THS4503EVM
June 2002 HPL
User’ s G uide
SLOU132
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third−party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
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Resale of T I products or services with statements different from or beyond the parameters stated by TI for that
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Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated
EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION
PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR S TATUTORY, INCLUDING ANY W ARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT T O THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the EVM User ’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 5 V and the output
voltage range of +5 V and –5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than
50°C. The EVM is designed to operate properly with certain components above 50°C as long
as the input and output ranges are maintained. These components include but are not limited
to linear regulators, switching transistors, pass transistors, and current sense resistors. These
types of devices can be identified using the EVM schematic located in the EVM User’s Guide.
When placing measurement probes near these devices during operation, please be aware
that these devices may be very warm to the touch.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated
Information About Cautions and Warnings
iii
Preface
About This Manual
This manual provides information about using the THS4503 fully differential
amplifier on evaluation module PCB marked with Edge # 6439396.
Additionally, this document provides a good example of PCB design for
high-speed applications. The user should keep in mind the following points.
-The design of the high-speed amplifier PCB is a sensitive process.
-The user must approach the PCB design with care and awareness.
-It is recommended that the user initially review the data sheet of the device
under test.
-It is helpful to review the schematic and layout of the THS4503EVM to
determine the design techniques used in the evaluation board.
-It is recommended that the user review the application note Fully
Differential Amplifiers (literature number SLOA054) to learn more about
differential amplifiers. This application note reviews fully differential amps
and presents calculations for various filters.
How to Use This Manual
This document contains the following chapters:
-Chapter 1—Introduction and Description
-Chapter 2—Using the THS4503EVM
-Chapter 3—THS4503EVM Applications
-Chapter 4—High-Speed Amplifier PCB Layout Tips
-Chapter 5—EVM Hardware Description
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
Related Documentation From Texas Instruments
iv
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It gen-
erates, uses, and can radiate radio frequency energy and has not been tested
for compliance with the limits of computing devices pursuant to subpart J of
part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other en-
vironments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may
be required to correct this interference.
Electrostatic Sensitive Components
This EVM contains components that can potentially be damaged by
electrostatic discharge. Always transport and store the EVM in its
supplied ESD bag when not in use. Handle using an antistatic
wristband. Operate on an antistatic work surface. For more
information on proper handling, refer to SSYA008.
Related Documentation From Texas Instruments
The URLs below are correct as of the date of publication of this manual. Texas
Instruments applications apologizes if they change over time.
-THS4503 data sheet (literature number SLOS350)
-Application report (literature number SLOA054), Fully Differential
Amplifiers
-Application report (literature number SLOA069), How (Not) to Decouple
High Speed Op Amp Circuits,
http://www−s.ti.com/sc/psheets/sloa069/sloa069.pdf
-Application report (literature number SLOA072), Single Supply Differen-
tial Op Amp Techniques,
http://www−s.ti.com/sc/psheets/sloa072/sloa072.pdf
Trademarks
v
-Application report (literature number SLMA002), Power Pad Thermally
Enhanced Package,
http://www−s.ti.com/sc/psheets/slma004/slma002.pdf
-Application report (literature number SLMA004), Power Pad Made Easy,
http://www−s.ti.com/sc/psheets/slma004/slma004.pdf
-Application report (literature number SSYA008), Electrostatic Discharge
(ESD), http://www−s.ti.com/sc/psheets/ssya008/ssya008.pdf
Trademarks
PowerPAD is a trademark of Texas Instruments.
vi
Contents
vii
1 Introduction and Description 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Evaluation Module Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 THS4503EVM Operating Conditions 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 EVM Default Configuration 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Using the THS4503EVM 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Required Equipment 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Power Supply Connection 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Function Generator Setup 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Signal Connection VIN− 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 THS4503EVM Applications 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Single-Ended In/Single-Ended Out, Utilizing Transformer 3-2. . . . . . . . . . . . . . . . . . . . . . . .
