Copyright © 2013 Future Technology Devices International Limited 1
DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.1
Document No.: FT_000816 Clearance No.: FTDI# 331
Future Technology Devices
International Ltd.
DS_FT312D
(USB Android Host IC)
The FT312D is a USB 2.0 Full Speed
host IC specifically targeted at
providing access to peripheral
hardware from an Android platform
with a USB device port. The device will
bridge the USB port to a UART
interface via the Android Open
Accessory protocol and has the
following advanced features:
Single chip USB to UART interface.
Entire USB protocol handled on the chip. No
USB specific firmware programming required.
Supports USB bulk transfer mode
Basic UART interface with RXD, TXD, RTS#,
CTS# pins.
TX_ACTIVE signal for controlling transceivers
on RS485 interfaces.
UART RX buffer size is 5512 bytes
UART TX buffer size is 256 bytes
USB_ERROR indicator pin
Suitable for use on any Android platform
supporting Android Open Accessory Mode
(Typically 3.1 onwards, however some
platforms may port Open Accessory Mode to
version 2.3.4)
12MHz oscillator using external crystal.
Integrated power-on-reset circuit.
+3V3Single Supply Operation with 5V tolerant
inputs.
USB 2.0 Full Speed compatible.
Extended operating temperature range; -40C
to 85C.
Available in compact Pb-free 32 Pin LQFP and
QFN packages (both RoHS compliant).
Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary
information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow
G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
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DS_FT312D USB ANDROID HOST IC Datasheet
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1 Typical Applications
Connecting Android phones to USB accessories
Connecting Android tablets to USB accessories
Controlling instrumentation from Android
devices.
Home automation via Android devices
Data logging from USB accessories
Connecting serial printing devices to Android
devices
1.1 Part Numbers
Part Number
FT312D-32Q1C-x
FT312D-32L1C-x
Note: Packing codes for x is:
- R: Taped and Reel, QFN 3,000pcs per reel, LQFP 1500 pcs per reel.
- (no suffix): Tray packing, 260pcs per tray QFN, 250 pcs per tray LQFP
For example: FT312D-32Q1C-R is 3,000pcs QFN taped and reel packing
1.2 USB Compliant
At the time of writing this datasheet, the FT312Dhad not completed the USB Compliancy Test.
Copyright © 2013 Future Technology Devices International Limited 3
DS_FT312D USB ANDROID HOST IC Datasheet
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2 FT312D Block Diagram
USB
Transceiver USB Host Buffer UART
USBDP
USBDM
TXD
RXD
RTS#
CTS#
TX_ACTIVE
USB_ERROR#
Figure 2.1FT312D Block Diagram
For a description of the function please refer to Section 4.
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Table of Contents
1 Typical Applications ...................................................................... 2
1.1 Part Numbers ..................................................................................... 2
1.2 USB Compliant .................................................................................... 2
2 FT312D Block Diagram ................................................................. 3
3 Device Pin Out and Signal Description .......................................... 6
3.1 Package Symbol.................................................................................. 6
3.1.1 Package PinOut Description ........................................................................................... 6
4 Function Description..................................................................... 8
4.1 Key Features ....................................................................................... 8
4.2 Functional Block Descriptions ............................................................. 8
4.2.1 UART Interface Module ................................................................................................. 8
4.2.2 Buffers ....................................................................................................................... 8
4.2.3 USB Host .................................................................................................................... 8
4.2.4 USB Transceivers ......................................................................................................... 8
4.3 Default Descriptor Strings .................................................................. 8
5 UART Interface ........................................................................... 10
6 USB Error Detection .................................................................... 12
7 Absolute Maximum Ratings ........................................................ 13
7.1 DC Characteristics .............................................................................14
7.2 ESD and Latch-up Specifications ........................................................15
8 Application Examples ................................................................. 16
8.1 USB to UARTConverter .......................................................................16
8.2 USB to RS232 Converter ....................................................................17
9 Package Parameters ................................................................... 18
9.1 FT312D Package Markings .................................................................18
9.1.1 QFN-32 .................................................................................................................... 18
9.1.2 LQFP-32 ................................................................................................................... 19
9.2 FT312DPackage Dimensions ..............................................................20
9.2.1 QFN-32 Package Dimensions ....................................................................................... 20
9.2.2 LQFP-32 Package Dimensions ...................................................................................... 21
9.3 Solder Reflow Profile .........................................................................22
10 Contact Information ................................................................... 24
Appendix A References ............................................................................25
Appendix B - List of Figures and Tables ......................................................26
Appendix C - Revision History .....................................................................27
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Copyright © 2013 Future Technology Devices International Limited 6
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Document No.: FT_000816 Clearance No.: FTDI# 331
3 Device Pin Out and Signal Description
3.1 Package Symbol
17
18
19
20
21
22
23
24
USBDP
FT312D
QFN 32
USBDM
GND
NC
NC
VCCIO
TXD
RXD
RTS#
25
26
27
28
29
30
31
32
CTS#
GND
VCCIO
TX_ACTIVE
NC
NC
USB_ERROR#
GND
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TEST1
VREGOUT
GND
XTOUT
XTIN
AVCC
VCC
GND
GND
GND
GND
VCCIO
NC
TEST0
RESET#
TEST2
Figure 3.1QFN Schematic Symbol
NOTE: The pinout is the same for the QFN and LQFP packages.
