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LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator
1 Features 3 Description
The LM2936 ultra-low quiescent current regulator
1• LM2936 Operating VIN range of 5.5 V to 40 V features low dropout voltage and low current in the
• LM2936HV Operating VIN range of 5.5 V to 60 V standby mode. With less than 15-μA quiescent
• Ultra Low Quiescent Current (IQ≤15 μA for current at a 100-μA load, the LM2936 is ideally suited
IOUT = 100 μA) for automotive and other battery operated systems.
The LM2936 retains all of the features that are
• Fixed 3-V, 3.3-V or 5-V with 50-mA Output common to low dropout regulators including a low
• ±2% Initial Output Tolerance dropout PNP pass device, short circuit protection,
• ±3% Output Tolerance Over Line, Load, and reverse battery protection, and thermal shutdown.
Temperature The LM2936 has a 40-V maximum operating voltage
limit, a −40°C to 125°C operating temperature range,
• Dropout Voltage Typically 200 mV at IOUT = 50 mA and ±3% output voltage tolerance over the entire
• –24-V Input Voltage Protection output current, input voltage, and temperature range.
• –50-V Input Transient Protection The LM2936 is available in a TO-92 through-hole
package, as well as SOIC-8, VSSOP, SOT–223, and
• Internal Short Circuit Current Limit TO-252 surface mount packages.
• Internal Thermal Shutdown Protection
• Shutdown Pin Available with LM2936BM Package Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
2 Applications SOIC (8) 4.90 mm x 3.91 mm
• Automotive TO-252 (3) 6.10 mm x 6.58 mm
• Industrial Controls LM2936 VSSOP (8) 3.00 mm x 3.00 mm
• Point of Load SOT-223 (4) 6.50 mm x 3.50 mm
TO-92 (3) 4.30 mm x 4.30 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
* Required if regulator is located more than 2″from power supply filter capacitor.
** Required for stability. See Electrical Characteristics for 3-V LM2936 for required values. Must be rated over
intended operating temperature range. Effective series resistance (ESR) is critical, see Typical Characteristics. Locate
capacitor as close as possible to the regulator output and ground pins. Capacitance may be increased without bound.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2936
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Table of Contents
7.3 Feature Description................................................. 12
1 Features.................................................................. 17.4 Device Functional Modes........................................ 13
2 Applications ........................................................... 18 Application and Implementation ........................ 14
3 Description............................................................. 18.1 Application Information............................................ 14
4 Revision History..................................................... 28.2 Typical Application ................................................. 14
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 15
6 Specifications......................................................... 410 Layout................................................................... 16
6.1 Absolute Maximum Ratings ..................................... 410.1 Layout Guidelines ................................................. 16
6.2 ESD Ratings.............................................................. 410.2 Layout Examples................................................... 16
6.3 Recommended Operating Conditions....................... 410.3 Thermal Considerations........................................ 16
6.4 Thermal Information.................................................. 411 Device and Documentation Support................. 18
6.5 Electrical Characteristics for 3-V LM2936................. 511.1 Documentation Support ........................................ 18
6.6 Electrical Characteristics for 3.3-V LM2936.............. 611.2 Trademarks........................................................... 18
6.7 Electrical Characteristics for 5-V LM2936................. 711.3 Electrostatic Discharge Caution............................ 18
6.8 Typical Characteristics.............................................. 811.4 Glossary................................................................ 18
7 Detailed Description............................................ 12 12 Mechanical, Packaging, and Orderable
7.1 Overview................................................................. 12 Information........................................................... 18
7.2 Functional Block Diagram....................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (March 2013) to Revision O Page
• Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision M (March 2013) to Revision N Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 13
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OUT 1
NC 2
NC 3
NC 4
8 IN
7 GND
6 NC
5 NC
LM2936MM
1
2
3
OUT
GND
IN
OUT 1
GND 2
GND 3
NC 4 5 SD
6 GND
7 GND
8 IN
LM2936BM
IN 1
GND 2
OUT 3
4 GND
(TAB)
LM2936MP
IN 1
OUT 3
4 GND
(TAB)
LM2936DT
LM2936
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5 Pin Configuration and Functions
LM2936DT TO-252 (NDP) Package LM2936MP SOT-223 (DCY) Package
3-Pins 4-Pins
Top View Top View
LM2936BM SOIC (D) Package LM2936M SOIC (D) Package
8-Pins 8-Pins
Top View Top View
LM2936Z TO-92 (LP) Package LM2936MM VSSOP (DGK) Package
3-Pins 8-Pins
Bottom View Top View
Pin Functions
PIN I/O DESCRIPTION
D D
NAME NDP DGK DCY LP
(LM2936BM) (LM2936M)
IN 8 8 1 8 1 3 I Unregulated input voltage.
