TM8
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Revision: 02-Mar-18 1Document Number: 40133
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Solid Tantalum Chip Capacitors
M
ICROTAN
®
High Reliability, Low DC Leakage, Leadframeless Molded
PERFORMANCE CHARACTERISTICS
www.vishay.com/doc?40170
Operating Temperature: -55 °C to +125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 0.33 μF to 47 μF
Capacitance Tolerance: ± 10 % and ± 20 % standard
Voltage Range: 2 VDC to 40 VDC
FEATURES
• High reliability solid surface mount tantalum
capacitors
• Low DC leakage for extended battery life
• Small sizes for space constrained applications
• L-shaped face-down terminations for superior board
mounting
• Suitable for medical implantable applications with
additional screening
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Available
Available
ORDERING INFORMATION
TM8 R 106 M 016 E B A
MODEL CASE
CODE
CAPACITANCE CAPACITANCE
TOLERANCE
DC VOLTAGE
RATING AT +85 °C
TERMINATION /
PACKAGING
RELIABILITY
LEVEL
SURGE
CURRENT
See
Ratings
and
Case
Codes
table
This is
expressed in
picofarads.
The first two
digits are the
significant
figures. The
third is the
number of
zeros to
follow.
K = ± 10 %
M = ± 20 %
This is expressed
in volts. To complete
the three-digit block,
zeros precede the
voltage rating.
A decimal point is
indicated by an “R”
(6R3 = 6.3 V).
Sn / Pb solder
E = 7" (178 mm) reels
L = 7" (178 mm) reels,
½ reel
R = 7" (178 mm)
300 pcs. qty.
100 % tin
C = 7" (178 mm) reels
H = 7" (178 mm) reels,
½ reel
U = 7" (178 mm)
300 pcs. qty.
Gold
A = 7" (178 mm) reels
G = 7" (178 mm) reels,
½ reel
P = 7" (178 mm)
300 pcs. qty.
B = 0.1 %
weibull FRL
S = hi-rel std.
(40 h burn-in)
Z = non-
established
reliability
A = 10 cycles
at 25 °C
B = 10 cycles
at -55 °C /
+85 °C
Z = none
TM8
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DIMENSIONS in inches [millimeters]
CASE CODE L W H P1 P2 (MIN.) C
K0.045 ± 0.002
[1.14 ± 0.05]
0.026 ± 0.002
[0.66 ± 0.05]
0.024 max.
[0.61 max.]
0.010 ± 0.004
[0.25 ± 0.1]
0.020
[0.51]
0.015 ± 0.004
[0.38 ± 0.1]
M0.063 ± 0.006
[1.60 ± 0.15]
0.033 ± 0.006
[0.84 ± 0.15]
0.033 ± 0.006
[0.84 ± 0.15]
0.020 ± 0.004
[0.51 ± 0.1]
0.026
[0.65]
0.024 ± 0.004
[0.61 ± 0.1]
G0.063 ± 0.006
[1.60 ± 0.15]
0.033 ± 0.006
[0.84 ± 0.15]
0.047 max.
[1.2 max.]
0.020 ± 0.004
[0.51 ± 0.1]
0.026
[0.65]
0.024 ± 0.004
[0.61 ± 0.1]
W0.081 ± 0.006
[2.06 ± 0.15]
0.053 ± 0.006
[1.35 ± 0.15]
0.047 max.
[1.2 max.]
0.020 ± 0.004
[0.51 ± 0.1]
0.035
[0.9]
0.035 ± 0.004
[0.90 ± 0.1]
R0.081 ± 0.006
[2.06 ± 0.15]
0.053 ± 0.006
[1.35 ± 0.15]
0.058 ± 0.004
[1.47 ± 0.10]
0.020 ± 0.004
[0.51 ± 0.1]
0.035
[0.9]
0.035 ± 0.004
[0.90 ± 0.1]
P0.096 ± 0.006
[2.45 ± 0.15]
0.059 ± 0.006
[1.5 ± 0.15]
0.049 max.
[1.25 max.]
0.020 ± 0.004
[0.51 ± 0.1]
0.051
[1.3]
0.035 ± 0.004
[0.90 ± 0.1]
A0.126 ± 0.008
[3.2 ± 0.2]
0.063 ± 0.008
[1.6 ± 0.2]
0.071 max.
[1.8 max.]