3.2 Single-Ended to Fully Differential Application 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4 High-Speed Amplifier PCB Layout Tips 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5 EVM Hardware Description 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
viii
1−1. Schematic of the Populated Circuit on the EVM (Default Configuration) 1-3. . . . . . . . . . . . . .
2−1. Power Supply Connection for ±5 Vdc 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2−2. Signal Connections 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−1. Single-Ended In/Single-Ended Out, Utilizing Transformer 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . .
3−2. Sinlge Supply Operation 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−3. Output of an AC-Coupled, Single-Supply Application 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1. Top Layer 1 (Signals for THS4503EVM) 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−2. Bottom Layer 2 (Ground and Signal) 5-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−3. Schematic Diagram 5-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1 THS4503EVM Bill of Materials 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
Introduction and Description
The Texas Instruments THS4503 evaluation module (EVM) helps designers
evaluate the performance of the THS4503 fully differential operational
amplifier (FDA). Also, this EVM is a good example of high-speed PCB design.
This document details the THS4503EVM. It includes a list of EVM features, a
brief description of the module illustrated with a series of schematic diagrams,
EVM specifications, details on connecting and using the EVM, and a
discussion of high-speed amplifier design considerations.
This EVM enables the user to implement various circuits to clarify the available
configurations presented by the schematic of the EVM. The user is not limited
to the circuit configurations presented here. The EVM provides enough
hardware hooks that the only limitation should be the creativity of the user.
Topic Page
1.1 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Evaluation Module Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 THS4503EVM Operating Conditions 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 EVM Default Configuration 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1
Description
1-2
1.1 Description
The THS4503EVM provides a platform for developing high-speed FDA
application circuits. It contains the THS4503 high-speed FDA, a number of
passive components, and various features and footprints that enable the user
to experiment, test, and verify various operational amplifier circuit
implementations. The PC board measures 3.08 by 2.42 inches.
1.2 Evaluation Module Features
THS4503 high-speed operational amplifier EVM features include:
-Wide operating supply voltage range: single supply 5 Vdc to dual supply
±5 Vdc operation (see the device data sheet). Single supply operation is
obtained by placing a jumper from GND (J7) to –VS (J5).
-Single-ended and fully differential input capability
-Single-ended and fully differential output capability
-Nominal 50-Ω input termination (R1||R2). Termination can be configured
according to the application requirement.
-VOCM direct input through TP1
-Output transformer T1
-Footprints for antialiasing filter implementation using locations R6, R7, C5,
and C6
-Footprints for low pass filter implementation using locations C3, C4
-800-Ω load provided through R8, R10, R9, and R11 reflected through T1
-Three convenient GND test points on the PCB
-Power supply ripple rejection capacitors (C8 and C11)
-Decoupling capacitors (C9, C12) populated with 0.1 µF capacitors—
design final decoupling in accordance with SLOA069.
-PowerPAD heatsinking capability
-A good example of high-speed amplifier PCB design and layout
1.3 THS4503EVM Operating Conditions
-Supply voltage range, ±VS5 V to ±5 V (see the device data sheet)
-Supply current, IS (see the device data sheet)
For complete THS4503 amplifier IC specifications, parameter measurement
information, and additional application information, see the THS4503 data
sheet, TI literature number SLOS350.
EVM Default Configuration
1-3
Introduction and Description
1.4 EVM Default Configuration
As delivered, the EVM has a fully functional example circuit, just add power
supplies, a signal source, and monitoring instrument. See Figure 1−1 for the
default schematic diagram. The user can change the gain by changing the
ratios of the feedback and gain resistors (see the device data sheet for
recommended resistor values). Chapter 5 has a complete EVM schematic
diagram showing all component locations.
The default configuration assumes a 50-Ω signal source and contains a
termination resistor R1 for the source.
Some components such as C8, C9, C11, C12, TP1, TP2, R10, T1, and J4 are
omitted on the application schematics of Chapter 3 for clarity.