GND 2, 3, 6, 7 2, 3, 6, 7 4 7 2, 4 2 — Ground.
Regulated output voltage. Requires a minimum
OUT 1 1 3 1 3 1 O output capacitance, with specific ESR, on this pin
to maintain stability.
Shutdown. LM2936BM only. Pull this pin HIGH (> 2
V) to turn the output OFF. If this pin is left open,
pull ed low (< 0.6 V), or connected to GND, the
SD 5 — — — — — I output will be ON by default. Avoid having any
voltage between 0.6 V and 2 V on this pin as the
output status may not be predicable across the
operating range.
No internal connection, Connect to GND, or leave
NC 4 4, 5 — 2, 3, 4, 5, 6 — — — open.
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6 Specifications
6.1 Absolute Maximum Ratings (1)(2)
MIN MAX UNIT
Input voltage (survival) −50 60 V
Power dissipation (3) Internally limited
Junction temperature (TJMAX) 150 °C
Storage temperature, Tstg −65 150
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) −TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and
the LM2936 may go into thermal shutdown.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions MIN MAX UNIT
Temperature, TJ−40 125 °C
Input voltage, VIN , LM2936 5.5 40 V
Input voltage, VIN , LM2936HV only 5.5 60 V
Shutdown pin voltage, VSD, LM2936BM only 0 40 V
6.4 Thermal Information LM2936
SOIC (D) TO-252 VSSOP SOT-223 TO-92 (LP)
THERMAL METRIC(1) UNIT
(NDP) (DGK) (DCY)
8 PINS 3 PINS 8 PINS 4 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 111.4 50.5 173.4 62.8 156.8
RθJC(top) Junction-to-case (top) thermal resistance 56.3 52.6 65.9 44.2 80.4
RθJB Junction-to-board thermal resistance 51.9 29.7 94.9 11.7 n/a °C/W
ψJT Junction-to-top characterization parameter 10.9 4.8 9.6 3.6 24.5
ψJB Junction-to-board characterization parameter 51.4 29.3 93.3 11.6 136.0
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 1.6 n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics for 3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
3-V LM2936HV ONLY
Output voltage 5.5 V ≤VIN ≤48 V, 100 µA ≤IOUT ≤50 mA,(2) 2.91 3 3.09 V
–40°C ≤TJ≤125°C
Line regulation 6 V ≤VIN ≤60 V, IOUT = 1 mA 10 30 mV
ALL 3-V LM2936
2.94 3 3.06
Output voltage V
4 V ≤VIN ≤26 V, 100 µA ≤IOUT ≤50 mA,(2) 2.91 3.000 3.09
–40°C ≤TJ≤125°C
Quiescent current IOUT = 100 μA, 8 V ≤VIN ≤24 V 15 20 μA
IOUT = 10 mA, 8 V ≤VIN ≤24 V 0.2 0.5 mA
IOUT = 50 mA, 8 V ≤VIN ≤24 V 1.5 2.5 mA
Line regulation 9 V ≤VIN ≤16 V 5 10 mV
6 V ≤VIN ≤40 V, IOUT = 1 mA 10 30
