PRELIMINARY
DESCRIPTION
The LZ37C1B is a 1/7-type (2.55 mm) solid-state
color image sensor that consists of PN photo-
diodes and CMOS (Complementary Metal Oxide
Semiconductor) devices. The sensor further
includes a timing generator (TG), a correlated
double sampling (CDS) circuit, an auto gain control
(AGC) circuit and an analog-to-digital converter
(ADC) circuit. With approximately 110 000 pixels
(393 horizontal x 299 vertical), the sensor provides
a stable digital color image with extremely low
power consumption.
FEATURES
• Progressive scan
• Square pixel
• Compatible with CIF standard
• Number of image pixels : 367 (H) x 291 (V)
• Number of optical black pixels
– Horizontal : 13 front and 13 rear
– Vertical : 4 front and 4 rear
• Pixel pitch : 5.6 µm (H) x 5.6 µm (V)
• R, G, and B primary color mosaic filters
• Image inversion function (horizontally and/or
vertically)
• Available for two types of power save mode
– AGC and AD circuits become power-off with
serial data.
– All circuits become power-off with STBY pin
• Analog output and 8-bit digital output
• Variable gain control (3 to 30 dB)
• Variable electronic focal plane shutter (1/30 to
1/10 000 s)
• Single +2.8 V power supply
• Package : 36-pin LCC*(N-LCC036-S425A)
* Leadless Chip Carrier
PIN CONNECTIONS
PRECAUTIONS
• Refer to "PRECAUTIONS FOR CMOS IMAGE
SENSORS".
LZ37C1B
1
LZ37C1B 1/7-type Color CMOS Image Sensor with
110 k Pixels
1
2
3
4
5
6
7
8
9
NC
BIAS1
ADL
AGCOUT
ADH
CKI
CKO
STBY
NC
NC
SDI
VD
HD
DGND
CLK
D7
DVDD
D6
27
26
25
24
23
22
21
20
19
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
NC
AVDD
AGND
SIGIN
SIGOUT
BIAS2
OFS
CLP
SCLK
DVDD
DGND
D0
D1
D2
D3
D4
D5
NC
36-PIN LCC TOP VIEW
(N-LCC036-S425A)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
BACK
PRELIMINARY
LZ37C1B
2
BLOCK DIAGRAM
HD, VD
CLK TG AGC
CONTROL
AGC
CMOS
IMAGE
SENSOR
ANALOG
VIDEO OUT
AGC OUT
8-BIT
D/A
8-BIT
A/D DIGITAL
VIDEO OUT
DATA
PRELIMINARY
LZ37C1B
3
PIN NO.
SYMBOL I/O DESCRIPTION
1 NC – No connection–
A/D
Digital
ADC signal output
OD113
Digital
ADC signal output
OD012
Digital
ADC signal output (LSB)
–DGND11
Digital
Digital ground
–DVDD10
–
Digital power supply
–NC9
Digital
No connection
ISTBY8
Digital
Standby control mode*
OCKO7
Digital
Clock output for oscillator
ICKI6
Analog
Clock input for oscillator (9.0 MHz)
–ADH5
Analog
Top ADC reference voltage
OAGCOUT4
Analog
AGC output
–ADL3
Analog Analog bias voltage 1 for image sensor–BIAS12
Bottom ADC reference voltage
14 D2O Digital
––NC27 No connection
DigitalISDI26 Control data input (AGC gain, offset, shutter control,
image inversion, etc.)
DigitalIVD25 Vertical drive pulse input
DigitalIHD24 Horizontal drive pulse input
Digital–DGND23 Digital ground
DigitalOCLK22 Clock output (9.0 MHz)
DigitalOD721 ADC signal output (MSB)
Digital–DVDD20 Digital power supply
DigitalOD619 ADC signal output
––NC18 No connection
DigitalOD517 ADC signal output
DigitalOD416 ADC signal output
DigitalOD315 ADC signal output
No connection36
* Standby mode functions
High level : Standby mode (all circuits power-off), Low level or open : Normal mode (all circuits active)
NC – –
Analog power supply35 AVDD – Analog
Analog ground34 AGND – Analog
Analog image signal input33 SIGIN I Analog
Analog image signal output32 SIGOUT O Analog
Analog bias voltage 2 for image sensor31 BIAS2– Analog
Offset bias voltage for AGC output30 OFS – Analog
Analog bias voltage for clamp circuit29 CLP – Analog
Shift clock for SDI28 SCLK I Digital
PIN DESCRIPTION
PRELIMINARY
LZ37C1B
4
ABSOLUTE MAXIMUM RATINGS (TA= +25 ˚C)
PARAMETER SYMBOL
Power supply voltage VDD
Input signal voltage VØ–0.3 to VDD + 0.3
–0.3 to +4.6
RATING UNIT
V
V
˚C–40 to +80TSTGStorage temperature
PARAMETER SYMBOL
Power supply voltage VDD
Operating temperature TOPR –20
2.6
MIN. UNIT
V
˚C
TYP. MAX.
