ADUM2201BRIZ-RL - Analog Devices

Dual-Channel Digital Isolators, 5 kV

Data Sheet ADuM2200/ADuM2201

Rev. G Document Feedback

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FEATURES

High isolation voltage: 5000 V rms

Enhanced system-level ESD performance per IEC 61000-4-x

Low power operation

5 V operation

1.6 mA per channel maximum at 0 Mbps to 1 Mbps

3.7 mA per channel maximum at 10 Mbps

3.3 V operation

1.4 mA per channel maximum at 0 Mbps to 1 Mbps

2.4 mA per channel maximum at 10 Mbps

3.3 V/5 V level translation

High temperature operation: 105°C and 125°C options

High data rate: dc to 10 Mbps (NRZ)

Precise timing characteristics

3 ns maximum pulse width distortion

3 ns maximum channel-to-channel matching

High common-mode transient immunity: >25 kV/μs

16-lead SOIC wide body package version (RW-16)

16-lead SOIC wide body enhanced creepage version (RI-16-2)

Safety and regulatory approvals

UL recognition: 5000 V rms for 1 minute per UL 1577

CSA Component Acceptance Notice 5A (RI-16-2 package)

IEC 60601-1: 250 V rms (reinforced)

IEC 60950-1: 400 V rms (reinforced)

VDE certificate of conformity

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

VIORM = 848 V peak

Qualified for automotive applications

APPLICATIONS

General-purpose, high voltage, multichannel isolation

Medical equipment

Power supplies

RS-232/RS-422/RS-485 transceiver isolation

Hybrid electric vehicles, battery monitors, and motor drives

GENERAL DESCRIPTION

The ADuM2200/ADuM22011 are 2-channel digital isolators based

on Analog Devices, Inc., iCoupler® technology. Combining high

speed CMOS and monolithic air core transformer technology, these

isolation components provide outstanding performance character-

istics that are superior to alternatives such as optocoupler devices.

By avoiding the use of LEDs and photodiodes, iCoupler devices

remove the design difficulties commonly associated with optocouplers.

Typical optocoupler concerns regarding uncertain current transfer

ratios, nonlinear transfer functions, and temperature and lifetime

effects are eliminated with the simple iCoupler digital interfaces

FUNCTIONAL BLOCK DIAGRAMS

GND

DD1

GND

DD2

GND

NC = NO CONNECT

ADuM2200

ENCODE

DECODE

PIN 1

INDICATOR

07235-001

Figure 1. ADuM2200

GND

DD1

GND

DD2

GND

NC = NO CONNECT

ADuM2201

DECODE

ENCODE

DECODE

PIN 1

INDICATOR

07235-002

Figure 2. ADuM2201

and stable performance characteristics. The need for external drivers

and other discrete components is eliminated with these iCoupler

products. Furthermore, iCoupler devices consume one-tenth to

one-sixth the power of optocouplers at comparable signal data rates.

The ADuM2200/ADuM2201 isolators provide two independent

isolation channels in two channel configurations with data rates up

to 10 Mbps (see the Ordering Guide). Both parts operate with the

supply voltage on either side ranging from 3.0 V to 5.5 V, providing

compatibility with lower voltage systems, as well as enabling

voltage translation functionality across the isolation barrier. The

ADuM2200/ADuM2201 isolators have a patented refresh feature

that ensures dc correctness in the absence of input logic transitions

and during power-up/power-down conditions.

Similar to the ADuM3200/ADuM3201 isolators, the ADuM2200/

ADuM2201 isolators contain various circuit and layout enhance-

ments that provide increased capability relative to system-level

IEC 61000-4-x testing (ESD, burst, and surge). The precise

capability in these tests for either the ADuM3200/ADuM3201

or ADuM2200/ADuM2201 products is strongly determined by

the design and layout of the user’s board or module. For more

information, see the AN-793 Application Note, ESD/Latch-Up

Considerations with iCoupler Isolation Products.

1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329. Other patents pending.

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 2 of 17

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagrams ............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Electrical Characteristics—5 V Operation................................ 3

Electrical Characteristics—3.3 V Operation ............................ 4

Electrical Characteristics—Mixed 5 V/3.3 V Operation ........ 5

Electrical Characteristics—Mixed 3.3 V/5 V Operation ........ 6

Package Characteristics ............................................................... 7

Regulatory Information ............................................................... 7

Insulation and Safety-Related Specifications ............................ 7

Insulation Characteristics (DIN V VDE V 0884-10 (VDE V

0884-10):2006-12) ........................................................................ 8

Recommended Operating Conditions .......................................8

Absolute Maximum Ratings ............................................................9

ESD Caution...................................................................................9

Pin Configurations and Function Descriptions ......................... 10

Typical Performance Characteristics ........................................... 12

Applications Information .............................................................. 13

PCB Layout ................................................................................. 13

Propagation Delay-Related Parameters ................................... 13

DC Correctness and Magnetic Field Immunity ..................... 13

Power Consumption .................................................................. 14

Insulation Lifetime ..................................................................... 15

Outline Dimensions ....................................................................... 16

Ordering Guide .......................................................................... 17

Automotive Products ................................................................. 17

REVISION HISTORY

9/15—Rev. F to Rev. G

Changed 3 V Operation to 3.3 V Operation .............. Throughout

Updated Page 1 Layout .................................................................... 1

Changes to Features Section............................................................ 1

Changes to Table 2 and Table 3 ....................................................... 3

Changes to Table 5 and Table 6 ....................................................... 4

