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eMCP Components - medded Multi-Chip Package for device
manufacturers
Kingston offers a wide range of JDC standard
eMCP components. eMCP integrates eMMC and
low-power DRAM into a package with one small
footprint. This solution simplifies sstem PC
design and speeds time to market. eMCP is an
ideal comined storage and memor component
for space-constrained sstems such as smartphones, talets, wearales and various IoT devices.
eMCP Part Numers and pecifications
LPDDR2 eMCP P/Ns LPDDR2 eMCP Capacit peed Mode e•MMC version Package ize
04MCP04-NL2DM627 4G eMMC + 4G LPDDR2 H200 5.0 11.5 x 13 x 1.0 (162 all)
08MCP04-NL2DT227 8G eMMC + 4G LPDDR2 H200 5.0 11.5 x 13 x 1.0 (162 all)
08MCP08-NL2DT227 8G eMMC + 8G LPDDR2 H200 5.0 11.5 x 13 x 1.0 (162 all)
LPDDR3 eMCP P/Ns LPDDR3 eMCP Capacit peed Mode e•MMC version Package ize
04MCP04-NL3DM627 4G eMMC + 4G LPDDR3 H400 5.0 11.5 x 13 x 1.0 (221 all)
08MCP04-NL3DT227 8G eMMC + 4G LPDDR3 H400 5.0 11.5 x 13 x 1.0 (221 all)
08MCP08-NL3DT227 8G eMMC + 8G LPDDR3 H400 5.0 11.5 x 13 x 1.0 (221 all)
16MCP08-NL3DT28 16G eMMC + 8G LPDDR3 H400 5.1 11.5 x 13 x 1.0 (221 all)
16MCP16-L3GT29 16G eMMC + 16G LPDDR3 H400 5.1 11.5 x 13 x 1.0 (221 all)
32MCP16-L3GT29 32G eMMC + 16G LPDDR3 H400 5.1 11.5 x 13 x 1.0 (221 all)
32MCP24-L3JT29 32G eMMC + 24G LPDDR3 H400 5.1 11.5 x 13 x 1.0 (221 all)
64MCP24-L3JTA29 64G eMMC + 24G LPDDR3 H400 5.1 11.5 x 13 x 1.0 (221 all)
64MCP32-L3HTA29 64G eMMC + 32G LPDDR3 H400 5.1 11.5 x 13 x 1.1 (221 all)
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