TCK22892G,LF - TOSHIBA - Datasheet.Live

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

1

Toshiba Electronic Devices & Storage Corporation

TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic

TCK22xxxG, TCK2065G, TCK1024G

Load Switch IC with Over current limited function

The TCK22xxxG, TCK2065G and TCK1024G are Load Switch ICs for

power management with Over Current Limited function featuring low

switch on resistance, ultra low quiescent current, high output current and

wide input voltage operation. Typical switch ON resistance is only 31 mΩ

at VIN = 5.0 V, IOUT = -0.15 A load conditions. And these feature a thermal

shut down function and output auto-discharge function.

These devices are available in 0.4 mm pitch ultra small package

WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm). So these devices are ideal for

portable applications that require high-density board assembly such as

cellular phone.

Feature

 Over current limit function

ICL = 400/740/1110/1540 mA (Option)

 Thermal shutdown function

 Inrush current reduction

 Output auto-discharge function

 True reverse current blocking function(Option)

 Under voltage lockout function(Option)

 Low ON resistance :

RON = 31 mΩ (typ.) at VIN = 5.0 V, IOUT = -0.15 A

RON = 40 mΩ (typ.) at VIN = 3.3 V, IOUT = -0.15 A

RON = 70 mΩ (typ.) at VIN = 1.8 V, IOUT = -0.15 A

 Low quiescent current: IQ = 25 μA (typ.) at VIN = 5.5 V, IOUT = 0 mA

 Pull down connection between CONTROL and GND

 Ultra small package : WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm)

WCSP6E

Weight: 1 mg (typ.)

Start of commercial production

2016-02

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

2

Toshiba Electronic Devices & Storage Corporation

Function Table

Part number

Function

Device

Marking

Output current

limit

True Reverse

current blocking

Output auto-

discharge

Under voltage

lock out

Thermal shut

down

Control pin

polarity

TCK22946G

400 mA

Built in

Active High

1T

TCK22951G

740 mA

Built in

Active High

2T

TCK2065G

1110 mA

Built in

Active High

3T

TCK1024G

1540 mA

Built in

Active High

4T

TCK22891G

400 mA

N/A

Built in

N/A

Built in

Active High

5T

TCK22892G

740 mA

N/A

Built in

N/A

Built in

Active High

6T

TCK22893G

1110 mA

N/A

Built in

N/A

Built in

Active High

7T

TCK22894G

1540 mA

N/A

Built in

N/A

Built in

Active High

8T

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

3

Toshiba Electronic Devices & Storage Corporation

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Input voltage

VIN

-0.3 to 6.0

V

Control voltage

VCT

-0.3 to 6.0

V

Output voltage

VOUT

-0.3 to 6.0

V

Output current

IOUT

Internally limited

-

Power dissipation

PD

800 (Note 1)

mW

Operating temperature range

Topr

−40 to 85

°C

Junction temeperature

Tj

150

°C

Storage temperature

Tstg

−55 to 150

°C

Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant

change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating

conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the

appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling

Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated

failure rate, etc).

Note1: Rating at mounting on a board

Board material: Glass epoxy (FR4)

Board dimension: 40mm x 40mm (both sides of board), t=1.6mm

Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%

Through hole: diameter 0.5mm x 28

Operating conditions

Characteristics

Symbol

Condition

Min

Max

Unit

Input voltage

VIN

TCK22946G

TCK22891G

―

1.1

5.5

V

Others

―

1.4

5.5

Output voltage

VOUT

―

―

VIN

V

CONTROL High-level input voltage

VIH

1.2V < VIN ≤ 5.5 V

1.0

―

V

1.1V ≤VIN ≤1.2 V

0.9

―

CONTROL Low-level input voltage

VIL

―

0.4

V

Pin Assignment(Top view) Top marking

Index

A1: V

OUT

B1: VOUT

C1: GND

A2: VIN

B2: VIN

C2: CONTROL

1

2

A

B

C

Lot trace code

Device Marking

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

4

Toshiba Electronic Devices & Storage Corporation

Block Diagram

TCK22946G, TCK22951G, TCK2065G, TCK1024G

TCK22891G, TCK22892G, TCK22893G, TCK22894G

Operation logic table

TCK22946G, TCK22951G

TCK2065G, TCK1024G

TCK22891G, TCK22892G

TCK22893G, TCK22894G

Control

“High”

Output Q1

ON

Discharge Q2

OFF

Reverse current blocking

Active

―

Control

“Low”

Output Q1

OFF

Discharge Q2

ON

Reverse current blocking

Active

―

Control

Logic

Pull

Down

V

IN

V

OUT

GND

Slew Rate

Control Driver

Output

Discharge

CONTROL

True Reverse current

blocking

UVLO

Thermal

Shut down

Over current

Protection

Q1

Q2

Current

Sense

Control

Logic

Pull

Down

V

IN

V

OUT

GND

Slew Rate

Control Driver

Output

Discharge

CONTROL

Thermal

Shut down

Over current

Protection

Q1

Q2

Current

Sense

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

5

Toshiba Electronic Devices & Storage Corporation

Electrical Characteristics

DC Characteristics (Ta = -40 to 85°C)

Characteristics

Symbol

Test Condition

Ta = 25°C

Ta = −40 to 85°C

Unit

Min

Typ.