Changes to Table 8 and Table 9 ....................................................... 5

Changes to Table 11 and Table 12 .................................................. 6

7/15—Rev. E to Rev. F

Changed ADuM320x to ADuM3200/ADuM3201 ... Throughout

Changes to Table14 ........................................................................... 7

2/13—Rev. D to Rev. E

Changes to Table 19 .......................................................................... 9

1/13—Rev. C to Rev. D

Changes to Features Section and Applications Section ............... 1

Changes to Electrical Characteristics—5 V Operation Section .... 3

Replaced Table 1; added Table 2 and Table 3 ................................ 3

Changes to Electrical Characteristics—3 V Operation Section .... 4

Replaced Table 2; added Table 5 and Table 6 ................................ 4

Changed Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V

Operation Section to Electrical Characteristics—Mixed 5 V/3 V

Operation Section ............................................................................. 5

Replaced Table 3; added Table 8 and Table 9 ................................ 5

Added Electrical Characteristics—Mixed 3 V/5 V Operation

Section, Table 10, Table 11, and Table 12 ...................................... 6

Changes to Table 13, Table 14, and Table 15 ................................. 7

Changes to Table 16 and Table 17 ................................................... 8

Replaced Figure 3 .............................................................................. 8

Changes to Table 18 and Table 19 ................................................... 9

Changes to Figure 4 and Table 22................................................. 10

Changes to Figure 5 and Table 23................................................. 11

Changes to PCB Layout Section ................................................... 13

Updated Outline Dimensions ....................................................... 16

Changes to Ordering Guide .......................................................... 17

Added Automotive Products Section .......................................... 17

3/12—Rev. B to Rev. C

Created Hyperlink for Safety and Regulatory Approvals Entry

in Features Section ............................................................................ 1

Change to PCB Layout Section ..................................................... 16

8/11—Rev. A to Rev. B

Added 16-Lead SOIC_IC Package ................................... Universal

Changes to Features Section ............................................................ 1

Changes to Table 5 and Table 6..................................................... 10

Changes to Endnote 1, Table 8...................................................... 11

Updated Outline Dimensions ....................................................... 19

Changes to Ordering Guide .......................................................... 19

7/08—Rev. 0 to Rev. A

Changes to Features Section and General Description Section ........ 1

Changes to Table 5 .......................................................................... 10

1/08—Revision 0: Initial Version

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 3 of 17

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V OPERATION

All voltages are relative to their respective grounds. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications apply

over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5.0 V.

Table 1.

A Grade B Grade

Test Conditions/Comments

Parameter Symbol Min Typ Max Min Typ Max Unit

SWITCHING SPECIFICATIONS

CL = 15 pF, CMOS levels

Pulse Width PW 1000 100 ns Within PWD limit

Data Rate 1 10 Mbps Within PWD limit

Propagation Delay t

PHL

, t

PLH

20 150 20 50 ns 50% input to 50% output

Pulse Width Distortion PWD 40 3 ns |t

PLH

− t

PHL

Change vs. Temperature 5 ps/°C

Propagation Delay Skew t

PSK

100 15 ns Between any two units

Channel Matching

Codirectional t

PSKCD

50 3 ns

Opposing Directional t

PSKOD

50 15 ns

Table 2.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT (NO LOAD)

ADuM2200 I

DD1

1.3 1.8 3.5 4.6 mA

DD2

1.0 1.6 2.0 2.8 mA

ADuM2201 I

DD1

1.1 1.6 3.1 4.2 mA

DD2

1.3 1.9 3.1 4.0 mA

Table 3.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments1

DC SPECIFICATIONS

Logic High Input Threshold V

0.7 V

DDx

Logic Low Input Threshold

VIL

0.3 VDDx

Logic High Output Voltages V

DDx

− 0.1 5.0 V I

= −20 µA, V

= V

IxH

DDx

− 0.5 4.8 V I

= −3.2 mA, V

= V

IxH

Logic Low Output Voltages V

0.0 0.1 V I

= 20 µA, V

= V

IxL

0.2 0.4 V I

= 3.2 mA, V

= V

IxL

Input Current per Channel I

−10 +0.01 +10 µA 0 V ≤ V

≤ V

DDx

Supply Current per Channel

Quiescent Input Supply Current I

DDI (Q)

0.4 0.8 mA All inputs at logic low

Quiescent Output Supply Current I

DDO (Q)

0.5 0.6 mA All inputs at logic low

Dynamic Input Supply Current I

DDI (D)

0.19 mA/Mbps

Dynamic Output Supply Current I

DDO (D)

0.05 mA/Mbps

AC SPECIFICATIONS

Output Rise/Fall Time t

10% to 90%

A Grade 10 ns

B Grade

2.5

Common-Mode Transient Immunity

|CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate f

1.2 Mbps

1 IOx is the Channel x output current, where x = A or B, VIxH is the input side logic high, and VIxL is the input side logic low.

2 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 4 of 17

ELECTRICAL CHARACTERISTICS—3.3 V OPERATION

All voltages are relative to their respective grounds. 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V. All minimum/maximum specifications apply

over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.3 V.

Table 4.