2.8 3.0
+25 +50
RECOMMENDED OPERATING CONDITIONS
9.0 MHzfCKOscillation frequency
(Connect to pin
through a capacitor)
Analog input voltage
Digital input voltage VØL 0V0.2VDDLOW level
HIGH level
Analog bias voltage (Connect to GND
through a capacitor)
VØH 0.8VDD VDD V
3
1
2
NOTE
NOTES :
1. Applied to input pins STBY, HD, VD, SDI and SCLK.
2. Applied to input pin SIGIN. Do not connect to DC directly.
3. Applied to pins BIAS1, BIAS2, OFS, ADL, ADH, CLP.
Do not connect to GND directly.
PRELIMINARY
LZ37C1B
5
CHARACTERISTICS (1/30 s progressive scan readout mode)
(TA= +25˚C, Operating conditions : The typical values specified in
"RECOMMENDED OPERATING CONDITIONS"
.
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1mmt) is used.)
• Measurement point : Analog image signal output (pin No.32), before AGC circuit and AD converter.
Standard output voltage VO
Photo response non-uniformity PRNU
Saturation output voltage VSAT
VDARK
Dark signal non-uniformity DSNU
Sensitivity (Green channel) R (G)
Supply current IVDD
PARAMETER SYMBOL NOTE
Dark output voltage
VFPNVertical line fixed pattern noise
MIN.
400
3
260
0.5
11
150
700
2
TYP. MAX.
14
1
4
3
2
mV
mV
mVp-p
mA
mV
%
mV
mV
UNIT
6
5
7
9
160
10
10
6
NOTES :
1. The average output voltage of G signal under uniform
illumination. The standard exposure conditions are
defined as when VOis 150 mV.
2. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/VO,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.
3. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. VSAT is the minimum
segment's voltage under 10 times exposure of the
standard exposure conditions.
4. The difference between average output voltage of the
image area and that of the OB area, under non-
exposure conditions.
5. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.
6. The average output voltage of G signal when a 1 000
lux light source with a 90% reflector is imaged by a lens
of F4, F50 mm.
7. Total current of analog and digital power supplies, in the
dark and at the standard load conditions. (Pin No.6
[oscillator] is external input. Pin No.7 is open.)
8. Total current of power supply in standby mode. (Pin
No.8 (STBY) is fixed to "H" level and other input pins are
fixed to "H" level or "L" level.)
9. One mean horizontal line signal <bi> is obtained by
adding all the horizontal line signals <aij> vertically and
dividing them by the line number. <xi> is the deviation of
the center pixel from the average of successive 5 pixels
in <bi>. VFPN is the maximum absolute value of <xi>.
8µA1ISTBYStandby current
1.1
PRELIMINARY
LZ37C1B
6
PIXEL STRUCTURE
COLOR FILTER ARRAY
(1, 291) (367, 291)
(1, 1) (367, 1)
R
G
R
G
R
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
G
R
G
R
G
R
B
G
B
G
B
G
G
B
G
B
G
B
R
G
R
G
R
G
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
G
B
G
B
G
B
R
G
R
G
R
G
R
G
R
G
R
G
G
B
G
B
G
B
1 pin OPTICAL BLACK
(4 PIXELS)
OPTICAL BLACK
(13 PIXELS)
OPTICAL BLACK
(13 PIXELS)
OPTICAL BLACK
(4 PIXELS)
367 (H) x 291 (V)
PRELIMINARY
LZ37C1B
7
TIMING CHART
CLK
ADOUT
(D0-D7)
Normal
HD
CLK
ADOUT
(D0-D7)
906 4
363 365
367 OB
OB
8 12162024283236404448525660646872768084889092
HORIZONTAL PULSE TIMING
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)
VERTICAL PULSE TIMING
ππππππππππππππ
OB
ππππππππππππππ
Mirror
7531 OB
CLK
ADOUT
(D0-D7)
Normal
HD
104 108 112 116 120 124 128 132 136 140 144 148 152 156 160 164 168 172 176 180 184 188 192 196 200
OB OB 2 4 6 8 10
ππππππππππππππ
OB
ππππππππππππππ
Mirror
ADOUT
(D0-D7)
Normal
Mirror
910
HD
SCLK
SDI
AGC
VD
329 330
123456789101112131415161718192021222324252627282930313233343536
SDI, SCLK
Forbidden Period
37 38
OB OB
39
328
289 290 291
OB OB OB OB
288
D0D10 D20 D30 D38
OB 366 364 362 360 358
SYMBOL
MIN. TYP. MAX. UNIT
∆t 0 15 40 ns
OB OB
321
OB OB OB OB
4
SERIAL DATA TIMING (SDI, SCLK)
Offset Shutter
∆t
01
• The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1).
