIN
OSC2/CLKOUT(1)
I/O
Clock from
Ext. System PIC® MCU
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview”.
2010 Microchip Technology Inc. DS41302D-page 39
PIC12F609/615/617/12HV609/615
4.3.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 a nd OSC2 (Figur e 4-3). The mod e selects a low ,
medium or high gain setting of the internal inverter-
amplifi er to support vari ous resonator typ es and spee d.
LP Oscillator mode selects the lowest gain setting of
the internal inverter-amplifier. LP mode current
consum ption is the least of the three modes. This mode
is designed to drive only 32.768 kHz tuning-fork type
crystals (watch crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current c onsumption is the medium of the three mo des.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of
the internal inverter-amplifier. HS mode current
consumption is the highest of the three modes. This
mode is best suited for resonators that require a high
drive setting.
Figure 4-3 and Figure 4-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
FIGURE 4-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 4-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheet s for sp ecifi catio ns an d reco mmen ded
application.
2: Always veri fy os ci lla tor performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator de sign assistance, refer ence
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator OSC2/CLKOUT
PIC12F609/615/617/12HV609/615
DS41302D-page 40 2010 Microchip Technology Inc.
4.3.4 EXTERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 4-5 shows the
external RC mode connections.
FIGURE 4-5: EXTERNAL RC MODES
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes an additional general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resi stor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packa ging vari ations in c apacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
4.4 Internal Clock Modes
The Oscillator module provides a selectable system
clock source of either 4 MHz or 8 MHz. The selectable
frequency is configured through the IOSCFS bit of the
Configuration Word.
The frequency of the internal oscill ator can be trimmed
with a calibration value in the OSCTUNE register.
4.4.1 INTOSC AND INTOSCIO MODES
The INTOSC and INTOSCIO modes configure the
internal oscillators as the system clock source when
the devi ce is pr ogrammed using the o scillato r selectio n
or the FOSC<2:0> bits in the Configuration Word
register (CONFIG). See Section 12.0 “Special
Features of the CPU” for more information.
In INTOSC mode , OSC1/CLKIN i s availab le for genera l
purpose I/O. OSC2/CLKOUT outputs the selected
internal oscillator fre quency divide d by 4. The CLKO UT
signal may be used to provide a clock for external
circuitry, synchronization, calibration, test or other
application requirements.
In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT
are available for general purpose I/O.
OSC2/CLKOUT(1)
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 o r
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.
2: Output depen ds upon RC or RCIO Clock
mode.
I/O(2)
2010 Microchip Technology Inc. DS41302D-page 41
PIC12F609/615/617/12HV609/615
4.4.1.1 OSCTUNE Register
The oscillator is factory calibrated but can be adjusted
in software by writing to the OSCTUNE register
(Register 4-1).
The default value of the OSCTUNE register is ‘0’. The
value is a 5-bit two’s complement number.
When the OSCTUNE register is modified, the frequenc y
will begin shifting to the new frequency. Code execution
continues during this shif t. There is no indication that the
shift has occurred.
TABLE 4-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
REGISTER 4-1: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 TUN<4:0>: Frequency Tuning bits
01111 = Maximu m frequency
01110 =
•
•
•
00001 =
00000 = Oscillator module is running at the calibrated frequency.
11111 =
•
•
•
10000 = Minimum fre quency
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets(1)
CONFIG(2) IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — —
OSCTUNE ——— TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by oscillators.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: See Configuration Word register (Register 12-1) for operation of all register bits.
PIC12F609/615/617/12HV609/615
DS41302D-page 42 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 43
PIC12F609/615/617/12HV609/615
5.0 I/O PORT
There are as many as six general purpose I/O pins
available. Depending on which peripherals are enabled,
some or all of t he pins may not be available as general
purpose I /O. In gen eral, when a per ipheral i s enabled,
the associated pin may not be used as a general
purpose I/O pin.
5.1 GPIO and the TRISIO Registers
GPIO is a 6-bi t wide p ort wi th 5 bi directio nal an d 1 inp ut-
only pin. The corresponding data direction register is
TRISIO (Register 5-2). Setting a TRISIO bit (= 1) will
make the corresponding GPIO pin an input (i.e., disable
the output driver). Clearing a TRISIO bit (= 0) will make
the corresponding GPIO pin an output (i.e., enables
output driver and put s the conten ts of the ou tput latch on
the selected pin). The exception is GP3, which is input
only and its TRIS bit will always read as ‘1’. Example 5-
1 show s ho w to i niti ali ze G PIO .
Reading the GPIO register (Register 5-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a po rt implies that the
port pins are read, this value is modified and then
written to the PORT data latch. GP3 reads ‘0’ when
MCLRE = 1.
The TRISIO register controls the direction of the
GPIO pins, even when they are being used as analog
inputs. The user must ensure the bits in the TRISIO
register are maintai ned set when usin g them as analo g
input s. I/O pin s co nfigure d as analo g inpu t alw ays read
‘0’.
EXAMPLE 5-1: INITIALI ZING GPIO
Note: GPIO = PORTA
TRISIO = TRISA
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’ and cannot generate an interrupt.
BANKSEL GPIO ;
CLRF GPIO ;Init GPIO
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O, ADC clock
;setting ‘don’t care’
MOVLW 0Ch ;Set GP<3:2> as inputs
MOVWF TRISIO ;and set GP<5:4,1:0>
;as outputs
REGISTER 5-1: GPIO: GPIO REGISTER
U-0 U-0 R/W-x R/W-x R-x R/W-x R/W-x R/W-x
—— GP5 GP4 GP3 GP2 GP1 GP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 GP<5:0>: GPIO I/O Pin bit
1 = GPIO pin is > VIH
0 = GPIO pin is < VIL
PIC12F609/615/617/12HV609/615
DS41302D-page 44 2010 Microchip Technology Inc.
5.2 Additional Pin Functions
Every GPIO pin on the PIC12F609/615/617/12HV609/
615 has an interrupt-on-change option and a weak pull-
up option. The next three sections describe these
functions.
5.2.1 ANSEL REGISTER
The ANSEL register is used to configure the Input
mode of an I/O pin to analog. Setting the appropriate
ANSEL bit hi gh wil l ca us e all digi t al read s on the pi n to
be rea d as ‘0’ and allow analog functions on the pin to
operate correctly.
The state of the ANSEL bits has no affect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affec ted port.
5.2.2 WEAK PULL-UPS
Each of the GPIO pins, ex cept GP3, has an indivi dually
configurable internal weak pull-up. Control bits WPUx
enable or disable each pull-up. Refer to Register 5-5.
Each weak pull-up is automatically turned off when the
port pin is configured as an output. The pull-ups are
disabled on a Power-on Reset by the GPPU bit of the
OPTION register). A weak pull-up is automatically
enabled for GP3 when configured as MCLR and
disabled when GP3 is an I/O. There is no software
control of the MCLR pull-up.
5.2.3 INTERRUPT-ON-CHANGE
Each GPIO pin is individually configurable as an
interrupt-on-change pin. Control bits IOCx enable or
disable the interrupt function for each pin. Refer to
Register 5-6. The interrupt-on-change is disabled on a
Power-on Reset.
For enabled interrupt-on-change pins, the values are
comp ared with the old val ue latch ed on the la st read of
GPIO. Th e ‘mismatch’ o utputs of t he last read are OR’d
together to set the GPIO Change Interrupt Flag bit
(GPIF) in the INTCON register (Register 2-3).
This interrupt can wake the device from Sleep. The
user, in the Interrupt Service Routine, clears the
interrupt by :
a) Any rea d of GPIO AND Cle ar fla g bi t GP IF. Thi s
will end the mi sm atc h con dit ion;
OR
b) Any write of GPIO AND Clear flag bit GPIF will
end the mismatch condition;
A mismatch condition will continue to set flag bit GPIF.
Reading GPIO will end the mismatch condition and
allow flag bit GPIF to be cleared. The latch holding the
last read value is not affected by a MCLR nor BOR
Reset. Af ter the se res ets, the GPIF fl ag will contin ue to
be set if a mismatch is present.
REGISTER 5-2: TRISIO: GPIO TRI-STATE REGISTER
U-0 U-0 R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1
—— TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 TRISIO<5:0>: GPIO Tri-State Control bit
1 = GPIO pin configured as an input (tri-stated)
0 = GPIO pin configured as an output
Note 1: TRISIO<3> always reads ‘1’.
2: TRISIO<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
2010 Microchip Technology Inc. DS41302D-page 45
PIC12F609/615/617/12HV609/615
REGISTER 5-3: ANSEL: ANALOG SELECT REGISTER (PIC12F609/HV609)
U-0 U-0 U-0 U-0 R/W-1 U-0 R/W-1 R/W-1
— — — —ANS3— ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimpleme nt ed bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as ‘0’
bit 3 ANS3: Analog Select Between Analog or Di gital Func tion on Pi n GP 4
1 = Analog input. Pin is assi gn ed as analog in pu t(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 2 Unimplemented: Read as ‘0’
bit 1 ANS1: Analog Select Between Analog or Digital Function on Pin GP1
1 = Analog input. Pin is ass igned as analog input.(1)
0 = Digital I/O. Pin is assigned to port or special function.
bit 0 ANS0: Analog Select Between Analog or Digital Function on Pin GP0
0 = Digital I/O. Pin is assigned to port or special function.
1 = Analog input. Pin is ass igned as analog input.(1)
Note 1: Setting a pin to an ana log in put autom ati cal ly di sables th e digi tal inp ut ci rc ui t ry, w ea k pul l -u ps, and i nt er ru pt -o n-
change i f av ail abl e. The corresp onding TRIS bit mu st be set to Input mo de i n or der to allow external control of
the voltage on th e pi n.
REGISTER 5-4: ANSEL: ANALOG SELECT REGISTER (PIC12F615/617/HV615)
U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
— ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimpleme nt ed bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-4 ADCS<2:0>: A/D Conversion Cloc k Select bits
000 = FOSC/2
001 = FOSC/8
010 = FOSC/32
x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max)
100 = FOSC/4
101 = FOSC/16
110 = FOSC/64
bit 3-0 ANS<3:0>: Ana l og S e lec t B et wee n Anal og or Di gital Func tion on Pi ns GP 4, GP 2, GP1 , GP0 , r es pe ct iv el y.
1 = Analog input. Pin is assi gn ed as analog in pu t(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an ana log in put autom ati cal ly di sables th e digi tal inp ut ci rc ui t ry, w ea k pul l -u ps, and i nt er ru pt -o n-
change i f av ail abl e. The corresp onding TRIS bit mu st be set to Input mo de i n or der to allow external control of
the voltage on th e pi n.
PIC12F609/615/617/12HV609/615
DS41302D-page 46 2010 Microchip Technology Inc.
REGISTER 5-5: WPU: WEAK PULL-UP GPIO REGISTER
U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1
—— WPU5 WPU4 — WPU2 WPU1 WPU0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 WPU<5:4>: We ak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
bit 3 WPU<3>: Weak Pull-up Register bit(3)
bit 2-0 WPU<2:0>: We ak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global GPPU must be enabled for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0).
3: The GP3 pull-up is enabl ed when conf igured as MCLR in the Configuration Word, otherwise it is disabled
as an input and reads as ‘0’.
4: WPU<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
REGISTER 5-6: IOC: INTERRUPT-ON-CHANGE GPIO REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— IOC5 IOC4 IOC3 IOC2 IOC1 IOC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOC<5:0>: Interrupt-on-change GPIO Control bit
1 = Interrupt-on-change enabled
0 = Interrupt-on-change disabled
Note 1: Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized.
2: IOC<5:4> always reads ‘1’ in XT, HS and LP Oscill ator mo des .
2010 Microchip Technology Inc. DS41302D-page 47
PIC12F609/615/617/12HV609/615
5.2.4 PIN DESCRIPTIONS AND
DIAGRAMS
Each GPIO pin is multiplexed with other functions. The
pins and their combined f unc tio ns a r e bri efl y de sc ribe d
here. For specific information about individual funct ions
such as the Comparator or the ADC, refer to the
appropriate section in this data sheet.
5.2.4.1 GP0/AN0(1)/CIN+/P1B(1)/ICSPDAT
Figure 5-1 shows th e dia gram fo r this pin. T he GP0 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• an analog non-inverting input to the comparator
• a PWM output(1)
• In-C ircuit S erial Progr amming data
5.2.4.2 GP1/AN1(1)/CIN0-/VREF(1)/ICSPCLK
Figur e 5-1 show s th e diag ram for th is pin . T he GP1 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• an analog inverting input to the comparator
• a voltage reference input for the ADC(1)
• In-Circuit Serial Programming clock
FIGURE 5-1: BLOCK DIAGRAM OF GP<1:0>
Note 1: PIC12F615/617/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To Comparator
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator m ode and ANSEL determines Analog In put mode.
2: Set has priority over Reset.
3: PIC12F615/617/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP<5:0> pins (GP0)
Write ‘ 0’ to GBIF GP<5:2, 0> pins (GP1)
PIC12F609/615/617/12HV609/615
DS41302D-page 48 2010 Microchip Technology Inc.
5.2.4.3 GP2/AN2(1)/T0CKI/INT/COUT/
CCP1(1)/P1A(1)
Figure 5-2 shows th e dia gram fo r this pin. T he GP2 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(1)
• the clock inpu t for TMR0
• an external edge triggered interrupt
• a digital output from Comparator
• a Capture input/Comp are inp ut/PW M outp ut(1)
• a PWM output(1)
FIGURE 5-2: BLOCK DIAGRAM OF GP2
Note 1: PIC12F615/617/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To INT
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator mode and ANSEL determines Analog Input mode.
2: Set has priority over Reset.
3: PIC12F615/617/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP< 5 :3, 1:0> pins
Write ‘ 0’ to GBIF
0
1
C1OE
C1OE
Enable
To Timer0
2010 Microchip Technology Inc. DS41302D-page 49
PIC12F609/615/617/12HV609/615
5.2.4.4 GP3/T1G(1, 2)/MCLR/VPP
Figure 5-3 shows th e dia gram fo r this pin. T he GP3 pin
is configurable to function as one of the following:
• a general purpose input
• a Timer1 gate (count enable), alternate pin(1, 2)
• as Master Clear Reset with weak pull-up
FIGURE 5-3: BLOCK DIAGRAM OF GP3
Note 1: Altern ate pin funct ion .
2: PIC12F615/617/HV615 only.
VSS
D
Q
CK
Q
D
EN
Q
Data Bus
RD GPIO
RD
GPIO
WR
IOC
RD
IOC
Reset MCLRE
RD
TRISIO VSS
D
EN
Q
MCLRE
VDD
Weak
MCLRE
Q1
Input
Pin
Interrupt-on-
Change
S(1)
R
Q
From other
Write ‘0’ to GBIF
Note 1: Set has priority over Reset
GP<5:4, 2:0> pins
PIC12F609/615/617/12HV609/615
DS41302D-page 50 2010 Microchip Technology Inc.
5.2.4.5 GP4/AN3(2)/CIN1-/T1G/
P1B(1, 2)/OSC2/CLKOUT
Figure 5-4 shows th e dia gram fo r this pin. T he GP4 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC(2)
• Comparator inverting input
• a Timer1 gate (count enable)
• PWM output, alternate pin(1, 2)
• a crystal/ reso na tor con nec tio n
• a clock output
FIGURE 5-4: BLOCK DIAGRAM OF GP4
Note 1: Alternate pin function.
2: PIC 12F615/ 617/HV615 onl y.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Analog
Input Mode
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
FOSC/4
To A/D Converter(5)
Oscillator
Circuit
OSC1
CLKOUT
0
1
CLKOUT
Enable
Enable
Analog(3)
Input Mode
GPPU
RD GPIO
To T1G
INTOSC/
RC/EC(2)
CLK(1)
Modes
CLKOUT
Enable
Note 1: CLK modes are XT, HS, LP, TMR1 LP and CLKOUT Enable.
2: With CLKOUT option.
3: Analog Input mode comes from ANSEL.
4: Set has priority over Reset.
5: PIC12F615/617/HV615 only.
Q1
I/O Pin
Interrupt-on-
Change
S(4)
R
Q
From other
Write ‘0’ to GBIF
GP<5, 3:0> pins
2010 Microchip Technology Inc. DS41302D-page 51
PIC12F609/615/617/12HV609/615
5.2.4.6 GP5/T1CKI/P1A(1, 2)/OSC1/CLKIN
Figure 5-5 shows th e dia gram fo r this pin. T he GP5 pin
is configurable to function as one of the following:
• a general purpose I/O
• a Timer1 clock input
• PWM output, alternate pin(1, 2)
• a crystal/resonator connection
• a clock input
FIGURE 5-5: BLOCK DIAGRAM OF GP5
Note 1: Alternate pin function.
2: PIC12F615/617/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
To Timer1
INTOSC
Mode
RD GPIO
INTOSC
Mode
GPPU
OSC2
Note 1: Timer1 LP O scillator enabled.
2: Set has priority over Reset.
TMR1LPEN(1)
Oscillator
Circuit
Q1
I/O Pin
Interrupt-on-
Change
S(2)
R
Q
From other
GP<4:0> pins
Write ‘0’ to GBIF
PIC12F609/615/617/12HV609/615
DS41302D-page 52 2010 Microchip Technology Inc.
TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH GPIO
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL —ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 0000 -0-0
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC —— IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
GPIO —— GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --u0 u000
TRISIO —— TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
WPU —— WPU5 WPU4 WPU3 WPU2 WPU1 WPU0 --11 1111 --11 -111
T1CON T1GINV TMR1GE TICKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
CCP1CON(1) P1M —DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
APFCON(1) — — — T1GSEL —— P1BSEL P1ASEL ---0 --00 ---0 --00
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by GPIO.
Note 1: PIC12F615/6 17/HV615 only.
2010 Microchip Technology Inc. DS41302D-page 53
PIC12F609/615/617/12HV609/615
6.0 T IMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 8-bit prescaler (shared with Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on over flow
Figure 6-1 is a block diagram of the Timer0 module.
6.1 Timer0 Operation
When use d as a tim er, the Timer0 modul e can be used
as either an 8-bit timer or an 8-bit counter.
6.1.1 8-BIT TIMER MODE
When used as a timer, the Timer0 module will
increment every instruction cycle (without prescaler).
Timer mode is selected by clearing the T0CS bit of the
OPTION register to ‘0’.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
6.1.2 8-BIT COUNTER MODE
When used as a counter, the Timer0 module will
increment on every rising or falling edge of the T0CKI
pin. The incrementing edge is determined by the T0SE
bit of the OPTION register . Counter mode is selected by
setting the T0CS bit of the OPTION register to ‘1’.
FIGURE 6-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
Note: The value writ ten to the T MR0 register can
be adju sted, in o rder to ac count for th e two
instruction cycle delay when TMR0 is
written.
T0CKI
T0SE
pin
TMR0
Watchdog
Timer
WDT
Time-out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
2: WDTE bit is in the Configuration Word register .
0
1
0
1
0
1
8
8
8-bit
Prescaler
0
1
FOSC/4
PSA
PSA
PSA
Sync
2 TCY
PIC12F609/615/617/12HV609/615
DS41302D-page 54 2010 Microchip Technology Inc.
6.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignme nt is contro lled by the PSA bit o f the OPTION
register. To assign the p res ca ler t o Timer0, the PSA bit
must be cleared to a ‘0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
select able via th e PS<2:0> bits of the OPTION registe r .
In order to have a 1:1 prescaler value for the Timer0
module, the prescaler must be assigned to the WDT
module.
The prescaler is not readable or writable. When
assigned to the T im er0 module, all instructions writing to
the TMR0 register will clear the prescaler.
When the prescaler is assigned to WDT, a CLRWDT
instruction will clear the prescaler along with the WDT.
6.1.3.1 Switching Prescaler Between
Timer0 and WDT Modules
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values . When chan gin g th e presca le r ass ig nme nt fro m
Timer0 to the WDT module, the instruction sequence
shown in Example 6-1, must be executed.
EXAMPLE 6-1: CHANGING PRESCALER
(TIMER0 WDT)
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be execute d (see Example 6-2).
EXAMPLE 6-2: CHANGING PRESCA LER
(WDT TIMER0)
6.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit must be
cleared in softw are. The Timer0 interrupt enable is the
T0IE bit of the INTCON register.
6.1.5 USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Count er mo de, the syn chronization
of the T0CKI input and the Timer0 register is
accomplished by samp ling the prescaler ou tput on the
Q2 and Q4 cycles of the internal phase clocks.
Therefore, the high and low periods of the external
clock source must meet the timing requirements as
shown in Section 16.0 “Electrical Specifications”.
BANKSEL TMR0 ;
CLRWDT ;Clear WDT
CLRF TMR0 ;Clear TMR0 and
;prescaler
BANKSEL OPTION_REG ;
BSF OPTION_REG,PSA ;Select WDT
CLRWDT ;
;
MOVLW b’11111000’ ;Mask prescaler
ANDWF OPTION_REG,W ;bits
IORLW b’00000101’ ;Set WDT prescaler
MOVWF OPTION_REG ;to 1:32
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
CLRWDT ;Clear WDT and
;prescaler
BANKSEL OPTION_REG ;
MOVLW b’11110000’ ;Mask TMR0 select and
ANDWF OPTION_REG,W ;prescaler bits
IORLW b’00000011’ ;Set prescale to 1:16
MOVWF OPTION_REG ;
2010 Microchip Technology Inc. DS41302D-page 55
PIC12F609/615/617/12HV609/615
TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 6-1: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: TMR0 Cloc k Sourc e Sele ct bit
1 = Transit ion on T0CKI pin
0 = Internal instruction cycle clo ck (FOSC/4)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assig nme nt bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TMR0 RATE WDT RATE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0
module.
PIC12F609/615/617/12HV609/615
DS41302D-page 56 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 57
PIC12F609/615/617/12HV609/615
7.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/coun ter regis ter pai r (TMR1H: TMR1L)
• Programmable internal or external clock source
• 3-bit prescaler
• Optional LP oscillator
• Synchronous or asynchronous operation
• Timer1 gate (count enable) via comparator or
T1G pin
• Interrupt on over flow
• Wake-up on over flow (ext erna l clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Special Event Trigger (with ECCP)
• Comparator output synchronization to Timer1
clock
Figure 7-1 is a block diagram of the Timer1 module.
7.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When us ed with an interna l clock source, t he modul e is
a time r. Whe n used with an extern al clo ck source , the
module can be used as either a timer or counter.
7.2 Clock Source Selection
The TMR1CS bit of the T1CON register is used to select
the clock source. When TMR1CS = 0, the clock source
is FOSC/4. When TMR1CS = 1, the clock source is
supplied exte rnally.
Clock Source TMR1CS T1ACS
FOSC/4 00
FOSC 01
T1CKI pin 1x
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DS41302D-page 58 2010 Microchip Technology Inc.
FIGURE 7-1: TI MER1 BLOCK DIAGRAM
TMR1H TMR1L
Oscillator T1SYNC
T1CKPS<1:0>
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
1
0
0
1
Synchronized
clock input
2
Set fl ag b it
TMR1IF on
Overflow TMR1(2)
TMR1GE
TMR1ON
T1OSCEN
1
0
COUT
T1GSS
T1GINV
To Comparator Module
Timer1 Clock
TMR1CS
OSC2/T1G
OSC1/T1CKI
Note 1: ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
4: Alternate pin function.
5: PIC12F615/617/HV615 only.
(1)
EN
INTOSC
Without CLKOUT 1
0
T1ACS
FOSC
0
1
T1GSEL(2)
GP3/T1G(4, 5)
Synchronize(3)
det
2010 Microchip Technology Inc. DS41302D-page 59
PIC12F609/615/617/12HV609/615
7.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of TCY as determined by the T imer1 pres caler.
7.2.2 EXTERNAL CLOCK SOURCE
When the external clock sour ce is selected, the Timer1
module may wo rk as a timer or a cou nter.
When counting, Timer1 is incremented on the rising
edge of the external clock input T1CKI. In addition, the
Counter mode clock can be synchronized to the
microcontroller system clock or run async hronously.
If an external clock oscillator is needed (and the
microc ontroller is using the INT OSC withou t CLKOUT),
Timer1 can use the LP oscillator as a clock source.
In Counter mode, a falling edge must be registered by
the counter prior to the first incrementing rising edge
after one or more of the following conditions:
• Timer1 is enabled after POR or BOR Reset
• A write to TMR1H or TMR1L
• T1CKI is high when T imer1 is disabled and when
T imer1 is re-enabled T1CKI is low . See Figure 7-2.
7.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however , the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
7.4 Timer1 Oscillator
A low-power 32.768 kHz crystal oscillator is built-in
between pins OSC1 (input) and OSC2 (output). The
oscillator is enabled by setting the T1OSCEN control
bit of th e T1CON register. The oscillat or will continue to
run during Sleep.
The Timer1 oscillator is shared with the system LP
oscillator. Thus, Timer1 can use this mode only when
the primary system clock is derived from the internal
oscill ator or when in LP osci llator m ode. The user m ust
provide a software time delay to ensure proper
osci llator s tart-up.
TRISIO5 and TRISIO4 bits are set when the Timer1
oscill ator is enable d. GP5 an d GP4 bi t s read as ‘0’ an d
TRISIO5 and TRISIO4 bits read as ‘1’.