0.031 ± 0.004
[0.8 ± 0.1)
0.063
[1.60]
0.047 ± 0.004
[1.2 ± 0.1]
N0.138 ± 0.004
[3.5 ± 0.1]
0.110 ± 0.004
[2.80 ± 0.1]
0.047 max.
[1.2 max.]
0.0335 ± 0.004
[0.85 ± 0.1]
0.065
[1.65]
0.094 ± 0.004
[2.4 ± 0.10]
T0.138 ± 0.004
[3.5 ± 0.1]
0.110 ± 0.004
[2.80 ± 0.10]
0.063 max.
[1.57 max.]
0.0335 ± 0.004
[0.85 ± 0.1]
0.065
[1.65]
0.094 ± 0.004
[2.4 ± 0.10]
RATINGS AND CASE CODES
μF 2 V 4 V 6.3 V 10 V 16 V 20 V 25 V 40 V
0.33 K
0.68 M
1.0 K K M M M / W R P
2.2 M M
3.3 M M / G R R
4.7 M M P
6.8 R R
7.5 W N
10 K M M R R / A A
15 M M / R R
22 A
33 P P
47 P P / T T
L
Anode Polarity Bar
Anode Termination
H
W
P1
C
P2P1
Cathode Termination
TM8
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MARKING
VOLTAGE CODE CAPACITANCE CODE
V CODE CAP, μF CODE
6.3 J 0.68 w
10 A 1.0 A
16 C 2.2 J
20 D 3.3 N
25 E 4.7 S
40 g 6.8 W
7.5 X
10 a
15 e
22 j
47 s
STANDARD RATINGS
CAPACITANCE
(μF)
CASE
CODE PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
(%)
MAX. ESR
AT +25 °C
100 kHz STD.
()
AVAILABLE
RELIABILITY
LEVELS
2 VDC AT +85 °C; 1.4 VDC AT +125 °C
10 K TM8K106M002(2)(4)(6) 0.50 20 20.0 Z
4 VDC AT +85 °C; 2.7 VDC AT +125 °C
1.0 KTM8K105(1)004(2)(3)(6) 0.20 820.0 Z, S, B
10 MTM8M106(1)004(2)(3)(5) 0.20 85.0 Z, S, B
15 MTM8M156(1)004(2)(3)(5) 0.30 85.0 Z, S, B
33 PTM8P336(1)004(2)(3)(5) 0.66 30 6.0 Z, S, B
47 PTM8P476(1)004(2)(3)(5) 0.94 22 3.0 Z, S, B
Note
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, L, R, C, H, U, A, G, P
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
M, G-Case
Voltage code
A
Polarity bar
P, R, W-Case
Voltage
code Capacitance
code
Polarity bar
CW
K-Case
Polarity bar
A-Case
Voltage
code Capacitance
code
Polarity bar
A226
N, T-Case
2
Vishay marking
(if space allows)
47 10
VoltageCapacitancePolarity bar
TM8
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Revision: 02-Mar-18 4Document Number: 40133
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6.3 VDC AT +85 °C; 4 VDC AT +125 °C
1.0 K TM8K105(1)6R3(2)(3)(6) 0.20 8 20.0 Z, S, B
3.3 MTM8M335(1)6R3(2)(3)(5) 0.20 86.0 Z, S, B
4.7 M TM8M475(1)6R3(2)(3)(5) 0.20 8 6.0 Z, S, B
10 M TM8M106(1)6R3(2)(3)(5) 0.32 8 5.0 Z, S, B
15 M TM8M156(1)6R3(2)(3)(5) 0.47 8 5.0 Z, S, B
15 RTM8R156(1)6R3(2)(3)(5) 0.47 85.0 Z, S, B
33 P TM8P336(1)6R3(2)(3)(5) 1.00 30 6.0 Z, S, B
47 P TM8P476(1)6R3(2)(3)(5) 1.50 22 3.0 Z, S, B
47 T TM8T476(1)6R3(2)(3)(5) 1.50 8 0.5 Z, S, B
10 VDC AT +85 °C; 7 VDC AT +125 °C
1.0 M TM8M105(1)010(2)(3)(5) 0.20 6 12.0 Z, S, B
2.2 MTM8M225(1)010(2)(3)(5) 0.20 10 10.0 Z, S, B
3.3 M TM8M335(1)010(2)(3)(5) 0.20 8 6.0 Z, S, B
4.7 M TM8M475(1)010(2)(3)(5) 0.24 8 6.0 Z, S, B
3.3 GTM8G335(1)010(2)(3)(5) 0.20 86.0 Z, S, B
7.5 W TM8W755(1)010(2)(3)(5) 0.38 8 8.0 Z, S, B
6.8 RTM8R685(1)010(2)(3)(5) 0.34 66.0 Z, S, B
10 R TM8R106(1)010(2)(3)(5) 0.50 8 6.0 Z, S, B
15 R TM8R156(1)010(2)(3)(5) 0.75 8 5.0 Z, S, B
22 A TM8A226(1)010(2)(3)(5) 1.10 8 1.5 Z, S, B
47 T TM8T476(1)010(2)(3)(5) 2.35 8 1.0 Z, S, B
16 VDC AT +85 °C; 10 VDC AT +125 °C
1.0 M TM8M105(1)016(2)(3)(5) 0.20 6 12.0 Z, S, B
2.2 M TM8M225(1)016(2)(3)(5) 0.20 10 10.0 Z, S, B
3.3 RTM8R335(1)016(2)(3)(5) 0.26 88.0 Z, S, B
6.8 R TM8R685(1)016(2)(3)(5) 0.54 6 6.0 Z, S, B
10 R TM8R106(1)016(2)(3)(5) 0.80 8 6.0 Z, S, B
10 ATM8A106(1)016(2)(3)(5) 0.80 83.0 Z, S, B
20 VDC AT +85 °C; 13 VDC AT +125 °C
0.33 K TM8K334(1)020(2)(3)(6) 0.20 6 100.0 Z, S, B
0.68 M TM8M684(1)020(2)(3)(5) 0.20 6 20.0 Z, S, B