Load regulation 100 μA≤IOUT ≤5 mA 10 30 mV
5 mA ≤IOUT ≤50 mA 10 30
Dropout voltage IOUT = 100 μA 0.05 0.1 V
IOUT = 50 mA 0.20 0.40 V
Short-circuit current VOUT = 0 V 65 120 250 mA
Output impedance IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz 450 mΩ
Output noise voltage 10 Hz–100 kHz 500 μV
Long-term stability 20 mV/1000 Hr
Ripple rejection Vripple = 1 Vrms, ƒripple = 120 Hz −40 −60 dB
Reverse polarity RL= 500 Ω, t = 1 ms −50 −80 V
transient input voltage
Output voltage with VIN =−15 V, RL= 500 Ω0−0.3 V
reverse polarity input
Maximum Line Transient RL= 500 Ω, VOUT ≤3.3 V, T = 40 ms 60 V
Output bypass COUT = 22 µF, 0.1 mA ≤IOUT ≤50 mA 0.3 8 Ω
capacitance (COUT) ESR
SHUTDOWN INPUT −3-V LM2936BM ONLY
Output voltage, VOUT Output off, VSD = 2.4 V, RLOAD = 500 Ω0 0.01 V
Shutdown high Output off, RLOAD = 500 Ω2 1.1 V
threshold voltage, VIH
Shutdown low Output on, RLOAD = 500 Ω1.1 0.6 V
threshold voltage, VIL
Shutdown high Output off, VSD = 2.4 V, RLOAD = 500Ω12 μA
current, IIH
Quiescent current Output off, VSD = 2.4 V, RLOAD = 500 Ω, 30 μA
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
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6.6 Electrical Characteristics for 3.3-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
3.3-V LM2936HV ONLY
Output voltage 5.5 V ≤VIN ≤48 V, 100 µA ≤IOUT ≤50 mA,(3) 3.201 3.300 3.399 V
–40°C ≤TJ≤125°C
Line regulation 6 V ≤VIN ≤60 V, IOUT = 1 mA 10 30 mV
ALL 3.3-V LM2936
3.234 3.300 3.366
Output voltage V
4 V ≤VIN ≤26 V, 100 µA ≤IOUT ≤50 mA,(3) 3.201 3.300 3.399
–40°C ≤TJ≤125°C
Quiescent current IOUT = 100 μA, 8 V ≤VIN ≤24 V 15 20 μA
IOUT = 10 mA, 8 V ≤VIN ≤24 V 0.2 0.5 mA
IOUT = 50 mA, 8 V ≤VIN ≤24 V 1.5 2.5 mA
Line regulation 9 V ≤VIN ≤16 V 5 10 mV
6 V ≤VIN ≤40 V, IOUT = 1 mA 10 30
Load regulation 100 μA≤IOUT ≤5 mA 10 30 mV
5 mA ≤IOUT ≤50 mA 10 30
Dropout voltage IOUT = 100 μA 0.05 0.10 V
IOUT = 50 mA 0.2 0.4 V
Short-circuit current VOUT = 0 V 65 120 250 mA
Output impedance IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz 450 mΩ
Output noise voltage 10 Hz–100 kHz 500 μV
Long-term stability 20 mV/1000 Hr
Ripple rejection Vripple = 1 Vrms, ƒripple = 120 Hz −40 −60 dB
Reverse polarity RL= 500 Ω, T = 1 ms −50 −80 V
transient input voltage
Output voltage with VIN =−15 V, RL= 500 Ω0−0.3 V
reverse polarity input
maximum line transient RL= 500 Ω, VOUT ≤3.63 V, T = 40 ms 60 V
Output bypass COUT = 22 µF, 0.1 mA ≤IOUT ≤50 mA 0.3 8 Ω
