| SODER-WICK FINE-BRAID= Soder-Wick Fine-Braid ! A51-234 ee : Technical Data Shect PRODUCT DESCRIPTION Soder-Wick Fine Braid is the state of the art in desoldering. Soder-Wick is especially designed for today's heat sensitive electronic components. braid construction allows for better thermal conductivity, even at low temperatures. Soder-Wick responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less contact pressure for greater opcrator control. A full range of sizes and flux airangements are available. including an unfluxed version and a patented No Clean ype. Whatever the requirement, Soder-Wick has the answer. # Optimized weave design for faster wicking and heat transfer # Requires little or no post solder cleaning No corrosive residues }ialide free Minimal risk of heat damage to components and circuit boards TYPICAL APPLICATIONS Soder-Wick desoldering braid safely removes solder from: # Thru-Hole Components Surface Mount Device Pads BGA Pads @ Micro Circuits Terminals Lugs and Posts . Identification Script ye vt sale, pean 8 1 een: SODER-WI Its lighter mass, pure copper IC K Fl N E- BRAI D The State of The the Art in a Desaldering TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES Soder-Wick Desoldering Braid Flux Type: ____Grade WW, Type "R" Cleanup Required: NO Mi MIL.-F-142561 Military Specifications: Sve# Width Siti itd res NY Casets #00 | .022 Gold 56mm eOl. as Gold 114mm #02055" Gold 140mm | } 030" | White , 76mm 2 060 | Yellow | 132mm | ; 3 ' 080 Green 2.03mm ae 110" Blue 279mm 5 148" Brown 3.68mm 6 210" Red |} 533mm | STATIC DISSIPATIVE PACKAGING Static dissipative packaging 1s available on 45 and 10 foot bobbins. The SD bobbins qualify as electrostatic discharge protective per DOD Standard 1686 and DOD Handbook 263. Meets the static decay rate provision of MIL-B-81705C. vet a of x. tren