Figure 1−1.Schematic of the Populated Circuit on the EVM (Default Configuration)
J6
Vin+
+VS
+VS
R8
340Ω
J2
Vout+
R10
280Ω
R7 0
R4
392Ω
TP4
C2 0
+C8
6.8µF
−VS
C12
0.1µF
−
Vocm
+
U1
THS4503
1
8
2
3
6
5
4
R5
392Ω
R3
402Ω
R2
374Ω
J1
Vin−
J8
+VS
R9
340Ω
J5
−VS
TP2
PD−
R1
56.2Ω
TP1
Vocm J7
GND
C9
0.1µF
R17
0
J4
Vout
C1 0
TP5TP3
J3
Vout−
+
C11
6.8µF
R6 0 T1
ADP4−1WT
6 1
5
4 3
−VS
C13
1µF
1-4
2-1
Using the THS4503EVM
!"
This section describes how to connect the THS4503EVM to test equipment.
It is recommended that the user connect the EVM as described in this section
to avoid damage to the EVM or the THS4503 installed on the board.
Topic Page
2.1 Required Equipment 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Power Supply Connection 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Function Generator Setup 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Signal Connection VIN− 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2
Required Equipment
2-2
2.1 Required Equipment
-One dual-output dc power supply (±5 V, 1 A output minimum)
-Two dc current meters with resolution to 1 mA and capable of the
maximum current the dc power supply can supply.
-50-Ω source impedance function generator (1 MHz, 10 VPP sine wave)
-Oscilloscope (50-MHz bandwidth minimum, 50-Ω input impedance)
-3 BNC-to-SMA cables
-BNC-to-BNC cable
-5 Banana-to-Banana wires; 4 red, 1 black
2.2 Power Supply Connection (Refer to Figure 2−1)
1) Set the dual dc power supply to ±5 V. If available, set the current limit on
the dc power supply to 100 mA.
2) Make sure the dual dc power supply is turned of f before proceeding to t h e
next step.
3) Connect the positive (+) terminal of the power supply to the positive (+)
terminal of the current meter number 1.
4) Connect the negative (–) terminal of the current meter number 1 to +VS
(J8).
5) Connect the common ground terminal of the power supply to GND (J7).
6) Connect the negative (–) terminal of the power supply to the negative (–)
terminal of the second current meter.
7) Connect the positive (+) terminal of the current meter number 2 to –VS
(J5).
Figure 2−1.Power Supply Connection for ±5 Vdc
Function Generator Setup
2-3
Using the THS4503EVM
2.3 Function Generator Setup
Note:
The oscilloscope inputs 1 and 2 must be set to 50-Ω input impedance for
proper results.
1) Connect the function generator to oscilloscope channel 1.
2) Set vertical channels 1 and 2 of the oscilloscope to 0.2 V/division and the
time-base to 0.1 µs/division.
3) Set the function generator to generate a 1-MHz, ±0.5 V (1 VPP) sine wave
with no dc offset.
4) Verify that the output is 1 MHz, ±0.5 V (1 VPP).
5) Disable the function generator output before proceeding to the next step.
6) Disconnect the cable from the oscilloscope, retaining the setting of the
function generator.
2.4 Signal Connection VIN− (Refer to Figure 2−2)
1) Using a BNC-to-SMA cable, connect the function generator to J1 (VIN−).
2) Using a BNC-to-SMA cable, connect the oscilloscope channel 1 to J2
(VOUT+).
3) Using a BNC-to-SMA cable, connect the oscilloscope channel 2 to J3
(VOUT−).
Figure 2−2.Signal Connections
2-4
3-1
THS4503EVM Applications
!" #
Example applications are presented in this chapter. These applications dem-
onstrate the most popular circuits, but many other circuits can be constructed.
The user is encouraged to experiment with different circuits, exploring new and
creative design techniques. After all, that is the function of an evaluation board.
