MC74AC244DTR2G - ON Semiconductor

September, 2006 − Rev. 7 1Publication Order Number:

MC74AC244/D

MC74AC244, MC74ACT244

Octal Buffer/Line Driver

with 3−State Outputs

The MC74AC244/74ACT244 is an octal buffer and line driver

designed to be employed as a memory address driver, clock driver and

bus oriented transmitter/receiver which provides improved PC board

density.

Features

•3−State Outputs Drive Bus Lines or Buffer Memory Address

Registers

•Outputs Source/Sink 24 mA

•′ACT244 Has TTL Compatible Inputs

•Pb−Free Packages are Available*

1920 18 17 16 15 14

21 34567

VCC

OE2

OE1GND

Pinout: 20−Lead Packages Conductors (Top View)

TRUTH TABLE

Inputs Outputs

OE1D(Pins 12, 14, 16, 18)

L L L

L H H

H X Z

NOTE: H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

Z = High Impedance

TRUTH TABLE

Inputs Outputs

OE2D(Pins 3, 5, 7, 9)

L L L

L H H

H X Z

NOTE: H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

Z = High Impedance

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

See general marking information in the device marking

section on page 6 of this data sheet.

DEVICE MARKING INFORMATION

SOIC−20W

DW SUFFIX

CASE 751D

TSSOP−20

DT SUFFIX

CASE 948E

SOEIAJ−20

M SUFFIX

CASE 967

PDIP−20

N SUFFIX

CASE 738

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See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

MC74AC244, MC74ACT244

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V

VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V

VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V

IIN DC Input Current, per Pin ±20 mA

IOUT DC Output Sink/Source Current, per Pin ±50 mA

ICC DC VCC or GND Current per Output Pin ±50 mA

Tstg Storage Temperature −65 to +150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended O p e r a t i n g Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage ′AC 2.0 5.0 6.0 V

′ACT 4.5 5.0 5.5

VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V

tr, tfInput Rise and Fall Time (Note 1)

′AC Devices except Schmitt Inputs

VCC @ 3.0 V − 150 −

VCC @ 4.5 V − 40 − ns/V

VCC @ 5.5 V − 25 −

tr, tfInput Rise and Fall Time (Note 2)

′ACT Devices except Schmitt Inputs

VCC @ 4.5 V − 10 − ns/V

VCC @ 5.5 V − 8.0 −

TJJunction Temperature (PDIP) − − 140 °C

TAOperating Ambient Temperature Range −40 25 85 °C

IOH Output Current − High − − −24 mA

IOL Output Current − Low − − 24 mA

1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

MC74AC244, MC74ACT244

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74AC 74AC

Unit Conditions

TA = +25°CTA =

−40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

2.1

3.15

3.85

2.1

3.15

3.85

V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level Input Voltage 3.0

4.5

5.5

1.5

2.25

2.75

0.9

1.35

1.65

0.9

1.35

1.65

V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level Output Voltage 3.0

4.5

5.5

2.99

4.49

5.49

2.9

4.4

5.4

2.9

4.4

5.4

VIOUT = −50 mA

3.0

4.5

5.5

−

2.56

3.86

4.86

2.46

3.76

4.76

V *VIN = VIL or VIH

−12 mA

IOH −24 mA

−24 mA

VOL Maximum Low Level Output Voltage 3.0

4.5

5.5

0.002

0.001

0.1

VIOUT = 50 mA

3.0

4.5

5.5

−

0.36

0.44

V *VIN = VIL or VIH

12 mA

IOL 24 mA

24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mAVI (OE) = VIL, VIH

VI = VCC, GND

VO = VCC, GND

IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.

AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)

Symbol Parameter VCC*

(V)

74AC 74AC

Unit Figure

No.

TA = +25°C

CL = 50 pF TA = −40°C to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay

Data to Output 3.3

5.0 2.0

1.5 6.5

5.0 9.0

7.0 1.5

1.0 10.0

7.5 ns 3−5

tPHL Propagation Delay

Data to Output 3.3

5.0 2.0

1.5 6.5

5.0 9.0

7.0 2.0

1.0 10.0

7.5 ns 3−5

tPZH Output Enable Time 3.3

5.0 2.0

1.5 6.0

5.0 10.5

7.0 1.5

1.5 11.0

8.0 ns 3−7

tPZL Output Enable Time 3.3

5.0 2.5

1.5 7.5

5.5 10.0

8.0 2.0

1.5 11.0

8.5 ns 3−8

tPHZ Output Disable Time 3.3

5.0 3.0

2.5 7.0

6.5 10.0

9.0 1.5

1.0 10.5

9.5 ns 3−7

tPLZ Output Disable Time 3.3

5.0 2.5

2.0 7.5

6.5 10.5

9.0 2.5

2.0 11.5

9.5 ns 3−8

*Voltage Range 3.3 V is 3.3 V ±0.3 V.

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

MC74AC244, MC74ACT244

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74ACT 74ACT

Unit Conditions

TA = +25°CTA =

−40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 4.5

5.5 1.5

1.5 2.0

2.0 2.0

2.0 V VOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level Input Voltage 4.5

5.5 1.5

1.5 0.8

0.8 0.8

0.8 V VOUT = 0.1 V

or VCC − 0.1 V

VOH Minimum High Level Output Voltage 4.5

5.5 4.49

5.49 4.4

5.4 4.4

5.4 VIOUT = −50 mA

4.5

5.5 −

−3.86

4.86 3.76

4.76

V *VIN = VIL or VIH

−24 mA

IOH −24 mA

VOL Maximum Low Level Output Voltage 4.5

5.5 0.001

0.001 0.1

0.1 0.1

0.1 VIOUT = 50 mA

4.5

5.5 −

−0.36

0.36 0.44

0.44

V *VIN = VIL or VIH

24 mA

IOL 24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V

IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mAVI (OE) = VIL, VIH

VI = VCC, GND

VO = VCC, GND

IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 8.0 80 mAVIN = VCC or GND

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)

Symbol Parameter VCC*

(V)

74ACT 74ACT

Unit Figure

No.