1.0 M TM8M105(1)020(2)(3)(5) 0.20 6 12.0 Z, S, B
1.0 W TM8W105(1)020(2)(3)(5) 0.20 8 8.0 Z, S, B
3.3 R TM8R335(1)020(2)(3)(5) 0.33 8 8.0 Z, S, B
7.5 N TM8N755(1)020(2)(3)(5) 0.75 8 6.0 Z, S, B
10 A TM8A106(1)020(2)(3)(5) 1.00 8 3.0 Z, S, B
25 VDC AT +85 °C; 17 VDC AT +125 °C
1.0 R TM8R105(1)025(2)(3)(5) 0.20 6 10.0 Z, S, B
4.7 P TM8P475(1)025(2)(3)(5) 0.59 6 6.0 Z, S, B
40 VDC AT +85 °C; 27 VDC AT +125 °C
1.0 P TM8P105(1)040(2)(3)(5) 0.20 8 10.0 Z, S, B
STANDARD RATINGS
CAPACITANCE
(μF)
CASE
CODE PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
(%)
MAX. ESR
AT +25 °C
100 kHz STD.
()
AVAILABLE
RELIABILITY
LEVELS
Note
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, L, R, C, H, U, A, G, P
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
TM8
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Revision: 02-Mar-18 5Document Number: 40133
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TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
STANDARD PACKAGING QUANTITY
CASE CODE
QUANTITY (PCS/REEL)
7" REEL ½ REEL PARTIAL REEL
K 5000 2500 300
M 4000 2000 300
G 3000 1500 300
W 2500 1250 300
R 2500 1250 300
P 3000 1500 300
A 2000 1000 300
N 2500 1250 300
T 2500 1250 300
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
10 μF - 6 V
IMPEDANCE
ESR
0.1
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
4.7 μF - 10 V
IMPEDANCE
ESR
1
10
100
1000
10 000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
1 μF - 16 V
IMPEDANCE
ESR
1000.0
100.0
10.0
1.0
0.1
0.1 110 100 1000
FREQUENCY, kHz
ESR, Z, Ω
4.7 μF - 25 V
IMPEDANCE
ESR
“P” Case
TM8
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POWER DISSIPATION
CASE CODE MAXIMUM PERMISSIBLE
POWER DISSIPATION AT +25 °C (W) IN FREE AIR
K 0.015
M 0.025
G 0.025
W 0.040
R 0.045
P 0.045
A 0.075
N 0.075
T 0.084
PRODUCT INFORMATION
Micro Guide
www.vishay.com/doc?40115
Pad Dimensions
Packaging Dimensions
Moisture Sensitivity www.vishay.com/doc?40135
Typical Performance Characteristics www.vishay.com/doc?40170
SELECTOR GUIDES
Solid Tantalum Selector Guide www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors www.vishay.com/doc?40091
FAQ
Frequently Asked Questions www.vishay.com/doc?40110
Micro Guide
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Revision: 12-Sep-17 1Document Number: 40115
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Guide for Leadframeless Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today’s surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called “valve”
metals and include titanium, zirconium, niobium, tantalum,
hafnium, and aluminum. Only a few of these permit the
accurate control of oxide thickness by electrochemical
means. Of these, the most valuable for the electronics
industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
C= capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
COMPARISON OF CAPACITOR DIELECTRIC
CONSTANTS
DIELECTRIC e
DIELECTRIC CONSTANT
Air or Vacuum 1.0
Paper 2.0 to 6.0
Plastic 2.1 to 6.0
Mineral Oil 2.2 to 2.3
Silicone Oil 2.7 to 2.8
Quartz 3.8 to 4.4
Glass 4.8 to 8.0
Porcelain 5.1 to 5.9
Mica 5.4 to 8.7
Aluminum Oxide 8.4
Tantalum Pentoxide 26
Ceramic 12 to 400K
CeA
t
-------
=
Micro Guide
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SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Molded chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost.
