MAC97A6 - NXP Semiconductors

1. Product profile

1.1 General description

Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic

integrated circuits and other low power gate trigger circuits.

Product availability:

MAC97A8 in SOT54 (TO-92)

MAC97A6 in SOT54 (TO-92).

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

MAC97A8; MAC97A6

Logic level triac

Rev. 2 — 14 September 2011 Product data sheet

TO-92

Blocking voltage to 600 V (MAC97A8) RMS on-state current to 0.6 A

Sensitive gate in all four quadrants Low cost package.

General purpose bidirectional switching Phase control applications

Solid state relays.

Table 1. Quick reference data

Symbol Parameter Conditions Typ Max Unit

VDRM repetitive peak off-state voltage

MAC97A8

MAC97A6 Tj=25to125C 600 V

Tj=25to125C 400 V

IT(RMS) on-state current (RMS value) full sine wave; Tlead 50 C; Figure 5 0.6 A

ITSM non-repetitive peak on-state current 8.0 A

Product data sheet Rev. 2 — 14 September 2011 2 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

2. Pinning information

3. Ordering information

Table 2. Pinning - SOT54 (TO-92), simplified outline and symbol

Pin Description Simplified outline Symbol

1 main terminal 2

SOT54 (TO-92)

2 gate

3 main terminal 1

msb033

mbl305

Table 3. Ordering information

Type number Package

Name Description Version

MAC97A8 TO-92 Plastic single-ended leaded (through hole) p ackage; 3 leads SOT54

MAC97A6 TO-92 Plastic single-ended leaded (through hole) p ackage; 3 leads SOT54

Product data sheet Rev. 2 — 14 September 2011 3 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

4. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage

MAC97A8

MAC97A6 Tj=25to125C600 V

Tj=25to125C400 V

IT(RMS) on-state current (RMS value) full sine wave; Tlead 50 C; Figure 5 0.6 A

ITSM non-repetitive peak on-state current full sine wave; Tj=25C prior to surge

t=20ms 8.0 A

t=16.7ms 8.8 A

I2tI

2t for fusing t  10 ms 0.32 A2s

dIT/dt repetitive ra te of rise of on-sta te

current after triggering ITM = 1.0 A; IG= 0.2 A; dIG/dt = 0.2 A/s

T2+ G+ 50 A/s

T2+ G50 A/s

T2G50 A/s

T2G+ 10 A/s

IGM gate current (peak value) t = 2 s max 1

VGM gate voltage (peak value) t = 2 s m ax 5 V

PGM gate power (peak val ue) t = 2 s max 5W

PG(AV) average gate power Tcase =80C; t = 2 s max 0.1 W

Tstg storage temperature 40 +150 C

Tjoperating junction temperature 40 +125 C

Product data sheet Rev. 2 — 14 September 2011 4 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

5. Thermal characteristics

5.1 Transient thermal impedance

Table 5. Thermal characteristics

Symbol Parameter Conditions Value Unit

Rth(j-lead) thermal resistance from junction to lead full cycle 60 K/W

half cycle 80 K/W

Rth(j-a) therma l resistance from junction to ambient mounted on a printed circuit board;

lead length = 4 mm; Figure 1 150 K/W

Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration.

003aaa029

tp (s)

10-5 11010-1

10-2

10-4 10-3

102

103

Zth(j-a)

(K/W)

Product data sheet Rev. 2 — 14 September 2011 5 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

6. Characteristics

Table 6. Characteristics

Tj=25



C unless otherwise specified

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

IGT gate trigger cur r en t VD=12V; I

T=0.1A; Figure 8

T2+ G+ 15mA

T2+ G 25mA

T2G 25mA

T2G+ 47mA

ILlatching current VD=12V; I

GT =0.1A; Figure 9

T2+ G+ 110mA

T2+ G510mA

T2G110mA

T2G+ 210mA

IHholding current VD=12V; I

GT =0.1A; Figure 10 110mA

VTon-state voltage IT=0.85A; Figure 11 1.4 1.9 V

VGT gate trigger voltage VD=12V; I

T=0.1A; Figure 7 0.9 2 V

VD=V

DRM; IT= 0.1 A; Tj=110C0.1 0.7 V

IDoff-st ate leakage current VD=V

DRM (max); Tj=110C3100A

Dynamic characteristics

dVD/dt critical rate of rise of

off-state voltage VD= 67% of VDM(max);

Tcase =110C; exponential

waveform; gate open circuit;

Figure 12

30 45 V/s

dVcom/dt critical rate of rise of

commutation voltage VD= rated VDRM;T

case =50C;

ITM =0.84A;

commutating dI/dt = 0.3 A/ms

5V/s

tgt gate controlled turn-on

time ITM = 1.0 A; VD=V

DRM(max);

IG=25mA; dI

G/dt = 5 A/s2s

Product data sheet Rev. 2 — 14 September 2011 6 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

= conduction angle tp20 ms

Fig 2. Maximum on-state dissip a tion a s a function of

RMS on-state current; typical values. Fig 3. Max imum permissible non-repetitive peak

on-state current as a function of puls e width

for sinusoidal currents; typical values.

n = number of cycles at f = 50 Hz

Fig 4. Maximum permissible non-repe titive peak

on-state current as a function of number of

cycles for sinusoidal currents; typical values.