capacitance (COUT) ESR
SHUTDOWN INPUT −3.3-V LM2936BM ONLY
Output voltage, VOUT Output off, VSD = 2.4 V, RLOAD = 500 Ω0 0.01 V
Shutdown high Output off, RLOAD = 500 Ω2 1.1 V
threshold voltage, VIH
Shutdown low Output on, RLOAD = 500 Ω1.1 0.6 V
threshold voltage, VIL
Shutdown high Output off, VSD = 2.4V, RLOAD = 500 Ω12 μA
current, IIH
Quiescent current Output off, VSD = 2.4V, RLOAD = 500 Ω, 30 μA
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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6.7 Electrical Characteristics for 5-V LM2936
VIN = 14 V, IOUT = 10 mA, TJ= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
5-V LM2936HV ONLY
Output voltage 5.5 V ≤VIN ≤48 V, 100 µA ≤IOUT ≤50 mA,(3) 4.85 5 5.15 V
–40°C ≤TJ≤125°C
Line regulation 6 V ≤VIN ≤60 V, IOUT = 1 mA 15 35 mV
ALL 5-V LM2936
4.9 5 5.1
Output voltage V
5.5 V ≤VIN ≤26 V, 100 µA ≤IOUT ≤50 mA,(3) 4.85 5 5.15
–40°C ≤TJ≤125°C
Quiescent current IOUT = 100 μA, 8 V ≤VIN ≤24 V 9 15 μA
IOUT = 10 mA, 8 V ≤VIN ≤24 V 0.2 0.5 mA
IOUT = 50 mA, 8 V ≤VIN ≤24 V 1.5 2.5 mA
Line regulation 9 V ≤VIN ≤16 V 5 10 mV
6 V ≤VIN ≤40 V, IOUT = 1 mA 10 30
Load regulation 100 μA≤IOUT ≤5 mA 10 30 mV
5 mA ≤IOUT ≤50 mA 10 30
Dropout voltage IOUT = 100 μA 0.05 0.1 V
IOUT = 50 mA 0.2 0.4 V
Short-circuit current VOUT = 0 V 65 120 250 mA
Output impedance IOUT = 30 mAdc and 10 mArms, ƒ = 1000 Hz 450 mΩ
Output noise voltage 10 Hz–100 kHz 500 μV
Long-term stability 20 mV/1000 Hr
Ripple rejection Vripple = 1 Vrms, ƒripple = 120 Hz −40 −60 dB
Reverse polarity RL= 500 Ω, T = 1 ms −50 −80 V
transient input voltage
Output voltage with VIN =−15 V, RL= 500 Ω0−0.3 V
reverse polarity input
Maximum line transient RL= 500 Ω, VOUT ≤5.5 V, T = 40 ms 60 V
Output bypass COUT = 10 µF, 0.1 mA ≤IOUT ≤50 mA 0.3 8 Ω
capacitance (COUT) ESR
SHUTDOWN INPUT −5-V LM2936BM ONLY
Output voltage, VOUT Output off, VSD = 2.4 V, RLOAD = 500 Ω0 0.01 V
Shutdown high Output off, RLOAD = 500 Ω2 1.1 V
threshold voltage, VIH
Shutdown low Output on, RLOAD = 500 Ω1.1 0.6 V
threshold voltage, VIL
Shutdown high Output off, VSD = 2.4 V, RLOAD = 500 Ω12 μA
current, IIH
Quiescent current Output off, VSD = 2.4 V, RLOAD = 500Ω, 30 μA
includes IIH current
(1) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
(2) Typicals are at 25°C (unless otherwise specified) and represent the most likely parametric norm.
(3) To ensure constant junction temperature, pulse testing is used.
