1
011119
Transmission Line MIM Cacpacitor
(Metal-Insulator-Metal)
BENEFITS
DESCRIPTION
• HFSS Design Unique for every device
• Gold Wirebondable
• Copper Conductor Design for improved Circuit Conductivity
• Designs Optimized for RF/Performance
• ROHS Compliant
AVX Thin Film Technologies is pleased to introduce a novel MIM (Metal-Insulator-Metal)
capacitor using a transmission line wire bond pad structure with backside ground.
The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize
losses. Copper traces are used for optimal conductivity. Front and backside gold
metalization make this device suitable epoxy, gold wire bond/ribbon bond attachments.
APPLICATIONS
• DC Blocking at UHF
• High Frequency Link
• RF Microwave applications
Fused Silica (Quartz)
Alumina (AI203)
SUBSTRATE MATERIALS
MECHANICAL DIMENSIONS
Based on Transmission Line Design Request
Rated Voltage Specic Capacitance Dissipation Factor TCC (ppm/°C)
<100 50 - 100 * pf/mm2<0.1% ±60
CAPACITOR MATERIALS
*Actual maximum capacitance values depend on transmission line dimensions
W2
L
W1
Substrate W1 or Substrate W2
Length is determined by transmission line
SPECIFICATION LIMIT
MIL-STD-883-2011.8 BOND STRENGTH > 3 gm min. w/0.001” Au Wire
MIL-STD-883-2018 SHEAR STRENGTH Size Dependent See Procedure
MIL-STD-202-108 LIFE 1000 hrs @ 125°C
TEST METHODS