NOTE: Pin 33 on the symbol is the copper pad in the centre of the QFN package
3.1.1 Package PinOut Description
Note: # denotes an active low signal.
Pin No.
Name
Type
Description
2
VCC
POWER
Input
3V3 supply to IC internal 1V8 regulator
3
AVCC
POWER
Input
1V8 supply to IC core
13, 22, 28
VCCIO
POWER
Input
3V3 supply for the IO cells
7
VREGOUT
POWER
Output
1V8 output. May be used as input source for pin 3.
1,6,14,15,16,19,27
GND
POWER
Input
0V Ground input.
Table 3.1 Power and Ground
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Pin No.
Name
Type
Description
4
XTIN
INPUT
Input to 12MHz Oscillator Cell. Connect 12MHz crystal
across pins 4 and 5.
5
XTOUT
OUTPUT
Output from 12MHz Oscillator Cell. Connect 12MHz
crystal across pins 4 and 5.
8
TEST1
INPUT
For internal use. Pull to GND
9
TEST2
INPUT
For factory use. Pull to 3V3.
10
RESET#
INPUT
Reset input (active low).
11
TEST0
OUTPUT
Leave unterminated.
12
NC
-
No connect pins. Leave unterminated.
17
USBDP
INPUT/OUTPUT
USB Data Signal Plus.
18
USBDM
INPUT/OUTPUT
USB Data Signal Minus.
20
NC
-
No connect pins. Leave unterminated.
21
NC
-
No connect pins. Leave unterminated.
23
TXD
OUTPUT
Transmit asynchronous data output
24
RXD
INPUT
Receive asynchronous data input
25
RTS#
OUTPUT
Request to send control output
26
CTS#
INPUT
Clear to send control input
29
TX_ACTIVE
OUTPUT
UART active signal (typically used with RS485)
30
NC
-
No connect pins. Leave un-terminated
31
NC
-
No connect pins. Leave un-terminated
32
USB_ERROR#
OUTPUT
Output signal to indicate a problem with the USB
connection
Table 3.2 Function pins
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4 Function Description
The FT312D is FTDIs second dedicated Android Open Accessory Mode integrated circuit device or Android
Host. The FT312D USB host port is dedicated to support of the Android Open Accessory class and will
bridge data between this port and the UART interface.
4.1 Key Features
Easy to use Android Open Accessory IC translating the Device port of the Android device into UART
capabilities
4.2 Functional Block Descriptions
The following paragraphs describe each function within FT312D. Please refer to the block diagram shown
inFigure 2.1.
4.2.1 UART Interface Module
The FT312DUART module controls the UART interface providing basic RXD, TXD signalling with
RTS#/CTS# hardware flow control. An additional TX_Active signal is supplied to control external RS485
transceivers for users wishing to create a USB to RS485 bridge. The UART supports baud rates from 300
baud to 921600 baud. A full description of the UART module is provided in Section 5.
4.2.2 Buffers
The FT312D provides internal buffering between the USB port and the UART port of the IC for smooth
data streaming.
The Android device can send NAK’s to the USB OUT token sent from the FT312D. This can happen when
the UART application on the Android is running in the background or multiple applications are launched in
the Android device. When the UART application on the Android device is not accepting data, the data will
be buffered in the UART RX buffer in FT312D. The UART RX buffer size is 5512 bytes.