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
Fig. 1 - Leadframeless Molded Capacitors, All Types
Side Cathode
Termination (-)
Sintered
Tantalum Pellet
MnO2/Carbon/
Silver Coating
Bottom Cathode
Termination (-)
Silver Adhesive Epoxy
Glass Reinforced
Epoxy Resin Bottom Anode
Termination (+)
Side Anode
Termination (+)
Polarity Bar Marking
Epoxy Resin
Encapsulation
Voltage Code
Excluding 0402 (1005 metric)
case size
Micro Guide
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SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES TL8 298D 298W TR8
PRODUCT IMAGE
TYPE Solid tantalum leadframeless molded chip capacitors
FEATURES
Small size including 0603 and 0402 foot print
Ultra low profile Industrial grade Industrial grade,
extended range Low ESR
TEMPERATURE RANGE
Operating Temperature:
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
CAPACITANCE RANGE 0.68 μF to 220 μF 0.33 μF to 220 μF 2.2 μF to 220 μF 1 μF to 220 μF
VOLTAGE RANGE 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V
CAPACITANCE TOLERANCE ± 20 %, ± 10 %
DISSIPATION FACTOR 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 %
CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B
TERMINATION 100 % tin 100 % tin or gold plated
SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES TP8 TM8 DLA 11020 T42
PRODUCT IMAGE
TYPE Solid tantalum leadframeless molded chip capacitors
FEATURES
Small size including 0603 and 0402 foot print Built in fuse,
double-stacked
High performance,
automotive grade High reliability High reliability,
DLA approved
High reliability,
ultra-low ESR
TEMPERATURE RANGE Operating Temperature:
-55 °C to +125 °C (above 85 °C, voltage derating is required)
CAPACITANCE RANGE 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF
VOLTAGE RANGE 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V
CAPACITANCE TOLERANCE ± 20 %, ± 10 %
DISSIPATION FACTOR 6 % to 30 % 6 % to 20 % 6 % to 8 % 6 % to 15 %
CASE CODES M, W, R, P, A, N, T, B K, M, G, W, R, P, A, N, T M, W, R, P, A, N, T M2
TERMINATION 100 % tin Tin / lead solder plated,
100 % tin and gold plated
Tin / lead solder plated
or gold plated
Tin / lead solder plated
or 100 % tin
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Revision: 12-Sep-17 4Document Number: 40115
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Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
(6) B1 dimension is a reference dimension tape feeder clearance only.
Notes
(1) For reference only
(2) Packaging of M case in plastic tape is available per request
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
Tape and Reel Specifications: all case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8
CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W
M (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0]
W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0]
R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0]
P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0]
A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0]
A0, Q 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0]
B 8 mm 0.157 [4.0] 0.039 [1.0] 0.138 [3.5] 0.087[2.22] 0.157 [4.0] 0.315 [8.0]
W9, S 8 mm 0.126 [3.20] 0.029 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0]
B0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.472 [12.0]
0.004 [0.10]
max.
K0
Tape thickness
B1 (max.) (6)
0.014
[0.35]
max.
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
Embossment
0.069 ± 0.004
[1.75 ± 0.10]
D1 (min.) for components
0.079 x 0.047 [2.0 x 1.2] and larger (5)
.
Maximum
USER DIRECTION
OF FEED
Center lines
of cavity
A0
P1
FW
0.030 [0.75]
min. (3)
0.030 [0.75]
min. (4)
0.079 ± 0.002
[2.0 ± 0.05]
0.157 ± 0.004
[4.0 ± 0.10]
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
B0
Maximum
component
rotation
(Side or front sectional view)
20°
For tape feeder
reference only
including draft.