Topic Page
3.1 Single-Ended In/Single-Ended Out, Utilizing Transformer 3-2. . . . . . . . .
3.2 Single-Ended to Fully Differential Application 3-2. . . . . . . . . . . . . . . . . . .
Chapter 3
Single-Ended In/Single-Ended Out, Utilizing Transformer
3-2
3.1 Single-Ended In/Single-Ended Out, Utilizing Transformer
The fully differential amp output can be monitored by a single-ended
instrument at J4. The THS4503EVM utilizes Mini-Circuits CD542 footprint
transformers to make the fully differential to single-ended conversion. An
ADP4−1WT transformer is installed on the board.
R8, R9, and R10 are chosen such that the load on the fully differential amp is
800 Ω when combined with the load impedance transformed by the turn ratio
T1. This load is chosen because it is a common input impedance value for
ADCs, and is the impedance at which many fully differential amp parameters
are measured. The 800-Ω load occurs when one of two conditions is met:
-R11 is installed and the measuring instrument is set to 1-MΩ input
impedance
or
-R11 is not installed and the measuring instrument has an input impedance
of 50 Ω.
Figure 3−1.Single-Ended In/Single-Ended Out, Utilizing Transformer
R7 0
R2
374Ω
R5
392Ω
+VS
R9
340Ω
R6 0
J1
Vin−
R3
402Ω
R1
56.2Ω
R4
392Ω
R17
0
R10
280Ω
J4
Vout
R11
49.9Ω
R8
340Ω
−VS
−
Vocm
+
U1
THS4503
1
8
2
3
6
5
4
TP1
Vocm
C1 0 T1
ADP4−1WT
6 1
5
4 3
C2 0
C13
1µF
3.2 Single-Ended to Fully Differential Application
The schematic of Figure 3−2 shows the proper technique for ac-coupling. The
voltage present on the VOCM pin determines the dc operating point of the
circuit. When no voltage is connected to TP1, the VOCM voltage level is
determined by a voltage divider internal to the op amp, and is approximately
equal to half of +VS. This dc voltage is present on both outputs, and also
present on both inputs—being connected through R2 and R3.
Single-Ended to Fully Differential Application
3-3
THS4503EVM Applications
Figure 3−2.Single Supply Operation
TP1
Vocm
R1
56.2 W
J3
Vout−
R5
392 W
J2
Vout+
J1
Vin−
C2 R3
402 W
R4
392 W
+VS
−
Vocm
+
U1
THS4503
1
8
2
3
6
5
4
C1
R17
0
R7 0
R6 0
C13
1mF
R2
374 W
Note:
For this and some of the following circuits, it is necessary to install capacitors
into locations designated as resistors, and vice versa. Because the
capacitors and resistors come in the same case size, this should be easily
accomplished.
The designer should note that the ground connection of the schematic at C2
through R17 is a second input—to avoid confusion about whether a coupling
capacitor is actually needed. In fact, there is no difference between
single-ended and fully differential inputs to the board, except that the
single-ended circuits utilize ground as signal return, while fully differential
inputs utilize the other input as signal return. Any fully differential input to the
board can be converted to a single-ended input merely by connecting one of
the inputs to ground.
This circuit allows the input voltage to swing below the negative power supply
rail of the op-amp, as shown in Figure 3−3.
Single-Ended to Fully Differential Application
3-4
Figure 3−3.Output of an AC-Coupled, Single-Supply Application
3
2
1
0
−1 0 500 n 1 Ω
t − Time − s
Volts
The designer should realize that the coupling capacitors, acting with the
gain resistors, produce a high pass characteristic into the circuit.
This application circuit has interaction between Rsource, Rtermination, and Rg.
Texas Instruments has provided an engineer design utility to facilitate the
design of these circuits. Engineer design utilities are available on the Am-
plifiers and Comparators section of the Analog and Mixed Signal portion of
the TI web page.
Designers should be aware that each individual feedback path is an invert-
ing path. There is no noninverting gain circuit for fully differential amps.
The designer should also be aware that the gain is affected by the open
loop characteristic of the FDA, the same as single−ended op amps. If there
is sufficient safety margin between the closed loop response and open loop
response of the FDA (40 dB or more), the error contribution from the open
loop response of the FDA is negligible and can be ignored.