The UART_TX buffer which stores data from the USB port, heading for the UART is 256 bytes.
4.2.3 USB Host
The USB Host block handles the parallel-to-serial and serial-to-parallel conversion of the USB physical
layer. This includes bit stuffing, CRC generation.
4.2.4 USB Transceivers
USB transceiver cells provide the physical USB device interface supporting USB 1.1 and USB 2.0
standards. Low-speed and full-speed USB data rates are supported. The output driver provides 3V3 level
slew rate control signalling, whilst a differential receiver and two single ended receivers provide USB
DATA IN, SE0 and USB Reset condition detection. These cells also include integrated internal pull-down
resistors as required for host mode.
4.3 Default Descriptor Strings
When the USB port is connected to the Android USB port, the Android platform will determine which
application to load based on the strings read from the FT312D. These strings are configurable with a
Windows utility: FT312D_Cofiguration available for download from the FTDI website.
http://www.ftdichip.com
Please refer to the application note AN_236 User Guide for FT312D Configuration to change the default
string values.
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Default values for the strings are set in the device as per Table 4.1
Descriptor String
Default Value
Manufacturer
FTDI
Model
Android Accessory FT312D
Version
1.0
Serial
FTDI FT312D
URL
http://www.ftdichip.com/Android.htm
Description
FTDI Android Accessory FT312D
Table 4.1Default Descriptor Strings
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5 UART Interface
The interface implements a standard asynchronous serial UART port with flow control, for example
RS232/422/485. The UART can support baud rates from 300 to 921600 with RTS/CTS flow control. The
UART can support baud rates from 300 to 115200 with no flow control.
Data transfer uses NRZ (Non-Return to Zero) data format consisting of 1 start bit, 7 or 8 data bits, an
optional parity bit, and one or two stop bits. When transmitting the data bits, the least significant bit is
transmitted first. Transmit and receive waveforms are illustrated in Figure 5-1 and Figure 5-2:
Figure 5-1 UART Receive Waveform
Figure 5-2 UART Transmit Waveform
Baud rate (default =9600 baud), flow control settings (default = None), number of data bits (default=8),
parity (default is no parity) and number of stop bits (default=1) are all configurable from the Android
application. Please refer to ftdichip document number FT_000532 for further details.
http://www.ftdichip.com
TX_ACTIVE is transmit enable, this output may be used in RS485 designs to enable the line driver for
transmit mode.
UART RX buffer size is 5512 bytes and UART TX buffer size is 256 bytes.
Note: UART software flow control with XON/XOFF is not supported
UART hardware flow control with DTR/DSR is not supported
Note:
The FT312D has to enumerate the Android device before receiving data from the UART device.
This can be implemented by disconnecting the UART TXD signal of external UART device connected to the
FT312D RXD signal until after the FT312D has established the USB link with Android device.
The connection sequence should be:
1. Connect FT312D to Android and complete enumeration.
2. Connect the TXD of UART device to FT312D’s RXD then start to receive data.
There are two methods to implement this function:
1.When FT312D connects to the Android device and enumeration is completed, the USB_ERROR# will
become Logic 0 (default Logic 1). This signal can be used to control the TTL gate (74LVC2G241,
74LVC1G125 or others) ON/OFF such that the TXD/RXD lines are connected/disconnected.
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Figure 5-3 UART RXD and TXD connection gated by Enumeration
2. If the UART device has an enable pin(active high enable) such as on the GPS module, the
USB_ERROR# can also be used. The USB_ERROR# pin may be inverted with an NPN BJT then connected
to the enable pin of the GPS module.
Figure 5-4 Inverting Gate Control signal to enable GPS module(active high enable)
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6 USB Error Detection
Pin 32 of the device is provided to indicate a problem has occurred with the USB connection. The errors
are USB device not supported, USB hub not supported and USB device not responding. USB device not
supported would occur if the USB port was connected to a non-Android class device port. e.g. The
FT312D is not designed to host memory sticks or printers etc. USB hub not supported would be reported
if FT312D is connected to a USB hub. USB device not responding would occur if the USB device connected
to the FT312D host port did not respond and the enumeration failed. The signal states are as follows:
Pin state
Definition
Logic 0
Device connected to USB and functional
Logic 1
Device not connected
One 50ms logic 0 pulse
Device not responding. This pulse occurs at plug-in
and then the signal returns to logic 1. This then
repeats every second.