Concentric around B0
(5)
Deformation
between
embossments
Top
cover
tape
Top cover
tape
cavity size (1)
Cathode (-)
Anode (+)
DIRECTION OF FEED
20° maximum
component rotation
Typical
component
cavity
center line
Typical
component
center line
A0
B0
(Top view)
0.9843 [250.0]
Tape
3.937 [100.0]
0.039 [1.0]
max.
0.039 [1.0]
max.
Camber
Allowable camber to be 0.039/3.937 [1/100]
(Top view)
Non-cumulative over 9.843 [250.0]
Micro Guide
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Revision: 12-Sep-17 5Document Number: 40115
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Notes
(1) For reference only
Note
(1) For reference only
Note
(1) A0, B0 are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation
of the component within the cavity of not more than 20°.
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8
CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W
M 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0]
G 8 mm 0.077 [1.96] 0.02 [0.5] 0.138 [3.5] 0.051 [1.30] 0.157 [4.0] 0.315 [8.0]
W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0]
R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0]
P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0]
A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0]
N 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0]
T 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0]
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42
CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W
M2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0]
PAPER TAPE AND REEL PACKAGING in inches [millimeters]
FOR 298D, 298W, TR8, TP8, TL8, TM8 (K case only)
CASE
SIZE
TAPE
SIZE A
0
B
0
D
0
P
0
P
1
P
2
EFWT
K8 mm
0.033 ± 0.002
[0.85 ± 0.05]
0.053 ± 0.002
[1.35 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.078 ± 0.004
[2.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.03 ± 0.002
[0.75 ± 0.05]
M8 mm
0.041 ± 0.002
[1.05 ± 0.05]
0.071 ± 0.002
[1.8 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.037 ± 0.002
[0.95 ± 0.05]
Ø D0
T
Bottom cover
tape
F
P1
A0
B0E2
P2
W
P0E1
Cavity size
(1)
Bottom cover tape
USER FEED DIRECTION
Cavity center lines
Top
cover tape
[10 pitches cumulative tolerance on tape ± 0.2 mm]
G
Anode
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Revision: 12-Sep-17 6Document Number: 40115
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
PREHEAT AND SOAK
Temperature min. (TSmin.) 100 °C 150 °C
Temperature max. (TSmax.) 150 °C 200 °C
Time (tS) from (TSmin. to TSmax.) 60 s to 90 s 60 s to 150 s
RAMP UP
Ramp-up rate (TL to Tp) 3 °C/s maximum
Liquidus temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL60 s to 150 s
Peak package body temperature (Tp) max. 235 °C 260 °C
Time (tp) within 5 °C of the peak max. temperature 20 s 30 s
RAMP DOWN
Ramp-down rate (Tp to TL) 6 °C/s maximum
Time from 25 °C to peak temperature 6 min maximum 8 min maximum
PAD DIMENSIONS in inches [millimeters]
CASE CODE A (NOM.) B (MIN.) C (NOM.) D (MIN.)
K 0.021 [0.53] 0.016 [0.41] 0.022 [0.55] 0.054 [1.37]
M, G 0.024 [0.61] 0.027 [0.70] 0.025 [0.64] 0.080 [2.03]
R, W9, S 0.035 [0.89] 0.029 [0.74] 0.041 [1.05] 0.099 [2.52]
W 0.035 [0.89] 0.029 [0.74] 0.037 [0.95] 0.095 [2.41]
P 0.035 [0.89] 0.029 [0.74] 0.054 [1.37] 0.112 [2.84]
A, Q, A0 0.047 [1.19] 0.042 [1.06] 0.065 [1.65] 0.148 [3.76]
B, B0 0.094 [2.39] 0.044 [1.11] 0.072 [1.82] 0.159 [4.03]
N, T 0.094 [2.39] 0.044 [1.11] 0.065 [1.65] 0.152 [3.86]
M2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0]
Time
Temperature
tS
Time 25 °C to Peak
tp
TP
TL
TSmin.
