BACK 1/7-type Color CMOS Image Sensor with 110 k Pixels LZ37C1B DESCRIPTION PIN CONNECTIONS The LZ37C1B is a 1/7-type (2.55 mm) solid-state color image sensor that consists of PN photodiodes and CMOS (Complementary Metal Oxide Semiconductor) devices. The sensor further includes a timing generator (TG), a correlated double sampling (CDS) circuit, an auto gain control (AGC) circuit and an analog-to-digital converter (ADC) circuit. With approximately 110 000 pixels (393 horizontal x 299 vertical), the sensor provides a stable digital color image with extremely low power consumption. 3 AGCOUT 4 ADH 5 CKI NC AVDD AGND SIGIN SIGOUT BIAS2 OFS CLP SCLK 35 34 33 32 31 30 29 28 Y ADL 36 27 NC 26 SDI 25 VD 24 HD 23 DGND 6 22 CLK CKO 7 21 D7 STBY 8 20 DVDD NC 9 19 D6 R 2 10 11 12 13 14 15 16 17 18 DVDD D0 D1 D2 D3 D4 D5 NC IN IM DGND A 1 (N-LCC036-S425A) PRECAUTIONS * * P * * * R E * NC BIAS1 * Refer to "PRECAUTIONS FOR CMOS IMAGE SENSORS". L * * * Progressive scan Square pixel Compatible with CIF standard Number of image pixels : 367 (H) x 291 (V) Number of optical black pixels - Horizontal : 13 front and 13 rear - Vertical : 4 front and 4 rear Pixel pitch : 5.6 m (H) x 5.6 m (V) R, G, and B primary color mosaic filters Image inversion function (horizontally and/or vertically) Available for two types of power save mode - AGC and AD circuits become power-off with serial data. - All circuits become power-off with STBY pin Analog output and 8-bit digital output Variable gain control (3 to 30 dB) Variable electronic focal plane shutter (1/30 to 1/10 000 s) Single +2.8 V power supply Package : 36-pin LCC* (N-LCC036-S425A) TOP VIEW 36-PIN LCC FEATURES * * * * * LZ37C1B * Leadless Chip Carrier In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 LZ37C1B BLOCK DIAGRAM HD, VD CLK AGC CONTROL TG 8-BIT D/A CMOS IMAGE SENSOR IN IM AGC OUT P R E L ANALOG VIDEO OUT AGC A R 8-BIT A/D Y DATA 2 DIGITAL VIDEO OUT LZ37C1B PIN DESCRIPTION PIN NO. SYMBOL 1 NC I/O - A/D - DESCRIPTION No connection 2 3 BIAS1 ADL - - Analog Analog Analog bias voltage 1 for image sensor 4 5 AGCOUT ADH O - Analog Analog AGC output Top ADC reference voltage 6 7 CKI CKO I O Digital Digital Clock input for oscillator (9.0 MHz) Clock output for oscillator 8 STBY I Digital 9 10 NC DVDD - - - Digital Standby control mode* No connection Digital power supply 11 12 DGND D0 - O Digital Digital Digital ground ADC signal output (LSB) Digital ADC signal output 15 D3 O O Digital Digital ADC signal output ADC signal output 16 17 D4 D5 O O Digital Digital ADC signal output ADC signal output NC - - D6 DVDD O - Digital Digital ADC signal output Digital power supply 21 22 D7 CLK O O Digital Digital ADC signal output (MSB) Clock output (9.0 MHz) 23 DGND - Digital Digital ground 24 25 HD VD I I Digital Digital Horizontal drive pulse input Vertical drive pulse input 26 SDI I Digital Control data input (AGC gain, offset, shutter control, image inversion, etc.) 27 28 NC SCLK - I - Digital No connection Shift clock for SDI 29 CLP - Analog Analog bias voltage for clamp circuit 30 31 OFS BIAS2 - - Analog Analog Offset bias voltage for AGC output Analog bias voltage 2 for image sensor 32 33 SIGOUT SIGIN O I Analog Analog Analog image signal output Analog image signal input 34 AGND - Analog Analog ground 35 AVDD NC - - Analog - Analog power supply L E R P IM 18 19 20 36 No connection R O D2 A D1 14 IN 13 Y Bottom ADC reference voltage No connection * Standby mode functions High level : Standby mode (all circuits power-off), Low level or open : Normal mode (all circuits active) 3 LZ37C1B ABSOLUTE MAXIMUM RATINGS