Two 50ms logic 0 pulses
Device not supported. These pulses occur at plug-
in and then the signal returns to logic 1. This then
repeats every second.
Three 50ms logic 0 pulses
Hub not supported. These pulses occur at plug-in
and then the signal returns to logic 1. This then
repeats every second.
Table 6.1 Error Detection
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7 Absolute Maximum Ratings
The absolute maximum ratings for FT312D are shown in Table 7.1. These are in accordance with the
Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the
device.
Parameter
Value
Unit
Storage Temperature
-65°C to 150°C
Degrees C
Floor Life (Out of Bag) At Factory Ambient
( 30°C / 60% Relative Humidity)
168 Hours
(IPC/JEDEC J-STD-033A MSL Level 3
Compliant)*
Hours
Ambient Temperature (Power Applied)
-40°C to 85°C
Degrees
C.
Vcc Supply Voltage
0 to +3.63
V
VCCIO
0 to +3.63
V
AVCC
0 to + 1.98
V
DC Input Voltage - USBDP and USBDM
-0.5 to +(Vcc +0.5)
V
DC Input Voltage - High Impedance
Bidirectional
-0.5 to +5.00
V
DC Input Voltage - All other Inputs
-0.5 to +(Vcc +0.5)
V
DC Output Current - Outputs
4
mA
DC Output Current - Low Impedance
Bidirectional
4
mA
Table 7.1 Absolute Maximum Ratings
* If devices are stored out of the packaging beyond this time limit the devices should be baked
before use. The devices should be ramped up to a temperature of 125°C and baked for up to 17
hours.
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7.1 DC Characteristics
DC Characteristics (Ambient Temperature -40˚C to +125˚C)
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Vcc1
VCC Operating Supply
Voltage
2.97
3.3
3.63
V
Vcc2
VCCIO Operating Supply
Voltage
2.97
3.3
3.63
V
AVCC
VCC_PLL Operating
Supply Voltage
1.62
1.8
1.98
V
Icc1
Operating Supply Current
48MHz
25
mA
Normal
Operation
Icc2
Operating Supply Current
128
µA
USB Suspend
Table 7.2Operating Voltage and Current
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
Voh
Output Voltage High
2.4
V
I source = 8mA
Vol
Output Voltage Low
0.4
V
I sink = 8mA
Vin
Input Switching
Threshold
1.5
V
Table 7.3I/O Pin Characteristics
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
UVoh
I/O Pins Static Output
( High)
2.8
V
UVol
I/O Pins Static Output
( Low )
0.3
V
UVse
Single Ended Rx
Threshold
0.8
2.0
V
UCom
Differential Common
Mode
0.8
2.5
V
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Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
UVdif
Differential Input
Sensitivity
0.2
V
UDrvZ
Driver Output
Impedance
3
6
9
Ohms
Table 7.4USB I/O Pin (USBDP, USBDM) Characteristics
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCCK
Power supply of internal
core cells and I/O to core
interface
1.62
1.8
1.98
V
1.8V power
supply
VCC18IO
Power supply of 1.8V
OSC pad
1.62
1.8
1.98
V
1.8V power
supply
TJ
Operating junction
temperature
-40
25
125
°C
Iin
Input leakage current
-10
±1
10
µA
Iin= VCC18IO or
0V
Ioz
Tri-state output leakage
current
-10
±1
10
µA
Table 7.5Crystal Oscillator 1.8 Volts DC Characteristics
7.2 ESD and Latch-up Specifications
Description
Specification
Human Body Mode (HBM)
± 2000V
Machine mode (MM)
± 200V
Charged Device Mode (CDM)
± 500V
Latch-up
> ± 200mA
Table 7.6 ESD and Latch-up Specifications
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8 Application Examples
The following sections illustrate possible applications of the FT312D.