25
tL
TSmax. Preheat Area
Max. Ramp Up Rate = 3 °C/s
Max. Ramp Down Rate = 6 °C/s
A
BC
D
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Notes
•At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
•At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
•At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
TYPICAL LEAKAGE CURRENT FACTOR RANGE
TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
100
10
1.0
0.1
0.01
0.001
010 40 708090605020 30 100
+ 125 °C
+ 85 °C
+ 55 °C
+ 25 °C
0 °C
- 55 °C
PERCENT OF RATED VOLTAGE
LEAKAGE CURRENT FACTOR
1
10
100
0.1 1 10 100 1000
FREQUENCY, kHz
“M” Case
22 μF - 4 V
IMPEDANCE
ESR
ESR/Z, Ω
0.1
1
10
100
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
47 μF - 4 V
IMPEDANCE
ESR
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
10 μF - 6 V
IMPEDANCE
ESR
0.1
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
4.7 μF - 10 V
IMPEDANCE
ESR
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TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
10 μF - 10 V
IMPEDANCE
ESR
1
10
100
1000
10 000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
1 μF - 16 V
IMPEDANCE
ESR
100.0
10.0
1.0
0.1
ESR/Z, Ω
0.1 1 10 100 1000
33 μF - 10 V
IMPEDANCE
ESR
“P” CASE
FREQUENCY, kHz
1000.0
100.0
10.0
1.0
0.1
0.1 110 100 1000
IMPEDANCE
ESR
FREQUENCY, kHz
ESR/Z, Ω
“P” CASE
4.7 μF - 25 V
100.0
1.0
10.0
0.1
0.1 110 100 1000
ESR/Z, Ω
FREQUENCY, kHz
“P” CASE
IMPEDANCE
ESR
47 μF - 10 V
10.0
1.0
0.1
0.1 1 10 100 1000
ESR/Z, Ω
FREQUENCY, kHz
“P” CASE
220 μF - 4 V
IMPEDANCE
ESR
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GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
where,
P = power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
RESR = the capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
RESR = the capacitor equivalent series resistance at
the specified frequency
Z = the capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
3. Reverse Voltage: these capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at +25 °C, 5 % of the
DC rating at +25 °C, 5 % of the DC rating at +85 °C,
and 1 % of the DC rating at +125 °C.
4. Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
5. Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power Dissipation calculated using
+25 °C temperature rise.)
6. Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: the recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9. Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
TEMPERATURE DERATING FACTOR
+25 °C 1.0
+85 °C 0.9
+125 °C 0.4
IRMS
P
RESR
------------=
VRMS ZP
RESR
------------=
VRMS IRMS x Z=
Typical Performance Characteristics
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Revision: 16-Jan-14 1Document Number: 40170
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Solid Tantalum Chip Capacitors MICROTAN®
High Reliability Leadframeless Molded Capacitors
TM8 and DLA 11020
Notes
•At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
•At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
•At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table.
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE CHARACTERISTICS
Category temperature range -55 °C to +85 °C (to +125 °C with voltage derating)
Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz
Dissipation factor Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz.
ESR Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz.
Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k
resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in
Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See
graph below for the appropriate adjustment factor.
Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at +25 °C
5 % of the DC rating at +85 °C
1 % of the DC rating at +125 °C
Vishay does not recommend intentional or repetitive application of reverse voltage.
Ripple current and
Temperature derating
For maximum permissible ripple current (IRMS) or/and voltage (VRMS) please refer to product datasheet and
Guide to Application. If capacitors are to be used at temperatures above +25 °C, the permissible RMS
ripple current or voltage shall be calculated using the derating factors:
1.0 at +25 °C
0.9 at +85 °C
0.4 at +125 °C
TYPICAL LEAKAGE CURRENT FACTOR RANGE
Leakage Current Factor
Percent of Rated Voltage
100
10
1.0
0.1
0.01
0.001
0 10 20 30 40 50 60 70 80 90 100
+125 °C +85 °C
+55 °C
+25 °C
-55 °C
0 °C
Typical Performance Characteristics
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Note
• All measurements to be performed after 24 h conditioning at room temperature.
ENVIRONMENTAL AND MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM CONDITION POST TEST PERFORMANCE
Vibration
In accordance with MIL-PRF-55365 In accordance with MIL-PRF-55365
(as for style CWR15)
Thermal shock
Resistance to solder heat
Moisture resistance
Stability at low and high
temperatures
Surge voltage
Life test
Solderability
Resistance to solvents
Terminal strength/
Shear stress test
Method: AEC-Q200-006, conditions:
Pressure load of 5 N for 10 s ± 1 s
There shall be no mechanical or visual damage and
the components shall meet the original electrical
requirements.
Flammability Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.
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Revision: 08-Feb-17 1Document Number: 91000
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
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