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6.8 Typical Characteristics
Figure 1. Maximum Power Dissipation (TO-92) Figure 2. Dropout Voltage
Figure 3. Dropout Voltage Figure 4. Quiescent Current
Figure 6. Quiescent Current
Figure 5. Quiescent Current
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Typical Characteristics (continued)
Figure 8. Quiescent Current
Figure 7. Quiescent Current
Figure 9. 5-V LM2936 COUT ESR Figure 10. 3-V LM2936 COUT ESR
Figure 12. Peak Output Current
Figure 11. 3.3-V LM2936 COUT ESR
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Typical Characteristics (continued)
Figure 14. 5-V LM2936 Current Limit
Figure 13. Peak Output Current
Figure 16. 5-V LM2936 Output at Voltage Extremes
Figure 15. 5-V LM2936 Line Transient Response
Figure 17. 5-V LM2936 Ripple Rejection Figure 18. 5-V LM2936 Load Transient Response
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Typical Characteristics (continued)
Figure 19. 5-V LM2936 Low Voltage Behavior Figure 20. 5-V LM2936 Output Impedance
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+
Current
Limit Thermal
Shutdown
IN OUT
GND
LM2936
PNP
Bandgap
Reference
LM2936
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7 Detailed Description
7.1 Overview
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. With less than 15 μA quiescent current at a 100-μA load, the LM2936 is ideally suited for automotive and
other battery operated systems. The LM2936 retains all of the features that are common to low dropout
regulators including a low dropout PNP pass device, short circuit protection, reverse battery input protection, and
thermal shutdown. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating
temperature range, and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 High Input Operating Voltage
Unlike namy other PNP low dropout regulators, the LM2936 remains fully operational with VIN = 40 V, and the
LM2936HV remains fully operational with VIN = 60 V . Owing to power dissipation characteristics of the available
packages, full output current cannot be ensured for all combinations of ambient temperature and input voltage.
While the LM2936HV maintains regulation to 60 V, it will not withstand a short circuit to ground on the output
when VIN is above 40 V because of safe operating area limitations in the internal PNP pass device. Above 60V
the LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use
this device in a design where the input operating voltage may exceed 40 V, or where transients are likely to
exceed 60 V.
7.3.2 Thermal Shutdown (TSD)
The TSD circuitry of the LM2936 has been designed to protect the device against temporary thermal overload
conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LM2936
device at TSD may degrade device reliability as the junction temperature will be exceeding the absolute
maximum junction temperature rating. If the LM2936 goes into TSD mode, the output current will be shut off until
the junction temperature falls approximately 10°C, then the output current will automatically be restored. The
LM2936 will continuously cycle in and out of TSD until the condition is corrected. The LM2936 TSD junction
temperature is typically 160°C.
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Feature Description (continued)
7.3.3 Short-Circuit Current Limit
The output current limiting circuitry of the LM2936 has been designed to limit the output current in cases where
the load impedance is unusually low. This includes situations where the output may be shorted directly to ground.
Continuous operation of the LM2936 at the current limit will typically result in the LM2936 transitioning into TSD
mode.
7.3.4 Shutdown (SD) Pin
The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (> 2 V) to the SD
pin will cause the output to turn off. Leaving the SD pin open, connecting it to Ground, or applying a Logic Level
Low (< 0.6 V) will allow the regulator output to turn on.
7.4 Device Functional Modes
The LM2936 design does not include any undervoltage lockout (UVLO), or overvoltage shutdown (OVSD)
functions. Generally, the output voltage will track the input voltage until the input voltage is greater than VOUT + 1
V. When the input voltage is greater than VOUT + 1 V the LM2936 will be in linear operation, and the output
voltage will be regulated; however, the device will be sensitive to any small perturbation of the input voltage.
Device dynamic performance is improved when the input voltage is at least 2 V greater than the output voltage.
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GND
CIN
100 nF *COUT
10 µF **
VIN VOUT
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby
mode. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating temperature range,
–24-V input voltage protection and ±3% output voltage tolerance over the entire output current, input voltage, and
temperature range This following section presents a simplified discussion of the design process. Also the
WEBENCH®software may be used to generate complete designs. When generating a design, WEBENCH
utilizes iterative design procedure and accesses comprehensive databases of components. Please go to
www.ti.com for more details.
8.2 Typical Application
Figure 21 shows the typical application circuit for the LM2936. For the LM2936 5-V option, the output capacitor,
COUT, must have a capacitance value of at least 10 µF with an equivalent series resistance (ESR) of at least 300
mΩ, but no more than 8 Ω. For the LM2936 3.3-V and 3-V options, the output capacitor, COUT, must have a
capacitance value of at least 22 µF with an ESR of at least 300 mΩ, but no more than 8 Ω. The minimum
capacitance value and the ESR requirements apply across the entire expected operating ambient temperature
range.
* CIN is required only if the regulator is located more than 3 inches from the power-supply-filter capacitors.