Max

Min

Max

Quiescent current ( ON state)

IQ

IOUT = 0 mA

VIN = 1.1 V

―

16

―

μA

VIN = 5.5 V

―

25

―

50

μA

Quiescent current ( OFF state)

IQ(OFF)

VIN = 5.5 V, VOUT = OPEN,

―

0.6

―

2.5

μA

Reverse blocking current

IRB

VOUT = 5.0 V,

VIN = 0 V, RCB active (Note 2)

―

0.01

―

2

μA

Reverse blocking voltage threshold

VRB

VOUT – VIN (Note 2)

―

35

―

mV

Reverse blocking release voltage

threshold

VRBR

VOUT – VIN (Note 2)

―

-15

―

mV

Under Voltage Lock Out (UVLO)

rising threshold

VUVL_RI

― (Note 2)

―

0.82

―

1.1

V

Under Voltage Lock Out (UVLO)

falling threshold

VUVL_FA

― (Note 2)

―

0.77

―

V

On resistance

RON

IOUT = -0.15 A

VIN = 5.0 V

―

31

―

85

mΩ

VIN = 3.3 V

―

40

―

95

VIN = 1.8 V

―

70

―

140

VIN = 1.2 V (Note 3)

―

141

―

VIN = 1.1 V (Note 3)

―

179

―

Output Limited Current

ICL

VIN = 5.5 V

TCK22946G

TCK22891G

―

400

―

mA

TCK22951G

TCK22892G

―

740

―

TCK2065G

TCK22893G

―

1110

―

TCK1024G

TCK22894G

―

1540

―

Output discharge on resistance

RSD

― 

―

100

―

Ω

Note 2: Only applies to the TCK22946G, TCK22951G, TCK2065G and TCK1024G

Note 3: Only applies to the TCK22946G and TCK22891G

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

6

Toshiba Electronic Devices & Storage Corporation

AC Characteristics (Ta = 25°C)

VIN = 5.0 V

Characteristics

Symbol

Test Condition(Figure 1)

Min

Typ.

Max

Unit

VOUT rise time

tr

VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF, 

―

50

―

μs

VOUT fall time

tf

VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF, 

―

50

―

μs

Turn on delay

tON

VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF, 

―

40

―

μs

Turn off delay

tOFF

VIN= 5.0 V , RL = 500 Ω , CL=0.1 μF, 

―

10

―

μs

AC Waveform

Figure 1 tr, tf, tON, tOFF Waveforms

VIH

VOUT

VCT

VOL

VOH

VIL

90%

tON

tOFF

50%

10%

tr

tf

VOUT

10%

90%

10%

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

7

Toshiba Electronic Devices & Storage Corporation

Application Note

1. Application circuit example (top view)

The figure below shows the recommended configuration.

1) Input and Output capacitor

An input capacitor (CIN) and an output capacitor (COUT) are necessary for the stable operation. And they are effective to

reduce voltage overshoot or undershoot due to sharp changes in output current and also for improved stability of the

power supply. When used, place CIN and COUT more than 1.0μF as close to VIN pin to improve stability of the power supply.

2) Control pin

The CONTROL pin controls state of the switch, operated by the control voltage and Schmitt trigger. Also, pull down

resistance equivalent to a few MΩ is connected between CONTROL and GND, thus the load switch IC is in OFF state

even when CONTROL pin is OPEN.

2. Over current limit function

This device has a built-in fold-back type of Current-limiting Circuit. Around 15% or more derating against typical values

is recommended for system design with enough margin.

3. Thermal shutdown function

Each device has a built-in Thermal shutdown circuit. If the junction temperature goes beyond 170°C (Typ.), thermal

shutdown circuit operates and turns off power switch. When the junction temperature decreases lower than 150°C, the

power switch is turned on due to hysteresis. This operation is repeated as long as the junction temperature continues

increasing.

4. True reverse current blocking function(Option)

Some of these devices have built-in True reverse current blocking circuit (TRCB) to block reverse current from VOUT to

VIN regardless of output MOSFET ON/OFF condition. (Full-Time Reverse Current Protection)

5. Under-voltage Lockout function(Option)

Some of these devices have a built-in Under-voltage Lockout Circuit to turn off switch if VIN drops below UVLO. This

circuit has hysteresis and UVLO is released when VIN exceeds threshold.

6. Instructions and directions for use

Each device has several built-in protection functions, but these does not assure for the suppression of uprising device

operation. In use of these products, please read through and understand dissipation idea for absolute maximum ratings from

the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings

in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design.

Control

Voltage Output

Voltage

HIGH

ON

LOW

OFF

OPEN

OFF

VOUT

GND

VIN

CONTROL

CL

RL

LOAD

CIN

COUT

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

8

Toshiba Electronic Devices & Storage Corporation

7. Power Dissipation

Power dissipation is measured on the board condition shown below.

[The Board Condition]

Board material: Glass epoxy (FR4)

Board dimension: 40mm x 40mm (both sides of board), t=1.6mm

Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%

Through hole: diameter 0.5mm x 28

Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into consideration

the ambient temperature, input voltage, output current etc. and applying the appropriate derating for allowable power

dissipation during operation.

0

200

400

600

800

1000

-40 040 80 120

Power Dissipation PD(mW)

Ambient Temperature Ta (℃)

PD-Ta

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

9

Toshiba Electronic Devices & Storage Corporation

Package dimension

Weight: 1 mg (typ.)

Unit: mm

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

10

Toshiba Electronic Devices & Storage Corporation

Land pattern dimensions (for reference only)

Unit： mm

TCK22xxxG/TCK2065G/TCK1024G

2019-04-12

11

Toshiba Electronic Devices & Storage Corporation

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.

Hardware, software and systems described in this document are collectively referred to as “Product”.

 TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

 This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

 Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for

complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to

property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the

Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,

including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and

conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product

will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited

to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the

applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any

other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

 PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,

equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment,

equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or

explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE,

TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our

website.

 Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

 Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

 The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

 ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR

PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)

DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR

INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,

ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

 Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for

the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass

destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations

including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export

and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and

regulations.

 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please

use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including

without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT

OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

https://toshiba.semicon-storage.com/