PARAMETER Power supply voltage Input signal voltage Storage temperature (TA = +25 C) SYMBOL VDD RATING -0.3 to +4.6 UNIT V VO TSTG -0.3 to VDD + 0.3 -40 to +80 V C RECOMMENDED OPERATING CONDITIONS MIN. 2.6 TYP. 2.8 MAX. 3.0 Operating temperature TOPR -20 +25 +50 C Oscillation frequency Digital input voltage UNIT V LOW level fCK VOL 9.0 0 0.2VDD MHz V HIGH level VOH 0.8VDD VDD V (Connect to pin Analog input voltage 1 2 A through a capacitor) NOTE (Connect to GND through a capacitor) Analog bias voltage IN NOTES : P R E L IM 1. Applied to input pins STBY, HD, VD, SDI and SCLK. 2. Applied to input pin SIGIN. Do not connect to DC directly. 3. Applied to pins BIAS1, BIAS2, OFS, ADL, ADH, CLP. Do not connect to GND directly. 4 Y SYMBOL VDD R PARAMETER Power supply voltage 3 LZ37C1B CHARACTERISTICS (1/30 s progressive scan readout mode) (TA = +25C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1mmt) is used.) * Measurement point : Analog image signal output (pin No.32), before AGC circuit and AD converter. MIN. TYP. 150 Saturation output voltage Dark output voltage VSAT VDARK 400 700 2 Dark signal non-uniformity DSNU 3 Sensitivity (Green channel) Supply current R (G) IVDD Standby current Vertical line fixed pattern noise ISTBY VFPN 160 1 6 mV mV 3 4 10 mV 5 mV mA 6 7 A 10 1.1 5 A 8 mVp-p 9 5. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 6. The average output voltage of G signal when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, F50 mm. 7. Total current of analog and digital power supplies, in the dark and at the standard load conditions. (Pin No.6 [oscillator] is external input. Pin No.7 is open.) 8. Total current of power supply in standby mode. (Pin No.8 (STBY) is fixed to "H" level and other input pins are fixed to "H" level or "L" level.) 9. One mean horizontal line signal <bi> is obtained by adding all the horizontal line signals <aij> vertically and dividing them by the line number. <xi> is the deviation of the center pixel from the average of successive 5 pixels in <bi>. VFPN is the maximum absolute value of <xi>. IN P R E L IM 1. The average output voltage of G signal under uniform illumination. The standard exposure conditions are defined as when VO is 150 mV. 2. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/VO, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 3. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 4. The difference between average output voltage of the image area and that of the OB area, under nonexposure conditions. NOTE 1 2 260 11 0.5 NOTES : 14 UNIT mV % MAX. Y SYMBOL VO PRNU R PARAMETER Standard output voltage Photo response non-uniformity LZ37C1B PIXEL STRUCTURE OPTICAL BLACK (4 PIXELS) OPTICAL BLACK (13 PIXELS) OPTICAL BLACK (13 PIXELS) 1 pin R Y 367 (H) x 291 (V) COLOR FILTER ARRAY (1, 291) R G R G B R G G B R R G R G R G B G G B G B G R G R R G R G R G B G G B G B G G R G R R G R G R B G B G G B G B G P R E G (367, 291) L R IM G IN A OPTICAL BLACK (4 PIXELS) G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R G B G B G G B G B G R G R G R R G R G R (1, 1) (367, 1) 6 LZ37C1B TIMING CHART HORIZONTAL PULSE TIMING HD 906 910 01 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 889092 CLK ADOUT (D0-D7) Normal 361 363 365 367 OB OB Mirror 7 5 3 1 OB OB Y HD 104 108 112 116 120 124 128 132 136 140 144 148 152 156 160 164 168 172 176 180 184 188 192 196 200 CLK Normal R ADOUT (D0-D7) OB OB 2 Mirror 4 6 8 10 OB OB 366 364 362 360 358 A * The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1). * The falling edge of the HD pulse must be between two rising edges of CLK (90) and CLK (91). IN PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK) CLK t MIN. t 0 TYP. MAX. UNIT 15 40 IM ADOUT (D0-D7) SYMBOL SDI, SCLK Forbidden Period VERTICAL PULSE TIMING VD ns Normal 288 289 290 291 OB OB OB OB OB OB E ADOUT (D0-D7) L 328 329 330 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 HD Mirror 4 3 2 1 OB OB OB OB OB OB P R * The rising edge and falling edge of the VD pulse must be in high period of the HD pulses. D0 SERIAL DATA TIMING (SDI, SCLK) Offset AGC D10 Shutter D20 D30 D38 SDI SCLK * Data in SDI are taken at the rising edge of SCLK. * Clock frequency of SCLK should be less than 1/2 of that of CLK. * Do not insert the SDI and SCLK pulses between 36H* and 37H*. Refer to "VERTICAL PULSE TIMING". * Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D38. * It means ordinal number of the HD pulse. 7 LZ37C1B SERIAL DATA INPUTS DATA D0 NAME FUNCTION Not used. D1 D2 AGC6 (MSB) D3 D4 AGC5 AGC4 D5 D6 AGC3 AGC2 D7 AGC1 D8 D9 AGC0 (LSB) (Fix to low level.) Auto gain control Y (0 to 20 dB) R Not used. D10 D11 (Fix to low level.) OFS7 (MSB) OFS6 D15 D16 OFS5 OFS4 D17 OFS3 D18 D19 OFS2 OFS1 D20 D21 OFS0 (LSB) D22 SHT8 (MSB) D23 D24 SHT7 SHT6 D25 D26 SHT5 SHT4 D27 D28 SHT3 SHT2 D29 SHT1 IM Not used. (Fix to low level.) Shutter speed control R E L (Exposure time is 1 to 1/330 frame period.) SHT0 (LSB) MIRH H : Horizontal mirror inversion image, L : Normal image D32 D33 MIRV SAD1 (MSB) H : Vertical mirror inversion image, L : Normal image Phase selection of AD clock P D30 D31 Offset level control of ADC (0.9 to 1.5 V) IN D13 D14 A D12 D34 SAD0 (LSB) (Fix to low level.) D35 D36 MAX2 (MSB) MAX1 Selection of fixed gain (3 to 10 dB) D37 D38 MAX0 (LSB) LPMD H : Power save mode (AGC and AD off), L : Normal mode 8 LZ37C1B Setting of Auto Gain Control * One LSB of the gain code represents approximately 0.156 dB. * Nominal gain values at typical codes are shown below. AUTO GAIN CONTROL D3 D4 D5 D6 D7 D8 L L L L L L L L L H L H L L 2 3 L L L L L H H L H L L H H H 4 L L H H L L H 5 6 L L H H L L L L L H L H L L 7 8 L L H H L H H L H L H L H L A R Y D2 (dB) 0 1 H L L H H H H L L L L 12 13 H H L L L H 14 H L H H L L H 15 16 H H L H H L H L H H H H H L IM 17 18 19 H L H L H L L H L H L L H L H H H H H L H H L H L L H L H H H H H L L H H H H H H H H L 20 L L L IN 9 10 11 Setting of Offset Level E * One LSB of the offset code represents approximately 0.002 V. * Nominal offset values at typical codes are shown below. D13 L D14 L D15 L D16 L D17 L D18 L D19 L D20 L 1.0 1.1 L L L H H L L H H L L H H L H H 1.2 1.3 H H L L L H L L L H L L L H L L 1.4 H H L H L H L H 1.5 H H H H H H H H P R OFFSET LEVEL (V) 0.9 9 LZ37C1B Setting of Shutter Speed * One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period. * Shutter speed values at typical codes are shown below. SHUTTER SPEED D23 D24 D25 D26 D27 D28 D29 D30 L L L L L L L L L L L L L L L L L H 328 * L L L L L L L H L 300 L L L L H H H H L L H L L L L H H H H L 3 2 H H L L 1 H L L H L A 200 * L H H L * * 10 Setting of Fixed Gain H L L L L L L H H L L L L L H H L H L H L L L H L L H IM * L H L * One LSB of the gain code represents 1 dB. FIXED GAIN (dB) 3 D35 D36 L D37 L L H H L 6 L H H 7 8 H H L L L H 9 10 H H H H L H P R E L L L 4 5 L IN 100 * R * * Y D22 (Exposure Time Unit : H) 330 329 10 P R 30 31 32 33 34 35 36 BIAS2 SIGOUT SIGIN AGND AVDD NC + 10 F 11 7 CKO 6 CKI 5 ADH 4 AGCOUT ADL NC Oscillator (9 MHz) 9 8 STBY 3 IN (TOP VIEW) NC 10 F + 2 BIAS1 1 D5 D4 D3 D2 D1 D0 DGND DVDD 17 16 15 14 13 12 11 10 R NC 18 A 19 20 LZ37C1B 24 VD 29 23 HD CLP 21 22 DGND OFS D7 CLK 25 DVDD