7.5 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
continues to increment asynchronous to the internal
phase clocks. The timer will continue to run during
Sleep and can generate an interrupt on overflow,
which will wake-up the processor. However, special
precautions in software are needed to read/write the
timer (see Section 7.5.1 “Reading and Writing
Timer1 in Asynchronous Counter Mode”).
7.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an e xternal asyn chronous cl ock will ens ure a valid
read (taken care of in hardware). However, the user
should keep i n mind that rea ding t he 16-bi t time r in tw o
8-bit values itself poses certain problems, since the
timer may overflow between the read s.
For writes , it is re commend ed that th e user s imply sto p
the timer and write the desired values. A write
conte ntion may occ ur by w ritin g to th e timer regist ers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TTMR1L register
pair.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce a single spurious
increment.
Note: In asynchronous counter mode or when
using t he interna l oscillat or and T1AC S=1,
T i mer1 ca n not be u sed as a time ba se for
the capture or compare modes of the
ECCP module (for PIC12F615/617/
HV615 only).
PIC12F609/615/617/12HV609/615
DS41302D-page 60 2010 Microchip Technology Inc.
7.6 Timer1 Gate
Timer1 gate source is software configurable to be the
T1G pin (or the alternate T1G pin) or the output of the
Comparator. This allows the device to directly time
external events using T1G or analog events using the
Comparator. See the CMCON1 Register (Register 9-2)
for selecting the Timer1 gate source. This feature can
simplify the software for a Delta-Sigma A/D converter
and many other applications. For more information on
Delta-Sigma A/D converters, see the Microchip web site
(www.microchip.com).
Timer1 gate can be inverted using the T1GINV bit of
the T1CON register, whether it ori ginates from the T1G
pin or the Comparator output. This configures Timer1
to measure either the active-high or active-low time
between events.
7.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the T i mer1 in terrupt fl ag bit of th e PIR1 regis ter is
set. To enable the interrupt on rollover, you must set
these bits:
• Timer1 interrupt enable bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
7.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynch ronous Counter mode. In this mode, an ext ernal
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
The device will wake-up on an overflow and execute
the next instruction. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine (0004h).
7.9 ECCP Capture/Compare Time
Base (PIC12F615/617/ HV615 only)
The ECCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
For more information, see Section 11.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/617/HV615 only)”.
Note: TMR1GE bit of the T1CON register must
be set to use either T1G or COUT as the
Timer1 gate source. See Register 9-2 for
more information on selecting the Timer1
gate source.
Note: The T MR1H:TTMR1L register p air and th e
TMR1IF bit should be cleared before
enabling interrupts.
2010 Microchip Technology Inc. DS41302D-page 61
PIC12F609/615/617/12HV609/615
7.10 ECCP Special Event Trigger
(PIC12F615/617/HV615 only)
If a ECCP is configured to trigger a special event, the
trigger will clear the TMR1H:TMR1L register pair. This
special event does not cause a Timer1 interrupt. The
ECCP module may still be configured to generate a
ECCP interrupt.
In this mode of operation, the CCPR1H:CCPR1L
register pair e f fe cti ve ly becom es th e period regi ste r for
Timer1.
Timer1 should be synchronized to the FOSC to utilize
the Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the eve nt that a write to TMR1H or TM R1L coinc ides
with a Special Event Trigger from the ECCP, the write
will take precedence.
For more information, see Section 11.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/617/HV615 only)”.
7.11 Comparator Synchro nization
The same cloc k used to increment Timer1 can also be
used to synchronize the comparator output. This
feature is enabled in the Comparator module.
When using the comparator for Timer1 gate, the
comparator output should be synchronized to Timer1.
This ensures Timer1 does not miss an increment if the
comp ara tor changes.
For more information, see Section 9.0 “Comparator
Module”.
FIGURE 7-2: TI MER1 INCREMENTING EDGE
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior t o the first incrementing rising edge of
the clock.
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DS41302D-page 62 2010 Microchip Technology Inc.
7.12 Timer1 Control Register
The Timer1 Control register (T1CON), shown in
Register 7-1, is used to control Timer1 and select the
various features of the Timer1 module.
REGISTER 7-1: T1CON: TIMER 1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 T1GINV : Timer1 Gate Invert bit(1)
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 6 TMR1GE: Timer1 Gate Enable bit(2)
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 is on if Timer1 gate is active
0 = Timer1 is on
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale Value
10 = 1:4 Prescale Value
01 = 1:2 Prescale Value
00 = 1:1 Prescale Value
bit 3 T1OSCEN: LP Oscilla tor Enab le Contro l bit
If INTOSC without CLKOUT oscillator is active:
1 = LP oscillator is enabled for Ti mer1 clock
0 = LP oscillator is off
For all other system clock modes:
This bit is ignored. LP oscillator is disabled.
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1:
1 = Do not synchroniz e exte rnal cloc k inp ut
0 = Synchronize external clock input
TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock
bit 1 TMR1CS: T im er1 Clock Sourc e Sele ct bit
1 = External clock from T1CKI pin (on the rising edge)
0 = Internal clock (FOSC/4) or system clock (FOSC)(3)
bit 0 TMR1ON: Time r1 On bit
1 = Enables Timer1
0 = Stops Timer1
Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source.
2: TMR1GE bit must be set to use either T1G pin or COUT, as selected by the T1GSS bit of the CMCON1
register, as a Timer1 gate source.
3: See T1ACS bit in CMCON1 register.
2010 Microchip Technology Inc. DS41302D-page 63
PIC12F609/615/617/12HV609/615
TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 B it 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
APFCON(1) — — — T1GSEL — — P1BSEL P1ASEL ---0 --00 ---0 --00
CMCON0 CMON COUT CMOE CMPOL —CMR —CMCH0000 -0-0 0000 -0-0
CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC ---0 0-10 ---0 0-10
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 —ADIE(1) CCP1IE(1) — CMIE — TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF(1) CCP1IF(1) — CMIF — TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
Note 1: PIC12F615/61 7/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 64 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 65
PIC12F609/615/617/12HV609/615
8.0 T IMER2 MODULE
(PIC12F615/617/HV615 ONLY)
The Timer2 module is an 8-bit timer with the following
features:
• 8-bit timer register (TMR2)
• 8-bit period register (PR2)
• Interrupt on TMR2 match with PR2
• Software programmable prescaler (1:1, 1:4, 1:16)
• Software programmable postscaler (1:1 to 1:16)
See Figure 8-1 for a block diagram of Timer2.
8.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4). The clock is fed into the
Timer2 prescaler, which has prescale options of 1:1,
1:4 or 1:16. The output of the prescaler is then use d to
increm ent the TM R2 regis ter.
The val ues of T MR2 and PR2 are co nstan tly com pared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, two things happen:
• TMR2 is reset to 00h on the next increment cycle.
• The Timer2 postscaler is incremented
The match output of the Timer2/PR2 comparator is
then fed into th e T i mer2 post sca ler. The posts caler has
post scal e options of 1:1 to 1: 16 inclus ive. The output of
the Timer2 postscaler is used to set the TMR2IF
interrupt flag bit in the PIR1 register.
The TMR2 and PR2 registers are both fully readable
and w rita ble. O n any Rese t, the TMR2 regis ter is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Tim er2 is turned off by clearin g
the TMR2ON bit to a ‘0’.
The Timer2 prescaler is contro lle d by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
controlled by the TOUTPS bits in the T2CON register.
The prescaler and postscaler counters are cleared
when:
• A write to TMR2 occurs.
• A write to T2CON occurs.
• Any device Reset occurs (Po wer-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
FIGURE 8-1: TIMER2 BLOCK DIAGRAM
Note: TMR2 is not cleared when T2CON is
written.
Comparator
TMR2 Sets Flag
TMR2
Output
Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
TOUTPS<3:0>
T2CKPS<1:0>
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DS41302D-page 66 2010 Microchip Technology Inc.
TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
REGISTER 8-1: T2CON: TIMER 2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 =1:1 Postscaler
0001 =1:2 Postscaler
0010 =1:3 Postscaler
0011 =1:4 Postscaler
0100 =1:5 Postscaler
0101 =1:6 Postscaler
0110 =1:7 Postscaler
0111 =1:8 Postscaler
1000 =1:9 Postscaler
1001 =1:10 Postscaler
1010 =1:11 Postscaler
1011 =1:12 Postscaler
1100 =1:13 Postscaler
1101 =1:14 Postscaler
1110 =1:15 Postscaler
1111 =1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
1x =Prescaler is 16
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 —ADIE(1) CCP1IE(1) — CMIE —TMR2IE
(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF(1) CCP1IF(1) — CMIF —TMR2IF
(1) TMR1IF -00- 0-00 -00- 0-00
PR2(1) Timer2 Modu le Period Register 1111 1111 1111 1111
TMR2(1) Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000
T2CON(1) — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module.
Note 1: For PIC12F615/617/HV615 only.
2010 Microchip Technology Inc. DS41302D-page 67
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9.0 COMPARATOR MODULE
The comparator can be used to interface analog
circuits to a digital circuit by comparing two analog
voltages and providing a digital indication of their
relative magnitudes. The comparator is a very useful
mixed s ign al bu ilding bloc k be ca us e it provides analog
functionality independent of the program execution.
The Analog Comparator module includes the following
features:
• Programmable input section
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
•PWM shutdown
• Ti me r1 gate (co unt enable)
• Output synchronization to Timer1 clock input
• Programmable voltage reference
• User-enable Comparator Hysteresis
9.1 Comparator Overview
The comparator is shown in Figure 9-1 along with the
relationship between the analog input levels and the
digital output. When the analog voltage at VIN+ is less
than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of th e comp arator is a digita l high leve l.
FIGURE 9-1:SINGLE COMPARATOR
FIGURE 9-2: COMPAR ATOR SIMPLIFIED BLOCK DIAGRAM
–
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
CMOE
MUX
CMPOL
0
1
CMON(1)
CMCH
From Timer1
Clock
Note 1: When CMON = 0, the comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
4: Output shown for reference only. See I/O port pin diagram for more details.
DQ
EN
DQ
EN
CL
DQ
RD_CMCON0
Q3*RD_CMCON0
Q1
Set CMIF
To
Reset
CMVIN-
CMVIN+
GP1/CIN0-
GP4/CIN1-
0
1
CMSYNC
CMPOL Data Bus
MUX COUT(4)
To PWM Auto-Shutdown
To Timer1 Gate
0
1
CMR
MUX
GP0/CIN+
0
1
MUX
CVREF
CMVREN
FixedRef CMVREF SYNCCMOUT
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9.2 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 9-3. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog in put, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 k is
recommended for the analog sources. Also, any
external component connected to an analog input pin,
such as a cap acitor or a Zener diode, should hav e very
little leakage current to minimize inaccuracies
introduced.
FIGURE 9-3: ANALOG INPUT MODEL
Note 1: When reading a GPIO register, all pins
configu red a s anal og inp uts will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digit al input, may ca use the input buff er to
consume more current than is specified.
VA
RS < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE
±500 nA
VSS
AIN
Legend: CPIN = Input Capacitanc e
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source I mpedance
VA= Analog Voltage
VT= Threshold Voltage
To Compara tor
2010 Microchip Technology Inc. DS41302D-page 69
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9.3 Comparator Control
The comparator has two control and Configuration
registers: CMCON0 and CMCON1. The CMCON1
register is used for controlling the interaction with
Timer1 and simultaneously reading the comparator
output.
The CMCON0 register (Register 9-1) contain the
control and Status bits for th e following:
• Enable
• Input selection
• Reference selection
•Output selection
• Output polarity
9.3.1 COMPARATOR ENABLE
Setting the CMON bit of the CMCON0 register enables
the comparator for operation. Clearing the CMON bit
disables the comparator for minimum current
consumption.
9.3.2 COMPARATOR INPUT SELECTION
The CMCH bit of the CMCON0 register directs one of
four anal og input pins to the compara tor inverting i nput.
9.3.3 COMPARATOR REFERENCE
SELECTION
Setting the CMR bit of the CMxCON0 register directs
an internal voltage reference or an analog input pin to
the non-inverting input of the comparator. See
Section 9.10 “Comparator Voltage Reference” for
more information on the internal voltage reference
module.
9.3.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the COUT bit of the CMCON0 register . In
order to make the output available for an external
connection, the following conditions must be true:
• CMOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CMON bit of the CMCON0 register must be set.
9.3.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CMPOL bit of the CMCON0 register. Clear-
ing CMPOL results in a non-inverted output. A com-
plete table showing the output state versus input
conditions and the polarity bit is shown in Table 9-1.
TABLE 9-1: OUTPUT STATE VS. INPUT
CONDITIONS
9.4 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new refe rence volta ge. This period is refer red to as
the response time. The response time of the compara-
tor differs from the settling time of the voltage refer-
ence. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See Section 16.0
“Electrical Specifications” for more details.
Note: To use CIN+ and CIN- pins as analog
inputs , the appropriate bits must be set in
the ANSEL register and the co rresponding
TRIS bits must also be set to disable the
output dr ivers.
Note 1: The CMOE bit overrides the PORT data
latch. Setting the CMON has no impact
on the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
Input Conditions CMPOL COUT
CMVIN- > CMVIN+00
CMVIN- < CMVIN+01
CMVIN- > CMVIN+11
CMVIN- < CMVIN+10
Note: COUT refers to both the register bit and
output pin.
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9.5 Comparator Interrupt Operation
The comparator interrupt flag can be set whenever
there is a chang e in the o utput val ue of the compa rator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusive-
or gate (see Figure 9-4 and Figure 9-5). One latch is
updated with the comparator output level when the
CMCON0 register is read. This latch retains the value
until the next read of the CMCON0 register or the
occurre nce of a Reset. The other la tch of the mism atch
circuit is updated on every Q1 system clock. A
mismatch condition will occur when a comparator
output change is clocked through the second latch on
the Q1 clock cycle. At this point the two mismatch
latches have opposite output levels which is detected
by the exclusive-or gate and fed to the interrupt
circuitry. The mismatch condition persists until either
the CMCON 0 re gis te r is re ad o r the c omparator output
returns to the previous state.
The comparator interrupt is set by the mismatch edge
and not the mismatch level. This means that the
inter rupt fla g can be res et w ithout the ad dition al st ep of
reading or writing the CMCON0 register to clear the
mismatch registers. When the mismatch registers are
cleared, an interrupt will oc cur upon the comparator ’s
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMCON1 reg is ter, to d eterm in e th e a ctu al ch ang e that
has occurred.
The CMIF bit of the PIR1 register is the Comparator
Interrupt flag. This bit must be reset in software by
clearing it to ‘0’. Since it is also p ossib le to wr ite a '1' to
this register, an interrupt can be generated.
The CMIE bit of the PIE1 register and the PEIE and GIE
bits of the INTCON register must all be set to enable
comparator interrupts. If any of these bits are cleared,
the interrupt is not enabled, although the CMIF bit of
the PIR1 regist er will s till b e set i f an inte rrupt co nditio n
occurs.
FIGURE 9-4: COMPARATOR
INTERRUPT TIMING W/O
CMCON0 READ
FIGURE 9-5: COMPARATOR
INTERRUPT TIMING WITH
CMCON0 READ
Note 1: A w rite operatio n to the CMCO N0 register
will also clear the mismatch condition
because all writes include a read
operation at the beginning of the write
cycle.
2: Comparator interrupts will operate
correctly regardless of the state of
CMOE. Note 1: If a change in the CMCON0 register
(COUT) should occur when a read
operation is being executed (start of the
Q2 cycle), then the CMIF of the PIR1
register interrupt flag may not get set.
2: When a compar ator is firs t ena bled, bias
circuitry in the comparator module may
cause an invalid output from the
comparator until the bias circuitry is
stable. Allow about 1 s for bias settling
then clear the mismatch condition and
interrupt flags before enabling
comp ara tor int errup ts.
Q1
Q3
CIN+
COUT
Set CMIF (edge)
CMIF
TRT
reset by software
Q1
Q3
CIN+
COUT
Set CMIF (edge )
CMIF
TRT
reset by software
cleared by CMCON0 read
2010 Microchip Technology Inc. DS41302D-page 71
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9.6 Operation During Sleep
The comparator, if enabled before entering Sleep
mode, remains active during Sleep. The additional
current consumed by the comparator is shown
separately in the Section 16.0 “Electrical
Specifications”. If the comparator is not used to wake
the device, power consumption can be minimized while
in Sleep mode by turning off the comparator. The
comparator is turned off by clearing the CMON bit of the
CMCON0 register.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the dev ice from Sleep, th e CMIE bit of the PIE1 register
and the PEIE bit of the INTCON register must be set.
The instruction following the SLEEP instruct ion a lways
executes following a wake from Sleep. If the GIE bit of
the INTCON register is also set, the device will then
execute the Interrupt Service Routine.
9.7 Effects of a Reset
A device Reset forces the CMCON1 register to its
Reset state. This sets the comparator and the voltage
reference to the OFF state.
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REGISTER 9-1: CMCON0: COMPARATOR CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0
CMON COUT CMOE CMPOL —CMR —CMCH
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CMON: Comparator Enable bit
1 = Comparator is enabled
0 = Compar ator is disabled
bit 6 COUT: Comparator Output bit
If C1POL = 1 (inverted polarity):
COUT = 0 when CMVIN+ > CMVIN-
COUT = 1 when CMVIN+ < CMVIN-
If C1POL = 0 (non-inverted polarity):
COUT = 1 when CMVIN+ > CMVIN-
COUT = 0 when CMVIN+ < CMVIN-
bit 5 CMOE: Comparator Output Enable bit
1 = COUT is present on the COUT pin(1)
0 = COUT is internal only
bit 4 CMPOL: Comparator Output Polarity Select bit
1 = COUT logic is inverted
0 = COUT logic is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 CMR: Comparat or Reference Select bit (non-i nverting inp ut)
1 = CMVIN+ connects to C MVREF output
0 = CMVIN+ connects to C IN+ pin
bit 1 Unimplemented: Read as ‘0’
bit 0 CMCH: Comparator C1 Channel Select bit
0 = CMVIN- pin of the Comparator connects to CIN0-
1 = CMVIN- pin of the Comparator connects to CIN1-
Note 1: Comparator output requires the following three conditions: CMOE = 1, CMON = 1 and cor res pondin g port
TRIS bit = 0.
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9.8 Comparator Gating Timer1
This feat ure can be used to time the d uration or inte rval
of analog events. Clearing the T1GSS bit of the
CMCON1 register will enable Timer1 to increment
based on the output of the comparator. This requires
that Timer1 is on and gating is enabled. See
Section 7.0 “Timer1 Module with Gate Control” for
details.
It is recommended to synchronize the comparator with
Timer1 by setting the CMSYNC bit when the
comparator is used as the Timer1 gate source. This
ensures Timer1 does not miss an increment if the
comparator changes during an increment.
9.9 Synchronizing Comparator Output
to Timer1
The comparator output can be synchronized with
Timer1 by setting the CMSYNC bit of the CMCON1
register. When enabled, the comparator output is
latc hed on the fall ing ed ge of the Timer1 clock sou rce.
If a prescaler is used with Timer1, the comparator
output is latched after the prescaling function. To
prevent a race condition, the comparator output is
latc hed on the fa lling edge of the Timer1 clock source
and Timer1 increments on the rising edge of its clock
source . See the C omparator Bl ock Diagra m (Figure 9-
2) and the Timer1 Block Diagram (Figure 7-1) for more
information.
REGISTER 9-2: CMCON1: COMPARATOR CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-1 R/W-0
— — — T1ACS CMHYS — T1GSS CMSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 T1ACS: Timer1 Alternate Clock Select bit
1 = Timer 1 Clock Source is System Clock (FOSC)
0 = Timer 1 Clock Source is Instruction Clock (FOSC\4)
bit 3 CMHYS: Comparator Hys teresis Select bit
1 = Comparator Hysteresis enabled
0 = Comparator Hysteresis disabled
bit 2 Unimplemented: Read as ‘0’
bit 1 T1GSS: Timer1 Gate Source Select bit(1)
1 = Timer 1 Gate Source is T1G pin (pin should be configured as digital input)
0 = Timer 1 Gate Source is comparator output
bit 0 CMSYNC: Comparator Output Synchronization bit(2)
1 = Output is synchronized with falling edge of Timer1 clock
0 = Output is asynchronous
Note 1: Refer to Section 7.6 “Timer1 Gate”.
2: Refer to Figure 9-2.
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9.10 Comparator Voltage Reference
The Comparator Voltage Reference module provides
an internally generated voltage reference for the
comparators. The following features are available:
• Independent from Comparator operation
• 16-level voltage range
• Output clamped to VSS
• Ratiometric with VDD
• Fix ed Reference (0.6 )
The VRCON register (Register 9-3) controls the
Voltage Reference module shown in Register 9-6.
9.10.1 INDEPENDENT OPERATION
The comparator voltage reference is independent of
the comparator configuration. Setting the VREN bit of
the VRCON register will enable the voltage reference.
9.10.2 OUTPUT VOLTAGE SELECTION
The CVREF voltage reference has 2 ranges with 16
voltage levels in each range. Range selection is
controlled by the VRR bit of the VRCON register. The
16 levels are set with the VR<3:0> bits of the VRCON
register.
The CVREF output voltage is determined by the
following equations:
EQUATION 9-1: CVREF OUTPUT VOLTAGE
The full range of VSS to VDD cannot be realized due to
the construction of the module. See Figure 9-6.
9.10.3 OUTPUT CLAMPED TO VSS
The CVREF output voltage can be set to Vss with no
power consumption by config uring VRCON as follows:
• FVREN = 0
This allows the comparator to detect a zero-crossing
while not consuming additional CVREF module curren t.
9.10.4 OUTPUT RATIOMETRIC TO VDD
The comparator voltage reference is VDD derived and
therefore, the CVREF output changes with fluctuations in
VDD. The tested absolute accuracy of the Comparator
Voltage Reference can be found in Section 16.0
“Electr ical Specifications”.
9.10.5 FIXED VOLTAGE REFERENCE
The fixed volta ge reference is ind ependent of VDD, with
a nomina l output volt age of 0.6V. This referen ce can be
enabled by setting the FVREN bit of the VRCON
register to ‘1’. This reference is always enabled when
the HFINTOSC oscillator is active.
9.10.6 FIXED VOLTAGE REFERENCE
STABILIZATION PERIOD
When the Fix ed Volt age Refe rence mo dule is enable d,
it will require some time for the reference and its
amplifier circuits to stabilize. The user program must
include a small delay routine to allow the module to
settle. See Section 16.0 “Electrical Specifications”
for the minimum delay requiremen t.
9.10.7 VOLTAGE REFERENCE
SELECTION
Multiplexers on the output of the Voltage Reference
module enable selection of either the CVREF or fixed
voltage reference for use by the comparators.
Setting the CMVREN bit of the VRCON register
enables current to flow in the CVREF voltage divider
and selects the CVREF voltage for use by the Compar-
ator . Clearing the CMVREN bit selects the fixed vol tage
for use by the Comparator.
When the CMVREN bit is cleared, current flow in the
CVREF volt age d ivider i s disabled minimi zing the power
drain of the voltage reference peripheral.
VRR 1 (low range):=
VRR 0 (high range):=
CVREF (VDD/4) + =
CVREF (VR<3:0>/24) VDD=
(VR<3:0> VDD/32)
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FIGURE 9-6: COMPAR ATOR VOLTAGE REFERENCE BLOCK DIAGRAM
VRR
8R
VR<3:0>(1)
Analog
8RRR RR
16 Stages
VDD
MUX
Fixed Voltage
CMVREN
CVREF(1)
Reference
EN
FVREN
Sleep
HFINTOSC enable
0.6V
FixedRef
To Comparators
and ADC Module
To Comparators
and ADC Module
Note 1: Care should be taken to ensure CVREF remains within the comparator common mode input range. See
Section 16.0 “Electrical Specifications” for more detail.
15
0
4
PIC12F609/615/617/12HV609/615
DS41302D-page 76 2010 Microchip Technology Inc.
REGISTER 9-3: VRCON: VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CMVREN — VRR FVREN VR3 VR2 VR1 VR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CMVREN: Comparator Voltage Reference Enable bit(1, 2)
1 = CVREF circuit powered on an d routed to CVREF input of the Comparator
0 = 0.6 Volt constant reference routed to CVREF input of the Comparator
bit 6 Unimplemented: Read as ‘0’
bit 5 VRR: CVREF Range Selection bit
1 = Low range
0 = High range
bit 4 FVREN: 0.6V Reference Enable bit(2)
1 = Enabled
0 = Disabled
bit 3-0 VR<3:0>: Comparator Voltage Reference CVREF Value Selection bits (0 VR<3:0> 15)
When VRR = 1: CVREF = (VR<3:0>/24) * VDD
When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD
Note 1: When CMVREN is low, the CVREF circuit is powered do wn and does not contri bute to IDD current.
2: When CMVREN is low and the FVREN bit is low, the CVREF signal should provide Vss to the comparator.
2010 Microchip Technology Inc. DS41302D-page 77
PIC12F609/615/617/12HV609/615
9.11 Comparator Hysteresis
Each comparator has built-in hysteresis that is user
enabled by setting the CMHYS bit of the CMCON1
register. The hysteresis feature can help filter noise and
reduce m ultiple comp arator output tran sitions when th e
output is changing state.