• The falling edge of the HD pulse must be between two rising edges of CLK (90) and CLK (91).
• The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.
• Data in SDI are taken at the rising edge of SCLK.
• Clock frequency of SCLK should be less than 1/2 of that of CLK.
• Do not insert the SDI and SCLK pulses between 36H* and 37H*. Refer to "VERTICAL PULSE TIMING".
• Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D38.
* It means ordinal number of the HD pulse.
361
PRELIMINARY
LZ37C1B
8
SERIAL DATA INPUTS
DATA NAME FUNCTION
D0Not used.
(Fix to low level.)D1
D2AGC6(MSB) Auto gain control
(0 to 20 dB)
Not used.
(Fix to low level.)
D3AGC5
D4AGC4
D5AGC3
D6AGC2
D7AGC1
D8AGC0(LSB)
D9
D10
D11
D12
D13 OFS7(MSB) Offset level control of ADC
(0.9 to 1.5 V)D14 OFS6
D15 OFS5
D16 OFS4
D17 OFS3
D18 OFS2
D19 OFS1
D20 OFS0(LSB)
D21 Not used. (Fix to low level.)
D22 SHT8(MSB) Shutter speed control
(Exposure time is 1 to 1/330 frame period.)D23 SHT7
D24 SHT6
D25 SHT5
D26 SHT4
D27 SHT3
D28 SHT2
D29 SHT1
D30 SHT0(LSB)
D31 MIRH H : Horizontal mirror inversion image, L : Normal image
D32 MIRV H : Vertical mirror inversion image, L : Normal image
D33 SAD1(MSB) Phase selection of AD clock
(Fix to low level.)D34 SAD0(LSB)
D35 MAX2(MSB) Selection of fixed gain
(3 to 10 dB)D36 MAX1
D37 MAX0(LSB)
D38 LPMD H : Power save mode (AGC and AD off), L : Normal mode
PRELIMINARY
LZ37C1B
9
Setting of Auto Gain Control
• One LSB of the gain code represents approximately 0.156 dB.
• Nominal gain values at typical codes are shown below.
AUTO GAIN CONTROL
(dB) D2D3D4D5D6D7D8
0 LLLLLLL
1LLLLHHL
2LLLHHLH
3LLHLLHH
4LLHHLLH
5 LHLLLLL
6 LHLLHHL
7LHLHHLL
8LHHLLHH
9LHHHLLH
10 HLLLLLL
11 H L L L H H L
12 H L L H H L L
13 HLHLLHH
14 H L H H L L H
15 H L H H H H H
16 H H L L H H L
17 H H L H H L L
18 H H H L L H H
19 HHHHL LH
20 HHHHHHH
Setting of Offset Level
• One LSB of the offset code represents approximately 0.002 V.
• Nominal offset values at typical codes are shown below.
OFFSET LEVEL (V) D13 D14 D15 D16 D17 D18 D19 D20
0.9 LLLLLLLL
1.0 LLHLHLHH
1.1 LHLHLHLH
1.2 HLLLLLLL
1.3 HLHLHLHL
1.4 HHLHLHLH
1.5 HHHHHHHH
PRELIMINARY
LZ37C1B
10
Setting of Shutter Speed
• One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period.
• Shutter speed values at typical codes are shown below.
SHUTTER SPEED
(Exposure Time Unit : H) D23 D24 D25 D26 D27 D28 D29 D30
330 LLLLLLLL
D22
L
329 LLLLLLLHL
328 LLLLLLHLL
·
300 L L L H H H H LL
·
·
200 HLLLLLHLL
·
·
100 H H H L L H H LL
·
·
10 LHLLLLLLH
·
3LHLLLHHHH
2 LHLLHLLLH
1LHLLHLLHH
Setting of Fixed Gain
• One LSB of the gain code represents 1 dB.
