HARTING
AdvancedMC
™
Connectors for AdvancedTCA®
People | Power | Partnership
2
Advanced Telecommunications
Computing Architecture
(AdvancedTCA®) is an
open industry standard
developed by the PCI
Industrial Computer
Manufacturers Group
(PICMG), a consortium
of over 450 companies.
PICMG's purpose is to define
standard architectures in an effort
to reduce system costs and development cycles.
Defined by PICMG 3.0, the AdvancedTCA® series
of specifications targets the requirements of the
next generation of carrier grade telecommunica-
tions equipment. It incorporates an impressive suite
of recent technological advancements including the
latest trends in high speed interconnect technologies.
To extend the functionality and modularity of
AdvancedTCA® carrier boards, PICMG developed the
Advanced Mezzanine Card (AdvancedMCTM) standard
AMC.0. Up to eight AdvancedMCTM add-on modules
can be hot-swapped in and out of a carrier board.
The AdvancedMCTM standard covers a wide range of
applications:
● AMC.1 PCI Express and advanced switching
● AMC.2 Gigabit Ethernet / 10 Gigabit XAUI Ethernet
● AMC.3 Storage
● AMC.4 Serial RapidIO
To connect AdvancedMCTM modules to carrier
boards PICMG defined a new high-speed mezzanine
connector: the AdvancedMCTM connector – a card
edge connector mounted on the carrier board. It
contacts directly with the module's PCB gold pads.
Although PICMG defined four AdvancedMCTM
connector types (B, B+, AB and A+B+), current
market developments focus on Type B+.
The HARTING AdvancedMCTM B+ connector
features a new press-fit compliant pin designed for
0.55 mm plated PCB holes. Press-fit termination
technology provides significant cost and durability
advantages over other termination technologies.
The connector design allows for the use of a standard
flat rock die. For more press-in process reliability,
HARTING offers a special top and bottom tool.
Additional mechanical robustness can be achieved by
screwing down the connector to the PCB, for instance
when used in non-AMC.0 compliant mechanical
environments.
Designed to minimize interferences from cross talk and
reflections the HARTING AdvancedMCTM B+ connector
provides superior transmission performance at high
data transmission speeds. It can be implemented
in today's applications such as PCI Express
(2.5 Gbps) and 10 GE (3.125 Gbps per differential pair)
as well as in next generations of applications at 5 Gbps,
6.25 Gbps and up to 12.5 Gbps per LVDS signal.
The HARTING connector footprint is easy to route,
keeping PCB layer counts and costs to a minimum.
HARTING provides application specific design-in
support for connector and system analysis:
● Test boards and test setups
● Simulation data and models (S-parameter, SPICE)
● Signal integrity data (S-parameter, TDR, cross talk,
eye-diagram analysis).
● Customer specific boards and models
● 3D models (STEP, IGES)
● Cadence Allegro and Mentor Graphics Pads decals
General information
Trademarks: PICMG, AdvancedMC and AdvancedTCA are trademarks of PICMG Inc.
Fig.1: ATCA® carrier board with AdvancedMC™ modules
Fig.2: Test board for measurements with
AdvancedMC™ B+ connectors
Type B+
connector
AdvancedMC™
module
Carrier
board
www.HARTING.com
3
Design according PICMG AMC.0
(RoHS compliance)
Materials
Moulded parts Liquid Crystal Polymer
(LCP), UL 94-V0
Contacts Copper Alloy
Contact surface Selectively gold plated
Technical characteristics
Number of contacts 170
Contact spacing 0.75 mm
Clearance and creepage
distance between
contacts 0.1 mm min.
Working current of 1.52 A @ 70 °C
power contacts max. 30 °C temp. rise
as defined
in AMC.0 spec.
Test voltage 80 Vr.m.s.
Contact resistance
ground contacts 60 mΩ max.
signal, power, general
purpose contacts 90 mΩ max.
Insulation resistance 10 MΩ
Nominal differential
impedance 100 Ω ± 10 %
Near end crosstalk
(pair-to-pair)
@ 30 ps risetime basic-to-basic < 0.6 %
basic-to-extended < 0.9 %
extended-to-extended
< 1.2 %
diagonal < 0.3 %
multiline < 4.0 %
Temperature range -55 °C … +105 °C
Durability as per
AMC.0 specification 200 mating cycles
Termination technique Press-in termination
Mating force 100 N max.
Withdrawal force 65 N max.
Packaging Card box (other packaging
on request)
Plated through hole recommendations
A PCB thickness min. 1.4 mm
B Plated hole-Ø 0.55 ± 0.05 mm
C Hole-Ø 0.64 ± 0.01 mm
D Cu min. 25 µm
E Plating - min. 0.8 µm chem. Sn
- 0.05 - 0.12 µm Au
over 3 - 7 µm Ni
- 0.1 - 0.3 µm Ag
F Pad width min. 0.15 mm
Differential propagation
delay Basic side: 140 ps
Extended side: 165 ps
Differential skew Between basic and
extended side: 25 ps
Within basic and
extended side: ± 2 ps
extended side
basic side
ground
2.25 0.75
1.5
1.5
1.5
1.5
www.HARTING.com
4
AdvancedMC
™
connector for AdvancedTCA®
Contact length [mm]
No. of termination
Identification contacts side Part number
170 2.0 16 04 170 1101
Card edge connectors, angled
AdvancedMC
™
connector for ATCA®, type B+
with peg
With peg With peg
Dimensions [mm]
Board drillings
170 2.0 16 04 170 1102
AdvancedMC
™
connector for ATCA®, type B+
without peg
Without peg Without peg
housing contour
row for ground
www.HARTING.com
04.2006