8.1 USB to UARTConverter
FT312D
1
2
3
4
5
SHIELD
Ferrite
Bead
GND
GND
3V3
GND
VCCIO
VREGOUT
USBDM
USBDP
AVCC
GND
RESET#
100nF
100nF
4.7uF
+
TX_ACTIVE
5V Power to USB
VCC
3V3
REGULATOR
5V
27R
27R
100nF
3V3
TXD
RXD
RTS#
CTS#
USB_ERROR
GND
47pF47pF
MCU/FPGA
UART_TXD
UART_RXD
UART_RTS#
UART_CTS#
UART_TX_ACTIVE
620R 3V3
LED
Figure 8.1Application Example showing USB to UART Converter
The UART signals are at 3V3 level and may be used to drive directly into a FPGA or MCU with a 3V3
interface, or could be level shifted with an RS232, RS422 or RS485 transceiver. The TX_ACTIVE signal is
used mostly with RS485 transceivers to enable the Transmit line drivers.
The unused pins may be left unterminated.
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8.2 USB to RS232 Converter
FT312D
1
2
3
4
5
SHIELD
Ferrite
Bead
GND
GND
3V3
GND
VCCIO
VREGOUT
USBDM
USBDP
AVCC
GND
RESET#
100nF
100nF
4.7uF
+
TX_ACTIVE
5V Power to USB
VCC
3V3
REGULATOR
5V
27R
27R
100nF
3V3
TXD
RXD
RTS#
CTS#
USB_ERROR
GND
47pF47pF
UART_TXD
UART_RXD
UART_RTS#
UART_CTS#
RS232
LEVEL
CONVERTER
TXD
RXD
RTS
CTS
2
3
7
8
DB9
620R 3V3
LED
5
10
SHIELD
Figure 8.2Application Example showing USB to RS232 Converter
An example of using the FT312D as a USB to RS232 converter is illustrated in Figure 8.2. In this
application, a TTL to RS232 Level Converter IC is used on the serial UART interface of the FT312D to
convert the TTL levels of the FT312D to RS232 levels. This level shift can be done using line drivers from
a variety of vendors e.g. Zywyn.
A suitable level shifting device is the Zywyn ZT3243F which is capable of RS232 communication at up to
1000k baud.
The unused pins may be left unterminated.
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9 Package Parameters
FT312D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP).
The packages are lead (Pb) free and use a ‘green’ compound. The package is fully compliant with
European Union directive 2002/95/EC.
The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres.
The solder reflow profile for all packages can be viewed in Section 9.3.
9.1 FT312D Package Markings
9.1.1 QFN-32
An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too
long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line.
Figure 9-1QFN Package Markings
1C should be printed on line 4, then a space and then the Date Code.
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
4. All marking dimensions should be marked proportionally. Marking font should be using
Unisem standard font (Roman Simplex)
FTDI
I
XXXXXXXX
FT312D-32Q
Line 1 FTDI Logo
Line 4 Revision and Date
Code
Line 2 Wafer Lot Number
1
32
Line 3 FTDI Part Number
1C YYWW
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9.1.2 LQFP-32
An example of the markings on the LQFP package are shown in Figure 9-2.
Figure 9-2 LQFP Package Markings
Notes:
1. YYWW = Date Code, where YY is year and WW is week number
2. Marking alignment should be centre justified
3. Laser Marking should be used
4. All marking dimensions should be marked proportionally. Marking font should be using Unisem
standard font (Roman Simplex)
FTD
I
XXXXXXXXXX
FT312D-32L
Line 1 FTDI Logo
Line 4 Revision, Date Code
Line 2 Wafer Lot Number
1
32
Line 3 FTDI Part Number
1C YYWW
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9.2 FT312DPackage Dimensions
9.2.1 QFN-32 Package Dimensions
1
XXXXXXXX
FTDl
1C YYWW
FT312D-32Q
1
Figure 9-3 QFN-32 Package Dimensions
Note: Dimensions are in mm
Note: The centre pad should be connected to the GND plane for improved thermal conduction and noise
immunity.