** Required for stability. COUT must be at least 10 µF for the LM2936 5-V option, and at least 22 µF for the 3.3-V and
3-V options. Capacitance must be maintained over entire expected operating temperature range, and located as close
as possible to the regulator. The ESR, of the COUT capacitor must at least 300 mΩ, but no more than 8 Ω.
Figure 21. LM2936 Typical Application
8.2.1 Design Requirements
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Output voltage 5 V
Input voltage 10 V to 26 V
Output current requirement 1 mA to 50 mA
Input capacitor 0.1 µF
Output capacitance 10 µF minimum
Output capacitor ESR value 300 mΩto 8 Ω
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8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
ESR and minimum amount of capacitance.
8.2.2.1.1 Minimum Capacitance
The minimum output capacitance required to maintain stability is at least 10 µF for the LM2936 5-V option, and
at least 22 µF for the 3.3-V and 3-V options. This value may be increased without limit. Larger values of output
capacitance will give improved transient response.
8.2.2.1.2 ESR Limits
The ESR of the output capacitor will cause loop instability if it is too high, or too low. ESR, of the COUT capacitor
must at least 300 mΩ, but no more than 8 Ω.
8.2.2.2 Output Capacitor ESR
It is essential that the output capacitor meet the capacitance and ESR requirements, or oscillations can result.
The ESR is used with the output capacitance in
Ceramic capacitors (MLCC) can be used for COUT only if a series resistor is added to simulate the ESR
requirement. The ESR is not optional, it is mandatory. Typically, a 500-mΩto 1-Ωseries resistor is used for this
purpose. When using ceramic capacitors, due diligence must be given to initial tolerances, capacitance derating
due to applied DC voltage, and capacitance variations due to temperature. Dielectric types X5R and X7R are
preferred.
8.2.3 Application Curve
Figure 22. LM2936 VOUT vs. VIN
9 Power Supply Recommendations
This device is designed to operate from an input supply voltage from at least VOUT + 1 V up to a maximum of 40
V. The input supply should be well regulated and free of spurious noise. To ensure that the LM2936 output
voltage is well regulated the input supply should be at least VOUT + 2 V. A capacitor at the IN pin may not be
specifically required if the bulk input supply filter capacitors are within three inches of the IN pin, but adding one
will not be detrimental to operation.
While the LM2936 maintains regulation to VIN = 60 V, it will not withstand a short circuit on the output with VIN
above 40 V because of safe operating area limitations in the internal PNP pass device. With VIN above 60 V the
LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this
device in a design where the input operating voltage, including transients, is likely to exceed 60 V.
Copyright © 2000–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM2936
1 3
4
GND
GND
VIN VOUT
COUT
CIN
Thermal
Vias
1
2
3
45
6
7
8
VOUT
GND GND
VIN
1
2
3
45
6
7
8
VOUT
GND
GND
VIN
VSD
CIN COUT
LM2936
SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
www.ti.com
10 Layout
10.1 Layout Guidelines
The dynamic performance of the LM2936 is dependent on the layout of the PCB. PCB layout practices that are
adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2936. Best
performance is achieved by placing CIN and COUT on the same side of the PCB as the LM2936, and as close as
is practical to the package. The ground connections for CIN and COUT should be back to the LM2936 ground pin
using as wide, and as short, of a copper trace as is practical.
Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided
as these will add parasitic inductances and resistances that will give inferior performance, especially during
transient conditions
10.2 Layout Examples
Figure 23. LM2936BM SOIC (D) Layout
Figure 24. LM2936M SOIC (D) Layout
Figure 25. LM2936 TO-252 (NDP) Layout
10.3 Thermal Considerations
Due to the power dissipation characteristics of the available packages (RθJA), full output current cannot be
ensured for all combinations of ambient temperature and input voltage.
Exceeding the maximum allowable power dissipation as defined by the final package RθJA will cause excessive
die junction temperature, and the regulator may go into thermal shutdown.