Figure 9-7 shows the relationship between the analog
input levels and digit al o utput of a compa r ato r w ith an d
without hysteresis. The output of the comparator
changes from a low state to a high state only wh en the
analog voltage at VIN+ rises above the upper
hysteresis threshold (VH+). The output of the
comparator changes from a high state to a low state
only when the analog voltage at VIN+ falls below the
lower hysteresis threshold (VH-).
FIGURE 9-7: COMPAR ATOR HYSTERESIS
–
+
VIN+
VIN-Output
Note: The black areas of the comparator output represents the uncertainty due to input offsets and response time.
VH-
VH+
VIN-
V+
VIN+
Output
(Without Hysteresis)
Output
(With Hysteresis)
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DS41302D-page 78 2010 Microchip Technology Inc.
TABLE 9-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND
VOLTAGE REFERENCE MODULES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL — ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL —CMR —CMCH0000 -000 0000 -000
CMCON1 — — — T1ACS CMHYS — T1GSS CMSYNC 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 —ADIE(1) CCP1IE(1) —CMIE—TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF(1) CCP1IF(1) —CMIF—TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
VRCON CMVREN — VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 0-00 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for comparator.
Note 1: For PIC12F615/617/HV615 only.
2010 Microchip Technology Inc. DS41302D-page 79
PIC12F609/615/617/12HV609/615
10.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
(PIC12F615/617/HV615 ONLY)
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC voltage reference is software selectable to
either VDD or a v olt age appli ed to the external reference
pins.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt ca n be used to wake-up the
device from Sleep.
Figure 10-1 shows the block diagram of the ADC.
FIGURE 10-1: ADC BLOCK DIAGRAM
Note: The ADRESL and ADRESH registers are
Read Only.
GP0/AN0
A/D
GP1/AN1/VREF
GP2/AN2
CVREF
VDD
VREF
ADON
GO/DONE
VCFG = 1
VCFG = 0
CHS VSS
0.6V Reference
1.2V Reference
GP4/AN3
ADRESH ADRESL
10
10
ADFM 0 = Left Justify
1 = Right Justify
000
001
010
011
100
101
110
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DS41302D-page 80 2010 Microchip Technology Inc.
10.1 ADC Configuration
When configuring and using the ADC the following
functio ns must be considere d :
• Port configuration
• Channel selection
• ADC voltage reference selection
• ADC conv ersion clock sour ce
• Interrupt control
• Results formatting
10.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and digital
signals. When converting analog signals, the I/O pin
should be configured for analog by setting the associated
TRIS and ANSEL bits. See the corresponding port
section for more information.
10.1.2 CHANNEL SELECTION
The CHS bits of the ADCON0 r egister det ermine whic h
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 10.2
“ADC Operation” for more information.
10.1.3 ADC VOLTAGE REFERENCE
The VCFG bit of the ADCON0 registe r provides contro l
of the positive voltage reference. The positive voltage
reference can be either VDD or an external voltage
source. The negative voltage reference is always
connected to the ground reference.
10.1.4 CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ANSEL register.
There are seven possible clock options:
•F
OSC/2
•F
OSC/4
•FOSC/8
•FOSC/16
•F
OSC/32
•FOSC/64
•FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One ful l 1 0-b it c on ve r si on requ ire s 11 TAD period s
as shown in Figure 10-3.
For correct conversion, the appropriate TAD specification
must be met. See A/D conversion requirements in
Section 16.0 “Electrical Specifications” for more
information. Table 10-1 gives examples of appropriate
ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
2010 Microchip Technology Inc. DS41302D-page 81
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TABLE 10-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
FIGURE 10-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
10.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt fla g is the ADIF bit in the
PIR1 reg ister. The AD C inte rrupt en able i s the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operatin g or while in Sle ep. If the device is in Sle ep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruc tio n is al ways executed . If th e use r i s att em ptin g
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interr u pt Service Routine.
Please see Section 10.1.5 “Interrupts” for more
information.
ADC Clock Period (TAD) Device Freque ncy (FOSC)
ADC Clock Source ADCS<2:0> 20 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 000 100 ns(2) 250 ns(2) 500 ns(2) 2.0 s
FOSC/4 100 200 ns(2) 500 ns(2) 1.0 s(2) 4.0 s
FOSC/8 001 400 ns(2) 1.0 s(2) 2.0 s8.0 s(3)
FOSC/16 101 800 ns(2) 2.0 s4.0 s16.0 s(3)
FOSC/32 010 1.6 s4.0 s8.0 s(3) 32.0 s(3)
FOSC/64 110 3.2 s8.0 s(3) 16.0 s(3) 64.0 s(3)
FRC x11 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 4 s for VDD > 3.0V.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be perf ormed during S leep.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion Starts
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
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DS41302D-page 82 2010 Microchip Technology Inc.
10.1.6 RESULT FORMATTING
The 10-bit A/D conversion res ult can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 10-4 shows the two output formats.
FIGURE 10-3: 10-BIT A/D CONVERSION RESULT FORMAT
10.2 ADC Operation
10.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digita l conversion.
10.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF flag bit
• Update the ADRE SH:ADRESL reg isters with new
conversion result
10.2.3 TERMINATING A CONVERSION
If a co nver sion must b e term ina ted be fore comp leti on,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion. Addi-
tionall y, a 2 TAD delay is required bef ore another acqu i-
sition can be initiated. Following this delay, an input
acquisition is automatically started on the selected
channel.
10.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC wa its on e addition al instru ction bef ore sta rting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present
conversion to be aborted and the ADC module is
turned off, although the ADON bit remains set.
10.2.5 SPECIAL EVENT TRIGGER
The E CCP Spec ial Even t Trigger a llow s peri odic AD C
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 counter resets to zero.
Using the Special Event Trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
See Section 11.0 “Enhanced Capture/Compare/
PWM (With Auto-Shutdown and Dead Band)
Module (PIC12F615/617/HV615 only)” for more
information.
ADRESH ADRESL
(ADFM = 0)MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit A/D Result Unimplemented: Read as ‘0’
(ADFM = 1)MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0’ 10-bit A/D Result
Note: The GO/DONE bit shou ld not be se t in the
same instruction that turns on the ADC.
Refer to Section 10.2.6 “A/D Conver-
sion Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
2010 Microchip Technology Inc. DS41302D-page 83
PIC12F609/615/617/12HV609/615
10.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digit al conve rsion:
1. Configu re Po rt:
• Disable pin output driver (See TRIS register)
• Configure pin as analog
2. Configu re the ADC module:
• Select AD C conversion clock
• Configure voltage reference
• Select ADC input channel
• Select result format
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conv ers ion to com ple te b y o ne o f
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the ADC in terrupt flag (re quired if in terrupt
is enabled).
EXAMPLE 10-1: A/D CONVE RSI ON
Note 1: The g lobal interrup t can b e dis abled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: See Section 10.3 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd reference, Frc clock
;and GP0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL TRISIO ;
BSF TRISIO,0 ;Set GP0 to input
BANKSEL ANSEL ;
MOVLW B’01110001’ ;ADC Frc clock,
IORWF ANSEL ; and GP0 as analog
BANKSEL ADCON0 ;
MOVLW B’10000001’ ;Right justify,
MOVWF ADCON0 ;Vdd Vref, AN0, On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,GO ;Start conversion
BTFSC ADCON0,GO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;Store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
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DS41302D-page 84 2010 Microchip Technology Inc.
10.2.7 ADC REGISTER DEFINITIONS
The following registers are used to control the operation of the ADC.
REGISTER 10-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Conversion Result Format Select bit
1 = Right justif ied
0 = Left justi fied
bit 6 VCFG: Voltage Refe ren ce bit
1 = V REF pin
0 = VDD
bit 5 Unimplemented: Read as ‘0’
bit 4-2 CHS<2:0>: Analog Channel Select bits
000 = Channel 00 (AN0)
001 = Channel 01 (AN1)
010 = Channel 02 (AN2)
011 = Channel 03 (AN3)
100 = CVREF
101 = 0.6V Reference
110 = 1.2V Reference
111 = Reserved. Do not use.
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: When the CHS<2:0> bits change to select the 1.2V or 0.6V reference, the reference output voltage will
have a transient. If the Comparator module uses this 0.6V reference voltage, the comparator output may
momentarily change state due to the transient.
2010 Microchip Technology Inc. DS41302D-page 85
PIC12F609/615/617/12HV609/615
REGISTER 10-2: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 10-3: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY)
R-x R-x U-0 U-0 U-0 U-0 U-0 U-0
ADRES1 ADRES0 — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
bit 5-0 Unimplemented: Read as ‘0’
REGISTER 10-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x
— — — — — — ADRES9 ADRES8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0’
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 10-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
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10.3 A/D Acquisition Requirements
For the A DC t o meet its specif ied accuracy, the char ge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 10-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 10-4.
The maximum recommended impedance for analog
sources is 10 k. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 10-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb erro r is the maximum er ror allow ed
for the ADC to meet its specified resolution.
EQUATION 10-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Ca pacitor Charging Time Temperature Coeffici e nt++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C0.05µs/°C++=
TCCHOLD RIC RSS RS++ ln(1/2047)–=
10pF 1k
7k
10k
++– ln(0.0004885)=
1.37
=µs
TACQ 2µs 1.37µs 50°C- 25°C0.05µs/°C++=
4.67µs=
VAPPLIED 1e
Tc–
RC
---------
–
VAPPLIED 11
2047
------------
–
=
VAPPLIED 11
2047
------------
–
VCHOLD=
VAPPLIED 1e
TC–
RC
----------
–
VCHOLD=
;[1] V CHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
5.0V V DD=
Assumptions:
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
2010 Microchip Technology Inc. DS41302D-page 87
PIC12F609/615/617/12HV609/615
FIGURE 10-4: ANALOG INPUT MODEL
FIGURE 10-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I LEAKAGE
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(k)
VDD
± 500 nA
Legend: CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
3FFh
3FEh
ADC Output Code
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1 LSB ideal
VSS/VREF-Zero-Scale
Transition VDD/VREF+
Transition
1 LSB ideal
Full-Scale Range
Analog Input Voltage
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DS41302D-page 88 2010 Microchip Technology Inc.
TABLE 10-2: SUMMARY OF ASSOCIATED ADC REGISTERS
Name Bit 7 Bit 6 B i t 5 Bit 4 Bit 3 B it 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ADCON0
(1)
ADFM VCFG — CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000
ANSEL
—
ADCS2
(1)
ADCS1
(1)
ADCS0
(1)
ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
ADRESH
(1,2)
A/D Result Register High Byte xxxx xxxx uuuu uuuu
ADRESL
(1,2)
A/D Result Register Low Byte xxxx xxxx uuuu uuuu
GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 --x0 x000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 —ADIE
(1) CCP1IE(1) —CMIE —TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF
(1) CCP1IF(1) —CMIF —TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
Note 1: For PIC12F615/617/HV615 only.
2: Read Only Register.
2010 Microchip Technology Inc. DS41302D-page 89
PIC12F609/615/617/12HV609/615
11.0 ENHANCED CAPTURE/
COMPARE/PWM (WITH AUTO-
SHUTDOWN AND DEAD BAND)
MODULE (P IC12F615/617 /
HV615 ONLY)
The Enhanced Capture/Compare/PWM module is a
peripheral which allows the user to time and control
different events. In Capture mode, the peripheral
allows the timing of the duration of an event.The
Compare mode allows the user to trigger an external
event when a predetermined amount of time has
expired. The PWM mode can generate a Pulse-Wi dth
Modulated signal of varying frequency and duty cycle.
Table 11-1 shows the timer resources required by the
ECCP module.
TABLE 11-1: ECCP MODE – TIMER
RESOURCES REQUIR ED
ECCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 11-1: CCP1CON: ENHANCED CCP1 CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M —DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 P1M: PWM Output Configuration bits
If CCP1M<3:2> = 00, 01, 10:
x = P1A assigned as Capture/Compare input; P1B assigned as port pins
If CCP1M<3:2> = 11:
0 = Single output; P1A modulated; P1B assigned as port pins
1 = Half-Bridge output; P1A, P1B modulated with dead-band control
bit 6 Unimplemented: Read as ‘0’
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: EC CP Mod e Se lec t bits
0000 =Capture/Compare/PWM off (resets ECCP module)
0001 =Unused (rese rve d)
0010 =Compare mode, toggle output on match (CCP1IF bit is set)
0011 =Unused (rese rve d)
0100 =Capture mode, every falling edge
0101 =Capture mode, every rising edge
0110 =Capture mode, every 4th rising edge
0111 =Capture mode, every 16th rising edge
1000 =Compare mode, set output on match (CCP1IF bit is set)
1001 =Compare mode, clear output on match (CCP1IF bit is set)
1010 =Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected)
1011 =Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 or TMR2 and starts
an A/D conversion, if the ADC module is enabled)
1100 =PWM mode; P1A active-high; P1B active-high
1101 =PWM mode; P1A active-high; P1B active-low
1110 =PWM mode; P1A active-low; P1B active-high
1111 =PWM mode; P1A active-low; P1B active-low
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11.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the
16-bit val ue of the TMR1 register when an event occurs
on pin CCP1. An event is defined as one of the
following and is configured by the CCP1M<3:0> bits of
the CCP1CON register:
• Every falling edge
• Every rising edge
• Ever y 4th rising edg e
• Every 16th rising edge
When a cap ture i s m ade, the I nterrupt Re quest Flag bit
CCP1IF of the PIR1 register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPR1H, CCPR1L register pair
is read, the old cap tured value is overwritten by the new
captured value (see Figure 11-1).
11.1.1 CCP1 PIN CONFIGURATION
In Capture mode, the CCP1 pin should be configured
as an input by setting the associated TRIS control bit.
FIGURE 11-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
11.1.2 TIMER1 MODE SELECTION
T imer1 must be running in T imer mode or Synchroni zed
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
11.1.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCP1IE i nterrupt en able bit of the PIE1 regis ter clear to
avoid false interrupts. Additionally, the user should
clear the CCP1IF interrupt flag bit of the PIR1 register
following any change in operating mode.
11.1.4 CCP PRESCALER
There are four prescaler settings specified by the
CCP1M<3:0> bits of the CCP1CON register.
Whenever the CCP module is turned off, or the CCP
module is not in Capture mode, the prescaler counter
is cleared. Any Reset wi ll clear the pres caler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCP1CON register before changing the
prescaler (see Example 11-1).
EXAMPLE 11 -1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the C CP1 pin is con figured as an output ,
a write to the port can cause a capture
condition.
CCPR1H CCPR1L
TMR1H TMR1L
Set Flag bit CCP1IF
(PIR1 reg ister)
Capture
Enable
CCP1CON<3:0>
Prescaler
1, 4, 16
and
Edge Detect
pin
CCP1
System Clock (FOSC)
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
; the new prescaler
; move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
; value
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TABLE 11-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 B i t 2 Bit 1 B it 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M —DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 —ADIE(1) CCP1IE(1) —CMIE —TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF(1) CCP1IF(1) —CMIF —TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TRISIO ——TRISIO5TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture.
Note 1: F or PIC12F 615/6 17/HV615 only.
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11.2 Compare Mode
In C ompare mo de, t he 16 -bit CC PR1 r egist er va lue is
constantly compared against the TMR1 register pair
value. When a match occurs, the CCP1 module may:
• Toggle the CCP 1 output .
• Set the CCP1 output.
• Clear the CCP1 output.
• Generate a Special Event Trigger.
• Generate a Software In terrupt.
The action on the pin is based on the value of the
CCP1M<3:0> control bits of the CCP1CON register.
All Compare modes can generate an interrupt.
FIGURE 11-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
11.2.1 CCP1 PIN CONFIGURATION
The user m us t co nfi gure the C CP 1 pin a s an out put b y
clearing the associated TRIS bit.
11.2.2 TIMER1 MODE SELECTION
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
11.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCP1M<3:0> = 1010), the CCP1 module does not
assert control of the CCP1 pin (see the CCP1CON
register).
11.2.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCP1M<3:0> = 1011), the CCP1 module does the
following:
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCP 1 module do es not assert co ntrol of the C CP1
pin in this mode (see the CCP1CON register).
The Special Event Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPR1H, CCPR1L
register pair. The TMR1H, TMR1L register pair is not
reset until th e next r ising ed ge of the T imer1 clock. This
allows the CCPR1H, CCPR1L register pair to
effectively provide a 16-bit programmable period
register for Timer1.
Note: Clearing the CCP1CON register will force
the CCP1 compare output latch to the
default lo w lev el. This is no t the PO R T I/O
data l atch.
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
ROutput
Logic
Special Event Trigger
Set CCP1IF Interrupt Flag
(PIR1)
Match
TRIS
CCP1CON<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger will:
• Clear TMR1H and TMR1L registers.
• NOT set interrupt flag bit TMR1IF of the PIR1 register.
• Set the GO/DONE bit to start the ADC conversion.
CCP1 4
Note 1: The Special Event Trigger from the CCP
module does not set interrupt flag bit
TMRxIF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPR1H
and CCPR1L register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generate s the T imer1 Reset, w ill preclud e
the Reset from occurring.
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TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M —DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 —ADIE(1) CCP1IE(1) —CMIE —TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF(1) CCP1IF(1) —CMIF —TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR2 Timer2 Module Register 0000 0000 0000 0000
TRISIO ——TRISIO5TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Compare.
Note 1: F or PIC12F 615/6 17/HV615 only.
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DS41302D-page 94 2010 Microchip Technology Inc.
11.3 PWM Mode
The PWM mode generates a Pulse-Width Modulated
signal on the CCP1 pin. The duty cycle, period and
resolution are determined by the following registers:
•PR2
•T2CON
• CCPR1L
• CCP1CON
In Pulse-Width Modulation (PWM) mode, the CCP
module produce s up to a 10 -bit resol ution PWM outp ut
on the CCP1 pin. Since the CCP1 pin is multiplexed
with the POR T dat a latch, the TRIS for that pi n must be
cleared to enable the CCP1 pin output driver.
Figure 11-3 shows a simplified block diagram of PWM
operation.
Figure 11-4 shows a typical waveform of the PWM
signal.
For a ste p-by-step proced ure on how t o set up the CCP
module for PWM operation, see Section 11.3.7
“Setup for PWM Operation”.
FIGURE 11-3: SIMPLIFIED PWM BLOCK
DIAGRAM
The PWM output (Figure 11-4) has a time base
(period) and a time that the output stays high (duty
cycle).
FIGURE 11-4: CCP PWM OUTPUT
Note: Clearing the CCP1CON register will
relinquish CCP1 control of the CCP1 pin.
CCPR1L
CCPR1H(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer2 ,
toggle CCP1 pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler , to create the 10-bit time
base.
2: In PWM mode, CCPR1H is a read-only register .
TRIS
CCP1
Comparator
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxL:CCPxCON<5:4>
TMR2 = PR2
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11.3.1 PW M PE RIO D
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 11-1.
EQUATION 11-1: PWM PERIOD
When TM R2 is equa l to PR2, t he followi ng three ev ents
occur on t he next inc rement cy cle:
• TMR2 is cleare d
• The CCP1 pin is se t. (Ex cep tio n: If t he PWM du ty
cycle = 0%, the pin will not be set.)
• The PWM duty cy cle is lat ched from CC PR1L into
CCPR1H.
11.3 .2 PWM DUTY CYCL E
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPR1L register and
DC1B<1:0> bits of the CCP1CON register. The
CCPR1L contains the eight MSbs and the DC1B<1:0>
bits of the CCP1CON register contain the two LSbs.
CCPR1L and DC1B<1:0> bits of the CCP1CON
register can be written to at any time. The duty cycle
value is not latched into CCPR1H until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPR1H
register is read-only.
Equation 11-2 is used to calculate the PWM pulse
width.
Equat ion 11-3 is used to calc ula t e the PWM duty cycle
ratio.
EQUATION 11-2: PULSE WIDTH
EQUATION 11-3: DUTY CYCLE RATIO
The CCPR1H register and a 2-bit internal latch are
used to dou ble buf fer th e PWM duty cycle. Thi s doubl e
buffering is essential for gl itchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler , to create the 10-bit time ba se. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPR1H and
2-bit latch, then the CCP1 pin is cleared (see Figure 1 1-
3).
11.3 .3 PWM RES OLUTIO N
The res olution de termines the number of availa ble duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolu ti on will re su lt in 256 di sc re te du ty c ycl es .
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 11-4.
EQUATION 11-4: PWM RESOLUTION
TABLE 11-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 11-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: The Timer2 postscaler (see Section 8.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
PWM Period PR21+4TOSC =
(TM R2 Prescale Value)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Pulse Width CCPR1L:CCP1CON<5:4>
=
TOSC
(TM R2 Prescale Value)
Duty Cycle Ratio CCPR1L:CCP1CON<5:4>
4PR2 1+
-----------------------------------------------------------------------=
Resolution 4PR2 1+log 2log
------------------------------------------ bits=
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
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11.3.4 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the st ate of the module will not change. If the CCP1
pin is dri ving a value , it wi ll cont inue to d rive th at valu e.
When the device wakes up, TMR2 wil l continue from it s
previous state.
11.3.5 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 4.0 “Oscillator Module” for additional
details.
11.3.6 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
11.3.7 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Disable the PWM pin (CCP1) output drivers by
setting the associated TRIS bit.
2. Set the PWM period by loading the PR2 register .
3. Configure the CCP module for the PWM mode
by loading the CCP1CON register with the
appropriate values.
4. Set the PWM duty cycle by loading the CCPR1L
register and DC1B bits of the CCP1CON register .
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the PIR1
register.
• Set the Timer2 presca le value by loading the
T2CKPS bits of the T2CON register.
• Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PW M ou tput af ter a new PWM c ycle has
started:
• Wait until Timer2 overflows (TMR2IF bit of the
PIR1 register is set).
• Enable the CCP1 pin output driver by clearing
the associated TRIS bit.
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11.4 PWM (Enhanced Mode)
The Enhanced PWM Mode can generate a PWM signal
on up to four different output pins with up to 10-bits of
resolution. It can do this through four different PWM
output modes:
• Single PWM
• Half-Bridge PWM
To select an Enhanced PWM mode, the P1M bits of the
CCP1CON register must be set appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A and P1B. The polarity of the PWM p ins
is configurable and is selected by setting the CCP1M
bits in the CCP1CON register appropriatel y.
Table 11-6 shows the pin assignments for each
Enhanced PWM mode.
Figure 11-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
FIGURE 11-5: EXAMPLE SIMPLIFIED B LOCK DIA GRAM O F T HE E NHANC ED PWM MO DE
TABLE 11-6: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
Note: To prevent the generation of an
incomplete waveform when the PWM is
first enabl ed, the ECCP module w aits unti l
the start of a new PWM period before
generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
RQ
S
Duty Cycle Registers CCP1<1:0>
Clear Timer2,
toggle PWM pin and
latch duty cycle
* Alternate pin function.
Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base.
TRISIO2
CCP1/P1A
Output
Controller
P1M<1:0> 2CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
0
1
TRISIO5
CCP1/P1A*
P1ASEL
(APFCON<0>)
TRISIO0
P1B
0
1
TRISIO4
P1B*
P1BSEL
(APFCON<1>)
Note 1: The TRIS register value for each PWM output must be configured appropriately.
2: Clearing the CCP1CON register will relinquish ECCP control of all PWM output pins.
3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions.
ECCP Mode P1M<1:0> CCP1/P1A P1B
Single 00 Yes(1) Yes(1)
Half-Bridge 10 Yes Yes
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FIGURE 11-6: EXAMP LE PW M (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
FIGURE 11-7: EXAMP LE ENHA NCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
Pulse
Width
(Single Output)
(Half-Bridge)
Delay(1) Delay(1)
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 “Programmable Dead-Band Delay
mode”).
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inact ive
P1D Modulated
Pulse
Width
(Single Output)
(Half-Bridge) Delay(1) Delay(1)
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Wid th = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.4.6 “Programmable Dead-Band Delay
mode”).
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11.4.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-p ull loa ds. The PW M outp ut sign al is output
on the C CP1/P1A pin, while the complementary PWM
output signal is output on the P1B pin (see Figure 1 1-8).
This mode can be used for Half-Bridge applications, as
shown in Figure 11-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 11.4.6 “Programmable Dead-Band Delay
mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 11-8: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, t he TM R2 register is equal to t he
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-Pull”)
Half-Bridge Output Driving a Full-Bridge Circuit
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11.4.2 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the us er t o ch oose whe the r th e P WM output si gna ls are
active-hi gh or acti ve-low fo r each PWM out put pin (P 1A
and P1B ). The P WM output pol arities must be s elected
before the PWM pin output drivers are enabled.
Changing the polarity configuration while the PWM pin
output drivers are enable is not recommended since it
may result in damage to the application circuits.
The P1A and P1B output latches may not be in the proper
states when the PWM module is initialized. Enabling the
PWM pin output drivers at the same time as the
Enhanced PWM modes may cause damage to the
applic ation circuit. The Enhanc ed PWM modes must be
enabled in the proper Output mode and complete a full
PWM cycle before configuring the PWM pin output
drivers. Th e completi on of a full PWM cycle i s indicated
by the TMR 2IF bit of the PIR1 regi ster being set as the
second PWM period begins.