A Grade B Grade

Test Conditions/Comments

Parameter Symbol Min Typ Max Min Typ Max Unit

SWITCHING SPECIFICATIONS C

= 15 pF, CMOS levels

Pulse Width PW 1000 100 ns Within PWD limit

Data Rate

Mbps

Within PWD limit

Propagation Delay t

PHL

, t

PLH

20 150 20 60 ns 50% input to 50% output

Pulse Width Distortion PWD |t

PLH

− t

PHL

A Grade and B Grade 40 3 ns

WA Grade and WB Grade 40 4 ns

Change vs. Temperature 5 ps/°C

Propagation Delay Skew t

PSK

100 22 ns Between any two units

Channel Matching

Codirectional t

PSKCD

50 3 ns

Opposing Directional t

PSKOD

50 22 ns

Table 5.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT (NO LOAD)

ADuM2200 I

DD1

0.8 1.3 2.2 3.2 mA

DD2

0.7 1.0 1.3 1.7 mA

ADuM2201 I

DD1

0.7 1.3 1.9 2.5 mA

DD2

0.8 1.6 1.9 2.5 mA

Table 6.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments1

DC SPECIFICATIONS

Logic High Input Threshold V

0.7 V

DDx

Logic Low Input Threshold V

0.3 V

DDx

Logic High Output Voltages V

DDx

− 0.1 3.0 V I

= −20 µA, V

= V

IxH

DDx

− 0.5 2.8 V I

= −3.2 mA, V

= V

IxH

Logic Low Output Voltages V

0.0 0.1 V I

= 20 µA, V

= V

IxL

0.2 0.4 V I

= 3.2 mA, V

= V

IxL

Input Current per Channel I

−10 +0.01 +10 µA 0 V ≤ V

≤ V

DDx

Supply Current per Channel

Quiescent Input Supply Current I

DDI (Q)

0.3 0.5 mA All inputs at logic low

Quiescent Output Supply Current I

DDO (Q)

0.3 0.5 mA All inputs at logic low

Dynamic Input Supply Current I

DDI (D)

0.10 mA/Mbps

Dynamic Output Supply Current I

DDO (D)

0.03 mA/Mbps

AC SPECIFICATIONS

Output Rise/Fall Time t

10% to 90%

A Grade 10 ns

B Grade 3 ns

Common-Mode Transient Immunity

|CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate f

1.1 Mbps

1 IOx is the Channel x output current, where x = A or B, VIxH is the input side logic high, and VIxL is the input side logic low.

2 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 5 of 17

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3.3 V OPERATION

All voltages are relative to their respective grounds. 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V. All minimum/maximum specifications apply

over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = 3.3 V, V DD2 = 5.0 V.

Table 7.

A Grade B Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS C

= 15 pF, CMOS levels

Pulse Width PW 1000 100 ns Within PWD limit

Data Rate

Mbps

Within PWD limit

Propagation Delay t

PHL

, t

PLH

15 150 15 55 ns 50% input to 50% output

Pulse Width Distortion PWD |t

PLH

− t

PHL

A Grade and B Grade 40 3 ns

WA Grade and WB Grade 40 4 ns

Change vs. Temperature 5 ps/°C

Propagation Delay Skew t

PSK

50 22 ns Between any two units

Channel Matching

Codirectional t

PSKCD

50 3 ns

Opposing Directional t

PSKOD

50 22 ns

Table 8.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT (NO LOAD)

ADuM2200 I

DD1

1.3 1.8 3.5 4.6 mA

DD2

0.7 1.0 1.3 1.7 mA

ADuM2201 I

DD1

1.1 1.6 3.1 4.2 mA

DD2

0.8 1.6 1.9 2.5 mA

Table 9.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments1

DC SPECIFICATIONS

Logic High Input Threshold V

0.7 V

DDx

Logic Low Input Threshold V

0.3 V

DDx

Logic High Output Voltages V

DDx

− 0.1 V

DDx

V I

= −20 µA, V

= V

IxH

DDx

− 0.5 V

DDx

− 0.2 V I

= −3.2 mA, V

= V

IxH

Logic Low Output Voltages V

0.0 0.1 V I

= 20 µA, V

= V

IxL

0.2 0.4 V I

= 3.2 mA, V

= V

IxL

Input Current per Channel I

−10 +0.01 +10 µA 0 V ≤ V

≤ V

DDx

Supply Current per Channel

Quiescent Input Supply Current I

DDI (Q)

0.4 0.8 mA All inputs at logic low

Quiescent Output Supply Current I

DDO (Q)

0.3 0.5 mA All inputs at logic low

Dynamic Input Supply Current I

DDI (D)

0.19 mA/Mbps

Dynamic Output Supply Current I

DDO (D)

0.03 mA/Mbps

AC SPECIFICATIONS

Output Rise/Fall Time t

10% to 90%

A Grade 10 ns

B Grade 3 ns

Common-Mode Transient Immunity

|CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate f

1.2 Mbps

1 IOx is the Channel x output current, where x = A or B, VIxH is the input side logic high, and VIxL is the input side logic low.

2 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 6 of 17

ELECTRICAL CHARACTERISTICS—MIXED 3.3 V/5 V OPERATION

All voltages are relative to their respective grounds. 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications apply

over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VDD1 = 5.0 V, VDD2 = 3.3 V.

Table 10.