Power dissipation, PD, is calculated from the following formula:
PD= ((VIN – VOUT)×IOUT) + (VIN × IGND) (1)
16 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
IN OUT
GND
CIN COUT
VIN VOUT
LOAD
IOUT
IGND
IIN = IGND + IOUT
LM2936
www.ti.com
SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
Thermal Considerations (continued)
space
Figure 26. Current Paths for Power Dissipation Calculation
Knowing the power dissipation (PD), the thermal resistance of the package (RθJA), and the ambient temperature
(TA), the junction temperature (TJ) can be estimated using the following formula:
TJ= (PD× RθJA)+TA(2)
Knowing the thermal resistance of the package (RθJA), the ambient temperature (TA), and the maximum allowed
operating junction temperature (TJ) of 125°C, the maximum power dissipation can be estimated using the
following formula:
PD(MAX) = (125°C – TA) / RθJA (3)
Alternately, solving for the required thermal resistance (RθJA):
RθJA = (125°C – TA) / PD(MAX) (4)
The maximum allowed PDinformation from Equation 3 can be used to estimate the maximum allowed load
current (IOUT), or the maximum allowed VIN:
VIN(MAX) = (PD(MAX) / IOUT)+VOUT (5)
IOUT(MAX) = (PD(MAX) / (VIN – VOUT)) (6)
As an example, an application requires : VIN = 14 V, VOUT =5V,IOUT = 25 mA, and TA= 85°C. Find the
maximum RθJA to keep the junction temperature under 125°C.
RθJA ≤(125°C – TA) / PD(MAX) (7)
RθJA ≤(125°C – 85°C) / ((14 V – 5 V) × 0.025 A) (8)
RθJA ≤40°C / 0.225W (9)
RθJA ≤177°C/W (10)
The EIA/JEDEC standard (JESD51-2) provides methodologies to estimate the junction temperature from external
measurements (ΨJB references the temperature at the PCB, and ΨJT references the temperature at the top
surface of the package) when operating under steady-state power dissipation conditions. These methodologies
have been determined to be relatively independent of the copper thermal spreading area that may be attached to
the package DAP when compared to the more typical RθJA. Refer to Texas Instruments Application Report
Semiconductor and IC Package Thermal Metrics (SPRA953), for specifics.
On the 8-pin SOIC (D) package, the four ground pins are thermally connected to the backside of the die. Adding
approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the JEDEC RθJA rating
from 111.4°C/W to approximately 100°C/W. If this extra copper area is placed directly beneath the SOIC
package there should not be any impact on board density.
The LM2936 has an internally set thermal shutdown point of typically 160°C. Thermal shutdown is outside the
ensured operating temperature range and is intended as a safety feature only. Continuous operation near the
thermal shutdown temperature should be avoided as it may have a negative affect on the life of the device.
Copyright © 2000–2014, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM2936
LM2936
SNOSC48O –JUNE 2000–REVISED DECEMBER 2014
www.ti.com
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
Texas Instruments Application Report Semiconductor and IC Package Thermal Metrics (SPRA953)
11.2 Trademarks
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: LM2936
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2936BM-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6B3.3
LM2936BM-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6B5.0
LM2936BMX-3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6B3.3
LM2936BMX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6B5.0
LM2936DT-3.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM2936D
T-3.0
LM2936DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM2936D
T-3.3
LM2936DT-5.0 NRND TO-252 NDP 3 75 Non-RoHS
& Green Call TI Call TI -40 to 125 LM2936D
T-5.0
LM2936DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM2936D
T-5.0
LM2936DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM2936D
T-3.3
LM2936DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM2936D
T-5.0
LM2936HVBMA-3.3 NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 125 2936H
BM3.3
LM2936HVBMA-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 2936H
BM3.3
LM2936HVBMA-5.0 NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 125 2936H
BM5.0
LM2936HVBMA-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 2936H
BM5.0
LM2936HVBMAX3.3 NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI 2936H
BM3.3
LM2936HVBMAX3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 2936H
BM3.3
LM2936HVBMAX5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 2936H
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
BM5.0
LM2936HVMA-5.0 NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 125 2936H
M-5.0
LM2936HVMA-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 2936H
M-5.0
LM2936HVMAX-5.0 NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 125 2936H
M-5.0
LM2936HVMAX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 2936H
M-5.0
LM2936M-3.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6M-3