11.4 .3 OPERATION DURING SLEEP
When the device is placed in sleep, the allocated timer
will not increment and the state of the module will not
change. If the CCP1 pin is driving a value, it will
continue to drive that value. When the device wakes
up, it will continue from this state.
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the high-
impedance state. The external circuits
must ke ep the powe r switch de vices in the
OFF state until the microcontroller drives
the I/O pi ns with the pr oper signal l evels or
activates the PWM output(s).
2010 Microchip Technology Inc. DS41302D-page 101
PIC12F609/615/617/12HV609/615
11.4.4 ENHANCED PWM AUTO-
SH UTDOWN MODE
The PWM mode supports an Auto-Shut dow n m ode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
ECCPASx bits of the ECCPAS register. A shutdown
event may be generated by:
•A logic ‘0’ on the INT pin
•Comparator
• Setting the ECCPASE bit in firmware
A shutdown condition is indicated by the ECCPASE
(Auto-Shutdown Event Status) bit of the ECCPAS
register. If the bit is a ‘0’, t he PWM pins are oper ating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state. Refer to Figure 1.
When a shutdow n event oc curs, two things ha ppen:
The ECCPASE bit is set to ‘1’. The ECCPASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 1 1.4.5 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The state of P1A is determined by
the PSSAC bit. The state of P1B is determined by the
PSSBD bit. The PSSAC and PSSBD bits are located in
the ECCPAS register. Each pin may be placed into one
of three states:
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
FIGURE 11-10: AUTO-SHUTDOWN BLOCK DIAGRAM
PSSAC<1>
TRISx P1A
0
1
P1A_DRV
PSSAC<0>
PSSBD<1>
TRISx P1B
0
1
PSSBD<0>
P1B_DRV
000
001
010
011
100
101
110
111
From Comparator
ECCPAS<2:0>
R
DQ
S
ECCPASE
From Data Bus
Write to ECCPASE
PRSEN
INT
PIC12F609/615/617/12HV609/615
DS41302D-page 102 2010 Microchip Technology Inc.
REGISTER 11-2: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN
CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
0 = ECCP outputs are operating
bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits
000 =Auto-Shutdown is disabled
001 =Comparator output change
010 =Auto-Shutdown is disabled
011 =Comparator output change(1)
100 =VIL on INT pin
101 =VIL on INT pin or Comparator change
110 =VIL on INT pin(1)
111 =VIL on INT pin or Comparator change
bit 3-2 PSSAC<1:0>: Pin P1A Shutd own State Contro l bit s
00 = Drive pin P1A to ‘0’
01 = Drive pin P1A to ‘1’
1x = Pin P1A tri-state
bit 1-0 PSSBD<1:0>: Pin P1B Shutdown State Control bits
00 = Drive pin P1B to ‘0’
01 = Drive pin P1B to ‘1’
1x = Pin P1B tri-state
Note 1: If CMSYNC is enabled, the shutdown will be delayed by Timer1.
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
2: Writing to the ECCPASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
2010 Microchip Technology Inc. DS41302D-page 103
PIC12F609/615/617/12HV609/615
FIGURE 11-11: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0)
11.4 .5 AUTO-RESTART MODE
The Enhanced PWM can be configured to automati-
cally restart the PWM signal once the auto-shutdown
condition has been removed. Auto-restart is enabled by
setting the PRSEN bit in the PWM1CON register.
If auto-restart is enabled, the ECCPASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
ECCPASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 11-12: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1)
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs Shutdown
Event Clears PWM
Resumes
PWM Period
Start of
PWM Period
ECCPASE
Cleared by
Firmware
Shutdown
PWM
ECCPAS E bit
Activity
Event
Shutdown
Event Occurs Shutdown
Event Cle ars PWM
Resumes
PWM Period
Start of
PWM Period
PIC12F609/615/617/12HV609/615
DS41302D-page 104 2010 Microchip Technology Inc.
11.4.6 PROGRAMMABLE D EAD-BAND
DELAY MODE
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If b oth the u pper and lowe r power swit ches ar e
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through c urre nt) wi ll flow through bot h po wer s w itches ,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches . The delay
occurs at the si gnal tra nsition fro m the no n-acti ve st ate
to the active state. See Figure 1 1-13 for illustration. The
lower seven bits of the associated PWMx CON regist er
(Register 11-3) sets the delay period in terms of
microcontrolle r instruction cycles (TCY or 4 TOSC).
FIGURE 11-13: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11-14: EXAMPL E OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
V-
Load
+
V
-
+
V
-
Standard Half-Bridge Circuit (“Push-Pull”)
2010 Microchip Technology Inc. DS41302D-page 105
PIC12F609/615/617/12HV609/615
TABLE 11-7: SUMMARY OF REGISTERS ASSOCIATED WITH PWM
REGISTER 11-3: PWM1CON: ENHANCED PWM CONTROL REGISTE R
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 PRSEN: PWM Restart Enab le bit
1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
PDCn =Number of FOSC/4 (4 * TOSC) cycl es between th e schedul ed time wh en a PWM signa l should
transition active and the actual time it transitions active
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on
POR, BOR
Value on
all other
Resets
APFCON
— — — T1GSEL —— P1BSEL P1ASEL
---0 --00 ---0 --00
CCP1CON
(1)
P1M — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
0-00 0000 0-00 0000
CCPR1L
(1)
Capture/Compare/PWM Register 1 Low Byte
xxxx xxxx uuuu uuuu
CCPR1H
(1)
Capture/Compare/PWM Register 1 High Byte
xxxx xxxx uuuu uuuu
CMCON0
CMON COUT CMOE CMPOL —CMR—CMCH
0000 -0-0 0000 -0-0
CMCON1
— — — T1ACS CMHYS —T1GSSCMSYNC
---0 0-10 ---0 0-10
ECCPAS
(1)
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
0000 0000 0000 0000
PWM1CON
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
0000 0000 0000 0000
INTCON
GIE PEIE T0IE INTE GPIE T0IF INTF GPIF
0000 0000 0000 0000
PIE1
—ADIE
(1)
CCP1IE
(1)
—CMIE —TMR2IE
(1)
TMR1IE
-00- 0-00 -00- 0-00
PIR1
—ADIF
(1)
CCP1IF
(1)
—CMIF —TMR2IF
(1)
TMR1IF
-00- 0-00 -00- 0-00
T2CON
(1)
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
-000 0000 -000 0000
TMR2
(1)
Timer2 Module Register
0000 0000 0000 0000
TRISIO
—— TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0
--11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
Note 1: F or PIC12F 615/6 17/HV615 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 106 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 107
PIC12F609/615/617/12HV609/615
12.0 SPECIAL FEATURES OF THE
CPU
The PIC12F609/615/617/12HV609/615 has a host of
features intended to maximize system reliability,
minimize cost through elimination of external
components, provide power-saving features and offer
code protection.
These features are:
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• Oscillator selection
• Sleep
• Code protection
• ID Locations
• In-Circuit Serial Programming
The PIC12 F60 9/6 15/ 617/12HV 609 /615 has two ti mers
that offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in Reset until the crystal oscillator is stable. The
other is t he Power-up T im er (PWR T), which prov ide s a
fixed delay of 64 ms (nominal) on power-up only,
designed to keep the part in Reset while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-out occurs , which can use the Power-
up Timer to provide at lea st a 64 ms Reset. With these
three functions-on-chip, most applications need no
external Reset circuitry.
The Sleep mode is de signe d to of fer a very low-c urrent
Power-Dow n mode. The us er ca n wa ke -up fro m Slee p
through:
• External Reset
• Watchdog Timer Wake-up
• An interrupt
Several oscillator options are also made available to
allow the part to fit the application. The INTOSC option
saves system cost while the LP crystal option saves
power. A set of Configuration bits are used to select
various options (see Register 12-1).
12.1 Configuration Bits
The Configuration bits can be programmed (read as
‘0’), or left un programmed (read as ‘ 1’) to select various
device configurations as shown in Register 12-1.
These bits are mapped in program memory location
2007h.
Note: Address 2007h is beyond the user program
memory space. It belongs to the special
configuration memory space (2000h-
3FFFh), which can be accessed only during
programming. See Memory Programming
Specification (DS41204) for more
information.
PIC12F609/615/617/12HV609/615
DS41302D-page 108 2010 Microchip Technology Inc.
REGISTER 12-1: CONFIG: CONFIGURATION WORD REGISTER (ADDRESS: 2007h) FOR
PIC12F609/615/HV609/615 ONLY
U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
— — — —BOREN1
(1) BOREN0(1) IOSCFS CP(2) MCLRE(3) PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 13 bit 0
Legend:
R = Readable bit
-n = Value at POR
W = Writable bit
‘1’ = Bit is set
P = Programmable
‘0’ = Bit is cleared
U = Unimplemented bit, read as ‘0’
x = Bit is unknown
bit 13-10 Unimplemented: Read as ‘1’
bit 9- 8 BOREN<1:0>: Brow n-out Reset Selectio n bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
0x = BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select bit
1 = 8 MHz
0 = 4 MHz
bit 6 CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 5 MCLRE: MCLR Pin Function Select bit(3)
1 = MCLR pin function is MCLR
0 = MCLR pin f unction is digit al input , MCLR internally tied to VDD
bit 4 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Ti mer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 =RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
110 =RCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
101 =INTOSC oscill ator: CLKOUT fu nctio n on GP4/OSC2/CLKOUT pin, I/O functio n on
GP5/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on
GP5/OSC1/CLKIN
011 =EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN
010 =HS oscillator: High-speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOU T and GP5/OSC1/CLKIN
000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire program memory will be erased when the code protection is turned off.
3: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
2010 Microchip Technology Inc. DS41302D-page 109
PIC12F609/615/617/12HV609/615
REGISTER 12-2: CONFIG – CONFIGURATION WORD (ADDRESS: 2007h) FOR PIC12F617 ONLY
U-1 U-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
—— WRT1 WRT0 BOREN1 BOREN0 IOSCFS CP MCLRE PWRTE WDTE FOSC2 F0SC1 F0SC0
bit
13 bit 0
bit 13-12 Unim plemen ted : Read as ‘1’
bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bits
11 =Write protection off
10 =000h to 1FFh write protected, 200h to 7FFh may be modified by PMCON1 control
01 =000h to 3FFh write protected, 400h to 7FFh may be modified by PMCON1 control
00 =000h to 7FFh write protected, entire program memory is write protected.
bit 9-8 BOREN<1:0>: Brown-out Reset Enable bits
11 =B OR enabled
10 =B OR disabled during Sleep and enabled during operation
0X =BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select
1 =8 MHz
0 =4 MHz
bit 6 CP: Code Protection
1 = Program memory is not code protected
0 = Program memory is external read and write protected
bit 5 MCLRE: MCLR Pin Function Select
1 =MCLR
pin is MCLR function and weak internal pull-up is enabled
0 =MCLR
pin is alternate function, MCLR fun ction is internally disabled
bit 4 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
000 =LP oscillator: Low-power crystal on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
001 =XT oscillator: Crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
010 =HS oscillator: High-speed crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT
011 =EC: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, CLKIN on RA5/T1CKI/OSC1/CLKIN
100 =INTOSCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/CLKIN
101 =INTOSC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/
CLKIN
110 =EXTRCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN
111 =EXTRC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN
Note 1:Enabling Brown-out Reset does not automatically enable the Power-up Timer (PWRT).
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘1’ P = Programmable
-n = Value at POR 1 = bit is set 0 = bit is cleared x = bit is unknown
PIC12F609/615/617/12HV609/615
DS41302D-page 110 2010 Microchip Technology Inc.
12.2 Calibrati on Bits
The 8 MHz internal oscillator is factory calibrated.
These calibration values are stored in fuses located in
the Calibration Word (2008h). The Calibration Word is
not erased when using the specified bulk erase
sequence in the Memory Programming Specification
(DS4120 4) and thus , doe s not requi re repr ogramming.
12.3 Reset
The PIC12F609/615/617/12HV609/615 device
differentiates between various kinds of Reset:
a) Power-on Reset (POR)
b) WDT Reset during normal operation
c) WDT Reset during Sleep
d) MCLR Reset during normal operation
e) MCLR Reset during Sleep
f) Brown-out Reset (BOR)
Some regi sters a re not af fected in any Rese t condit ion;
their st atus is unknown on POR a nd un changed i n an y
other Reset. Most other registers are reset to a “Reset
state” on:
• Pow er-on Reset
•MCLR
Reset
•MCLR
Reset during Sleep
• WDT Reset
• Brown-out Reset (BOR)
WDT wake-up does not cause register resets in the
same manner as a WDT Reset since wake-up is
viewe d as the resump tio n of no rm al op eration. T O an d
PD bits are set or cleared differently in different Reset
situati ons, as indicate d in Table 12-2. Soft ware can use
these bits to determine the nature of the Reset. See
Table 12-5 for a full description of Reset states of all
registers.
A simplif ied block diagra m of the On-Chip Rese t Circu it
is sh own i n Figure 12- 1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 16.0 “Electrical
Specifications” for pulse-width specifications.
FIGURE 12-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR/VPP pin
VDD
OSC1/
WDT
Module
VDD Rise
Detect
OST/PWRT
On-Chip
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
11-bit Ripple Counter
Reset
Enable OST
Enable PWRT
Sleep
Brown-out(1)
Reset BOREN
CLKIN pin
Note 1: Refer to the Configuration Word register (Register 12-1).
RC OSC
2010 Microchip Technology Inc. DS41302D-page 111
PIC12F609/615/617/12HV609/615
12.3.1 POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-on Reset. A maximum rise time for
VDD is required. See Section 16.0 “Electrical
Specifications” for details. If the BOR is enabled, the
maximum rise time specification does not apply. The
BOR circuitry will keep the device in Reset until VDD
reaches VBOR (see Section 12.3. 4 “ Brown-ou t Res et
(BOR)”).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the
operating conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
12.3.2 MCLR
PIC12F609/615/617/12HV609/615 has a noise filter in
the MCLR Reset path. The filter will detect and ignore
small pul ses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
Voltages applied to the MCLR pin that exceed its
specification can result in both MCLR Resets and
excessive current beyond the device specification
during the ESD event. For this reason, Microchip
recommends that the MCLR pin no longer be tied
directly to VDD. The use of an RC netw ork, as shown in
Figure 12-2, is suggeste d.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the GP3/MCLR pin
becomes an external Reset input. In this mode, the
GP3/MCLR pin has a weak pull-up to VDD.
FIGURE 12-2: RECOMMENDED MCLR
CIRCUIT
12.3.3 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from an internal
RC oscillator. For more information, see Section 4.4
“Internal Clock Modes”. The chip is kept in Reset as
long as PWRT is active. The PWRT delay allows the
VDD to rise to an acceptable level. A Configuration bit,
PWRTE, can disable (if set) or enable (if cleared or
programmed) the Power-up Timer. The Power-up
Timer should be enabled when Brown-out Reset is
enabled, although it is not required.
The Power-up Timer delay will vary from chip-to-chip
due to:
•V
DD variation
• Temperature variation
• Process variation
See DC parameters for details (Section 16.0
“Electrical Specifications”).
Note: The POR circuit does not produce an
internal Reset when VDD declines. To re-
enable the POR, VDD must reach Vss for
a minimum of 100 s.
Note: Voltage spikes below VSS at the MCLR
pin, induc ing cu rrent s gre ater than 80 mA,
may ca use la tch-up . Thus , a ser ies res is-
tor of 50-100 should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
VDD
PIC®
MCLR
R1
1kor greater)
C1
0.1 F
(optional, not critical)
R2
100
needed with capacitor)
SW1
(optional)
MCU
PIC12F609/615/617/12HV609/615
DS41302D-page 112 2010 Microchip Technology Inc.
12.3.4 BROWN-OUT RESET (BOR)
The BOREN0 and BOREN1 bits in the Configuration
Word register select one of three BOR modes. One
mode has been added to allow control of the BOR
enable for lower current during Sleep. By selecting
BOREN<1:0> = 10, the BOR is automatically disabled
in Sl eep to co nserve power an d enabl ed on wa ke-up.
See Register 12-1 for the Configuration Word
definition.
A brown-out occurs when VDD falls below VBOR for
greater than parameter TBOR (see Section 16.0
“Electrical Specifications”). The brown-out condition
will reset the device. This will occur regardless of VDD
slew rate. A Brown-out Reset may not occur if VDD falls
below VBOR for less than parameter TBOR.
On any Reset (Power-on, Brown-out Reset, Watchdog
timer, etc.), the chip will remain in Reset until VDD rises
above VBOR (see Figure 12-3). If enabled, the Power-
up T imer will be invoke d by the Reset and keep t he chip
in Reset an addi tional 64 ms.
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-u p Timer will be re-initialized. Onc e VDD
rises above VBOR, the Power-up Timer will execute a
64 ms Reset.
FIGURE 12-3: BROWN-OUT SITUATIONS
Note: The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
register.
64 ms(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset 64 ms(1)
< 64 ms
64 ms(1)
VBOR
VDD
Internal
Reset
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
2010 Microchip Technology Inc. DS41302D-page 113
PIC12F609/615/617/12HV609/615
12.3.5 TIME-OUT SEQUENCE
On power-up, the time-out seque nce is as follows:
• PWRT time-out is invoked after POR has expired.
• OST is activated after the PWRT time-out has
expired.
The total time-out will vary based on oscillator
configuration and PWR TE bit status. For example, in EC
mode with PWRTE bit erased (PWRT disabled), there
will be no time-out at all. Figure 12-4, Figure 12-5 and
Figure 12-6 depict time-out sequences.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 12-5). This is useful for testing purposes or
to synchronize more than one PIC12F609/615/617/
12HV609/615 device op erating in parallel.
Table 12-6 shows the Reset conditions for some
special registers, while Table 12-5 shows the Reset
conditions for all the registers.
12.3.6 POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset occurred
last.
Bit 0 is BOR (Brown-out). BOR is u nknow n o n Powe r-
on Reset. It must then be set by the user and checked
on subsequent Resets to see if BOR = 0, indicating th at
a Brown-out has occurred. The BOR Status bit is a
“don’t care” and is not necessarily predictable if the
brown-o ut circuit is disabl ed (BOREN<1:0> = 00 in the
Configuration Word register).
Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaf fec ted oth erwise. T he user m ust write a
‘1’ to this bit following a Power-on Reset. On a subse-
quent Reset, if POR is ‘0’, it will indicate that a Power-
on Reset has occurred (i.e., VDD may have gone too
low).
For more inform ation, see Section 12.3.4 “Bro wn- out
Reset (BOR)”.
TABLE 12-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 12-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE
TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT RESET
Oscillator Configuration Power-up Brown-out Reset Wake-up from
Sleep
PWRTE = 0PWRTE = 1PWRTE = 0PWRTE = 1
XT, HS, LP TPWRT + 1024 •
TOSC 1024 • TOSC TPWRT + 1024 •
TOSC 1024 • TOSC 1024 • TOSC
RC, EC, INTOSC TPWRT —TPWRT ——
POR BOR TO PD Condition
0x11Power-on Rese t
u011Brown-out Reset
uu0uWDT Reset
uu00WDT Wake-up
uuuuMCLR Reset during normal operation
uu10MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets(1)
PCON — — — — — —PORBOR ---- --qq ---- --uu
STATUS IRP RP1 RP0 TO PD ZDC C0001 1xxx 000q quuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Shaded cell s are not us ed by BOR.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
PIC12F609/615/617/12HV609/615
DS41302D-page 114 2010 Microchip Technology Inc.
FIGURE 12-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
FIGURE 12-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
FIGURE 12-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT T ime-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
2010 Microchip Technology Inc. DS41302D-page 115
PIC12F609/615/617/12HV609/615
TABLE 12-4: INITIALIZATION CONDITION FOR REGISTERS (PIC12F609/HV609)
Register Address Power-on
Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch ----- 0--0 ---- 0--0 ---- u--u(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch ----- 0--0 ---- 0--0 ---- u--u
PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
ANSEL 9Fh ---- 1-11 ---- 1-11 ---- q-qq
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 12-6 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Rese ts will caus e bit 0 = u.
PIC12F609/615/617/12HV609/615
DS41302D-page 116 2010 Microchip Technology Inc.
TABLE 12-5: INITIALIZATION CONDITION FOR REGISTERS (PIC12F615/617/HV615)
Register Address Power-on Reset MCLR Reset
WDT Res et
Brown-out Reset (1)
Wake-up from Slee p throu gh
Interrupt
Wake-up from Slee p throu gh
WDT Time - out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch -000 0-00 -000 0-00 -uuu u-uu(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
TMR2(1) 11h 0000 0000 0000 0000 uuuu uuuu
T2CON(1) 12h -000 0000 -000 0000 -uuu uuuu
CCPR1L(1) 13h xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H(1) 14h xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON(1) 15h 0-00 0000 0-00 0000 u-uu uuuu
PWM1CON(1) 16h 0000 0000 0000 0000 uuuu uuuu
ECCPAS(1) 17h 0000 0000 0000 0000 uuuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
ADRESH(1) 1Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0(1) 1Fh 00-0 0000 00-0 0000 uu-u uuuu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch -00- 0-00 -00- 0-00 -uu- u-uu
PCON 8Eh --- - -- 0x ---- --u u (1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
PR2 92h 1111 1111 1111 1111 1111 1111
APFCON 93h ---0 --00 ---0 --00 ---u --uu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
PMCON1(6) 98h ---- -000 ---- -000 ---- -uuu
PMCON2(6) 99h ---- ---- ---- ---- ---- ----
PMADRL(6) 9Ah 0000 0000 0000 0000 uuuu uuuu
Legend: u = unchanged, x = unknown, – = un i m pl em ented bit, reads as ‘0’, q = value de pends on co ndi t ion.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affec ted differently.
2: One or mor e bi ts in IN TC O N and/or PIR1 will be affected (t o cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4: See Tab le 12-6 f or Re se t va lu e f or specific cond iti on.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: For PIC12 F617 only.
2010 Microchip Technology Inc. DS41302D-page 117
PIC12F609/615/617/12HV609/615
TABLE 12-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS
PMADRH(6) 9Bh ---- -000 ---- -000 ---- -uuu
PMDATL(6) 9Ch 0000 0000 0000 0000 uuuu uuuu
PMDATH(6) 9Dh --00 0000 --00 0000 --uu uuuu
ADRESL(1) 9Eh xxxx xxxx uuuu uuuu uuuu uuuu
ANSEL 9Fh -000 1111 -000 1111 -uuu qqqq
Condition Program
Counter Status
Register PCON
Register
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR Reset during normal operation 000h 000u uuuu ---- --uu
MCLR Reset during Sleep 000h 0001 0uuu ---- --uu
WDT Reset 000h 0000 uuuu ---- --uu
WDT Wake- up PC + 1 uuu0 0uuu ---- --uu
Brown-out Reset 000h 0001 1uuu ---- --10
Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’.
Note 1: When the wa ke -up is due to an i nterrupt and Global Int errup t Ena ble bit, GIE, is set, the PC is l oad ed w i th
the inter rupt vector (0004h) after executio n of PC + 1.
TABLE 12-5: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED)(PIC12F615/617/HV615)
Register Address Power-on Reset MCLR Reset
WDT Reset (Con tinued)
Brown-out Reset (1)
Wake-up from Slee p throu gh
Interrupt
Wake-up from Slee p throu gh
WDT Time-out (Continue d)
Legend: u = unchanged, x = unknown, – = un i m pl em ented bit, reads as ‘0’, q = value de pends on co ndi t ion.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affec ted differently.
2: One or mor e bi ts in IN TC O N and/or PIR1 will be affected (t o cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4: See Tab le 12-6 f or Re se t va lu e f or specific cond iti on.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: For PIC12 F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 118 2010 Microchip Technology Inc.
12.4 Interrupts
The PIC12F609/615/617/12HV609/615 has 8 sources
of interrupt:
• External Interrupt GP2/INT
• Timer0 Overflow Interrupt
• GPIO Change Interrupts
• Comparator Interrupt
• A/D Interrupt (PIC12F61 5/6 17/HV 6 15 onl y)
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt (PIC12F615/617/HV615
only)
• Enhanced CC P Interrup t (PIC12 F615/61 7/HV615
only)
• Flash Memory Self Write (PIC12F617 only)
The Interrup t Control register (INTCON) and Peripheral
Interrupt Request Register 1 (PIR1) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
The Global Interrupt Enable bit, GIE of the INTCON
register, enables (if set) all unmasked interrupts, or
disables (if cleared) all interrupts. Individual interrupts
can be disabled through their corresponding enable
bits in the INTCON register and PIE1 register. GIE is
cleared on Reset.
When an interrupt is serviced, the following actions
occu r automatically:
• The GIE is clea red to di sa ble an y fu rther interrup t.
• The return address is pushed onto the stack.
• The PC is loaded with 0004h.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enabl es unm as ke d interrupt s.
The following interrupt flags are contained in the
INTCON register:
• INT Pin Interrupt
• GPIO Change Interrupt
• Timer0 Overflow Interrupt
The peripheral interrupt flags are contained in the
special register, PIR1. The corresponding interrupt
enable bit is contained in special register, PIE1.