A Grade B Grade

Test Conditions/Comments

Parameter Symbol Min Typ Max Min Typ Max Unit

SWITCHING SPECIFICATIONS C

= 15 pF, CMOS levels

Pulse Width PW 1000 100 ns Within PWD limit

Data Rate

Mbps

Within PWD limit

Propagation Delay t

PHL

, t

PLH

15 150 15 55 ns 50% input to 50% output

Pulse Width Distortion PWD |t

PLH

− t

PHL

A Grade and B Grade 40 3 ns

WA Grade and WB Grade 40 4 ns

Change vs. Temperature 5 ps/°C

Propagation Delay Skew t

PSK

50 22 ns Between any two units

Channel Matching

Codirectional t

PSKCD

50 3 ns

Opposing Directional t

PSKOD

50 22 ns

Table 11.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT (NO LOAD)

ADuM2200 I

DD1

0.8 1.3 2.2 3.2 mA

DD2

1.0 1.6 2.0 2.8 mA

ADuM2201 I

DD1

0.7 1.3 1.9 2.5 mA

DD2

1.3 1.9 3.1 4.0 mA

Table 12.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments1

DC SPECIFICATIONS

Logic High Input Threshold V

0.7 V

DDx

Logic Low Input Threshold V

0.3 V

DDx

Logic High Output Voltages V

DDx

− 0.1 V

DDx

V I

= −20 µA, V

= V

IxH

DDx

− 0.5 V

DDx

− 0.2 V I

= −3.2 mA, V

= V

IxH

Logic Low Output Voltages V

0.0 0.1 V I

= 20 µA, V

= V

IxL

0.2 0.4 V I

= 3.2 mA, V

= V

IxL

Input Current per Channel I

−10 +0.01 +10 µA 0 V ≤ V

≤ V

DDx

Supply Current per Channel

Quiescent Input Supply Current I

DDI (Q)

0.3 0.5 mA All inputs at logic low

Quiescent Output Supply Current I

DDO (Q)

0.5 0.6 mA All inputs at logic low

Dynamic Input Supply Current I

DDI (D)

0.10 mA/Mbps

Dynamic Output Supply Current I

DDO (D)

0.05 mA/Mbps

AC SPECIFICATIONS

Output Rise/Fall Time t

10% to 90%

A Grade 10 ns

B Grade 2.5 ns

Common-Mode Transient Immunity

|CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate f

1.1 Mbps

1 IOx is the Channel x output current, where x = A or B, VIxH is the input side logic high, and VIxL is the input side logic low.

2 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 7 of 17

PACKAGE CHARACTERISTICS

Table 13.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

Resistance (Input-to-Output)1

RI-O

1012

Capacitance (Input-to-Output)

I-O

2 pF f = 1 MHz

Input Capacitance

4 pF

IC Junction-to-Ambient Thermal Resistance θ

45 °C/W

1 This device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.

2 Input capacitance is from any input data pin to ground.

REGULATORY INFORMATION

The ADuM2200/ADuM2201 are approved by the organizations listed in Table 14. Refer to Table 19 and the Insulation Lifetime section

for more information about the recommended maximum working voltages for specific cross-isolation waveforms and insulation levels.

Table 14.

UL CSA CQC VDE

Recognized Under

UL 1577 Component

Recognition Program1

Approved under CSA Component

Acceptance Notice 5A

Approved under CQC11-471543-2012 Certified according to

DIN V VDE V 0884-10

(VDE V 0884-10):2006-122

Single Protection,

5000 V rms Isolation

Voltage

Basic insulation per CSA 60950-1-07 and

IEC 60950-1, 600 V rms (848 V peak)

maximum working voltage

Basic insulation per GB4943.1-2011,

600 V rms (848 V peak) maximum

working voltage, tropical climate,

altitude ≤ 5000 m

Reinforced insulation,

848 V peak

RW-16 package: reinforced insulation per

CSA 60950-1-07 and IEC 60950-1,

380 V rms (537 V peak) maximum

working voltage; reinforced insulation

per IEC 60601-1, 125 V rms (176 V peak)

maximum working voltage

RW-16 package: reinforced insulation

per GB4943.1-2011, 380 V rms

(537 V peak) maximum working

voltage, tropical climate, altitude ≤

5000 m

RI-16-2 package: reinforced insulation per

CSA 60950-1-07 and IEC 60950-1,

400 V rms (565 V peak) maximum

working voltage; reinforced insulation

per IEC 60601-1, 250 V rms (353 V peak)

maximum working voltage

RI-16 package: reinforced insulation

per 400 V rms (565 V peak) maximum

working voltage, tropical climate,

altitude ≤ 5000 m

File E214100 File 205078 File: CQC14001105917 File 2471900-4880-0001

1 In accordance with UL 1577, each ADuM2200/ADuM2201 is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 sec (current leakage detection limit = 10 µA).

2 In accordance with DIN V VDE V 0884-10 (VDE V 0884-10):2006-12, each ADuM2200/ADuM2201 is proof tested by applying an insulation test voltage ≥1592 V peak for 1 sec

(partial discharge detection limit = 5 pC). The asterisk (*) marking branded on the components designates DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 approval.

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 15.

Parameter Symbol Value Unit Test Conditions/Comments

Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration

Minimum External Air Gap (Clearance) L(I01) 8.0 min mm Distance measured from input terminals to output

terminals, shortest distance through air along the

PCB mounting plane, as an aid to PC board layout

Minimum External Tracking (Creepage)

L(I02)

Measured from input terminals to output terminals,

shortest distance path along body

RW-16 Package 7.7 min mm

RI-16-2 Package 8.3 min mm

Minimum Internal Distance (Internal Clearance) 0.017 min mm Insulation distance through insulation

Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303, Part 1

Isolation Group II Material Group (DIN VDE 0110, 1/89, Table 1)

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 8 of 17

INSULATION CHARACTERISTICS (DIN V VDE V 0884-10 (VDE V 0884-10):2006-12)

These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by

means of protective circuits. The asterisk (*) marking branded on the components designates DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

approval for 848 V peak working voltage.

Table 16.