4-1
High-Speed Amplifier PCB Layout Tips
$ #%& '( )*
The THS4503EVM layout has been designed for use with high-speed signals
and can be used as an example when designing PCBs incorporating the
THS4503. Careful attention has been given to component selection,
grounding, power supply bypassing, and signal path layout. Disregarding
these basic design considerations could result in less than optimum
performance of the THS4503 high-speed operational amplifier. Surface-
mount components were selected because of the extremely low lead
inductance associated with this technology. This helps minimize both stray
inductance and capacitance. Also, because surface-mount components are
physically small, the layout can be very compact.
Tantalum power supply bypass capacitors at the power input pads help filter
switching transients from the laboratory power supply. Power supply bypass
capacitors are placed as close as possible to the IC power input pins in order
to minimize the return path impedance. This improves high frequency
bypassing and reduces harmonic distortion. The GND side of these capacitors
should be located close to each other, minimizing the differential current loops
associated with differential output currents. If poor high frequency
performance is observed, replace the 0.1-µF capacitors with microwave
capacitors with a self-resonance at the frequency that produces trouble. A
proper ground plane on both sides of the PCB should be used with high-speed
circuit design. This provides low-inductive ground connections for return
current paths.
In the area of the amplifier input pins, however, the ground plane has been
removed to minimize stray capacitance and reduce ground plane noise
coupling into these pins. This is especially important for the inverting input pin.
As low as 1 pF capacitance at the inverting input can significantly affect the
response of the amplifier or even oscillation.
In general, it is best to keep signal lines as short and as straight as possible.
Incorporation of microstrip or stripline techniques is also recommended when
signal lines are greater than 1 inch in length. These traces must be designed
with a characteristic impedance of either 50 Ω or 75 Ω, as required by the
application. Such a signal line must also be properly terminated with an
appropriate resistor.
Chapter 4
4-2
Circuit pathways should be made as symmetrical as possible for both
feedback pathways to minimize second and other even-harmonic content.
The printed-circuit board used with PowerPAD packages must have features
included in the design to remove the heat from the package efficiently. As a
minimum, there must be an area of solder-tinned-copper underneath the
PowerPAD package. This area is called the thermal land. The thermal land
varies in size depending on the PowerPAD package being used, the PCB
construction and the amount of heat that needs to be removed. In addition, this
thermal land may or may not contain thermal vias depending on PCB
construction. The requirements for thermal lands and thermal vias are detailed
in http://www−s.ti.com/sc/techlit/slma002 and
http://www−s.ti.com/sc/techlit/slma004.
Finally, all inputs and outputs must be properly terminated, either i n the layout
or in the load instrumentation. Unterminated lines, such as coaxial cable, can
appear to b e a reactive load to the amplifier. By terminating a transmission line
with its characteristic impedance, the amplifier’s load then appears to be
purely resistive, and reflections are absorbed at each end of the line. Another
advantage of using an output termination resistor is that capacitive loads are
isolated from the amplifier output. This isolation helps minimize the reduction
in the amplifier ’s phase-margin and improves the amplifier stability resulting
in reduced peaking and settling times.
5-1
EVM Hardware Description
!" +
This chapter describes the EVM hardware. It includes the EVM parts list, and
printed circuit board layout.