The following interrupt flags are contained in the PIR1
register:
• A/D Interrupt
• Comparator Interrupt
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt
• Enhanced CCP Interrupt
For external interrupt events, such as the INT pin or
GPIO change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 12-8). The latency is the same for one or two-
cycle instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
For additional information on Timer1, Timer2,
comparators, ADC, Enhanced CCP modules, refer to
the respective peripheral section.
12.4.1 GP2/INT INTERRUPT
The external interrupt on the GP2/INT pin is edge-
triggered; either on the rising edge if the INTEDG bit of
the OPTION register is set, or the falling edge, if the
INTEDG b it is c lear. When a val id edge appea rs on th e
GP2/INT pin, the INTF b it of the INTCON regist er is set.
This interrupt can be disabled by clearing the INTE
control bit of the INTCON register. The INTF bit must
be cleare d by so ftware in the Interru pt Serv ic e Rou tine
before re -enabling this int errupt. The GP2/INT in terrupt
can wake-up the processor from Sleep, if the INTE bit
was set prior to going into Sleep. See Section 12.7
“Power-Down M ode (Sleep)” for details on Sleep and
Figure 12-9 for timing of wake-up from Sleep through
GP2/INT interrupt.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’ and cannot generate an interrupt.
2010 Microchip Technology Inc. DS41302D-page 119
PIC12F609/615/617/12HV609/615
12.4.2 TIMER0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
the T0IF bit of the INTCON register. The interrupt can
be enabled/disabled by setting/clearing T0IE bit of the
INTCON register. See Section 6.0 “Timer0 Module”
for operation of the Timer0 module.
12.4.3 GPIO INTERRUPT-ON-CHANGE
An input change on GPIO sets the GPIF bit of the
INTCON register. The interrupt can be enabled/
disabled by setting/clearing the GPIE bit of the
INTCON register. Plus, individual pins can be
configured through the IOC register.
FIGURE 12-7: INTERRUPT LOGIC
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
TMR1IF
TMR1IE
CMIF
CMIE
T0IF
T0IE
INTF
INTE
GPIF
GPIE
GIE
PEIE
Wake-up (If in Sleep mode)(1)
Inte rrup t to C PU
ADIF
ADIE
IOC-GP0
IOC0
IOC-GP1
IOC1
IOC-GP2
IOC2
IOC-GP3
IOC3
IOC-GP4
IOC4
IOC-GP5
IOC5
TMR2IF
TMR2IE
CCP1IF
CCP1IE
Note 1: Some peripherals depend upon the system clock for
operation. Since the system clock is suspended during Sleep, only
those peripherals which do not depend upon the system clock will wake
the part from Sleep. See Section 12.7.1 “Wake-up from Sleep”.
(615/617
(615/617 only)
(615/617 only)
only)
PIC12F609/615/617/12HV609/615
DS41302D-page 120 2010 Microchip Technology Inc.
FIGURE 12-8: INT PIN INTERRUPT TIMING
TABLE 12-7: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC —— IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
PIR1 —ADIF
(1) CCP1IF(1) —CMIF —TMR2IF
(1) TMR1IF -00- 0-00 -000 0-00
PIE1 —ADIE
(1) CCP1IE(1) —CMIE —TMR2IE
(1) TMR1IE -00- 0-00 -000 0-00
Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by the interrupt module.
Note 1: PIC12F615/617/HV615 only.
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT p i n
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Dummy Cycle
Inst (PC)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency
is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 16.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1) (2)
(3) (4)
(5)
(1)
2010 Microchip Technology Inc. DS41302D-page 121
PIC12F609/615/617/12HV609/615
12.5 Context Saving During Interr upts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Temporary holding registers W_TEMP and
STATUS_TEMP should be placed in the last 16 bytes
of GPR (see Figure 2-3). These 16 locations are
common to all banks and do not require banking. This
makes context save and restore operations simpler.
The code shown in Ex ample 12-1 can be used to:
• Store the W register
• Store the STATUS register
• Execute the ISR code
• Restore the Status (and Bank Select Bit register)
• Restore the W register
EXAMPLE 12-1: SAVING STATUS AND W REGISTERS IN RAM
12.6 Watchdog T imer (WDT)
The Watchdog Timer is a free running, on-chip RC
oscillator , which requires no external components. This
RC oscillator is separate from the external RC oscillator
of the CLKIN pin and INTOSC. That means that the
WDT will run , even if th e clock on the OSC 1 and OSC 2
pins of the device has been stopped (for example, by
execut ion of a SLEEP ins truc tio n). Du ring normal op er-
ation, a WDT time out generates a device Reset. If the
device is in Sleep mode, a WDT time out causes the
device to wake-up and continue with normal operation.
The WDT can be permanently disabled by program-
ming the Configuration bit, WDTE, as clear
(Section 12.1 “Configuration Bits”).
12.6.1 WDT PERIOD
The WDT ha s a nomin al time -out perio d of 18 ms (wi th
no prescaler). The time-out periods vary with
temperature, VDD and process variations from part to
part (see DC specs). If longer time-out periods are
desired, a prescaler with a division ratio of up to 1:128
can be as si gne d to th e WD T un der soft w are c ont rol b y
writing to the OPTION register. Thus, time-out periods
up to 2.3 seconds can be realized.
The CLRWDT and SLEEP instructions clear the WDT
and the presc al er, if assi gne d to the WD T, and preve nt
it from timing out and generating a device Reset.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time out.
Note: The PIC12F609/615/617/12HV609/615
does not require saving the PCLATH.
However, if computed GOTOs are used in
both the ISR and the main code, the
PCLATH must be saved and restored in
the ISR.
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS,W ;Swap status to be saved into W
;Swaps are used because they do not affect the status bits
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
PIC12F609/615/617/12HV609/615
DS41302D-page 122 2010 Microchip Technology Inc.
12.6.2 WDT PROGRA MMIN G
CONSIDERATIONS
It should also be taken in account that under worst-
case conditions (i.e., VDD = Min., Temperature = Max.,
Max. WDT prescaler) it may take several seconds
before a WDT time out occurs.
FIGURE 12-2: WATCHDOG TIMER BLOCK DIAGRAM
TABLE 12-9: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 12-8: WDT STATUS
Conditions WDT
WDTE = 0
Cleared
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTRC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
Name Bi t 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 B it 1 B it 0 Value on
POR, BOR
Value on
all other
Resets
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
CONFIG IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — —
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: S ee Register 12-1 fo r operation of all Configuration Word register bits.
T0CKI
T0SE
pin
CLKOUT
TMR0
Watchdog
Timer
WDT
Time-Out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
0
1
0
1
0
1
SYNC 2
Cycles
8
8
8-bit
Prescaler
0
1
(= FOSC/4)
PSA
PSA
PSA
3
2010 Microchip Technology Inc. DS41302D-page 123
PIC12F609/615/617/12HV609/615
12.7 Power-Down Mode (Sleep)
The Power-Down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
• WDT will be cleared but keeps running.
•PD
bit in the STATUS register is cleared.
•TO
bit is set.
• Oscillator driver is turned off.
• I/O ports maintain the status they had before SLEEP
was executed (driving high, low or high-impedance).
For lowest cu rrent consumption in this mode, all I/O pins
should be either at VDD or VSS, with no external circuitry
drawing current from the I/O pin and the comparators
and CVREF should be disabled. I/O pins that are high-
impedance inputs should be pulled high or low externally
to avoid switching currents caused by floating inputs.
The T0CKI input should also be at VDD or VSS for lowest
current cons umption. The contribution from on-chip pull-
ups on GPIO should be c onside red .
The MCLR pin must be at a logic high level.
12.7.1 WAKE-UP FROM SLEEP
The devi ce can wa ke-up from Sleep through one of th e
following events:
1. External Reset input on MCLR pin.
2. Watchdog Timer wake-up (if WDT was
enabled).
3. Interrupt from GP2/INT pin, GPIO change or a
peripheral interrupt.
The firs t event wi ll ca use a de vice Res et. The two latter
events are considered a continuation of program
execution. The TO and PD bits in the STA TUS register
can be used to determine the cause of device Reset.
The PD bit, whic h is set on power -up, is cl ear ed wh en
Sleep is invoked. TO bit is cleared if WDT wake-up
occurred.
The follo wing periph eral interrupt s can wake the device
from Sleep:
1. Timer1 interrupt. Timer1 must be operating as
an asynchronous counter.
2. ECCP Capture mode interrupt.
3. A/D conversion (when A/D clock source is RC).
4. Comparator output changes state.
5. Interrupt-on-change.
6. External Interrupt from INT pin.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up thro ugh an interrup t eve nt, the co rres pon din g
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
ins tructi on afte r the SLEEP instruction. If the GIE bit is
set (enabled) , th e device e x ecutes t he instructi on after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instruction following SLEEP is not desirable, the user
should hav e a NOP after the SLEEP instr ucti on.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
12.7.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and inte rrupt fla g bit s et, one of the fo llow ing wil l occu r:
• If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
comple te as a NOP. Therefore, the WDT an d WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
• If the interrupt occurs during or after the
execution of a SLEEP ins truc tio n, the dev ic e wi ll
Immediately wake-up from Sleep. The SLEEP
instruction is executed. Therefore, the WDT and
WDT prescal er and pos t s ca ler (if ena bl ed) w ill be
cleared, the TO bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP inst ruction comple tes. To
determine whether a SLEEP instr uctio n executed , test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction. See
Figure 12-9 for more details.
Note: It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note: If the g lobal interrup ts a re di sable d (GIE is
cleared) and any interrupt source has both
it s interrupt enabl e bit and the corres pond-
ing interrupt flag bits set, the device will
immediately wake-u p from Sleep.
PIC12F609/615/617/12HV609/615
DS41302D-page 124 2010 Microchip Technology Inc.
FIGURE 12-9: WAKE-UP FROM SLEEP THROUGH INTERRUPT
12.8 Code Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out using ICSP™ for verifi cation purposes.
12.9 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant 7 bits of the ID locations are
used.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(3)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 0005h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Oscillator mode assume d.
2: TOST = 10 24 TOSC (drawing not to scale). This delay does not apply to EC, INTOSC and RC Oscillator modes.
3: GIE = ‘1’ assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = ‘0’, execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
Note: The entire Flash program memory will be
erased when the code protection is turned
off. See the MemoryProgramming
Specification (DS41204) for more
information.
2010 Microchip Technology Inc. DS41302D-page 125
PIC12F609/615/617/12HV609/615
12.10 In-Circuit Serial Programming™
ThePIC12F609/615/617/12HV609/615
microcontrollers can be serially programmed while in
the end ap plica tion circu it. This is s imply done wit h five
connections for:
•clock
•data
• power
• ground
• programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom
firmware to be programmed.
The device is placed into a Program/Verify mode by
holding the GP0 and GP1 pins low, while raising the
MCLR (VPP) pin from VIL to VIHH. See the Memory
Programming Specification (DS41284) for more
info rmat io n. G P0 be come s t he p rogr amm ing data and
GP1 becomes the programming clock. Both GP0 and
GP1 are Schmitt Trigger inputs in Program/Verify
mode.
A typical In-Circuit Serial Programming connection is
shown in Figure 12-10.
FIGURE 12-10: TYPICAL IN-CIRCUIT
SERIAL PROGRAMMING
CONNECTION
12.11 In-Circuit Debugger
Since in-circuit debugging requires access to three pins,
MPLAB® ICD 2 development with an 14-pin device is
not practical. A special 28-pin PIC12F609/615/617/
12HV609/615 ICD device is used with MPLAB ICD 2 to
provide separ ate cloc k, data and MCLR pi ns an d fre es
all normally available pins to the user .
A special debugging adapter allows the ICD device to
be used in place of a PIC12F609/615/617/12HV609/
615 device. The debugging adapter is the only source
of the ICD device.
When the ICD pin on the PIC12F609/615/617/
12HV609/615 ICD device is held low, the In-Circuit
Debugg er fun cti on ali ty is ena ble d. This functi on allo ws
simple debugging functions when used with MPLAB
ICD 2. When the microcontroller has this feature
enabled, some of the resources are not available for
general use. Table 12-10 shows which features are
consumed by the background debugger.
TABLE 12-10: DEBUGGER RESOURCES
For more information, see “MPLAB® ICD 2 In-Circuit
Debugger User’s Guide” (DS51331), available on
Micro chip’s we b site (www.microchip.c om).
FIGURE 12-11: 28 PIN ICD PINOUT
Note: To erase the device VDD must be above
the Bulk Erase VDD minimum given in the
Memory Programming Specification
(DS41284)
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC12F615/12HV615
VDD
VSS
MCLR/VPP/GP3/RA3
GP1
GP0
+5V
0V
VPP
CLK
Data I/O
* * *
*
* Isolation devices (as required)
PIC12F609/12HV609
PIC12F617/
Resource Description
I/O pins ICDCLK, ICDDATA
Stack 1 level
Program Memory Add ress 0h must be NOP
700h-7FFh
28-Pin PDIP
In-Circuit Debug Device
VDD
CS0
CS1
CS2
RA5
RA4
GND
RA0
RA1
SHUNTEN
RC3 NC
RA2
RC0
RA3
RC5
RC4
RC1
RC2
NC
1
2
3
4
5
6
7
8
9
10
28
27
26
25
24
23
22
21
20
19
ICDDATA ICD
NC
ICDCLK
ICDMCLR
NC
NC
NC
11
12
13
14
18
17
16
15
PIC16F616-ICD
PIC12F609/615/617/12HV609/615
DS41302D-page 126 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 127
PIC12F609/615/617/12HV609/615
13.0 VOLTAGE REGULATOR
The PIC 12HV609/ HV615 de vice s i nclud e a permane nt
internal 5 volt (nominal) shunt regulator in parallel with
the VDD pin. This eliminates the need for an external
voltage regulator in systems sourced by an
unregulated supply. All external devices connected
directly to the VDD pin will share the regulated supply
voltage and contribute to the total VDD supply current
(ILOAD).
13.1 Regulator Operation
A shunt regulator generates a specific supply voltage
by creating a voltage drop across a pass resistor RSER.
The voltage at the VDD pin of the microcontroller is
monitored and compared to an internal voltage refer-
ence. The current through the resistor is then adjusted,
based on the result of the comparison, to produce a
volt age drop equal to the difference between the supply
voltage VUNREG and the VDD of the microcontroller.
See Figure 13-1 for voltage regulator schematic.
FIGURE 13-1: VO LTAGE REGULATOR
An external current limiting resistor, RSER, located
between the unregulated supply, VUNREG, and th e VDD
pin, drops the difference in voltage between VUNREG
and VDD. RSER must be between RMAX and RMIN as
defined by Equatio n 13-1.
EQUATION 13-1: RSER LIMITING RESISTOR
13.2 Regulator Considerations
The supply voltage VUNREG and load current are not
constant. Therefore, the current range of the regulator
is limited. Selecting a value for RSER must take these
three factors into consideration.
Since the regulator uses the band gap voltage as the
regulated voltage reference, this voltage reference is
permanently enabled in the PIC12HV609/HV615
devices.
The shunt regulator will still consume current when
below operating voltage range for the shunt regulator.
13.3 Design Considerations
For more information on using the shunt regulator and
managing current load, see Application Note AN1035,
“Designing with HV Microcontrollers” (DS01035).
Feedback
VDD
VSS
CBYPASS
RSER
VUNREG
ISUPPLY
ISHUNT
ILOAD
Device
RMAX = (VUMIN - 5V)
1.05 • (4 MA + ILOAD)
RMIN = (VUMAX - 5V)
0.95 • (50 MA)
Where:
RMAX = maximum value of RSER (ohms)
RMIN = minimum value of RSER (ohms)
VUMIN = minimum value of VUNREG
VUMAX= maximum value of VUNREG
VDD = regulated voltage (5V nominal)
ILOAD = maximum expected load current in mA
including I/O pin currents and external
circuits connected to VDD.
1.05 = compensatio n for +5% to leranc e of RSER
0.95 = compensation for -5% tolerance of RSER
PIC12F609/615/617/12HV609/615
DS41302D-page 128 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 129
PIC12F609/615/617/12HV609/615
14.0 INSTRUCTION SET SUMMARY
The PIC12F609/615/617/12HV609/615 instruction set
is highly orthogonal and is comprised of three basic
categories:
•Byte-oriented operations
•Bit-oriented operations
•Literal and cont rol operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instructi on type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
is presented in Figure 14-1, while the various opcode
fields are sum m ariz ed in Table 14-1.
Table 14-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The desti nation designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W regis ter . If ‘d’ is one, the res ult is place d
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instr uction cycle co nsists of four os cillator periods ;
for an oscillator frequency o f 4 MHz, t his gives a normal
instruction execution time of 1 s. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
change d as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
14.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF GPIO inst ruc tion will read GP IO,
clear all the data bits, then write the result back to
GPIO. This example would have the unintended
consequence of clearing the condition that set the
GPIF flag.
TABLE 14-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 14-1: GENERAL FORMAT FOR
INSTRUCTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral fie ld, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
Byte-oriented file re gister operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriente d file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k ( l i te ra l )
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal )
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC12F609/615/617/12HV609/615
DS41302D-page 130 2010 Microchip Technology Inc.
TABLE 14-2: PIC12F609/615/617/12HV609/615 INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-B it Opcod e Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
–
k
k
k
–
k
–
–
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move litera l to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of its elf (e.g., MOVF GPIO, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external
device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
2010 Microchip Technology Inc. DS41302D-page 131
PIC12F609/615/617/12HV609/615
14.2 Instruction Descriptions
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal ‘ k’
and the result is placed in the
W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Desc ription: Ad d the content s of the W register
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W registe r . I f
‘d’ is ‘1’, the result is stored back
in register ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal
‘k’. The r esult is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is ‘1’, the
result is sto r ed bac k in regi ste r ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Af fe cte d: None
Descr iption: If bit ‘b’ in regis ter ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in reg ister ‘f’ is ‘0’, t he ne xt
instruction is discarded, and a NOP
is exec uted ins tea d, m ak ing thi s a
two-cycle instruction.
PIC12F609/615/617/12HV609/615
DS41302D-page 132 2010 Microchip Technology Inc.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Desc ription: If bi t ‘b’ in regi ster ‘f’ is ‘0’, the ne xt
instructi on is exec uted .
If bit ‘b’ is ‘1’, then the next
instructi on is discarded an d a NOP
is exec ute d i nst ead, making this a
two -cycle instruc tion.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits <10:0>. The upper bits of
the PC are loa ded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Desc ript ion : The con t en t s of regi ste r ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Af fe cte d: T O, PD
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets
the prescaler of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Af fe cte d: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Af fe cte d: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
2010 Microchip Technology Inc. DS41302D-page 133
PIC12F609/615/617/12HV609/615
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decrem ented. If ‘d’ is ‘0’, th e result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
resu lt is ‘0’, then a NOP is
executed instead, making it a
two-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The e le ven -bi t im me dia t e v al ue i s
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
incremen ted. If ‘d’ is ‘0’, th e res ult
is placed in the W registe r. If ‘d’ i s
‘1’, the result is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Af fe cte d: None
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, a NOP is executed
instead, making it a two-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Af fe cte d: Z
Descr iption: The conten ts of the W register are
OR’ed with the eight-bit literal ‘k’.
The result is placed in the
W registe r.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Af fe cte d: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ is ‘0’, the result is
placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
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MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Desc ript ion : The con t en t s of regi ste r ‘f’ is
moved to a destination depe ndent
upon the status of ‘d’. If d = 0,
destination is W register. If d = 1,
the destination is file register ‘f’
itself. d = 1 is useful to test a file
register since Status flag Z is
affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W= value in FSR
register
Z= 1
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Desc ription: The eight-bit l iteral ‘k’ i s loaded i nto
W register. The “don’t cares” will
assemble as ‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W= 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Af fe cte d: None
Description: Move data from W register to
register ‘f’.
Words: 1
Cycles: 1
Example: MOVW
FOPTION
Before Instruction
OPTION= 0xFF
W = 0x4F
After Instruction
OPTION= 0x4F
W = 0x4F
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Af fe cte d: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
2010 Microchip Technology Inc. DS41302D-page 135
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RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is
POPed and Top-of-Stack (TOS)
is load ed in the PC. Inter rupt s are
enabled by setting Global
Interrupt Enable bit, GIE (INT-
CON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Af fe cte d: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
Words: 1
Cycles: 2
Example:
TABLE
DONE
CALL TABLE;W contains
;table offset
;value
GOTO DONE
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ;End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Af fe cte d: None
Description: Return from subroutine. The stack
is POPed an d t he top of the st a ck
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
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RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Desc ript ion : The conten t s of regis te r ‘f’ are
rotat ed one bit to the r ight throug h
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the res ult is placed
back in register ‘f’.
Register fC
Register fC
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Af fe cte d: TO, PD
Description: The power-down Status bit, PD
is cleared. Time-out Status bit,
TO is set. Watchdog Timer and
its prescaler are cleared.
The processor is put into Sleep
mode with th e oscillat or stopped.
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
Result Condition
C = 0W k
C = 1W k
DC = 0W<3:0> k<3:0>
DC = 1W<3:0> k<3:0>
2010 Microchip Technology Inc. DS41302D-page 137
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SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
‘0’, the result is placed in the W
register. If ‘d’ is ‘1’, the result is
placed in register ‘f’.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register
are XOR’ed with the eight-b it
literal ‘k’. The result is placed in
the W register.
C = 0W f
C = 1W f
DC = 0W<3:0> f<3:0>
DC = 1W<3:0> f<3:0>
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Af fe cte d: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
PIC12F609/615/617/12HV609/615
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NOTES:
2010 Microchip Technology Inc. DS41302D-page 139
PIC12F609/615/617/12HV609/615
15.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Deve lopment Boards,
Evaluation Kits, and Starter Kits
15.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- I n-Ci rcuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-l ine help
• Integrat ion of select thir d party tool s, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source fil es (either C or assembly)
• One-touch com pile or assem ble, and d ownload to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembl y)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
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15.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the comp ilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
15.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microc ontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the comp ilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
process or , and one-s tep driver , and can run on multipl e
platforms.
15.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly co de
• Conditional assembly for multi-purpose
sour ce fil es
• Directives that allow complete control over the
assembly process
15.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLA B C18 C Compiler. It can li nk relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manage s the cre ation an d
modification of library files of precompiled code. When
a rout in e from a l ibra ry is called fro m a so urc e f ile , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, re placement, delet ion and extraction
15.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the asse mbler to pro duce i ts o bje ct file . The ass embl er
generates relocatable object files that can then be
archived or lin ked with other relocata ble object files and
arch ives to c rea te an e xecu tabl e fil e. N otab le fe atu res
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
2010 Microchip Technology Inc. DS41302D-page 141
PIC12F609/615/617/12HV609/615
15.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most periph erals and i nternal regi sters.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
developm ent tool .
15.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated D evelopment Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgrad able through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers signifi-
cant advantages over competitive emulators including
low-cost, full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, a rugge-
dized probe interface and long (up to three meters) inter-
connection cables.
15.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
device s. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nect ed to t he des ign e nginee r's PC using a hig h-spee d
USB 2.0 i nte rfac e a nd is co nnected to the t arget w ith a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 support s all
MPLAB ICD 2 headers.
15.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most af fordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller , hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC12F609/615/617/12HV609/615
DS41302D-page 142 2010 Microchip Technology Inc.
15.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The P ICkit™ 2 Develo pment Program mer/Debu gger i s
a low-cost development tool with an easy to use inter-
face fo r programmin g and debu gging Micr ochip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families o f 8 - bi t, 1 6-b it, an d 3 2-b it
microcontrollers, and many Microchip Serial EEPROM
produ cts . With Mic rochip ’s power ful MPL AB Integrate d
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file reg ist ers can be ex amin ed and m odifie d.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller , hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
15.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for me nus an d err or messag es an d a modu-
lar, detachable socket assembly to support various
package type s. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer can rea d, verify an d program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPL AB PM3 has high-spe ed comm unications and
optimized algorithms for quick programming of large
memory devices and inc orporates an MMC card for file
storage and data applications.
15.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards includ e prototyping a reas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s suppo rt a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience t he specified d evice. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2010 Microchip Technology Inc. DS41302D-page 143
PIC12F609/615/617/12HV609/615
16.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias.......................................................................................................... -40° to +125°C
Storage temperature........................................................................................................................ -65°C to +150°C
Volta ge on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V
Volta ge on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total power dissipati on(1) ...............................................................................................................................800 mW
Maximum curr ent out of VSS pin...................................................................................................................... 95 mA
Maximum curr ent into VDD pin......................................................................................................................... 95 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin..............................................................................................25 mA
Maximum current sunk by GPIO...................................................................................................................... 90 mA
Maximum current sourced GPIO............................................................................................................. ..... .... 90 mA
Note 1: Power diss ipation is calcula ted as follows : PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x
IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC12F609/615/617/12HV609/615
DS41302D-page 144 2010 Microchip Technology Inc.