Description Test Conditions/Comments Symbol Characteristic Unit

Installation Classification per DIN VDE 0110

For Rated Mains Voltage ≤ 150 V rms I to IV

For Rated Mains Voltage ≤ 300 V rms I to IV

For Rated Mains Voltage ≤ 400 V rms I to IV

Climatic Classification 40/105/21

Pollution Degree per DIN VDE 0110, Table 1 2

Maximum Working Insulation Voltage VIORM 848 V peak

Input-to-Output Test Voltage, Method B1 VIORM × 1.875 = Vpd(m), 100% production test,

tini = tm = 1 sec, partial discharge < 5 pC

Vpd(m) 1592 V peak

Input-to-Output Test Voltage, Method A

After Environmental Tests Subgroup 1 VIORM × 1.5 = Vpd(m), tini = 60 sec, tm = 10 sec, partial

discharge < 5 pC

Vpd(m) 1273 V peak

After Input and/or Safety Tests Subgroup 2

and Subgroup 3

VIORM × 1.2 = Vpd(m), tini = 60 sec, tm = 10 sec, partial

discharge < 5 pC

Vpd(m) 1018 V peak

Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 6000 V peak

Surge Isolation Voltage V peak = 10 kV, 1.2 μs rise time, 50 μs, 50% fall time VIOSM 6000 V peak

Safety Limiting Values Maximum value allowed in the event of a failure;

see Figure 3

Maximum Junction Temperature TS 150 °C

Total Power Dissipation at 25°C PS 2.78 W

Insulation Resistance at TS V

IO = 500 V RS >109 Ω

3.0

2.0

1.0

00 50 100 150 200

07235-003

SAFE LIMITING POWER (W)

AMBIENT TEMPERATURE (°C)

2.5

1.5

0.5

Figure 3. Thermal Derating Curve, Dependence of Safety Limiting

Values with Case Temperature per DIN V VDE V 0884-10

RECOMMENDED OPERATING CONDITIONS

Table 17.

Parameter Symbol Min Max Unit

Operating Temperature TA

A Grade and B Grade −40 +105 °C

WA Grade and WB Grade −40 +125 °C

Supply Voltages1 V

DD1, VDD2 3.0 5.5 V

Input Signal Rise and Fall Times 1.0 ms

1 All voltages are relative to their respective grounds.

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 9 of 17

ABSOLUTE MAXIMUM RATINGS

Table 18.

Parameter Rating

Storage Temperature (T

) −65°C to +150°C

Ambient Operating Temperature (TA)

−40°C to +125°C

Supply Voltage (V

DD1

, V

DD2

)

−0.5 V to +7.0 V

Input Voltage (V

, V

)

1, 2

−0.5 V to V

DDI

+ 0.5 V

Output Voltage (V

, V

)1, 2 −0.5 V to V

DDO

+ 0.5 V

Average Output Current per Pin3

Side 1 (I

) −18 mA to +18 mA

Side 2 (I

) −22 mA to +22 mA

Common-Mode Transients

−100 kV/µs to +100 kV/µs

1 All voltages are relative to their respective grounds.

2 VDDI and VDDO refer to the supply voltages on the input and output sides

of a given channel, respectively. See the PCB Layout section.

3 See Figure 3 for maximum rated current values for various temperatures.

4 Refers to common-mode transients across the insulation barrier. Common-

mode transients exceeding the absolute maximum rating can cause latch-up

or permanent damage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

ESD CAUTION

Table 19. Maximum Continuous Working Voltage1

Parameter Max Unit Constraint

AC Voltage, Bipolar Waveform 565 V peak 50-year minimum lifetime

AC Voltage, Unipolar Waveform

Reinforced Insulation 1131 V peak 50-year minimum lifetime

DC Voltage

Reinforced Insulation 1131 V peak 50-year minimum lifetime

1 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more information.

Table 20. ADuM2200 Truth Table (Positive Logic)

Input1 V

DD1

State V

DD2

State V

Output1 V

Output1 Notes

H H Powered Powered H H

L L Powered Powered L L

H L Powered Powered H L

L H Powered Powered L H

X X Unpowered Powered H H Outputs return to the input state within

1 µs of V

DDI

power restoration.

X X Powered Unpowered Indeterminate Indeterminate Outputs return to the input state within

1 µs of V

DDO

power restoration.

1 H is logic high, L is logic low, and X is don’t care.

Table 21. ADuM2201 Truth Table (Positive Logic)

Input1 V

DD1

State V

DD2

State V

Output1 V

Output1 Notes

H H Powered Powered H H

L L Powered Powered L L

H L Powered Powered H L

L H Powered Powered L H

Unpowered

Powered

Indeterminate

Outputs return to the input state within

1 µs of V

DDI

power restoration.

X X Powered Unpowered H Indeterminate Outputs return to the input state within

1 µs of V

DDO

power restoration.

1 H is logic high, L is logic low, and X is don’t care.

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 10 of 17

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

GND

DD1 3

IA 4

GND

DD2

IB 5

GND

NC = NO CONNECT

NOTES:

1. PIN 1 AND PIN 7 ARE INTERNALLY CONNECTED TO E ACH OT HE R, AND

IT IS RECOMMENDED THAT BOTH P INS BE CONNECT E D TO A COMMO N GRO UND.

2. PIN 9 AND PIN 16 ARE I NTERNALLY CONNECTED TO E ACH OT HE R, AND

IT IS RECOMMENDED THAT BOTH P INS BE CONNECT E D TO A COMMO N GRO UND.