Fig 5. Max imum permissible RMS current as a

function of lead temperature; typical values.

α = 180°

0.4

0.8

1.2

00.2 0.4 0.6 0.8

IT(RMS) (A)

Ptot

30°

60°

90°

120°

003aaa036

(W)

003aaa040

102

103

ITSM

(A)

tp (s)

10-5 10-1

10-2

10-4 10-3

ITSM

dlT/dt limit

T2- G+ quadrant

11010

2103

ITSM

(A)

003aaa038 003aaa037

Tlead (°C)

0 15010050

0.4

0.2

0.6

0.8

IT(RMS)

(A)

Product data sheet Rev. 2 — 14 September 2011 7 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

f = 50 Hz; Tlead 50 C

Fig 6. Maximum permissible repetitive RMS on-state

current as a function of surge duration for

sinusoidal currents; typical values.

Fig 7. Normalized gate trigger voltage as a function

of junction temperature; typical values.

Fig 8. Normalized gate trigger current as a function

of junction temperature; typical values. Fig 9. Normalized latching curren t as a func tio n of

junction temperature; typical values.

tsurge (S)

10-3 10110-2

003aaa041

IT(RMS)

(A)

Tj (°C)

-60 14090-10 40

003aaa039

0.8

0.4

1.2

1.6

VGT(25°C)

VGT

aVGT Tj

VGT 25 C





------------------------

Tj (°C)

-60 14090-10 40

003aaa030

(1)

(2)

(3)

(4)

(1)

(2)

(3)

(4)

IGT

IGT(25°C)

Tj (°C)

-60 14090-10 40

003aaa031

IL(25°C)

aIGT Tj

IGT 25 C





----------------------

aILTj

IL25C





------------------

Product data sheet Rev. 2 — 14 September 2011 8 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

Fig 10. Normalized holding current as a function of

junction temperature; typical values. Fig 11. On-state current as a function of on-state

voltage; typical and max imum values.

Fig 12. Critical rate of ris e of off-state voltage as a function of junction temperature; typical values.

Tj (°C)

-60 14090-10 40

003aaa032

1.0

0.5

1.5

2.0

IH(25°C)

0.4

0.8

1.2

1.6

00.8 1.6 2.4

003aaa033

(A)

VT (V)

Tj = 125 °C

Tj = 25 °C

Typ Max

aIHTj

IH25C





-------------------

003aaa034

Tj (°C)

0 12510050 7525

102

103

dVD/dt

(V/μs)

Product data sheet Rev. 2 — 14 September 2011 9 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

7. Package outline

Fig 13. SOT54 (TO-92).

UNIT A

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 5.2

5.0

0.48

0.40

0.45

0.38

4.8

4.4

1.7

1.4

4.2

3.6

14.5

12.7

2.54

1.27

(1)

max.

2.5

0.66

0.55

DIMENSIONS (mm are the original dimensions)

Note

1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.

SOT54 TO-92 SC-43A 04-06-28

04-11-16

A L

0 2.5 5 mm

scale

b1L1

Plastic single-ended leaded (through hole) package; 3 leads SOT54

e1e

Product data sheet Rev. 2 — 14 September 2011 10 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

8. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

MAC97A8_A6 v.2 20110914 Product data sheet - MAC97A8_A6 v.1

(9397 750 07917)

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Package outline drawings have been updated to the latest version.

•Section 3 “Ordering information” added.

MAC97A8_A6 v.1

(9397 750 07917) 20010329 Product specification - -

Product data sheet Rev. 2 — 14 September 2011 11 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

9. Legal information

9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product st atus of de vice(s) d escribed in th is docume nt may have changed since this docume nt was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

9.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full da ta sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

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Product data sheet.

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customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

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products are sold subject to the general terms and conditions of commercial

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 14 September 2011 12 of 13

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this speci fic NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

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own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

9.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

10. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors MAC97A8; MAC97A6

Logic level triac

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 September 2011

Document identifier: MAC97A8_A6

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

5.1 Transient thermal impedance . . . . . . . . . . . . . . 4

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

10 Contact information. . . . . . . . . . . . . . . . . . . . . 12

11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13