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9.2.2 LQFP-32 Package Dimensions
FTDl
XXXXXXXX
1C YYWW
FT312D-32L
PIN #1
PIN #32
Figure 9-4LQFP-32 Package Dimensions
Note: Dimensions are in mm
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9.3 Solder Reflow Profile
Figure 9-5 All packages Reflow Solder Profile
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Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
see Figure 9-5
Time within 5°C of actual Peak Temperature
(tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 9.1Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 deg C
220 +5/-0 deg C
2.5 mm
220 +5/-0 deg C
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 9.2 Package Reflow Peak Temperature
Copyright © 2013 Future Technology Devices International Limited 24
DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.1
Document No.: FT_000816 Clearance No.: FTDI# 331
10 Contact Information
Head Office Glasgow, UK
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
E-mail (Sales)
sales1@ftdichip.com
E-mail (Support)
support1@ftdichip.com
E-mail (General Enquiries)
admin1@ftdichip.com
Branch Office Taipei, Taiwan
Future Technology Devices International Limited
(Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan, R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
E-mail (Sales)
tw.sales1@ftdichip.com
E-mail (Support)
tw.support1@ftdichip.com
E-mail (General Enquiries)
tw.admin1@ftdichip.com
Branch Office Oregon, USA
Future Technology Devices International Limited (USA)
7130 SW Fir Loop
Tigard, OR 97223
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-Mail (Sales)
us.sales@ftdichip.com
E-Mail (Support)
us.support@ftdichip.com
E-Mail (General Enquiries)
us.admin@ftdichip.com
Branch Office Shanghai, China
Room 1103, No. 666 West Huaihai Road,
Shanghai, 200052
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
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E-mail (Support)
E-mail (General Enquiries)
cn.support@ftdichip.com
cn.admin@ftdichip.com
Copyright © 2013 Future Technology Devices International Limited 25
DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.1
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix A References
Useful Links
http://www.ftdichip.com/Support/Documents/White_Papers/WP_001_Connecting_%20Peripherals_to_an
_Android_%20Platform.pdf
http://www.ftdichip.com/Support/Documents/ProgramGuides/FT31XD_Android_programmer_guide(FT_0
00532).pdf
Useful utilities and examples firmware
http://www.ftdichip.com/Support/Utilities/FT312D_Configuration_V010000.zip
http://www.ftdichip.com/Support/SoftwareExamples/Android_Projects.htm
Copyright © 2013 Future Technology Devices International Limited 26
DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.1
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix B - List of Figures and Tables
List of Figures
Figure 2.1FT312D Block Diagram .................................................................................................... 3
Figure 3.1QFN Schematic Symbol ................................................................................................... 6
Figure 5-1 UART Receive Waveform .............................................................................................. 10
Figure 5-2 UART Transmit Waveform ............................................................................................ 10
Figure 5-3 UART RXD and TXD connection gated by Enumeration ..................................................... 11
Figure 5-4 Inverting Gate Control signal to enable GPS module(active high enable) ............................ 11
Figure 8.1Application Example showing USB to UART Converter ....................................................... 16
Figure 8.2Application Example showing USB to RS232 Converter ...................................................... 17
Figure 9-1QFN Package Markings .................................................................................................. 18
Figure 9-2 LQFP Package Markings ................................................................................................ 19
Figure 9-3 QFN-32 Package Dimensions ........................................................................................ 20
Figure 9-4LQFP-32 Package Dimensions ........................................................................................ 21
Figure 9-5 All packages Reflow Solder Profile ................................................................................. 22
List of Tables
Table 3.1 Power and Ground .......................................................................................................... 6
Table 3.2 Function pins ................................................................................................................. 7
Table 4.1Default Descriptor Strings ................................................................................................. 9
Table 6.1 Error Detection ............................................................................................................. 12
Table 7.1 Absolute Maximum Ratings ............................................................................................ 13
Table 7.2Operating Voltage and Current ........................................................................................ 14
Table 7.3I/O Pin Characteristics .................................................................................................... 14
Table 7.4USB I/O Pin (USBDP, USBDM) Characteristics ................................................................... 15
Table 7.5Crystal Oscillator 1.8 Volts DC Characteristics ................................................................... 15
Table 7.6 ESD and Latch-up Specifications ..................................................................................... 15
Table 9.1Reflow Profile Parameter Values ...................................................................................... 23
Table 9.2 Package Reflow Peak Temperature .................................................................................. 23
Copyright © 2013 Future Technology Devices International Limited 27
DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.1
Document No.: FT_000816 Clearance No.: FTDI# 331
Appendix C - Revision History
Document Title: USB Android Host ICDS_FT312D
Document Reference No.: FT_000816
Clearance No.: FTDI# 331
Product Page: http://www.ftdichip.com/FTProducts.htm
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Version 1.0 Initial Release Feb2013
Version 1.1 Note added on USB enumeration to be completed before
Receiving data in RXD Nov 2013
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