ADuM2200

TOP VIEW

(No t t o Scal e)

07235-004

Figure 4. ADuM2200 Pin Configuration

Table 22. ADuM2200 Pin Function Descriptions

Pin No. Mnemonic Description

1, 7 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 1 and Pin 7 are internally connected to each other, and it is

recommended that both pins be connected to a common ground.

2 NC No Internal Connection.

3 V

DD1

Supply Voltage for Isolator Side 1, 3.0 V to 5.5 V.

4 V

Logic Input A.

5 V

Logic Input B.

6 NC No Internal Connection.

8 NC No Internal Connection.

9, 16 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 16 are internally connected to each other, and it is

recommended that both pins be connected to a common ground.

10 NC No Internal Connection.

11 NC No Internal Connection.

12 V

Logic Output B.

13 V

Logic Output A.

14 V

DD2

Supply Voltage for Isolator Side 2, 3.0 V to 5.5 V.

15 NC No Internal Connection.

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 11 of 17

GND

DD1 3

OA 4

GND

DD2

IB 5

GND

NC = NO CONNECT

ADuM2201

TOP VIEW

(No t t o Scal e)

07235-005

NOTES:

1. PIN 1 AND PIN 7 ARE I NTERNALLY CONNECT E D TO E ACH OTHE R, AND

IT IS RECOMMENDED THAT BOTH P INS BE CONNECT E D TO A COMMO N GRO UND.

2. PIN 9 AND PIN 16 ARE INTE RNALLY CONNECTED TO E ACH OT HE R, AND

IT IS RECOMMENDED THAT BOTH P INS BE CONNECT E D TO A COMMO N GRO UND.

Figure 5. ADuM2201 Pin Configuration

Table 23. ADuM2201 Pin Function Descriptions

Pin No. Mnemonic Description

1, 7 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 1 and Pin 7 are internally connected to each other, and it is

recommended that both pins be connected to a common ground.

2 NC No Internal Connection.

3 V

DD1

Supply Voltage for Isolator Side 1, 3.0 V to 5.5 V.

4 V

Logic Output A.

5 V

Logic Input B.

6 NC No Internal Connection.

8 NC No Internal Connection.

9, 16 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 16 are internally connected to each other, and it is

recommended that both pins be connected to a common ground.

10 NC No Internal Connection.

11 NC No Internal Connection.

12 V

Logic Output B.

13 V

Logic Input A.

14 V

DD2

Supply Voltage for Isolator Side 2, 3.0 V to 5.5 V.

15 NC No Internal Connection.

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 12 of 17

TYPICAL PERFORMANCE CHARACTERISTICS

DATA RAT E ( M bp s)

CURRENT/ CHANNE L (mA)

10 20 30

07235-006

Figure 6. Typical Input Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation (No Output Load)

DATA RAT E ( M bp s)

CURRENT/ CHANNE L (mA)

10 20 30

07235-007

Figure 7. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation (No Output Load)

DATA RAT E ( M bp s)

CURRENT/CHANNEL ( mA)

10 20 30

07235-008

Figure 8. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation (15 pF Output Load)

DATA RAT E ( M bp s)

CURRENT ( mA)

10 20 30

07235-009

Figure 9. Typical ADuM2200 VDD1 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

DATA RAT E ( M bp s)

CURRENT (mA)

10 20 30

07235-010

Figure 10. Typical ADuM2200 VDD2 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

DATA RAT E ( M bp s)

CURRENT (mA)

10 20 30

07235-011

Figure 11. Typical ADuM2201 VDD1 or VDD2 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 13 of 17

APPLICATIONS INFORMATION

PCB LAYOUT

The ADuM2200/ADuM2201 digital isolators require no external

interface circuitry for the logic interfaces. Power supply bypassing

is strongly recommended at the input and output supply pins (see

Figure 12). Bypass capacitors are most conveniently connected

between Pin 1 and Pin 3 for VDD1 and between Pin 14 and Pin 16

for VDD2. The capacitor value should be between 0.01 μF and 0.1 μF.

The total lead length between both ends of the capacitor and the

input power supply pin should not exceed 2 mm. Consider

bypassing between Pin 3 and Pin 7 and between Pin 9 and Pin 14

unless the ground pair on each package side is connected close

to the package.

GND

DD1

GND

DD2

NC NC

GND

NC GND

07235-012

Figure 12. Recommended Printed Circuit Board Layout

In applications involving high common-mode transients, ensure

that board coupling across the isolation barrier is minimized.

Furthermore, design the board layout such that any coupling that

does occur affects all pins equally on a given component side.

Failure to ensure this can cause voltage differentials between

pins exceeding the absolute maximum ratings for the device as

specified in Table 18, thereby leading to latch-up or permanent

damage.

See the AN-1109 Application Note for board layout guidelines.

PROPAGATION DELAY-RELATED PARAMETERS

Propagation delay is a parameter that describes the length of

time it takes for a logic signal to propagate through a component.

The propagation delay to a logic low output can differ from the

propagation delay to a logic high output.

INPUT (

)

OUTPUT (V

)

PLH

PHL

50%

07235-018

Figure 13. Propagation Delay Parameters

Pulse width distortion is the maximum difference between

these two propagation delay values and is an indication of how

accurately the timing of the input signal is preserved.

Channel-to-channel matching refers to the maximum amount

that the propagation delay differs between channels within a

single ADuM2200/ADuM2201 component.

Propagation delay skew refers to the maximum amount that

the propagation delay differs between multiple ADuM2200/

ADuM2201 components operated under the same conditions.

