Engwinklige LED im MIDLED-Gehause (850 nm) Narrow beam LED in MIDLED package (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4650 SFH 4655 SFH 4650 SFH 4655 gema OS-PCN-2009-021-A2 acc. to OS-PCN-2009-021-A2 Wesentliche Merkmale Features * Infrarot LED mit hoher Ausgangsleistung (60 mW) * Enger Abstrahlwinkel ( 15) * Kurze Schaltzeiten * Geringe Bauhohe * Als Toplooker und Sidelooker einsetzbar * SFH 4650: Gurtung als Toplooker SFH 4655: Gurtung als Sidelooker * * * * * * Anwendungen Applications * * * * * * * * Infrarotbeleuchtung fur Kameras IR-Datenubertragung Sensorik in der Automobiltechnik Fernsteuerung High Power (60 mW) Infrared LED Narrow halfangle ( 15) Short switching times Low profile component Usable as top-looking and side-looking device SFH 4650: Taping as Toplooker SFH 4655: Taping as Sidelooker Infrared Illumination for cameras IR Data Transmission Automotive sensors Remote controls Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4650 SFH 4655 Q65110A1572 Q65110A1569 25 (typ. 65) 25 (typ. 65) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2012-03-08 1 SFH 4650, SFH 4655 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Vorwartsgleichstrom Forward current IF 100 mA Stostrom, tp = 300 s, D = 0 Surge current IFSM 1 A Verlustleistung Power dissipation Ptot 180 mW 340 K/W 180 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 860 nm Schwerpunkt-Wellenlange der Strahlung Centroid wavelength IF = 100 mA centroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 30 nm Abstrahlwinkel Half angle 15 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 2012-03-08 2 SFH 4650, SFH 4655 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 12 ns VF VF 1.5 (< 1.8) 2.4 (< 3.0) V V Sperrstrom Reverse current IR not designed for A reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e typ 60 mW Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 0.7 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2012-03-08 3 SFH 4650, SFH 4655 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values -T Einheit Unit -U -V Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 25 50 40 80 63 125 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 25 s Ie typ 300 450 750 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 OHF03823 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2012-03-08 0.8 0.6 0.4 0 20 40 60 80 4 100 120 SFH 4650, SFH 4655 Relative Spectral Emission Irel = f () Single pulse, tp = 25 s OHF04132 100 Ie = f (IF) Ie 100 mA Radiant Intensity OHL01715 101 80 OHF02533 110 mA Ie I e (100 mA) I rel % Max. Permissible Forward Current IF = f (TA), RthJA = 340 K/W I F 90 100 80 5 70 60 60 10-1 50 5 40 40 30 10-2 20 20 5 10 0 700 750 800 10-3 0 10 nm 950 850 0 5 10 1 5 10 2 IF Permissible Pulse Handling Capability IF = f (), TA = 25 , duty cycle D = parameter OHL01713 100 A IF 1.2 A OHF02532 t tP D = TP 1.0 IF T 10-1 D= 5 0.8 10-2 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.6 5 0.4 10-3 5 0.2 10-4 0 0.5 1 1.5 2 2.5 V 3 VF 2012-03-08 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 5 0 20 40 60 80 C 100 TA IF Forward Current IF = f (VF) Single pulse, tp = 100 s mA 10 3 SFH 4650, SFH 4655 Mazeichnung Package Outlines Mae in mm / Dimensions in mm. Gehause / Package MID mit klarem Silikonverguss / MID casted with clear Silicone Anschlussbelegung Pin configuration Pad 1 = Anode / anode Pad 2 = Kathode / cathode 2012-03-08 6 SFH 4650, SFH 4655 Gurtung / Polaritat und Lage Verpackungseinheit 2000/Rolle, o180 mm oder 9000/Rolle, o330 mm Method of Taping / Polarity and Orientation Packing unit 2000/reel, o180 mm or 9000/reel, o330 mm SFH 4650 Mae in mm (inch) / Dimensions in mm (inch). SFH 4655 Mae in mm (inch) / Dimensions in mm (inch). 2012-03-08 7 SFH 4650, SFH 4655 Empfohlenes Lotpaddesign Recommended Solder Pad Design SFH 4650 2.4 1.35 Padgeometrie fur verbesserte Warmeableitung 4.0 Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist OHF02422 SFH 4655 1.7 1.25 Padgeometrie fur verbesserte Warmeableitung 4.5 Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area Lotstopplack Solder resist OHF02421 Mae in mm / Dimensions in mm. Verarbeitungshinweis: Das Gehause ist mit Silikon vergossen. Mechanischer Stress auf der Bauteiloberflache sollte so gering wie moglich gehalten werden. Handling indication: 2012-03-08 The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. 8 SFH 4650, SFH 4655 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020D.01) (acc. to J-STD-020D.01) OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 s 300 250 t Profileigenschaften Profile Feature Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) ) Aufheizrate zum Vorwarmen* / Ramp-up rate to preheat*) Zeit ts von TSmin bis TSmax / Time ts from TSmin to TSmax Aufheizrate zur Spitzentemperatur*) / Ramp-up rate to peak*) Empfehlung / Recommendation Grenzwerte / Max. Ratings 2K/s 3K/s 100 s min. 60 s max. 120 s 2K/s 3K/s 25 C to 150 C 150 C to 200 C 180 C to TP Liquidustemperatur TL / Liquidus temperature TL 217 C Zeit tL uber TL / Time tL above TL 80 s max. 100 s Spitzentemperatur TP / Peak temperature TP 245 C max. 260 C Verweilzeit tP innerhalb des spezifizierten Spitzentemperaturbereichs TP - 5 K / Time tP within the specified peak temperature range TP - 5 K 20 s min. 10 s max. 30 s Abkuhlrate*) / Ramp-down rate*) 3K/s 6 K / s maximum TP to 100 C Zeitspanne von 25 C bis zur Spitzentemperatur / Time from 25 C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung T/t: t max. 5 s; erfullt uber den gesamten Temperaturbereich / slope calculation T/t: t max. 5 s; fulfillment for the whole T-range 2012-03-08 9 SFH 4650, SFH 4655 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2012-03-08 10