LM2936M-3.3 NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 125 LM293
6-3.3
LM2936M-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6-3.3
LM2936M-5.0 NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 125 LM293
6M-5
LM2936M-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6M-5
LM2936MM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KBC
LM2936MM-3.3 NRND VSSOP DGK 8 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 KBB
LM2936MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KBB
LM2936MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KBA
LM2936MMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KBB
LM2936MMX-5.0 NRND VSSOP DGK 8 3500 Non-RoHS
& Green Call TI Call TI -40 to 125 KBA
LM2936MMX-5.0/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KBA
LM2936MP-3.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM KACA
LM2936MP-3.3 NRND SOT-223 DCY 4 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 KABA
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2936MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KABA
LM2936MP-5.0 NRND SOT-223 DCY 4 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 KAAA
LM2936MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KAAA
LM2936MPX-3.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KACA
LM2936MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KABA
LM2936MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 KAAA
LM2936MX-3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6-3.3
LM2936MX-5.0 NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 125 LM293
6M-5
LM2936MX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM293
6M-5
LM2936Z-3.3/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 LM2936
Z-3.3
LM2936Z-5.0/LFT1 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM293
6Z-5
LM2936Z-5.0/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM293
6Z-5
LM2936Z-5.0/LFT4 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM293
6Z-5
LM2936Z-5.0/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -40 to 125 LM293
6Z-5
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 4
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2936BMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936BMX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM2936HVBMAX3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVBMAX3.3/NOP
BSOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVBMAX5.0/NOP
BSOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVMAX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936HVMAX-5.0/NOP
BSOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MM-5.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-5.0 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM2936MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM2936MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2936BMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936BMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM2936HVBMAX3.3 SOIC D 8 2500 367.0 367.0 35.0
LM2936HVBMAX3.3/NOP SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
B
LM2936HVBMAX5.0/NOP
BSOIC D 8 2500 367.0 367.0 35.0
LM2936HVMAX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2936HVMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936MM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MMX-5.0 VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM2936MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM2936MX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LM2936MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 3
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE
4202506/B 06/2002
6,30 (0.248)
6,70 (0.264)
2,90 (0.114)
3,10 (0.122)
6,70 (0.264)
7,30 (0.287) 3,70 (0.146)
3,30 (0.130)
0,02 (0.0008)
0,10 (0.0040)
1,50 (0.059)
1,70 (0.067)
0,23 (0.009)
0,35 (0.014)
1 2 3
4
0,66 (0.026)
0,84 (0.033)
1,80 (0.071) MAX
Seating Plane
0°–10°
Gauge Plane
0,75 (0.030) MIN
0,25 (0.010)
0,08 (0.003)
0,10 (0.004) M
2,30 (0.091)
4,60 (0.181) M
0,10 (0.004)
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
www.ti.com
PACKAGE OUTLINE
C
10.42
9.40
6.73
6.35
6.22
5.97 1.27
0.88
5.46
4.96
2.285
4.57
1.02
0.64
3X 0.88
0.64
2.55 MAX
0.88
0.46
8
8
1.14
0.89
0.60
0.46
0.17
0.51 MIN
4.32 MIN
(2.345)
(2.5)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
0.25 C A B
TOP & BOTTOM
PKG
1
2
3
OPTIONAL
SEATING PLANE
4
3
2
1
SCALE 1.500
A
B
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
(4.57)
2X (1.3) 2X (2.15) (5.7)
(5.5)
(2.285)(4.38)
(R0.05) TYP
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SYMM
PKG
1
3
4
SEE SOLDER MASK
DETAIL
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK DETAIL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
2X (2.15)
2X (1.3)
(4.57)
(4.38)
(1.32) TYP
(1.35) TYP
(0.26) (R0.05) TYP
16X (1.12)
16X (1.15)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
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