FIXED GAIN
(dB) D36 D37
3LL
D35
L
4LHL
5HLL
6HHL
7LLH
8LHH
9HLH
10 H HH
PRELIMINARY
LZ37C1B
11
EXAMPLE OF OPERATION CIRCUIT
D6
DVDD
D7
CLK
DGND
HD
VD
SDI
NC
NC
STBY
CKO
CKI
ADH
AGCOUT
ADL
BIAS1
NC
SCLK
CLP
OFS
BIAS2
SIGOUT
SIGIN
AGND
AVDD
NC
192021222324252627
987654321
Oscillator
(9 MHz)
(9 MHz)
10 µF +
10 µF
+
Digital Power
Supply
Analog Power
Supply
NC
D5
D4
D3
D2
D1
D0
DGND
DVDD
18
17
16
15
14
13
12
11
10
28
29
30
31
32
33
34
35
36
LZ37C1B
(TOP VIEW)
• Insert capacitors more than 10 µF
between AVDD and AGND and
between DVDD and DGND.
• Capacitors whose values are not
shown must be 0.1 µF.
LZ37C1B
12
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9.8
±0.1
(◊2)
Center of effective
imaging area
0.7
TYP.
0.4
TYP.
Index markIndex markIndex mark
19
18
10
28
3636
27
91
R0.15
TYP.
1.27
TYP.
0.1
TYP.
0.6
TYP.
P-1.0
TYP.
R0.4
TYP.
AA'
1.2
±0.12
1.9
±0.2
5.4
±0.075
1.05
±0.1
0.85
±0.025
Package
CMOS
A
A'
0.7
±0.1
(◊2)
0.5
±0.35
0.88
±0.05
0.5
±0.35
6.28
±0.075
10.8
±0.1
Center of die.Center of die
Refractiva index : nd = 1.5Refractive index : nd = 1.5 Rotation error of die : ¬ 1.5˚
MAX.
(◊1 : Effective imaging area)
(◊2 : Lid' size)
27 19
91
28
36 10
18
¬
Glass Lid
0.04
(◊1)
0.04
(◊1)
36 LCC (N-LCC036-S425A) (Unit : mm)
PACKAGE OUTLINES
LZ37C1B
13
PRECAUTIONS FOR CMOS IMAGE SENSORS
1. Package Breakage
In order to prevent the package from being broken,
observe the following instructions :
1) The CMOS image sensor is a precise optical
component and the package material is
ceramic.
Therefore,
ø Take care not to drop the device when
mounting, handling, or transporting.
ø Avoid giving a shock to the package.
Especially when pins are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn’t fixed.
2) When mounting the package on the housing,
be sure that the package is not bent.
– If a bent package is forced into place
between a hard plate or the like, the pack-
age may be broken.
3) If any damage or breakage occurs on the sur-
face of the glass cap, its characteristics could
deteriorate.
Therefore,
ø Do not hit the glass cap.
ø Do not give a shock large enough to cause
distortion.
øDo not scrub or scratch the glass surface.
– Even a soft cloth or applicator, if dry, could
cause flaws to scratch the glass.
2. Electrostatic Damage
As compared with general MOS-LSI, CMOS image
sensor has lower ESD. Therefore, take the following
antistatic measures when handling the CMOS
image sensor :
1) Always discharge static electricity by grounding
the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.
2) When directly handling the device with the
fingers, hold the part without pins and do not
touch any pin.
3) To avoid generating static electricity,
a. do not scrub the glass surface with cloth or
plastic.
b. do not attach any tape or labels.
c. do not clean the glass surface with dust-
cleaning tape.
4) When storing or transporting the device, put it in
a container of conductive material.
3. Dust and Contamination
Dust or contamination on the glass surface could
deteriorate the output characteristics or cause a
scar. In order to minimize dust or contamination on
the glass surface, take the following precautions :
1) Handle the CMOS image sensor in a clean
environment such as a cleaned booth. (The
cleanliness level should be, if possible, class
1 000 at least.)
2) Do not touch the glass surface with the fingers.
If dust or contamination gets on the glass
surface, the following cleaning method is
recommended :
ø Dust from static electricity should be blown
off with an ionized air blower. For anti-
electrostatic measures, however, ground all
the pins on the device before blowing off the
dust.
øThe contamination on the glass surface
should be wiped off with a clean applicator
soaked in isopropyl alcohol. Wipe slowly and
gently in one direction only.
– Frequently replace the applicator and do not
use the same applicator to clean more than
one device.
◊ Note : In most cases, dust and contamination
are unavoidable, even before the device
is first used. It is, therefore, recommended
that the above procedures should be
taken to wipe out dust and contamination
before using the device.
LZ37C1B
14
4. Other
1) Soldering should be manually performed within
2 seconds per pin at 400°C maximum at the tip
of soldering iron.
2) Avoid using or storing the CMOS image sensor
at high temperature or high humidity as it is a
precise optical component. Do not give a
mechanical shock to the CMOS image sensor.
3) Do not expose the device to strong light. For
the color device, long exposure to strong light
will fade the color of the color filters.