FIGURE 16-1: PIC12F609/615/617 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
FIGURE 16-2: PIC12HV 60 9/61 5 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
5.5
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
2010 Microchip Technology Inc. DS41302D-page 145
PIC12F609/615/617/12HV609/615
16.1 DC Characteristi cs: PIC12F609/615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditi ons (unle ss otherw is e stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VDD Supply Voltage
D001 PIC12F609/615/617 2.0 — 5.5 V FOSC < = 4 MHz
D001 PIC12HV609/615 2.0 — —(2) V FOSC < = 4 MHz
D001B PIC12F609/615/617 2.0 — 5.5 V FOSC < = 8 MHz
D001B PIC12HV609/615 2.0 — —(2) V FOSC < = 8 MHz
D001C PIC12F609/615/617 3.0 — 5.5 V FOSC < = 10 MHz
D001C PIC12HV609/615 3.0 — —(2) V FOSC < = 10 MHz
D001D PIC12F609/615/617 4.5 — 5.5 V FOSC < = 20 MHz
D001D PIC12HV609/615 4.5 — —(2) V FOSC < = 20 MHz
D002* VDR RAM Data Retention
Voltage(1) 1.5 — — V Device in Sleep mode
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
—V
SS —VSee Section 1 2.3.1 “Power-on Reset
(POR)” for detai ls.
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 — — V/ms See Section 12.3.1 “Power-on Reset
(POR)” for detai ls.
* These parameters are characterized but not tested.
† Data in “Typ” col umn i s a t 5.0 V, 25°C un les s othe rwis e s t ate d. These parameters are for d es ign gu ida nc e
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: User defined. Voltage across the shunt regulator should not exceed 5V.
PIC12F609/615/617/12HV609/615
DS41302D-page 146 2010 Microchip Technology Inc.
16.2 DC Characteristics: PIC12F609/615/617-I (Industrial)
PIC12F609/615/617-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Char ac ter ist ics Min Typ† Max Unit s Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) —13 25 A2.0FOSC = 32 kHz
LP Oscillator mode
PIC12F609/615/617 — 19 29 A3.0
—3251A5.0
D011* — 135 225 A2.0F
OSC = 1 MHz
XT Oscillator mode
—185285A3.0
—300405A5.0
D012 — 240 360 A2.0F
OSC = 4 MHz
XT Oscillator mode
—360505A3.0
— 0.66 1.0 mA 5.0
D013* — 75 110 A2.0F
OSC = 1 MHz
EC Oscillator mode
—155255A3.0
—345530A5.0
D014 — 185 255 A2.0F
OSC = 4 MHz
EC Oscillator mode
—325475A3.0
— 0.665 1.0 mA 5.0
D016* — 245 340 A2.0F
OSC = 4 MHz
INTOSC mode
—360485A3.0
— 0.620 0.845 mA 5.0
D017 — 395 550 A2.0F
OSC = 8 MHz
INTOSC mode
— 0.620 0.850 mA 3.0
— 1.2 1.6 mA 5.0
D018 — 175 235 A2.0F
OSC = 4 MHz
EXTRC mode(3)
—285390A3.0
—530750A5.0
D019 — 2.2 3.1 mA 4.5 FOSC = 20 MHz
HS Oscillator mode
— 2.8 3.35 mA 5.0
* These parameters are characterized but not tested.
† Data in “Typ” colum n is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-
rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current con-
sumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in KO hm s ( K
2010 Microchip Technology Inc. DS41302D-page 147
PIC12F609/615/617/12HV609/615
16.3 DC Characteristics: PIC12HV609/615-I (Industrial)
PIC12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Char ac teri st ics Min Typ† Max Unit s Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) —160 230 A2.0FOSC = 32 kHz
LP Oscillator mode
PIC12HV609/615 — 240 310 A3.0
— 280 400 A4.5
D011* — 270 380 A2.0FOSC = 1 MHz
XT Oscillator mode
— 400 560 A3.0
— 520 780 A4.5
D012 — 380 540 A2.0F
OSC = 4 MHz
XT Oscillator mode
— 575 810 A3.0
— 0.875 1.3 mA 4.5
D013* — 215 310 A2.0F
OSC = 1 MHz
EC Osci ll ator mo de
— 375 565 A3.0
— 570 870 A4.5
D014 — 330 475 A2.0F
OSC = 4 MHz
EC Osci ll ator mo de
— 550 800 A3.0
— 0.85 1.2 mA 4.5
D016* — 310 435 A2.0F
OSC = 4 MHz
INTOSC mode
— 500 700 A3.0
— 0.74 1.1 mA 4.5
D017 — 460 650 A2.0F
OSC = 8 MHz
INTOSC mode
— 0.75 1.1 mA 3.0
— 1.2 1.6 mA 4.5
D018 — 320 465 A2.0F
OSC = 4 MHz
EXTRC mode(3)
— 510 750 A3.0
— 0.770 1.0 mA 4.5
D019 — 2.5 3.4 mA 4.5 FOSC = 20 MHz
HS Osci llator mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 4.5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test co ndi tions fo r all IDD measurement s in activ e operati on mode are: OSC1 = exte rnal squ are wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WD T disa bl ed.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
3: For RC oscillator configurations, current through REXT i s no t includ ed. The curre nt through the resist or can
be extended by the formula IR = VDD/2REXT (mA) with REXT in k
PIC12F609/615/617/12HV609/615
DS41302D-page 148 2010 Microchip Technology Inc.
16.4 DC Characteristi cs: PIC12F609/615/617 - I (Industri al)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Char ac teri st ics Min Typ† Max Unit s Conditions
VDD Note
D020 Power-down Base
Current (IPD)(2) — 0.05 0.9 A 2.0 WDT, BOR, Comparator, VREF and
T1OS C disabled
— 0.15 1.2 A3.0
PIC12F609/615/617 — 0.35 1.5 A5.0
150 500 nA 3.0 -40°C TA +25°C for industrial
D021 — 0.5 1.5 A 2.0 WDT Current(1)
—2.54.0A3.0
—9.517 A5.0
D022 — 5.0 9 A 3.0 BOR Current(1)
—6.012 A5.0
D023 — 50 60 A 2.0 Comparator Current(1), single
comparator enabled
—5565A3.0
—6075A5.0
D024 — 30 40 A2.0CV
REF Current(1) (high range )
—4560A3.0
—75105A5.0
D025* — 39 50 A2.0CV
REF Current(1) (low range)
—5980A3.0
—98130A5.0
D026 — 5.5 10 A 2.0 T1OSC Current(1), 32.768 kHz
—7.012 A3.0
—8.514 A5.0
D027 — 0.2 1.6 A 3.0 A/D Current(1), no conversion in
progress
— 0.36 1.9 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidan ce
only and are not tested.
Note 1: The peri pheral current is t he sum of the ba se IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
2010 Microchip Technology Inc. DS41302D-page 149
PIC12F609/615/617/12HV609/615
16.5 DC Characteristics: PIC12F609/615/617 - E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2)
PIC12F609/615/617
— 0.05 4.0 A 2.0 WDT, BOR, Comparator, VREF and
T1OSC disabled
— 0.15 5.0 A3.0
— 0.35 8.5 A5.0
D021E — 0.5 5.0 A 2.0 WDT Current(1)
—2.58.0A3.0
—9.519 A5.0
D022E — 5.0 15 A 3 .0 BOR Current(1)
—6.019 A5.0
D023E — 50 70 A 2.0 Comparator Current(1), single
comparator enabled
—5575A3.0
—6080A5.0
D024E — 30 40 A2.0CV
REF Current(1) (high range)
—4560A3.0
—75105A5.0
D025E* — 39 50 A2.0CV
REF Current(1) (low range)
—5980A3.0
—98130A5.0
D026E — 5.5 16 A 2.0 T1OSC Current(1), 32.7 68 kHz
—7.018 A3.0
—8.522 A5.0
D027E — 0.2 6.5 A 3.0 A/D Current(1), no convers ion in
progress
—0.3610 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unle ss othe rwis e stated. These p aram ete rs are for design guidanc e
only and are not tested.
Note 1: The peri pheral current is t he sum of the ba se IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
PIC12F609/615/617/12HV609/615
DS41302D-page 150 2010 Microchip Technology Inc.
16.6 DC Characteristi cs: PIC12HV609/615 - I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Char ac teri st ics Min Typ† Max Units Conditions
VDD Note
D020 Power-down Base
Current (IPD)(2,3) —135200A 2.0 WDT, BOR, Comparator, VREF and
T1OSC disabled
—210280A3.0
PIC12HV609/615 — 260 350 A4.5
D021 — 135 200 A 2.0 WDT Current(1)
—210285A3.0
—265360A4.5
D022 — 215 285 A 3.0 BOR Current(1)
—265360A4.5
D023 — 185 270 A 2.0 Comparat or Current(1), single
comparator enabled
—265350A3.0
—320430A4.5
D024 — 165 235 A2.0CV
REF Current(1) (high range)
—255330A3.0
—330430A4.5
D025* — 175 245 A2.0CV
REF Current(1) (low range)
—275350A3.0
—355450A4.5
D026 — 140 205 A 2.0 T1OSC Current(1), 32.768 kHz
—220290A3.0
—270360A4.5
D027 — 210 280 A 3.0 A/D Current(1), no conversion in
progress
—260350A4.5
* These parameters are characterized but not tested.
† Data in “Typ” column is at 4.5V, 25°C unle ss othe rwis e stated. These p aram ete rs are for design guidanc e
only and are not tested.
Note 1: The peri pheral current is t he sum of the ba se IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
3: Shunt regulator is always on and always draws operating current.
2010 Microchip Technology Inc. DS41302D-page 151
PIC12F609/615/617/12HV609/615
16.7 DC Characteristics: PIC12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characteristics Min Typ† Max Units Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2,3)
PIC12HV609/615
—135200A 2.0 WDT, BOR, Comparator, VREF and
T1OSC disabled
—210280A3.0
—260350A4.5
D021E — 135 200 A 2.0 WDT Current(1)
—210285A3.0
—265360A4.5
D022E — 215 285 A 3.0 BOR Current(1)
—265360A4.5
D023E — 185 280 A 2.0 Comparator Curren t(1), single
comparator enabled
—265360A3.0
—320430A4.5
D024E — 165 235 A2.0CV
REF Current(1) (high range)
—255330A3.0
—330430A4.5
D025E* — 175 245 A2.0CV
REF Current(1) (low range)
—275350A3.0
—355450A4.5
D026E — 140 205 A 2.0 T1OSC Current(1), 32.768 kHz
—220290A3.0
—270360A4.5
D027E — 210 280 A 3.0 A/D Current(1), no convers ion in
progress
—260350A4.5
* These parameters are characterized but not tested.
† Data in “Typ” c ol um n is at 4 . 5V, 25°C u nle ss oth erw is e s t at ed. Thes e parameters are for d esi gn gui dan ce
only and are not tested.
Note 1: The peri pheral current is t he sum of the ba se IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
3: Shunt regulator is always on and always draws operating current.
PIC12F609/615/617/12HV609/615
DS41302D-page 152 2010 Microchip Technology Inc.
16.8 DC Characteristics: PIC12F609/ 615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended)
DC CHARACTERISTICS Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VIL Input Low Voltage
I/O port:
D030 with TTL buffer Vss — 0.8 V 4.5V VDD 5.5V
D030A Vss — 0.15 VDD V2.0V VDD 4.5V
D031 with Schmitt Trigger buffer Vss — 0.2 VDD V2.0V VDD 5.5V
D032 MCLR, OSC1 (RC mode) V SS —0.2 VDD V(NOTE 1)
D033 O SC1 (XT and LP modes) V SS —0.3V
D033A OSC1 (HS mode) VSS —0.3 VDD V
VIH Input High Voltage
I/O ports: —
D040 with TTL buffer 2.0 — VDD V4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 — VDD V2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD —VDD V2.0V VDD 5.5V
D042 MCLR 0.8 VDD —VDD V
D043 O SC1 (XT and LP modes) 1.6 — V DD V
D043A OSC1 (HS mode) 0.7 VDD —VDD V
D043B OSC1 (RC mode) 0.9 VDD —VDD V(NOTE 1)
IIL Input Leakage Current(2,3)
D060 I /O ports — 0.1 1AVSS VPIN VDD,
Pin at high-impedance
D061 GP3/MCLR(3,4) —0.7 5AVSS VPIN VDD
D063 OSC1 — 0.1 5AVSS VPIN VDD, XT, HS and
LP oscillator configuration
D070* IPUR GPIO Weak Pull-up Current(5) 50 250 400 AVDD = 5.0V, VPIN = VSS
VOL Output Low Voltage ——0.6VIOL = 7.0 mA, VDD = 4.5V,
-40°C to +125°C
D080 I /O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40°C to +85°C
VOH Outp ut H igh Voltage VDD – 0.7 — — V IOH = -2.5mA, VDD = 4.5V,
-40°C to +125°C
D090 I /O ports(2) VDD – 0. 7 — — V IOH = -3.0 mA, VDD = 4.5V,
-40°C to +85°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.
5: This specification applies to all weak pull -up pins, including the weak pull-up found on GP3/ MCLR. When GP3/MCLR is
configured as MCLR reset pin, the weak pull-up is always enabled.
6: Applies to PIC12F617 only.
2010 Microchip Technology Inc. DS41302D-page 153
PIC12F609/615/617/12HV609/615
D101* COSC2 Capacitive Loading Specs on
Output Pins
OSC2 pin — — 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins — — 50 pF
Program Flash Memory
D130 EPCell Endurance 10K 100K — E/W -40°C TA +85°C
D130A EDCell Endurance 1K 10K — E /W +85°C TA +125°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VPEW VDD for Bulk Erase/Write 4.5 — 5.5 V
D132A VPEW VDD for Row Erase/Write(6) VMIN —5.5V
D133 TPEW Erase/Write cycle time — 2 2.5 ms
D134 TRETD Characteristic Retention 40 — — Year Provi de d n o ot h er sp eci f ic a ti o ns
are violated
16.8 DC Characteristics: PIC12F609/ 615/617/12HV609/615-I (Industrial)
PIC12F609/615/617/12HV609/615-E (Extended) (Continued)
DC CHARACTERISTICS Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt T r igger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: This specification applies to GP3/MCLR configured as GP3 with the internal weak pull-up disabled.
5: This specification applies to all weak pull -up pins, including the weak pull-up found on GP3/ MCLR. When GP3/MCLR is
configured as MCLR reset pin, the weak pull-up is always enabled.
6: Applies to PIC12F617 only.
PIC12F609/615/617/12HV609/615
DS41302D-page 154 2010 Microchip Technology Inc.
16.9 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Typ Units Conditions
TH01 JA Thermal Resistance
Junction to Ambient 84.6* C /W 8-pin P DIP package
149.5* C/W 8-pin SOIC package
211* C/W 8-pin MSOP package
60* C/W 8-pin DFN 3x3mm package
44* C/W 8-pin DFN 4x4mm package
TH02 JC Thermal Resistance
Junction to Case 41.2* C/ W 8-pin PDIP package
39.9* C/W 8-pin SOIC package
39* C/W 8-pin MSOP package
9* C/W 8-pin DFN 3x3mm package
3.0* C/W 8-pin DFN 4x4mm package
TH03 TDIE Die Temperature 150* C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/OI/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD -
VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TDIE - TA)/JA
(NOTE 2)
* These parameters are characterized but not tested.
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient temperature.
2010 Microchip Technology Inc. DS41302D-page 155
PIC12F609/615/617/12HV609/615
16.10 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 16-3: LOAD CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O Port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their mean ings:
SFFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
V
SS
C
L
Legend: CL=50 pF fo r all pins
15 pF for OSC2 output
Load Con dition
Pin
PIC12F609/615/617/12HV609/615
DS41302D-page 156 2010 Microchip Technology Inc.
16.11 AC Characteri stics: PIC12F609/615/617/12HV609/615 (Industrial, Extended)
FIGURE 16-4: CLOCK TIMING
TABLE 16-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 37 kHz LP Oscillator mode
DC — 4 MHz XT Oscillator mode
DC — 20 MHz HS Oscillator mode
DC — 20 MH z EC Oscillator mode
Oscillator Frequency(1) — 32.768 — kHz LP Os cillator mode
0.1 — 4 MHz XT Oscillator mode
1 — 20 MH z HS Oscillator mode
DC — 4 MHz RC Oscillator mode
OS02 TOSC External CLKIN Period(1) 27 — s LP Oscillator mode
250 — ns XT Oscillator mode
50 — ns HS Oscillator mode
50 — ns EC Oscillator mode
Oscillator Period(1) — 30.5 — s LP Oscillator mode
250 — 10,000 ns XT Oscillator mode
50 — 1,000 ns HS Oscillator mode
250 — — ns RC Oscillator mode
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TOSH,
TOSLExternal CLKIN High,
External CLKIN Low 2——s LP oscillator
100 — — ns XT oscillator
20 — — ns HS oscillator
OS05* TOSR,
TOSFExternal CLKIN Rise,
External CLKIN Fall 0—ns LP oscillator
0—ns XT oscillator
0—ns HS oscillator
* These parameters are characterized but not tested.
† Data in “T yp” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at “min” values wit h an external clock applied to OSC1 pin. When
an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
2010 Microchip Technology Inc. DS41302D-page 157
PIC12F609/615/617/12HV609/615
TABLE 16-2: OSCILLATOR PARAMETERS
Standard Operati ng Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Freq.
Tolerance Min Typ† Max Units Conditions
OS06 TWARM Internal Oscillator Switch
when running(3) ———2TOSC Slowest clock
OS07 INTOSC Internal Calibrated
INTOSC Frequency(2)
(4MHz)
1% 3.96 4.0 4.04 MHz VDD = 3.5V, TA = 25°C
2% 3.92 4.0 4.08 MHz 2.5V VDD 5.5V,
0°C TA +85°C
5% 3.80 4.0 4.2 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS08 INTOSC Internal Calibrated
INTOSC Frequency(2)
(8MHz)
1% 7.92 8.0 8.08 MHz VDD = 3.5V, TA = 25°C
2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V,
0°C TA +85°C
5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS10* TIOSC ST INTOSC Oscillator Wake-
up from Sleep
Start-up Time
— 5.5 12 24 sVDD = 2.0V, -40°C to +85°C
—3.5714sV
DD = 3.0V, -40°C to +85°C
—3611sV
DD = 5.0V, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
3: By design.
PIC12F609/615/617/12HV609/615
DS41302D-page 158 2010 Microchip Technology Inc.
FIGURE 16-5: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pi n
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17 OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
TABLE 16-3: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS11 TOSH2CKLFOSC to CLKOUT (1) — — 70 ns VDD = 5.0V
OS12 TOSH2CKHFOSC to CLKOUT (1) — — 72 ns VDD = 5.0V
OS13 TCKL2IOVCLKOUT to Port out valid(1) — — 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15 TOSH2IOVFOSC (Q1 cycle) to Port out valid — 50 70* ns VDD = 5.0V
OS16 TOSH2IOIFOSC (Q2 cycle) to Port input invalid
(I/O in hold time) 50 — — ns VDD = 5.0V
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle)
(I/O in setup time) 20 — — ns
OS18 TIOR Port output rise time(2) —
—15
40 72
32 ns VDD = 2.0V
VDD = 5.0V
OS19 TIOF Port output fall time(2) —
—28
15 55
30 ns VDD = 2.0V
VDD = 5.0V
OS20* TINP INT pin input high or low time 25 — — ns
OS21* TRAP GPIO interrupt-on-change new input
level time TCY ——ns
* These parameters are characterized but not tested.
† D ata in “Typ” column is at 5.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
2: Includes OSC2 in CLKOUT mode.
2010 Microchip Technology Inc. DS41302D-page 159
PIC12F609/615/617/12HV609/615
FIGURE 16-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 16-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Wat c hdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33*
37
* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.
Reset
(due to BOR)
VBOR + VHYST
PIC12F609/615/617/12HV609/615
DS41302D-page 160 2010 Microchip Technology Inc.
TABLE 16-4: RESET, WATCHDOG TI MER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
30 TMCLMCLR P ulse Width (low) 2
5—
——
—s
sVDD = 5V, -40°C to +85°C
VDD = 5V, -40°C to +125°C
31* TWDT Watchdog Timer Time-out
Period (No Prescaler) 10
10 20
20 30
35 ms
ms VDD = 5V, -40°C to +85°C
VDD = 5V, -40°C to +125°C
32 TOST Oscillation Start-up Timer
Period(1, 2) — 1024 — TOSC (NOTE 3)
33* TPWRT Power-up Timer Period 40 65 140 ms
34* TIOZ I/O High-impedance from
MCLR Low or Watchdog Timer
Reset
——2.0s
35 VBOR Brown-out Reset Voltage 2.0 2.15 2.3 V (NOTE 4)
36* VHYST Brown-out Reset Hysteresis — 100 — mV
37* TBOR Brown-out Reset Minimum
Detection Period 100 — — sVDD VBOR
* These parameters are characterized but not tested.
† D ata in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on charac teri za tion data for that p articula r osci lla tor typ e unde r standard ope rati ng con di t ion s
with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-
ation and/or higher than expected current consumption. All devices are tested to operate at “min” values
with an e xt erna l c lo ck app li ed t o th e O SC 1 pin . When an e xte rna l c loc k inp ut is us ed, the “max” cycle ti me
limit is “DC” (no clock) for all devices.
2: By design.
3: Period of the slow er clock.
4: To ensure these voltage tolera nces , VDD and VSS must be capacitively decoupled as close to the device
as possibl e. 0. 1 F and 0.01 F values in parallel are recommended.
2010 Microchip Technology Inc. DS41302D-page 161
PIC12F609/615/617/12HV609/615
FIGURE 16-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 16-5: T IMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CK I Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler 15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler 15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 — — ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN) — 32.768 — kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment 2 TOSC —7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
PIC12F609/615/617/12HV609/615
DS41302D-page 162 2010 Microchip Technology Inc.
FIGURE 16-9: PIC12F615/617/HV615 CAPTURE/COMPARE/PWM TIMINGS (ECCP)
TABLE 16-6: PIC12F615/617/HV615 CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP)
TABLE 16-7: COMPARATOR SPECIFICATIONS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCP1 Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCP1 Input Per iod 3TCY + 40
N— — ns N = prescale
value (1, 4 or
16)
* These parameters are characterized but not tested.
† D ata in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Standard Operating Conditions (unless otherwise stated)
Operati ng Tem per ature -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CM01 VOS Input Offset Voltage(2) — 5.0 10 mV
CM02 VCM Input Co mmon Mode Voltage 0 — VDD – 1.5 V
CM03* CMRR Common Mode Rejection Ratio +55 — — dB
CM04* TRT Response Time(1) Falling — 150 600 ns
Rising — 200 1000 ns
CM05* TMC2COV Comparator Mode Change to Output Valid — — 10 s
CM06* VHYS Input Hysteresis Voltage — 45 60 mV
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Respo nse time is m easure d with on e com pa rato r input at (VDD - 1.5)/2 - 100 mV to (VDD -1.5)/2+20mV.
The other input is at (VDD -1.5)/2.
2: Input offset voltage is measured with one comparator input at (VDD -1.5V)/2.
Note: Refer to Figure 16-3 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP1
2010 Microchip Technology Inc. DS41302D-page 163
PIC12F609/615/617/12HV609/615
TABLE 16-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS
TABLE 16-9: VOLTAGE REFERENCE SPECIFICATIONS
TABLE 16-10: SHUNT REGULATOR SPECIFICATIONS (PIC12HV609/615 only)
S tandard Operating Conditions (unless othe rwis e stated)
Operati ng tem pera ture -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CV01* CLSB Step Size(2) —
—VDD/24
VDD/32 —
—V
VLow Range (VRR = 1)
High Range (VRR = 0)
CV02* CACC Absolute Accuracy(3) —
——
— 1/2
1/2 LSb
LSb Low Range (VRR = 1)
High Range (VRR = 0)
CV03* CRUnit Resistor Value (R) — 2k —
CV04* CST Settling Time(1) ——10s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.
2: See Section 9.10 “Comparator Voltage Reference” for more information.
3: Absolute Accuracy when CVREF output is (VDD -1.5).
VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated)
Operati ng tem pera ture -40°C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
VR01 VP6OUT VP6 voltage output 0.5 0.6 0.7 V
VR02 V1P2OUT V1P2 voltage output 1.05 1.20 1.35 V
VR03* TSTABLE Settli ng Time — 10 — s
* These parameters are characterized but not tested.
SHUNT REGULATOR CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40 °C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
SR01 VSHUNT Shunt Voltage 4.75 5 5.4 V
SR02 ISHUNT Shunt Current 4 — 50 mA
SR03* TSETTLE Settling Time — — 150 ns To 1% of final value
SR04 CLOAD Load Capacitance 0.01 — 10 F Bypass capacitor on VDD
pin
SR05 ISNT Regulator operating current — 180 — A Includes ban d gap
reference current
* These parameters are characterized but not tested.
PIC12F609/615/617/12HV609/615
DS41302D-page 164 2010 Microchip Technology Inc.
TABLE 16-11: PIC12F615/617/HV615 A/D CONVERTER (ADC) CHARACTERISTICS:
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD01 NRResolution — — 10 bits bit
AD02 EIL Integral Error — — 1LSbVREF = 5.12V(5)
AD03 EDL Differential Error — — 1 LSb No missing codes to 10 bits
VREF = 5.12V (5)
AD04 EOFF Offset Error — +1.5 +2.0 LSb VREF = 5.12V(5)
AD07 EGN Gain Error — — 1LSbVREF = 5.12 V(5)
AD06
AD06A VREF Reference Voltage(3) 2.2
2.5 ——
VDD VAbsolute minimum to ensure 1 LSb
accuracy
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended
Impedance of Analog
Voltage Source
—— 10k
AD09* IREF VREF Input Current(3) 10 — 1000 ADuring VAIN acquisition.