IM 26 NC L 28 SDI 27 (9 MHz) D6 SCLK E * Insert capacitors more than 10 F between AVDD and AGND and between DVDD and DGND. * Capacitors whose values are not shown must be 0.1 F. Y Analog Power Supply Digital Power Supply LZ37C1B EXAMPLE OF OPERATION CIRCUIT LZ37C1B PACKAGE OUTLINES 36 LCC (N-LCC036-S425A) (Unit : mm) Center of effective imaging area 9.80.1(2) 18 28 19 27 18 28 A' Index mark 0.50.35 36 10 10 1 1.20.12 Center Center of of die. die 9 0.50.35 5.40.075 1.90.2 1.050.1 ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; 0.04 (1) A 0.850.025 Package 36 9 P-1.0TYP. Rotation error of die : 1.5MAX. (1 : Effective imaging area) (2 : Lid' size) Glass Lid ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; R0.4TYP. A' 0.04 (1) CMOS 12 1.27TYP. 0.880.05 0.4TYP. A 6.280.075 R0.15TYP. 0.7TYP. 19 Refractiva index : nd = 1.5 Refractive 0.70.1 (2) 10.80.1 27 1 0.6TYP. 0.1TYP. LZ37C1B 2) When directly handling the device with the fingers, hold the part without pins and do not touch any pin. 3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dustcleaning tape. 4) When storing or transporting the device, put it in a container of conductive material. PRECAUTIONS FOR CMOS IMAGE SENSORS 1. Package Breakage In order to prevent the package from being broken, observe the following instructions : 1) The CMOS image sensor is a precise optical component and the package material is ceramic. Therefore, o Take care not to drop the device when mounting, handling, or transporting. o Avoid giving a shock to the package. Especially when pins are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isn't fixed. 2) When mounting the package on the housing, be sure that the package is not bent. - If a bent package is forced into place between a hard plate or the like, the package may be broken. 3) If any damage or breakage occurs on the surface of the glass cap, its characteristics could deteriorate. Therefore, o Do not hit the glass cap. o Do not give a shock large enough to cause distortion. o Do not scrub or scratch the glass surface. - Even a soft cloth or applicator, if dry, could cause flaws to scratch the glass. 3. Dust and Contamination Dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the glass surface, take the following precautions : 1) Handle the CMOS image sensor in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 2) Do not touch the glass surface with the fingers. If dust or contamination gets on the glass surface, the following cleaning method is recommended : o Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the pins on the device before blowing off the dust. o The contamination on the glass surface should be wiped off with a clean applicator soaked in isopropyl alcohol. Wipe slowly and gently in one direction only. - Frequently replace the applicator and do not use the same applicator to clean more than one device. Note : In most cases, dust and contamination are unavoidable, even before the device is first used. It is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device. 2. Electrostatic Damage As compared with general MOS-LSI, CMOS image sensor has lower ESD. Therefore, take the following antistatic measures when handling the CMOS image sensor : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 13 LZ37C1B 4. Other 1) Soldering should be manually performed within 2 seconds per pin at 400C maximum at the tip of soldering iron. 2) Avoid using or storing the CMOS image sensor at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CMOS image sensor. 3) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters. 14