Table 5−1.THS4503EVM Bill of Materials
Item Description SMD
Size Reference
Designator PCB
Qty. Manufacturer’s
Part Number Distributor’s
Part Number
1CAP, 6.8 µF, tanatalum,
35 V, 10% DC8, C11 2 (AVX)
TAJD685K035R (Garrett)
TAJD685K035R
2CAP, 0.1 µF, ceramic,
X7R, 16 V 0508 C9, C12 2 (AVX)
0508YC104KAT2A (Garrett)
0508YC104KAT2A
3 Open 0805 C3, C4, C5, C6,
C7, C10 6
4 Open 1206 C13, C14 2
5 Open 0805 R11, R12, R13,
R14, R15, R16 6
6Resistor, 0 Ω, 1/8 W 0805 C1, C2, R6, R7 4 (Phycomp)
9C08052A0R00JLHFT (Garrett)
9C08052A0R00JLHFT
7Resistor, 280 Ω, 1/8 W,
1% 0805 R10 1 (Phycomp)
9C08052A2800FKHFT (Garrett)
9C08052A2800FKHFT
8Resistor, 340 Ω, 1/8 W,
1% 0805 R8, R9 2 (Phycomp)
9C08052A3400FKHFT (Garrett)
9C08052A3400FKHFT
9Resistor, 374 Ω, 1/8 W,
1% 0805 R2 1 (Phycomp)
9C08052A3740FKHFT (Garrett)
9C08052A3740FKHFT
10 Resistor, 392 Ω, 1/8 W,
1% 0805 R4, R5 2 (Phycomp)
9C08052A3920FKHFT (Garrett)
9C08052A3920FKHFT
11 Resistor, 402 Ω, 1/8 W,
1% 0805 R3 1 (Phycomp)
9C08052A4020FKHFT (Garrett)
9C08052A4020FKHFT
12 Resistor, 0 Ω, 1/4 W 1206 R17 1 (Phycomp)
9C12063A0R00JLHFT (Garrett)
9C12063A0R00JLHFT
13 Resistor, 56.2 Ω, 1/4 W,
1% 1206 R1 1 (Phycomp)
9C12063A56R2FKRFT (Garrett)
9C12063A56R2FKRFT
14 Transformer, 4:1 CD542 T1 1 (Mini-Circuits)
ADT4−1WT (Mini-Circuits)
ADT4−1WT
15 Test points (black) TP3, TP4, TP5 3 (Keystone)
5001 (Allied)
839−3601
16 Test points (red) TP1, TP2 2 (Keystone)
5000 (Allied)
839−3600
Chapter 5
5-2
Item Distributor’s
Part Number
Manufacturer’s
Part Number
PCB
Qty.
Reference
Designator
SMD
Size
Description
17 Jack, banana receptacle,
0.25” diameter hole J5, J7, J8 3(HH Smith)
101 (Newark)
35F865
18 Connector, SMA PCB
Jack J1, J2, J3, J4,
J6 5 (Amphenol)
901−144−8RFX (Newark)
01F2208
19 Standoff, 4−40 Hex,
0.625” Length 4 (Keystone)
1804 (Allied)
839−2089
20 Screw, Phillips, 4−40,
.250” 4 SHR−0440−016−SN
21 IC, THS4503 U1 1 (TI) THS4503DGN
22 Board, printed circuit 1 (TI) EDGE # 6439396
Figure 5−1.Top Layer 1 (Signals for THS4503EVM)
5-3
EVM Hardware Description
Figure 5−2.Bottom Layer 2 (Ground and Signal)
5-4
Figure 5−3.Schematic Diagram
C2 0
VCC+
C4*
R17
0
R8
340Ω
R5
392Ω
R13
*
C10
*
R3
402Ω
−
Vocm
+
U1
THS4503
1
8
2
3
6
5
4
J8
+VS
T1
ADP4−1WT
6 1
5
4 3
R2
374Ω
TP1
Vocm
+VS
−VS
J6
Vin+
R12
*
J1
Vin−
C12
0.1µ
F
TP4
C5
*
TP5
R11
*
R16
*
R4
392Ω
J4
Vout
−VS
C3*
R14
*
R15
*
C7
*
+C8
6.8µ
F
C1 0
J2
Vout+
+VS
J3
Vout−
R7 0
C6
*
TP2
PD−
J5
−VS
VCC+
R1
56.2Ω
J7
GND
C13
1µ
F
R9
340Ω
R10
280Ω
TP3
C9
0.1µ
F+C11
6.8µ
F
C14
*
R6 0
Note: Devices designated with an * are not installed on the EVM. The user must supply these components.