Based on differential of VHOLD to VAIN.
—— 50A During A/D convers ion cycle.
* These parameters are characterized but not tested.
† D ata in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module.
5: VREF = 5V for PIC12HV615.
2010 Microchip Technology Inc. DS41302D-page 165
PIC12F609/615/617/12HV609/615
TABLE 16-12: PIC12F615/617/HV615 A/D CONVERSION REQUIREMENTS
FIGURE 16-10: PIC12F615/617/HV615 A/D CONVERSION TIMING (NORMAL MODE)
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD130* TAD A/D Clock Period 1.6 — 9.0 sTOSC-based, VREF 3.0V
3.0 — 9.0 sTOSC-based, VREF full range(3)
A/D Internal RC
Oscillator Period 3.0 6.0 9.0 sADCS<1:0> = 11 (ADRC mode)
At VDD = 2.5V
1.6 4.0 6.0 sAt VDD = 5.0V
AD131 TCNV Conversion Time
(not includin g
Acquisiti on Time)(1)
—11—TAD Set GO/DONE bit to new data in A/D
Result register
AD132* TACQ Acquisiti on Time 11.5 — s
AD133* TAMP Amplifier Settling Time — — 5 s
AD134 TGO Q4 to A/D Clock Start —
—
TOSC/2
TOSC/2 +
TCY
—
—
—
— If the A/D clock source is selected as
RC, a time of TCY is added before the
A/D clock st art s. This allo ws the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
† D ata in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
2: See S ectio n 10.3 “A/D Acquisition Requireme nts” for minimum conditions.
3: Full range for PIC12HV609/HV615 powered by the shunt regulator is the 5V regulated voltage.
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
987 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
6
AD134 (TOSC/2(1))
1 TCY
AD132
PIC12F609/615/617/12HV609/615
DS41302D-page 166 2010 Microchip Technology Inc.
FIGURE 16-11: PIC12F615/617/HV615 A/D CONVERSION TIMING (SLEEP MODE)
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
AD134
6
8
1 TCY
(TOSC/2 + TCY(1))
1 TCY
2010 Microchip Technology Inc. DS41302D-page 167
PIC12F609/615/617/12HV609/615
16.12 High Temperature Operation
This section outlines the specifications for the
PIC12F615 device operating in a temperature range
between -40°C and 150°C.(4) The specifications
between -40°C and 150°C(4) are identical to those
shown in DS41288 and DS80329.
TABLE 16-13: ABSOLUTE MAXIMUM RATINGS
Note 1: Writes are not allowed for Flash
Program Memory above 125°C.
2: All AC tim ing specifi cations a re incre ased
by 30%. This derating factor will include
param et ers such as TPWRT.
3: The temperature range indicator in the
part number is “H” for -40°C to 150°C.(4)
Example: PIC12F615T-H/ST indicates the
device is shipped in a TAPE and reel
configuration, in the MSOP package, and
is rated for operation from -40°C to
150°C.(4)
4: AEC-Q100 reliability testing for devices
intended to operate at 150°C is 1,000
hours. Any desi gn in w hich the t ot al op er-
ating time from 125°C to 150°C will be
great er than 1,000 hours is not warr ante d
without prior written approval from
Microchip Technology Inc.
Parameter Source/Sink Value Units
Max. Current: VDD Source 20 mA
Max. Current: VSS Sink 50 mA
Max. Current: PIN Source 5 mA
Max. Current: PIN Sink 10 mA
Pin Current: at VOH Source 3 mA
Pin Current: at VOL Sink 8.5 mA
Port Current: GPIO Source 20 mA
Port Current: GPIO Sink 50 mA
Maximum Junction Temperature 155 °C
Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device . This is a stres s ra ting onl y, and functi ona l op era tion of the device at thos e or a ny othe r con di t ion s
above those indicated in the operation listings of this specification is not implied. Exposure above
maximum rating conditions for extended periods may affect device reliability.
PIC12F609/615/617/12HV609/615
DS41302D-page 168 2010 Microchip Technology Inc.
TABLE 16-14: DC CHARACTERISTICS FOR IDD SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No. Device
Characteristics Units Min Typ Max Condition
VDD Note
D010 Supply Current (IDD)A—1358 2.0 IDD LP OSC (32 kHz)
—1967 3.0
—3292 5.0
D011
A—135316 2.0 IDD XT OSC (1 MHz)
—185400 3.0
—300537 5.0
D012 A—240495 2.0 IDD XT OSC (4 MHz)
—360680 3.0
mA — 0.660 1.20 5.0
D013
A— 75 158 2.0 IDD EC OSC (1 MHz)
—155338 3.0
—345792 5.0
D014 A—185357 2.0 IDD EC OSC (4 MHz)
—325625 3.0
mA — 0.665 1.30 5.0
D016
A—245476 2.0 IDD INTOSC (4 M Hz)
—360672 3.0
— 620 1.10 5.0
D017 A — 395 757 2.0 IDD INTOSC (8 M Hz)
mA — 0.620 1.20 3.0
— 1.20 2.20 5.0
D018
A—175332 2.0 IDD EXTRC (4 MHz)
—285518 3.0
—530972 5.0
D019 mA — 2.20 4.10 4.5 IDD HS OSC (20 MHz)
— 2.80 4.80 5.0
2010 Microchip Technology Inc. DS41302D-page 169
PIC12F609/615/617/12HV609/615
TABLE 16-15: DC CHARACTERISTICS FOR IPD SPECIFICATIONS FOR PIC12F615-H (High Temp.)
TABLE 16-16: WATCHDOG TIMER SPECIFICATIONS FOR PIC12F615-H (High Temp.)
TABLE 16-17: LEAKAGE CURRENT SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No. Device
Characteristics Units Min Typ Max Condition
VDD Note
D020E Power Down Base
Current A— 0.05 12 2.0 IPD Base
— 0.15 13 3.0
— 0.35 14 5.0
D021E
A—0.520 2.0 WDT Current
—2.525 3.0
—9.536 5.0
D022E A—5.028 3.0 BOR Current
—6.036 5.0
D023E
A—105195 2.0 IPD Current (Both
Comparators Enabled)
— 110 210 3.0
— 116 220 5.0
A— 50 105 2.0 IPD Current (One Compar ator
Enabled)
—55110 3.0
— 60 125 5.0
D024E
A—3058 2.0 IPD (CVREF, High Range)
—4585 3.0
— 75 142 5.0
D025E
A—3976 2.0 IPD (CVREF, Low Range)
—59114 3.0
— 98 190 5.0
D026E
A—5.530 2.0 IPD (T1 OSC, 32 kHz)
—7.035 3.0
—8.545 5.0
D027E A—0.212 3.0IPD (A2D on, not conv erti ng)
—0.315 5.0
Param
No. Sym Characteristic Units Min Typ Max Conditions
31 TWDT Watchdog Timer Time-out Period
(No Prescaler) ms 6 20 70 150°C Temperature
Param
No. Sym Characteristic Units Min Typ Max Conditions
D061 IIL Input Leakage Current(1)
(GP3/RA3/MCLR)µA — ±0.5 ±5.0 VSS VPIN VDD
D062 IIL Input Leakage Current(2)
(GP3/RA3/MCLR)µA 50 250 400 VDD = 5.0V
Note 1: This specification applies when GP3/RA3/MCLR is configured as an input with the pull-up disabled. The
leakage current for the GP3/RA3/MCLR pin is higher than for the standard I/O port pins.
2: This specification applies when GP3/RA3/MCLR is configured as the MCLR reset pin function with the
weak pull-up enabled.
PIC12F609/615/617/12HV609/615
DS41302D-page 170 2010 Microchip Technology Inc.
TABLE 16-18: OSCILLATOR PARAMETERS FOR PIC12F615-H (High Temp.)
TABLE 16-19: COMPARATOR SPECIFICATIONS FOR PIC12F615-H (High Temp.)
Param
No. Sym Characteristic Frequency
Tolerance Units Min Typ Max Conditions
OS08 INTOSC Int. Calibrated INT OSC
Freq.(1) ±10% MHz 7.2 8.0 8.8 2.0V VDD 5.5V
-40°C TA 150°C
Note 1: To ensure these oscillator frequency tolerances, Vdd and Vss must be capacitively decoupled as close to
the device as possible. 0.1 µF and 0.01 µF values in parallel are recommended.
Param
No. Sym Characteristic Units Min Typ Max Conditions
CM01 VOS Input Offset Vo ltage mV — ±5 ±20 (VDD - 1.5)/2
2010 Microchip Technology Inc. DS41302D-page 171
PIC12F609/615/617/12HV609/615
17.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
“Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3) or (mean -
3) respectively, where s is a standard deviation, over each temperature range.
FIGURE 17-1: PIC12F609/615/617 IDD LP (32 kHz) vs. VDD
FIGURE 17-2: PIC12F609/615/617 IDD EC (1 MHz) vs. VDD
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for i nformational purp oses only . The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
0
10
20
30
40
50
60
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
IDD LP (µA)
Maximum
VDD (V)
Typical
135
42 6
0
100
200
300
400
500
600
135
42 6
Typical
Maximum
VDD (V)
IDD EC (µA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 172 2010 Microchip Technology Inc.
FIGURE 17-3: PIC12F 60 9/6 15/6 17 IDD EC (4 MHz) vs. VDD
FIGURE 17-4: PIC12F 60 9/6 15/6 17 IDD XT (1 MHz) vs. VDD
FIGURE 17-5: PIC12F 60 9/6 15/6 17 IDD XT (4 MHz) vs. VDD
0
200
400
600
800
1000
1200
Typical
VDD (V)
IDD EC (µA)
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Tem p) + 3
(-40°C to 125°C)
135
42 6
0
200
400
600
800
1000
1200
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Cas e Tem p) + 3
(-40°C to 125°C)
135
42 6
Typical
Maximum
VDD (V)
IDD XT (µA)
0
200
400
600
800
1000
1200
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Temp) + 3
(-40°C to 125°C)
135
42 6
Typical
Maximum
VDD (V)
IDD XT (µA)
2010 Microchip Technology Inc. DS41302D-page 173
PIC12F609/615/617/12HV609/615
FIGURE 17-6: PIC12F 60 9/6 15/6 17 IDD INTOSC (4 MHz) vs. VDD
FIGURE 17-7: PIC12F609/6 15/6 17 IDD INTOSC (8 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
900
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Ca se Temp ) + 3
(-40°C to 125°C)
135
42 6
Typical
Maximum
VDD (V)
IDD INTOSC (µA)
0
200
400
600
800
1000
1200
1400
1600
1800
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Case T emp) + 3
(-40°C to 125°C)
135
42 6
Typical
Maximum
VDD (V)
IDD INTOSC (µA)
PIC12F609/615/617/12HV609/615
DS41302D-page 174 2010 Microchip Technology Inc.
FIGURE 17-8: PIC12F 60 9/6 1561 7 IDD EXTRC (4 MHz) vs. VDD
FIGURE 17-9: PIC12F 60 9/6 15/6 17 IDD HS (20 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Case T emp) + 3
(-40°C to 125°C)
135
42 6
Typical
Maximum
VDD (V)
IDD EXTRC (µA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
1
2
3
4
VDD (V)
IDD HS (mA)
5
46
Maximum
Typical
2010 Microchip Technology Inc. DS41302D-page 175
PIC12F609/615/617/12HV609/615
FIGURE 17-10 : PIC12F60 9/6 15/6 17 IPD BASE vs. VDD
FIGURE 17-11: PIC12F609/6 15/6 17 IPD COMPARATOR (SIN GLE ON) vs. VDD
0
1
2
3
4
5
6
7
8
9
IPD BASE (µA)
Typical: Statistical Mean @25°C
Extended: Mean (Wors t-C ase Temp ) + 3
(-40°C to 125°C)
135
42 6
Industrial
Typical
Extended
VDD (V)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
30
40
50
60
70
80
90
VDD (V)
IPD CMP (µA)
135
42 6
Industrial
Typical
Extended
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Tem p) + 3
(-40°C to 85°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 176 2010 Microchip Technology Inc.
FIGURE 17-12 : PIC12F60 9/6 15/6 17 IPD WDT vs. VDD
FIGURE 17-13 : PIC12F60 9/6 15/6 17 IPD BOR vs. VDD
0
2
4
6
8
10
12
14
16
18
20
VDD (V)
IPD WDT (µA)
135
42 6
Industrial
Typical
Extended
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Cas e Temp ) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
0
2
4
6
8
10
12
14
16
18
20
VDD (V)
IPD BOR (µA)
135
42 6
Industrial
Typical
Extended
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40 °C to 85°C)
2010 Microchip Technology Inc. DS41302D-page 177
PIC12F609/615/617/12HV609/615
FIGURE 17-14 : PIC12F60 9/6 15/6 17 IPD CVREF (LOW RANGE) vs. VDD
FIGURE 17-15 : PIC12F60 9/6 15/6 17 IPD CVREF (HI RANGE) vs. VDD
0
20
40
60
80
100
120
140
VDD (V)
IPD CVREF (µA)
135
42 6
Maximum
Typical
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Indust rial: Me an (Wor st-Ca s e Temp) + 3
(-40°C to 85°C)
0
20
40
60
80
100
120
135
VDD (V)
IPD CVREF (
µ
A)
24 6
Maximum
Typical
Typical: Statistical Mean @25°C
Extended: Mean (Worst-Case Temp) + 3
(- 40°C t o 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 178 2010 Microchip Technology Inc.
FIGURE 17-16 : PIC12F60 9/6 15/6 17 IPD T1OSC vs. VDD
FIGURE 17-17 : PIC12F61 5/6 17 IPD A/D vs. VDD
0
5
10
15
20
25
VDD (V)
IPD T1OSC (µA)
Industrial
Typical
Extended
135
42 6
Typical: Statistical Mean @25°C
Extended: Mean (Worst- Case Tem p) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
0
2
4
6
8
10
12
14
VDD (V)
IPD A2D (µA)
Industrial
Typical
Extended
135
42 6
Ty pical: Statistical Mean @25°C
Extended: Mean (Worst-Case Tem p) + 3
(-40°C to 125°C)
Industrial: Mean (Worst-Case Temp) + 3
(-40°C to 85°C)
2010 Microchip Technology Inc. DS41302D-page 179
PIC12F609/615/617/12HV609/615
FIGURE 17-18 : PIC12HV60 9/61 5 IDD LP (32 kHz) vs. VDD
FIGURE 17-19 : PIC12HV60 9/61 5 IDD EC (1 MHz) vs. VDD
FIGURE 17-20 : PIC12HV60 9/61 5 IDD EC (4 MHz) vs. VDD
0
50
100
150
200
250
300
350
400
450
VDD (V)
IDD LP (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Tem p) + 3
(-40°C to 125°C)
100
200
300
400
500
600
700
800
900
1000
VDD (V)
IDD EC (µA)
5
13
4
2
Typical
Maximum
Typical: St atist ical Mean @25°C
Maximum: Mean (Worst -Cas e Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
1400
VDD (V)
IDD EC (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 180 2010 Microchip Technology Inc.
FIGURE 17-21 : PIC12HV60 9/61 5 IDD XT (1 MHz) vs. VDD
FIGURE 17-22 : PIC12HV60 9/61 5 IDD XT (4 MHz) vs. VDD
FIGURE 17-23 : PIC12HV60 9/61 5 IDD INTOSC (4 MHz) vs. VDD
0
100
200
300
400
500
600
700
800
900
VDD (V)
IDD XT (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
1400
VDD (V)
IDD XT (µA )
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
VDD (V)
IDD INTOSC (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 181
PIC12F609/615/617/12HV609/615
FIGURE 17-24 : PIC12HV60 9/61 5 IDD INTOSC (8 MHz) vs. VDD
FIGURE 17-25 : PIC12HV60 9/61 5 IDD EXTRC (4 MHz) vs. VDD
FIGURE 17-26 : PIC12HV60 9/61 5 IPD BASE vs. VDD
0
500
1000
1500
2000
VDD (V)
IDD INTOSC (µA )
5
134
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
200
400
600
800
1000
1200
VDD (V)
IDD EXTRC (µA)
5
13
4
2
Maximum
Ty pical: Statistical Mean @25°C
Maximum: Mea n (Worst-C ase Tem p ) + 3
(-40°C to 125°C) Typical
0
50
100
150
200
250
300
350
400
VDD (V)
IPD BASE (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 182 2010 Microchip Technology Inc.
FIGURE 17-27 : PIC12HV60 9/61 5 IPD COMPARATOR (SINGLE ON) vs. VDD
FIGURE 17-28 : PIC12HV60 9/61 5 IPD WDT vs. VDD
FIGURE 17-29 : PIC12HV60 9/61 5 IPD BOR vs. VDD
0
100
200
300
400
500
VDD (V)
IPD CMP (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Temp) + 3
(-40°C to 125°C)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD WDT (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Case T emp) + 3
(-40°C to 125°C)
100
150
200
250
300
350
400
VDD (V)
IPD BOR (µA)
5
342
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Wor st-C ase Temp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 183
PIC12F609/615/617/12HV609/615
FIGURE 17-30 : PIC12HV60 9/61 5 IPD CVREF (LOW RANGE) vs. VDD
FIGURE 17-31 : PIC12HV60 9/61 5 IPD CVREF (HI RANGE) vs. VDD
FIGURE 17-32 : PIC12HV60 9/61 5 IPD T1OSC vs. VDD
0
100
200
300
400
500
VDD (V)
IPD CVREF (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
VDD (V)
IPD CVREF (µA)
0
100
200
300
400
500
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Cas e Tem p) + 3
(-40°C to 125°C)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD T1OSC (µA)
5
13
4
2
Typical
Maximum
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 184 2010 Microchip Technology Inc.
FIGURE 17-33 : PIC12HV61 5 IPD A/D vs. VDD
FIGURE 17-34 : VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V)
0
50
100
150
200
250
300
350
400
VDD (V)
IPD A2D (µA)
5
342
Typical
Maximum
Typical: Stat istical Mean @25°C
Maximum: Mean (Worst -Case T emp) + 3
(-40°C to 125°C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Cas e Temp) + 3
(-40°C to 125°C) Max. 125°C
Min. -40°C
Max. 85°C
Typical 25°C
2010 Microchip Technology Inc. DS41302D-page 185
PIC12F609/615/617/12HV609/615
FIGURE 17-35 : VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V)
FIGURE 17-36 : VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Max. 85°C
Typ. 25°C
Min. -40°C
Max. 125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0 IOH (mA)
VOH (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 186 2010 Microchip Technology Inc.
FIGURE 17-37 : VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V)
FIGURE 17-38: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
3.0
3.5
4.0
4.5
5.0
5.5
-5.0-4.5-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0 IOH (mA)
VOH (V)
Max. -40°C
Typ. 25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
Min. 125°C
0.5
0.7
0.9
1.1
1.3
1.5
1.7
2.02.5 3.03.5 4.04.5 5.05.5
VDD (V)
VIN (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-Ca se Temp ) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 187
PIC12F609/615/617/12HV609/615
FIGURE 17-39: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
FIGURE 17-40: TYPICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max. 125°C
VIH Min. -40°C
VIL Min. 125°C
VIL Max. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
2
4
6
8
10
12
14
16
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (µs)
85°C
25°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
PIC12F609/615/617/12HV609/615
DS41302D-page 188 2010 Microchip Technology Inc.
FIGURE 17-41: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
FIGURE 17-42: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (µs)
-40°C
85°C
25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-Case Temp) + 3
(-40°C to 125°C)
0
1
2
3
4
5
6
7
8
9
10
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
-40°C
25°C
85°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -Case T emp) + 3
(-40°C to 125°C)
2010 Microchip Technology Inc. DS41302D-page 189
PIC12F609/615/617/12HV609/615
FIGURE 17-43: TYPICAL HFINTOSC FREQUE NCY CHANGE vs. VDD (25°C)
FIGURE 17-44: TYPICAL HFINTOSC FREQUE NCY CHANGE vs. VDD (85°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change fr om Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change fr om Calibration (%)
PIC12F609/615/617/12HV609/615
DS41302D-page 190 2010 Microchip Technology Inc.
FIGURE 17-45: TYPICAL HFINTOSC FREQUE NCY CHANGE vs. VDD (125°C)
FIGURE 17-46: TYPICAL HFINTOSC FREQUE NCY CHANGE vs. VDD (- 40°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
2010 Microchip Technology Inc. DS41302D-page 191
PIC12F609/615/617/12HV609/615
FIGURE 17-47: 0.6V REFERENCE VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-48: 1.2V REFERENCE VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-49: SHUNT REGULATOR VOLTAGE vs. INPUT CURRENT (TYPICAL)
0.56
0.57
0.58
0.59
0.6
0.61
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Reference Voltage (V)
2.5V
4V
5V
5.5V
3V
1.2
1.21
1.22
1.23
1.24
1.25
1.26
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Reference Voltage (V)
2.5V
3V
4V
5V
5.5V
4.96
4.98
5
5.02
5.04
5.06
5.08
5.1
5.12
5.14
5.16
0102030405060
Input Cur rent (mA)
Shunt Regulator Voltage (V)
25°C
85°C
125°C
-40°C
PIC12F609/615/617/12HV609/615
DS41302D-page 192 2010 Microchip Technology Inc.
FIGURE 17-50: SHUNT REGULATOR VOLTAGE vs. TEMP (TYPICAL)
FIGURE 17-51: COMPARATOR RESPONSE TIME (RISING EDGE)
4.96
4.98
5
5.02
5.04
5.06
5.08
5.1
5.12
5.14
5.16
-60 -40 -20 0 20 40 60 80 100 120 140
Temp (C)
Shunt Re gulator Volt a ge (V)
50 mA
40 mA
20 mA
15 mA
10 mA
4 mA
0
100
200
300
400
500
600
700
800
900
1000
2.0 2.5 4.0 5.5
VDD (V)
Resp on s e Ti m e (nS)
Note:
V- input = T r ansition from VCM + 100mV to VCM - 20mV
V+ input = VCM
VCM = (VDD - 1.5V)/2
Min. -40°C
Typ. 25°C
Max. 85°C
Max. 125°C
2010 Microchip Technology Inc. DS41302D-page 193
PIC12F609/615/617/12HV609/615
FIGURE 17-52 : COMPARATOR RESPONSE TIME (FALLING EDGE)
FIGURE 17-53: WDT TIME-OUT PERIOD vs. VDD OVER TEMPERATURE
0
100
200
300
400
500
600
700
800
900
1000
2.0 2.5 4.0 5.5
VDD (V)
Response Time (nS)
Max. 85°C
Typ . 25°C
Min . -40°C
Max. 125°C
Note:
V- input = Transition from VCM - 100mV to VCM + 20MV
V+ input = VCM
VCM = (VDD - 1.5V)/2
5
10
15
20
25
30
35
40
45
50
55
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VDD (V)
Time (ms)
-40°C
25°C
85°C
125°C
PIC12F609/615/617/12HV609/615
DS41302D-page 194 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 195
PIC12F609/615/617/12HV609/615
18.0 PACKAGING INFORMATION
18.1 Package Marking Information
*Standard PIC device marking consists of Microchip part number, year code, week code, and traceability code. For
PIC device marking beyond this, certain price adders apply. Please check with your Mic rochip Sales Office. For QTP
devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note:In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line, thus limiting the number of available characters for
customer-specific information.
3
e
3
e
XXXXXNNN
8-Lead PDIP (.300”)
XXXXXXXX
YYWW 017
Example
XXFXXX/P
0610
8-Lead SOIC (.150”)
XXXXXXXX
XXXXYYWW
NNN
Example
PICXXCXX
/SN0610
017
XXXXXX
8-Lead DFN (4x4 mm) (for PIC12F609/615/HV609/615
YYWW
NNN
Example
XXXXXX XXXXXX
0610
017
XXXX
3
e
3
e
3
e
8-Lead MSOP
XXXXXX
YWWNNN
Example
602/MS
610017
XXXX
8-Lead DFN (3x3 mm)
YYWW
NNN
Example
0610
017
XXXX
devices only)
PIC12F609/615/617/12HV609/615
DS41302D-page 196 2010 Microchip Technology Inc.
18.2 Package Details
The following sections give the technical details of the packages.
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2010 Microchip Technology Inc. DS41302D-page 197
PIC12F609/615/617/12HV609/615
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2010 Microchip Technology Inc. DS41302D-page 203
PIC12F609/615/617/12HV609/615
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A
This is a new data sheet.
Revision B (05/2008)
Added Graphs. Revised 28-Pin ICD Pinout, Electrical
Specifications Section, Package Details.
Revision C (09/2009)
Updated adding the PIC12F617 device throughout the
entire data sheet; Added Figure 2-2 to Memory
Organization section; Added section 3 ”FLASH
PROGRAM MEMORY SELF READ/SELF WRITE
CONTROL (FOR PIC12F617 ONLY)”; Updated
Register 12-1; Updated Table12-5 adding PMCON1,
PMCON2, PMADRL, PMADRH, PMDATL, PMDATH;
Added section 16-12 in the Electrical Specification
section; Other minor edits.
Revision D (01/2010)
Updated Figure 17-50; Revised 16.8 DC
Characteristics; Removed Preliminary Status.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC12F6XX Family of devices.