DC CORRECTNESS AND MAGNETIC FIELD

IMMUNITY

Positive and negative logic transitions at the isolator input cause

narrow (~1 ns) pulses to be sent to the decoder via the transformer.

The decoder is bistable and is, therefore, either set or reset by

the pulses, indicating input logic transitions. In the absence of

logic transitions at the input for more than ~1 μs, a periodic set

of refresh pulses indicative of the correct input state is sent to

ensure dc correctness at the output. If the decoder receives no

internal pulses for more than approximately 5 μs, the input side

is assumed to be unpowered or nonfunctional, and the isolator

output is forced to a default state by the watchdog timer circuit

(see Table 20 and Table 21).

The limitation on the magnetic field immunity of the ADuM2200/

ADuM2201 is set by the condition in which induced voltage in the

transformer receiving coil is large enough to either falsely set or

reset the decoder. The following analysis defines the conditions

under which this can occur. The 3.3 V operating condition of

the ADuM2200/ADuM2201 is examined because it represents

the most susceptible mode of operation.

The pulses at the transformer output have an amplitude greater

than 1.0 V. The decoder has a sensing threshold at approximately

0.5 V, thus establishing a 0.5 V margin in which induced voltages

can be tolerated. The voltage induced across the receiving coil is

given by

V = (−dβ/dt) ∑ πrn2; n = 1, 2, … , N

where:

β is the magnetic flux density (gauss).

rn is the radius of the nth turn in the receiving coil (cm).

N is the number of turns in the receiving coil.

Given the geometry of the receiving coil in the ADuM2200/

ADuM2201 and an imposed requirement that the induced

voltage be, at most, 50% of the 0.5 V margin at the decoder,

a maximum allowable magnetic field is calculated as shown

in Figure 14.

MAGNE TIC FIE LD FRE QUENCY ( Hz )

100

MAXIMUM ALLO W ABLE MAG NETIC FLUX

DENSITY (kgauss)

0.001 1M

0.01

1k 10k 10M

0.1

100M100k

07235-019

Figure 14. Maximum Allowable External Magnetic Flux Density

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 14 of 17

For example, at a magnetic field frequency of 1 MHz, the

maximum allowable magnetic field of 0.2 kgauss induces a voltage

of 0.25 V at the receiving coil. This voltage is approximately

50% of the sensing threshold and does not cause a faulty output

transition. Similarly, if such an event occurs during a transmitted

pulse (and is of the worst-case polarity), it reduces the received

pulse from >1.0 V to 0.75 V—still well above the 0.5 V sensing

threshold of the decoder.

The preceding magnetic flux density values correspond to

specific current magnitudes at given distances from the

ADuM2200/ADuM2201 transformers. Figure 15 expresses

these allowable current magnitudes as a function of frequency

for selected distances. As shown in Figure 15, the ADuM2200/

ADuM2201 are immune and can be affected only by extremely

large currents operated at high frequency very close to the

component. For the 1 MHz example noted, a 0.5 kA current

placed 5 mm away from the ADuM2200/ADuM2201 is

required to affect the operation of the component.

MAGNETI C FIE LD FRE QUENCY ( Hz )

MAXI MUM ALLO WABLE CURRENT (kA)

1000

100

0.1

0.011k 10k 100M100k 1M 10M

DISTANCE = 5mm

DISTANCE = 1m

DISTANCE = 100mm

07235-020

Figure 15. Maximum Allowable Current

for Various Current-to-ADuM2200/ADuM2201 Spacings

Note that at combinations of strong magnetic field and high

frequency, any loops formed by printed circuit board traces can

induce error voltages sufficiently large to trigger the thresholds

of succeeding circuitry. Care should be taken in the layout of

such traces to avoid this possibility.

POWER CONSUMPTION

The supply current at a given channel of the ADuM2200/

ADuM2201 isolators is a function of the supply voltage, the

channel data rate, and the channel output load.

For each input channel, the supply current is given by

IDDI = IDDI (Q) f ≤ 0.5fr

IDDI = IDDI (D) × (2f − fr) + IDDI (Q) f > 0.5fr

For each output channel, the supply current is given by

IDDO = IDDO (Q) f ≤ 0.5fr

IDDO = (IDDO (D) + (0.5 × 10−3) × CL × VDDO) × (2f − fr) + IDDO (Q)

f > 0.5fr

where:

IDDI (D), IDDO (D) are the input and output dynamic supply currents

per channel (mA/Mbps).

IDDI (Q), IDDO (Q) are the specified input and output quiescent

supply currents (mA).

CL is the output load capacitance (pF).

VDDO is the output supply voltage (V).

f is the input logic signal frequency (MHz, half of the input data

rate, NRZ signaling).

fr is the input stage refresh rate (Mbps).

To calculate the total IDD1 and IDD2, the supply currents for each

input and output channel corresponding to IDD1 and IDD2 are

calculated and totaled.

Figure 6 and Figure 7 provide per-channel supply currents as a

function of data rate for an unloaded output condition. Figure 8

provides per-channel supply current as a function of data rate for

a 15 pF output condition. Figure 9 through Figure 11 provide total

IDD1 and IDD2 as a function of data rate for the ADuM2200/

ADuM2201 channel configurations.

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 15 of 17

INSULATION LIFETIME

All insulation structures eventually break down when subjected

to voltage stress over a sufficiently long period. The rate of

insulation degradation is dependent on the characteristics of the

voltage waveform applied across the insulation. In addition to the

testing performed by the regulatory agencies, Analog Devices

carries out an extensive set of evaluations to determine the

lifetime of the insulation structure within the ADuM2200/

ADuM2201 devices.

