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FEATURES APPLICATIONS
z Multi-line EMI Suppression
M-series chip arrays contain four ferrite
beads in a single package. This
compact design makes the M-series
perfect for EMI suppression on
multiple-lines.
z High Density Packaging
M-series chip arrays have a compact
package design that is ideal for high density
packaging.
Multi-frequency Applications
M-series chip arrays are available in
A-type and B-type.The A-type chip
arrays are designed for lower frequency
applications.The B-type chip arrays are
designed for high frequency
applications.
M-series chip beads can be used in a variety of
electronics including:
Computers
Printers
Modems
Hard Drives
CD-ROMs
Monitor
Mainboards
Televisions
OPERATING TEMPERATURE: -40 ~ 85
TEST EQUIPMENTS AND TEST SETUP
Z by Agilent E4991A RF Impedance Analyzer
DCR by milli-ohm meter.
Typical electrical characteristic curves for
the SMB M-series chip bead arrays. The
M-series chip arrays have a wide range of
impedance characteristics and are ideal for
multi-line applications.
SMB M-SERIES
FERRITE CHIP BEADS FOR LOW FREQUENCY APPLICATION
S
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PRODUCT SPECIFICATIONS
Part Number Impedance ()
at 100 MHz
DCR
() Max.
Rate Current
(mA) Max
SMB-3216-E2-310M4 30±25% 0.4 350
SMB-3216-E2-600M4 60±25% 0.4 250
SMB-3216-E2-121M4 120±25% 0.8 150
SMB-3216-E2-301M4 300±25% 0.8 150
SMB-3216-E2-601M4 600±25% 1.5 100
SMB-3216-E2-102M4 1000±25% 1.7 50
TYPICAL ELECTRICAL CHARACTERISTIC CURVES
A: 3.2 ± 0.2 mm , 0.126 ± 0.0012 inch
B:1.6 ± 0.20 mm, 0.063 ± 0.008 inch
C : 1.1 ± 0.20 mm, 0.043 ± 0.008 inch
D : 0.3 ± 0.20 mm, 0.012 ± 0.008 inch
E : 0.35 ± 0.20 mm, 0.014 ± 0.008 inch
P : 0.8 ± 0.10 mm, 0.031 ± 0.004 inch
SMB M-SERIES -321609
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TYPICAL ELECTRICAL CHARACTERISTIC CURVES
SMB-3216-E2-300M4 SMB-3216-E2-600M4
SMB-3216-E2-121M4 SMB-3216-E2-301M4
SMB-3216-E2-601M4 SMB-3216-E2-102M4
SMB M-SERIES-3216
1 10 100 1000
Frequency (MHz)
1 10 100 1000
Frequency (MHz)
1 10 100 1000
Frequency (MHz) 1 10 100 1000
Frequency (MHz)
1 10 100 1000
Frequency (MHz)
1 10 100 1000
Frequency (MHz)