HARTING AdvancedMCTM Connectors for AdvancedTCA(R) People | Power | Partnership General information Advanced Telecommunications Computing Architecture (AdvancedTCA(R)) is an open industry standard developed by the PCI Industrial Computer Manufacturers Group (PICMG), a consortium of over 450 companies. PICMG's purpose is to define standard architectures in an effort to reduce system costs and development cycles. Defined by PICMG 3.0, the AdvancedTCA(R) series of specifications targets the requirements of the next generation of carrier grade telecommunications equipment. It incorporates an impressive suite of recent technological advancements including the latest trends in high speed interconnect technologies. To extend the functionality and modularity of AdvancedTCA(R) carrier boards, PICMG developed the Advanced Mezzanine Card (AdvancedMCTM) standard AMC.0. Up to eight AdvancedMCTM add-on modules can be hot-swapped in and out of a carrier board. The AdvancedMCTM standard covers a wide range of applications: AMC.1 PCI Express and advanced switching AMC.2 Gigabit Ethernet / 10 Gigabit XAUI Ethernet AMC.3 Storage AMC.4 Serial RapidIO To connect AdvancedMCTM modules to carrier boards PICMG defined a new high-speed mezzanine connector: the AdvancedMCTM connector - a card edge connector mounted on the carrier board. It contacts directly with the module's PCB gold pads. Although PICMG defined four AdvancedMCTM connector types (B, B+, AB and A+B+), current market developments focus on Type B+. The HARTING AdvancedMCTM B+ connector features a new press-fit compliant pin designed for 0.55 mm plated PCB holes. Press-fit termination technology provides significant cost and durability advantages over other termination technologies. The connector design allows for the use of a standard flat rock die. For more press-in process reliability, HARTING offers a special top and bottom tool. Additional mechanical robustness can be achieved by screwing down the connector to the PCB, for instance when used in non-AMC.0 compliant mechanical environments. Designed to minimize interferences from cross talk and reflections the HARTING AdvancedMCTM B+ connector provides superior transmission performance at high data transmission speeds. It can be implemented in today's applications such as PCI Express (2.5 Gbps) and 10 GE (3.125 Gbps per differential pair) as well as in next generations of applications at 5 Gbps, 6.25 Gbps and up to 12.5 Gbps per LVDS signal. The HARTING connector footprint is easy to route, keeping PCB layer counts and costs to a minimum. HARTING provides application specific design-in support for connector and system analysis: Test boards and test setups Simulation data and models (S-parameter, SPICE) Signal integrity data (S-parameter, TDR, cross talk, eye-diagram analysis). Customer specific boards and models 3D models (STEP, IGES) Cadence Allegro and Mentor Graphics Pads decals Carrier board Type B+ connector AdvancedMCTM module 2 Fig.1: ATCA(R) carrier board with AdvancedMCTM modules Fig.2: Test board for measurements with AdvancedMCTM B+ connectors Trademarks: PICMG, AdvancedMC and AdvancedTCA are trademarks of PICMG Inc. www.HARTING.com Technical characteristics Design according PICMG AMC.0 (RoHS compliance) Number of contacts 170 Contact spacing 0.75 mm Clearance and creepage distance between contacts 0.1 mm min. Temperature range Durability as per AMC.0 specification -55 C ... +105 C Termination technique Mating force Withdrawal force Press-in termination 100 N max. 65 N max. 200 mating cycles Materials Working current of power contacts as defined in AMC.0 spec. Test voltage Contact resistance ground contacts signal, power, general purpose contacts Insulation resistance Nominal differential impedance Near end crosstalk (pair-to-pair) @ 30 ps risetime 2.25 1.52 A @ 70 C max. 30 C temp. rise Moulded parts Contacts Contact surface 80 Vr.m.s. 60 m max. Packaging 90 m max. 10 M Liquid Crystal Polymer (LCP), UL 94-V0 Copper Alloy Selectively gold plated Card box (other packaging on request) 100 10 % basic-to-basic basic-to-extended extended-to-extended diagonal multiline < 0.6 % < 0.9 % < 1.2 % < 0.3 % < 4.0 % 0.75 Plated through hole recommendations 1.5 extended side 1.5 1.5 1.5 basic side A PCB thickness min. 1.4 mm B Plated hole-O 0.55 0.05 mm C Hole-O 0.64 0.01 mm D Cu min. 25 m E Plating - min. 0.8 m chem. Sn - 0.05 - 0.12 m Au over 3 - 7 m Ni - 0.1 - 0.3 m Ag F min. 0.15 mm ground Differential propagation delay Basic side: Extended side: Differential skew Between basic and extended side: Within basic and extended side: Pad width 140 ps 165 ps 25 ps 2 ps 3 www.HARTING.com AdvancedMCTM connector for AdvancedTCA(R) Card edge connectors, angled Identification No. of contacts Contact length [mm] termination side Part number 170 2.0 16 04 170 1101 170 2.0 16 04 170 1102 AdvancedMCTM connector for ATCA(R), type B+ with peg AdvancedMCTM connector for ATCA(R), type B+ without peg With peg Without peg With peg Without peg Board drillings housing contour row for ground Dimensions [mm] 4 04.2006 www.HARTING.com