TA = +25°C

CL = 50 pF TA = −40°C to +85°C

CL = 50 pF

Min Typ Max Min Max

tPLH Propagation Delay

Data to Output 5.0 2.0 6.5 9.0 1.5 10.0 ns 3−5

tPHL Propagation Delay

Data to Output 5.0 2.0 7.0 9.0 1.5 10.0 ns 3−5

tPZH Output Enable Time 5.0 1.5 6.0 8.5 1.0 9.5 ns 3−7

tPZL Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−8

tPHZ Output Disable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−7

tPLZ Output Disable Time 5.0 2.5 7.5 10.0 2.0 10.5 ns 3−8

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter Value Typ Unit Test Conditions

CIN Input Capacitance 4.5 pF VCC = 5.0 V

CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V

MC74AC244, MC74ACT244

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ORDERING INFORMATION

Device Package Shipping†

MC74AC244N PDIP−20

18 Units / Rail

MC74AC244NG PDIP−20

(Pb−Free)

MC74ACT244N PDIP−20

MC74ACT244NG PDIP−20

(Pb−Free)

MC74AC244DW SOIC−20 38 Units / Rail

MC74AC244DWG SOIC−20

(Pb−Free)

MC74AC244DWR2 SOIC−20 1000 / Tape & Reel

MC74AC244DWR2G SOIC−20

(Pb−Free)

MC74ACT244DW SOIC−20 38 Units / Rail

MC74ACT244DWG SOIC−20

(Pb−Free)

MC74ACT244DWR2 SOIC−20 1000 / Tape & Reel

MC74ACT244DWR2G SOIC−20

(Pb−Free)

MC74AC244DTR2 TSSOP−20*

2500 / Tape & Reel

MC74AC244DTR2G TSSOP−20*

MC74ACT244DTR2 TSSOP−20*

MC74ACT244DTR2G TSSOP−20*

MC74AC244MEL SOEIAJ−20 2000 / Tape & Reel

MC74AC244MELG SOEIAJ−20

(Pb−Free)

MC74ACT244M SOEIAJ−20 40 Units / Rail

MC74ACT244MG SOEIAJ−20

(Pb−Free)

MC74ACT244MEL SOEIAJ−20 2000 / Tape & Reel

MC74ACT244MELG SOEIAJ−20

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*These packages are inherently Pb−Free.

MC74AC244, MC74ACT244

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MARKING DIAGRAMS

PDIP−20 SOIC−20W TSSOP−20 SOEIAJ−20

244

ALYWG

74ACT244

AWLYWWG

20 MC74AC244N

AWLYYWWG

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Package

(Note: Microdot may be in either location)

74AC244

AWLYWWG

ACT

244

ALYWG

ACT244

AWLYYWWG

20 MC74ACT244N

AWLYYWWG

AC244

AWLYYWWG

MC74AC244, MC74ACT244

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PACKAGE DIMENSIONS

PDIP−20

N SUFFIX

PLASTIC DIP PACKAGE

CASE 738−03

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

J20 PL

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A25.66 27.171.010 1.070

B6.10 6.600.240 0.260

C3.81 4.570.150 0.180

D0.39 0.550.015 0.022

G2.54 BSC0.100 BSC

J0.21 0.380.008 0.015

K2.80 3.550.110 0.140

L7.62 BSC0.300 BSC

M0 15 0 15

N0.51 1.010.020 0.040

____

1.27 1.770.050 0.070

−A−

SEATING

PLANE

D20 PL

−T−

0.25 (0.010) T

1.27 BSC0.050 BSC

SOIC−20W

DW SUFFIX

CASE 751D−05

ISSUE G

B20X

H10X

18X A1

SEATING

PLANE

hX 45_

0.25 M

0.25 S

DIM MIN MAX

MILLIMETERS

A2.35 2.65

A1 0.10 0.25

B0.35 0.49

C0.23 0.32

D12.65 12.95

E7.40 7.60

e1.27 BSC

H10.05 10.55

h0.25 0.75

L0.50 0.90

q0 7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

MC74AC244, MC74ACT244

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PACKAGE DIMENSIONS

TSSOP−20

DT SUFFIX

CASE 948E−02

ISSUE B

DIM

MIN MAX MIN MAX

INCHES

6.60 0.260

MILLIMETERS

B4.30 4.50 0.169 0.177

C1.20 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.27 0.37 0.011 0.015

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

____

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER

SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER

SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN

FOR REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

ÍÍÍÍ

110

1120

PIN 1

IDENT

−T−

0.100 (0.004)

DGH

SECTION N−N

JJ1

−W−

SEATING

PLANE

−V−

−U−

0.10 (0.004) V S

20X REFK

L/2

U0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E 6.40 0.252

−−− −−−

U0.15 (0.006) T

MC74AC244, MC74ACT244

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PACKAGE DIMENSIONS

SOEIAJ−20

M SUFFIX

CASE 967−01

ISSUE A

DIM MIN MAX MIN MAX

INCHES

−−− 2.05 −−− 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.15 0.25 0.006 0.010

12.35 12.80 0.486 0.504

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0.70 0.90 0.028 0.035

−−− 0.81 −−− 0.032

_10 _0

_10 _

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

LEQ1

110

0.13 (0.005)

0.10 (0.004)

VIEW P

DETAIL P

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to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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Phone: 81−3−5773−3850

MC74AC244/D

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