B.1 PIC12F675 to PIC12F609/615/
12HV609/615
TABLE B-1: FEATURE COMPARISON
Feature PIC12F675 PIC12F609/
615/
12HV609/615
Max Operating Speed 20 MHz 20 MHz
Max Program
Memory (Words) 1024 1024
SRAM (bytes) 64 64
A/D Resolution 10-bit 10-bit (615
only)
Timers (8/16-bit) 1/1 2/1 (615)
1/1 (609)
Oscillator Modes 8 8
Brown-out Reset Y Y
Internal Pull -up s RA0/1/2/4/5 GP0/1/2/4/5,
MCLR
Interrupt-on-change RA0/1/2/3/4/5 GP0/1/2/3/4/5
Comparator 1 1
ECCP N Y (615)
INTOSC Frequencies 4 MHz 4/8 MHz
Internal Shun t
Regulator NY
(PIC12HV609/
615)
Note: This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performan ce c harac teristi cs than it s earli er
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
PIC12F609/615/617/12HV609/615
DS41302D-page 204 2010 Microchip Technology Inc.
NOTES:
2010 Microchip Technology Inc. DS41302D-page 205
PIC12F609/615/617/12HV609/615
INDEX
A
A/D Specifications....................................................164, 165
Absolute Maximum Ratings..............................................143
AC Characteristics
Industrial and Extended............................................156
Load Conditions.......... .. .. .. .... .. ..... .... .. .. .. .... .. ..... .... .. ..155
ADCAcquisition Requirements...........................................86
Associ a te d registers.............. ........... .......... ........... ......88
Block Diag ram......... .......... ........... ...... ..................... ....79
Calculating Acquisition Time.......................................86
Channel Selection............................................... .... .. ..80
Configuration...............................................................80
Configuring Interrupt...................................................83
Conversi o n Clo ck.......... ...... ..................... ....... ............80
Conversion Procedure ....................... .... .. .... ......... .... ..83
Internal Sampling Switch (RSS) Impedance................86
Interrupts.....................................................................81
Operation....................................................................82
Operation During Sleep ..............................................82
Port Configuration.......................................................80
Reference Voltage (VREF)...........................................80
Result For matting......................... ..................... ...... ....82
Source Impedance.................................................. ....86
Special Event Trigger..................................................82
Starting an A/D Conversion ........................................82
ADC (PIC12F615/617/HV615 Only) ...................................79
ADCON0 Register...............................................................84
ADRESH Register (ADFM = 0)...........................................85
ADRESH Register (ADFM = 1)...........................................85
ADRESL Register (ADFM = 0)............................................85
ADRESL Register (ADFM = 1)............................................85
Analog Input Connection Considerations............................68
Analog-to-Digital Converter. See AD C
ANSEL Register (PIC12F609/HV609) ................................45
ANSEL Register (PIC12F615/617/HV615) .........................45
APFCON Register...............................................................24
Assembler
MPASM Assembler...................................................140
B
Block Diagrams
(CCP) Capture Mode Operation .................................90
ADC ............................................................................79
ADC Transfer Function...............................................87
Analog Input Model...............................................68, 87
Auto-Shutdown .........................................................101
CCP PWM...................................................................94
Clock Source...............................................................37
Comparator.................................................................67
Compare.....................................................................92
Crystal Operation........................................................39
External RC Mode.......................................................40
GP0 and GP1 Pins............................. .. .. .... .. ....... .. .. .. ..47
GP2 Pins.....................................................................48
GP3 Pin.......................................................................49
GP4 Pin.......................................................................50
GP5 Pin.......................................................................51
In-Circuit Serial Programming Connections..............125
Inter rupt Logic............. .......... ........... .......... ...............119
MCLR Circuit............... ...... ..................... ........... ...... ..111
On-Chip Rese t Circuit................................ ....... ........110
PIC12F609/12HV609 ................................................... 7
PIC12F615/617/12HV615 ............................................ 8
PWM (Enhanced)....................................................... 97
Resonator Operation.................................................. 39
Timer1 .................................................................. 57, 58
Timer2 ........................................................................ 65
TMR0/WDT Prescaler ................................................ 53
Watchdog Timer .......................... .. .... ......... .. .... .... .. .. 122
Brown-out Reset (BOR).................................................... 112
Associated Registers................................................ 113
Specifications ........................................................... 160
Timing and Characteristics............ .... ......... .... .. .... .... 159
C
C Compilers
MPLAB C18.............................................................. 140
MPLAB C30.............................................................. 140
Calibration Bits.................................................................. 109
Capture Module. See Enhanced Capture/Compare/
PWM (ECCP)
Capture/Compare/PWM (CCP)
Associated registers w/ Capture................................. 91
Associ a te d registe rs w/ Compare................... .......... .. 93
Associated registers w/ PWM................................... 105
Capture Mode............................................................. 90
CCP1 Pin Configuration ............................................. 90
Compare Mode........................................................... 92
CCP1 Pin Configuration ..................................... 92
Softwar e In terrupt Mode.............. ........... ...... 90, 92
Special Event Trigger.................................... ..... 92
Timer1 Mode Selection................................. 90, 92
Prescaler .................................................................... 90
PWM Mode........... .......... ........... .......... ........... .......... .. 94
Duty Cycle.......................................................... 95
Effects of Reset.................................................. 96
Example PWM Frequencies and
Reso l u t i o n s , 2 0 MH Z...... ...... ......... ...... ...... . 95
Example PWM Frequencies and
Reso l u t i o n s , 8 MH z ...... ...... ..... ...... ...... ...... . 95
Operation in Sleep Mode................................ .. .. 96
Setup for Operation............................................ 96
System Clock Frequency Changes.................... 96
PWM Period ............................................................... 95
Setup for PWM Operation .......................................... 96
CCP1CON (Enhanced) Register............................ .... .... .... 89
Clock Sources
External Modes........................................................... 38
EC ...................................................................... 38
HS ...................................................................... 39
LP....................................................................... 39
OST.................................................................... 38
RC ...................................................................... 40
XT....................................................................... 39
Internal Modes............................................................ 40
INTOSC.............................................................. 40
INTOSCIO.......................................................... 40
CMCON0 Regis te r........ .......... ........... ...... ........... ................ 72
CMCON1 Regis te r........ .......... ........... ...... ........... ................ 73
Code Examples
A/D Conver sion ............ ........... .......... ....... .................. 83
Assign i n g Prescaler to Timer0............. ........... ............ 54
Assigning Prescaler to WDT....................................... 54
Changing Between Capture Prescalers ..................... 90
Indir ect Add ress i n g.. .. ...... ..... ...... ...... ..... ...... ...... ...... ... 25
PIC12F609/615/617/12HV609/615
DS41302D-page 206 2010 Microchip Technology Inc.
Initializing GPIO..........................................................43
Saving Status and W Registers in RAM ...................121
Writing to Flash Program Memory..............................34
Code Protection ................................................................124
Comparator.........................................................................67
Associ a te d regist e r s............ ..................... .......... .........78
Control ........................................................................69
Gating Timer1.............................................................73
Operation During Sleep ..............................................71
Overview.....................................................................67
Response Time...........................................................69
Synchronizing COUT w/Timer1 ..................................73
Comparator Hysteres is............. ........................... ........... ....77
Comparator Voltage Reference (CVREF)............................74
Effects of a Reset........................................................71
Comparator Voltage Reference (CVREF)
Response Time...........................................................69
Comparator Voltage Reference (CVREF)
Specifications............................................................163
Comparators
C2OUT as T1 Gate......... .......... ...... ..................... .......60
Effects of a Reset........................................................71
Specifications............................................................162
Compare Module. See Enhanced Capture/Com pare/
PWM (ECCP) (PIC12F615/617/HV615 only)
CONFIG Regi ster......... ........... .......... ........... ...... ...............108
Configuration Bits..............................................................107
CPU Features ...................................................................107
Customer Change Notification Service .............................209
Custome r Notification Se rvice........................ .......... .........209
Customer Support.................................................. .... .......209
D
Data EEPRO M Memor y
Associ a te d Re g i sters...... .......... ........... .......... ........... ..35
Data Memory.......................................................................11
DC and AC Characteristics
Graphs and Tables ...................................................171
DC Characteristics
Extended and Industrial............................................152
Industrial and Extended............................................145
Development Support . ......................................................139
Device Overview...................................................................7
E
ECCP. See Enh anced Capture/Compare/ PW M
ECCPAS Register...... ................................ .......... .............102
EEDAT Regi ster......... ........... .......... ........... .........................28
EEDATH Register...............................................................28
Effects of Reset
PWM mode...... .......... ........... .......... ........... .......... .......96
Electrical Specifications ....................................................143
Enhanced Capture/Compare/PWM (ECCP)
Enhanced PWM Mode................................................97
Auto-Restart......................................................103
Auto-shutdown..................................................101
Half-Bridge Application .......................................99
Half-Bridge Application Examples .....................104
Half-Bridge Mode................................................99
Output Relationships (Active-High and
Active-Low).................................................98
Output Re latio n ships Diagra m....... ...... ...............98
Programmable Dead Band Delay .....................104
Shoot-through Current......................................104
Start- u p Co nsid e r a tions................. ...... .............100
Specifications............................................................162
Time r R e so u r ces ....... ...... ...... ..... ...... ...... ...... ..... ...... ... 89
Enhanced Capture/Compare/PWM
(PIC12F615/617/HV615 Only)............................ .... ....89
Errata.................................................................................... 6
F
Firmware Instructions .......................................................129
Flash Program Memory Self Read/Self Write
Control (For PIC12F617 only)..................................... 27
Fuses. See Configuration Bits
G
General Purpose Register File ....................................... .... 12
GPIO................................................................................... 43
Additional Pin Functions............................................. 44
ANSE L R e g i st e r .. .. ...... .. ..... ...... ...... ...... . ...... ...... . 44
Interrupt-on-Change ........................................... 44
Wea k Pu l l - U p s....... ...... ..... .. ...... ...... ...... ..... .. ...... . 44
Associ a te d registers ............................ ........... .......... .. 52
GP0 ............................................................................ 47
GP1 ............................................................................ 47
GP2 ............................................................................ 48
GP3 ............................................................................ 49
GP4 ............................................................................ 50
GP5 ............................................................................ 51
Pin Descriptions and Diagrams .................................. 47
Specifications ........................................................... 158
GPIO Regis te r ........................ ........... .......... ........... ...... ...... 43
H
High Tempera ture Opera tio n.......... ........... ...... ................. 167
I
ID Loc a t i o n s.. .. ...... ...... ..... .......... ...... ..... ...... ...... ..... ...... ..... 124
In-Circuit Debugger ........................................................... 125
In-Circuit Serial Programming (ICSP)............................... 125
Indirect Addressing, INDF and FSR registers . .................... 25
Instruction Format............................................................. 129
Instr uctio n Se t....... .. ..... ...... ...... ...... .. ..... ...... ...... ..... ...... .. ... 129
ADDLW..................................................................... 131
ADDWF..................................................................... 131
ANDLW..................................................................... 131
ANDWF..................................................................... 131
MOVF ....................................................................... 134
BCF .......................................................................... 131
BSF........................................................................... 131
BTFSC...................................................................... 131
BTFSS...................................................................... 132
CALL......................................................................... 132
CLRF ........................................................................ 132
CLRW....................................................................... 132
CLRWDT .................................................................. 132
COMF....................................................................... 132
DECF........................................................................ 132
DECFSZ ................................................................... 133
GOTO ....................................................................... 133
INCF ......................................................................... 133
INCFSZ..................................................................... 133
IORLW...................................................................... 133
IORWF...................................................................... 133
MOVLW.................................................................... 134
MOVWF.................................................................... 134
NOP.......................................................................... 134
RETFIE..................................................................... 135
RETLW..................................................................... 135
RETURN................................................................... 135
2010 Microchip Technology Inc. DS41302D-page 207
PIC12F609/615/617/12HV609/615
RLF...........................................................................136
RRF...........................................................................136
SLEEP ......................................................................136
SUBLW.....................................................................136
SUBWF.....................................................................137
SWAPF.....................................................................137
XORLW.....................................................................137
XORWF.....................................................................137
Summary Ta b l e..... ..................... .......... ........... ..........130
INTCON Register................................................................20
Internal Oscillator Block
INTOSC
Specifications............................................157, 158
Internal Sampling Switch (RSS) Impedance........................86
Inter net Addre ss..... ........... .......... ........... ..................... ......209
Interrupts...........................................................................118
ADC ............................................................................83
Associ a te d Re g i sters...... ...... ..................... ........... ....120
Context Saving..........................................................121
GP2/INT....................................................................118
GPIO Interrupt-on-Change ........................................119
Interrupt-on-Change....................................................44
Timer0.......................................................................119
TMR1..........................................................................60
INTOSC Specifications .............................................157, 158
IOC Register.......................................................................46
L
Load Conditions........................ .. .. ....... .. .... .. .. .. .... ..... .. .... ..155
M
MCLR................................................................................111
Internal......................................................................111
Memory Organization..........................................................11
Data ............................................................................11
Program......................................................................11
Microc h i p In ternet Web Site........ ........... .......... ........... ......209
Migra tin g from other PICmicro Devi c es..... ...... .................203
MPLAB ASM30 Assembler, Linker, Librarian ...................140
MPLAB ICD 2 In-Circuit Debugger ...................... ........... ..141
MPLAB ICE 2000 High-Perform ance Universal
In-Circuit Emulator....................................................141
MPLAB Integrated Development Environment Software..139
MPLAB PM3 Device Programmer ....................................141
MPLAB REA L IC E In -Circuit Emulato r System............... ..141
MPLINK Object Linker/MPLIB Object Librarian............ ....140
O
OPCODE Fiel d Descr ip tions.............. ................ ........... ....129
Operation During Code Protect...........................................32
Operation During Write Protect...........................................32
Operational Amplifier (OPA) Module
AC Specifications......................................................163
OPTION Register................................................................19
OPTION_R EG Re g i ster........ ...... ..................... ........... ........55
Oscillator
Associ a te d registers.............. ........... .......... ...........41, 63
Oscillator Module ..........................................................27, 37
EC...............................................................................37
HS...............................................................................37
INTOSC ......................................................................37
INTOSCIO...................................................................37
LP................................................................................37
RC...............................................................................37
RCIO...........................................................................37
XT ...............................................................................37
Oscillator P arameters............. ............. ...... ............... ........ 157
Oscillato r Specifications.. ...... ....... ......................... ...... ...... 156
Oscillator Start-up Timer (OST)
Specifications ........................................................... 160
OSCTUNE Regis te r............ ....... ...... ...... ........... .......... ...... .. 41
P
P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/
PWM (ECCP) ........... ........... .......... ........... .......... ...... .. 97
Packaging......................................................................... 195
Marking..................................................................... 195
PDIP Details............................................................. 196
PCL and PCLATH............................................................... 25
Stack........................................................................... 25
PCON Register........................................................... 23, 113
PICSTART Plus Development Programmer..................... 142
PIE1 Register ..................................................................... 21
Pin Diagram
PIC12F609/HV609 (PDIP, SOIC, MSOP, DFN)........... 4
PIC12F615/617/HV615 (PDIP, SOIC, MSOP, DFN).... 5
Pinout Descriptions
PIC12F609/12HV609 ................................................... 9
PIC12F615/617/12HV615 .......................................... 10
PIR1 Register..................................................................... 22
PMADRH and PMADRL Regist ers..................................... 27
PMCON1 and PMCON2 Registers..................................... 27
Power-Down Mode (Sleep)............................................... 123
Power-on Reset (POR)..................................................... 111
Power-up Timer (PWRT).................................................. 111
Specifications ........................................................... 160
Precisio n In ternal Oscillator Parameters .......................... 158
Prescaler
Shared WDT/Timer0................................................... 54
Switching Prescaler Assignment................................ 54
Program Memory................................................................ 11
Map and Stack ............................................................ 11
Prog r a mming , D e v i ce In stru c ti o ns.... .. ...... ..... ...... .. ...... .. ... 12 9
Protection Agai n st Spuriou s Write....... ........... .......... .......... 32
PWM Mode. See Enh anced Captur e/Compare/ PWM. ....... 97
PWM1CON Register......................................................... 105
R
Reader Response............................................................. 210
Reading the Flash Program Memory.................................. 30
Read-Modify-Write Operations......................................... 129
Registers
ADCON0 (ADC Control 0).......................................... 84
ADRESH (ADC Result High) wi th ADFM = 0)............ 85
ADRESH (ADC Result High) wi th ADFM = 1)............ 85
ADRESL (ADC Result Low) with ADFM = 0).............. 85
ADRESL (ADC Result Low) with ADFM = 1).............. 85
ANSEL (Analog Select).............................................. 45
APFCON (Alternate Pin Function Register) ............... 24
CCP1CON (Enhanced CCP1 Control) ....................... 89
CMCON0 (Comparator Control 0).............................. 72
CMCON1 (Comparator Control 1).............................. 73
CONFIG (Configuration Word)................................. 108
Data Memory Map (PIC12F609/HV609) .................... 12
Data Memory Map (PIC12F615/617/HV615) ............. 13
ECCPAS (Enhanced CCP Auto-shutdown Control). 102
EEDAT (EEPROM Data)............................................ 28
EEDA T H ( EEPRO M Dat a ) ... ...... ...... .. ..... ...... .. ...... ..... 28
GPIO........................................................................... 43
INTC ON (I n te r rupt Control) ...... ...... ...... ......... .......... ... 2 0
IOC (Interrupt-on-Change GPIO) ............................... 46
OPTION_REG (OPTION)........................................... 19
PIC12F609/615/617/12HV609/615
DS41302D-page 208 2010 Microchip Technology Inc.
OPTION_R EG (Option) ........ ..................... .......... .......55
OSCTUNE (Oscillator Tun i n g )........ ....... ................. ....41
PCON (Power Control Register).................................23
PCON (Power Control) .............................................113
PIE1 (Peripheral Interrupt Enable 1)...........................21
PIR1 (Peripheral Interrupt Register 1) ........................22
PWM1CON (Enhanced PWM Control) .....................105
Reset Values (PIC12F609/HV609)...........................115
Reset Values (PIC12F615/617/HV615)....................116
Reset Values (special registers)...............................117
Special Function Registers.........................................12
Special Register Summary (PIC12F609/ HV609)..14, 16
Special Register Summary
(PIC12F615/617/HV615) ..............................15, 17
STATUS......................................................................18
T1CON........................................................................62
T2CON........................................................................66
TRISIO (Tri-State GPIO)............... ........... .......... .........44
VRCON (Voltage Reference Control) .........................76
WPU (Weak Pull-Up GPIO)........................................46
Reset.................................................................................110
Revision History................................................................203
S
Shoot-through Current ......................................................104
Sleep
Power-Down Mode ...................................................123
Wake-up....................................................................123
Wake-up using Interrupts..........................................123
Softwa re Simulator (MPLAB SIM)................ .......... ...........140
Special Event Trigger..........................................................82
Special Function Registers .................................................12
STATUS Regi ster..... .......... ........... .......... ........... ...... ...........18
T
T1CON Regis te r... ................. .......... ........... .......... ...... .........62
T2CON Regis te r... ................. .......... ........... .......... ...... .........66
Thermal Considerations....................................................154
Time-out Sequence........................... .. .... ........... .. .... .... .....113
Timer0.................................................................................53
Associ a te d Re gisters.............. ........... .......... ........... ....55
External Clock.............................................................54
Interrupt.......................................................................55
Operation..............................................................53, 57
Specifications............................................................161
T0CKI..........................................................................54
Timer1.................................................................................57
Associ a te d registers... ........... .......... ........... .......... .......63
Asynchronous Counter Mode .....................................59
Reading and Writing ....... .. .. .. .. ....... .. .. .. .. .. .. ....... ..59
Comparator Synchr o nization ............... .......... ...... .......61
ECCP Special Event Trigger
(PIC12F615/617/HV615 Only)................. .... .......61
ECCP Time Base (PIC12F615/617/HV615 Only).......60
Interrupt.......................................................................60
Modes of Operation .................. .... .. ......... .... .... .... .......57
Operation During Sleep ..............................................60
Oscillator.....................................................................59
Prescaler.....................................................................59
Specifications............................................................161
Timer1 Gate
Inverting Gate .....................................................60
Selectin g So u rce............... ........... ...... ...........60, 73
Sync h ro n i zi n g C OUT w/ Ti mer1 ........ ...... .. ..... .....73
TMR1H Register.........................................................57
TMR1L Register..........................................................57
Timer2 (PIC12F615/617/HV615 Only)
Associ a te d registers ............................ ........... .......... .. 66
Timers
Timer1
T1CON ............................................................... 62
Timer2
T2CON ............................................................... 66
Timing Diagrams
A/D Conver sion..... .......... ........... ...... ..................... .... 165
A/D Conversion (Sleep Mode).................................. 166
Brown-out Reset (BOR)............................................ 159
Brown-out Reset Situations...................................... 112
CLKOUT and I/O ...................................................... 158
Clock Timing............................................................. 156
Comparator Output..................................................... 67
Enhanced Capture/Compare/PWM (ECCP)............. 162
Half-Bridge PWM Output.................................... 99, 104
INT Pin Interrupt....................................................... 120
PWM Auto-shutdown
Auto-restart Enabled......................................... 103
Firm w a r e Rest a rt..... ...... ..... ...... ...... ...... ......... ... 103
PWM Output (A ctive-High)................ ...... ................. .. 98
PWM Output (A ctive-Low).............................. ...... ...... 98
Reset, WDT, OST and Power-up Timer................... 159
Time-out Sequence
Case 1.............................................................. 114
Case 2.............................................................. 114
Case 3.............................................................. 114
Timer0 and Timer1 External Clock........................... 161
Timer1 Incrementing Edge......................................... 61
Wake-up from Interrupt ............................................. 124
Timing Parameter Symbology .......................................... 155
TRISIO................................................................................ 43
TRISIO Register ................................................................. 44
V
Voltage Reference (VR)
Specifications ........................................................... 163
Voltage Reference. See Comparator Voltage
Reference (CVREF)
Voltage References
Associ a te d registers ............................ ........... .......... .. 78
VP6 Stabilization ...... ................... ...... ...... ....... ...... ...... 74
VREF. SEE ADC Reference Voltage
W
Wake-up Using Interrupts..................... ............................ 123
Watchdog Timer (WDT).................................................... 121
Associ a te d registers ............................ ........... .......... 122
Specifications ........................................................... 160
WPU Register..................................................................... 46
Writing th e F la sh Pro g r a m Memo ry. . ...... ...... ...... ..... ...... ..... 32
WWW Address ............. .......... ........... .......... ........... .......... 209
WWW, On-Line Support....................................................... 6
2010 Microchip Technology Inc. DS41302D-page 209
PIC12F609/615/617/12HV609/615
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microc hi p.c om . Thi s web si te i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
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To register, access the Microchip web site at
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Users of Microchip products can receive assistance
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Customers should contact their distributor,
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support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technic al suppo rt is avail able throug h the we b site
at: http://support.microchip.com
PIC12F609/615/617/12HV609/615
DS41302D-page 210 2010 Microchip Technology Inc.
READER RESP ONSE
It is ou r intention to pro vide you w it h th e b es t do cumentation po ss ib le to e ns ure suc c es sfu l u se of y ou r M ic roc hip pro d-
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DS41302DPIC12F609/615/617/12HV609/615
1. What are the best f eatures of thi s document ?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2010 Microchip Technology Inc. DS41302D-page 211
PIC12F609/615/617/12HV609/615
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC1 2F 60 9, P I C1 2F 60 9 T(1), PIC12HV609, PIC12HV609T(1),
PIC1 2F 61 5, P IC 1 2F 61 5 T(1), PIC12HV615, PIC12HV615T(1),
PIC12F617, PIC12F617T(1)
Temperature
Range: H= -40C to +150C (High Temp)(3)
I= -40C to +85C (Industrial)
E= -40C to +125C (Extended)
Package: P = Plastic DIP (PDIP)
SN = 8-lead Small Outline (150 mil) (SOIC)
MS = Micro Small Outline (MSOP)
MF = 8-lead Plastic Dual Flat, No Lead (3x3) (DFN)
MD = 8-lead Plastic Dual Flat, No Lead
(4x4)(DFN)(1,2)
Pattern: QTP, SQTP or ROM Code; Special Requirements
(blank oth erwis e )
Examples:
a) PIC12F615-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP patter n #301
b) PIC12F615-I/SN = Industrial Temp., SOIC
package, 20 MHz
c) PIC12F615T-E/MF = Tape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
d) PIC12F609T-E/MF = T ape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
e) PIC12HV615T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
f) PIC12HV609T-E/MF = Tape and Reel,
Extended Temp., 3x3 DFN, 20 MHz
g) PIC12F617T-E/MF = T ape and Reel, Extended
Temp., 3x3 DFN, 20 MHz
h) PIC12F617-I/P = Industrial Temp., PDIP pack-
age, 20 MHz
i) PIC12F615-H/SN = High Temp., SOIC pack-
age, 20 MHz
Note 1: T = in tape and reel for MSOP, SOIC and
DFN packages only.
2: Not available for PIC12F617.
3: High Temp. available for PIC12F615 only.
DS41302D-page 212 2010 Microchip Technology Inc.
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