Analog Devices performs accelerated life testing using voltage

levels higher than the rated continuous working voltage.

Acceleration factors for several operating conditions are

determined. These factors allow calculation of the time to failure

at the actual working voltage.

The values shown in Table 19 summarize the peak voltage for

50 years of service life for a bipolar ac operating condition and

the maximum CSA/VDE approved working voltages. In many

cases, the approved working voltage is higher than the 50-year

service life voltage. Operation at these high working voltages

can lead to shortened insulation life in some cases.

The insulation lifetime of the ADuM2200/ADuM2201 depends

on the voltage waveform type imposed across the isolation barrier.

The iCoupler insulation structure degrades at different rates,

depending on whether the waveform is bipolar ac, unipolar ac,

or dc. Figure 16, Figure 17, and Figure 18 illustrate these

different isolation voltage waveforms.

Bipolar ac voltage is the most stringent environment. The goal

of a 50-year operating lifetime under the bipolar ac condition

determines the maximum working voltage recommended by

Analog Devices.

In the case of unipolar ac or dc voltage, the stress on the insulation

is significantly lower. This allows operation at higher working

voltages while still achieving a 50-year service life. The working

voltages listed in Table 19 can be applied while maintaining the

50-year minimum lifetime, provided that the voltage conforms

to either the unipolar ac or dc voltage cases.

Any cross-insulation voltage waveform that does not conform to

Figure 17 or Figure 18 should be treated as a bipolar ac waveform

and its peak voltage should be limited to the 50-year lifetime

voltage value listed in Table 19.

Note that the voltage presented in Figure 17 is shown as sinusoidal

for illustration purposes only. It is meant to represent any voltage

waveform varying between 0 V and some limiting value. The

limiting value can be positive or negative, but the voltage cannot

cross 0 V.

RATED P E AK V OLTAGE

07235-021

Figure 16. Bipolar AC Waveform

RATED P E AK V OLTAGE

07235-022

Figure 17. Unipolar AC Waveform

RATED P E AK V OLTAGE

07235-023

Figure 18. DC Waveform

ADuM2200/ADuM2201 Data Sheet

Rev. G | Page 16 of 17

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75(0.0295)

0.25(0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

OPLANARITY

0.10 0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

16 9

1.27 (0.0500)

BSC

03-27-2007-B

Figure 19. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-16)

Dimensions shown in millimeters and (inches)

11-15-2011-A

16 9

SEATING

PLANE

COPLANARITY

0.1

1.27 BSC

12.85

12.75

12.65

7.60

7.50

7.40

2.64

2.54

2.44

1.01

0.76

0.51

0.30

0.20

0.10

10.51

10.31

10.11

0.46

0.36

2.44

2.24

PIN 1

MARK

1.93 REF

8°

0°

0.32

0.23

0.71

0.50

0.31 45°

0.25 BSC

GAGE

PLANE

COM P LIANT TO JEDEC S TANDARDS MS -013-AC

Figure 20. 16-Lead Standard Small Outline Package, with Increased Creepage [SOIC_IC]

Wide Body

(RI-16-2)

Dimensions shown in millimeters

Data Sheet ADuM2200/ADuM2201

Rev. G | Page 17 of 17

ORDERING GUIDE

Model1, 2, 3

Number

of Inputs,

DD1

Side

Number

of Inputs,

DD2

Side

Maximum

Data Rate

(Mbps)

Maximum

Propagation

Delay, 5 V (ns)

Maximum

Pulse Width

Distortion (ns)

Temperature

Range

Package

Description

Package

Option

ADuM2200ARIZ 2 0 1 150 40 −40°C to +105°C 16-Lead SOIC_IC RI-16-2

ADuM2200ARWZ 2 0 1 150 40 −40°C to +105°C 16-Lead SOIC_W RW-16

ADuM2200WARWZ 2 0 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16

ADuM2200BRIZ 2 0 10 50 3 −40°C to +105°C 16-Lead SOIC_IC RI-16-2

ADuM2200BRWZ 2 0 10 50 3 −40°C to +105°C 16-Lead SOIC_W RW-16

ADuM2200WBRWZ 2 0 10 50 3 −40°C to +125°C 16-Lead SOIC_W RW-16

ADuM2201ARIZ 1 1 1 150 40 −40°C to +105°C 16-Lead SOIC_IC RI-16-2

ADuM2201ARWZ 1 1 1 150 40 −40°C to +105°C 16-Lead SOIC_W RW-16

ADuM2201WARWZ 1 1 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16

ADuM2201BRIZ 1 1 10 50 3 −40°C to +105°C 16-Lead SOIC_IC RI-16-2

ADuM2201BRWZ 1 1 10 50 3 −40°C to +105°C 16-Lead SOIC_W RW-16

ADuM2201WBRWZ

−40°C to +125°C

16-Lead SOIC_W

RW-16

1 Z = RoHS Compliant Part.

2 W = Qualified for Automotive Applications.

3 Tape and reel is available. The addition of an -RL suffix designates a 13” (1,000 units) tape and reel option.

AUTOMOTIVE PRODUCTS

The ADuM2200W and ADuM2201W models are available with controlled manufacturing to support the quality and reliability

requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial

models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products

shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product

ordering information and to obtain the specific Automotive Reliability reports for these models.

registered trademarks are the property of their respective owners.

D07235-0-9/15(G)

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Authorized Distributor

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