ADC ADC
CONTROLLER
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
CS_N
SCLK
DIN
DOUT
Vin
Iin
Vout
Iout
CLK GEN
D0
D1
D2
D3
D4
D5
D6
D7 LIA
HIA
LIB
HIB
ADC_C
VDDA
VSSA
VDDD
VSSD
AVin
AIin
AVout
AIout
A0
A2
A4
A6
MPPT CONTROLLER
SM72441
www.ti.com
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
SM72441 Programmable Maximum Power Point Tracking Controller for Photovoltaic Solar
Panels
Check for Samples: SM72441
1FEATURES DESCRIPTION
The SM72441 is a programmable MPPT controller
2• Renewable Energy Grade capable of controlling four PWM gate drive signals for
• Programmable Maximum Power Point Tracking a 4-switch buck-boost converter. Along with SM72295
• Photovoltaic Solar Panel Voltage and Current (Photovoltaic Full Bridge Driver) it creates a solution
Diagnostic for an MPPT configured DC-DC converter with
efficiencies up to 98.5%. Integrated into the chip is an
• Single Inductor Four Switch Buck-boost 8-channel, 12 bit A/D converter used to sense input
Converter Control and output voltage and current, as well as board
• VOUT Overvoltage Protection configuration. Externally programmable values
• Over-Current Protection include maximum output voltage and current as well
as different settings on slew rate, and soft-start.
PACKAGE
• TSSOP-28
Block Diagram
Figure 1. Block Diagram
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
H-Bridge Driver
SM72441
VDDA
AVIN
NC7
NC1
A0
A2
A4
A6
NC2
NC5
NC6
NC3
NC8
NC4
LED
VSSA VSSD
RST
AIIN
AIOUT
AVOUT
NC9
LIA
HIA
HIB
LIB
VDDD
10k
10k
10k
5V
0.1 PF0.1 PF0.1 PF
RB1
.1 PF
5V
RT1
PV(+)
0.01 PF0.01 PF
2.2 PF
49.9:
0.01 PF
2.2 PF
5V
R
10k
10k
10k
Current Sensing Amplifier
Current Sensing Amplifier
PWM1
PWM2
PWM3
PWM4
5V
Vo
Gate 1
Gate 2
Gate 3
Gate 4
Rsen_out
Gate 1
Gate 2
Gate 3
Gate 4
Current sensing Amplifier
Rsen_in
Current Sensing Amplifier
RFB1
RFB2
RT2 RT3 RT4
RB2 RB3 RB4
R
150k
10k
10k
PV(-)
Vo
CONFIGURATION RESISTOR OVP
SM72441
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
www.ti.com
Figure 2. Typical Application Circuit
2Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: SM72441
SM72441
VDDA
AVIN
NC7
NC1
A0
A2
A4
A6
NC3
NC4 NC8
NC2
NC6
NC5
LED
VSSA
VSSD
RST
AIIN
AIOUT
AVOUT
OVP
NC9
LIA
HIA
HIB
LIB
VDDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
15
16
SM72441
www.ti.com
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
Connection Diagram
Top View
Figure 3. TSSOP-28 Package
See Package Drawing PW0028A
Pin Descriptions
Pin Name Description
1 RST Active low signal. External reset input signal to the digital circuit.
2 NC1 No Connect. This pin should be grounded.
3 VDDD Digital supply voltage. This pin should be connected to a 5V supply, and bypassed to VSSD with a 0.1uF monolithic
ceramic capacitor.
4 VSSD Digital ground. The ground return for the digital supply and signals.
5 NC2 No Connect. This pin should be pulled up to the 5V supply using 10k resistor.
6 NC3 No Connect. This pin should be grounded using a 10k resistor.
7 NC4 No Connect. This pin should be grounded using a 10k resistor.
8 NC5 No Connect. This pin should be pulled up to 5V supply using 10k resistor.
9 NC6 No Connect. This pin should be pulled up to 5V supply using 10k resistor.
10 NC7 No Connect. This pin should be grounded.
11 LED LED pin outputs a pulse during normal operation.
12 VDDA Analog supply voltage. This voltage is also used as the reference voltage. This pin should be connected to a 5V supply,
and bypassed to VSSA with a 1uF and 0.1uF monolithic ceramic capacitor.
13 VSSA Analog ground. The ground return for the analog supply and signals.
14 A0 A/D Input Channel 0. Connect a resistor divider to 5V supply to set the maximum output voltage. Please refer to
application section for more information on setting the resistor value.
15 AVIN A/D Input to sense input voltage.
16 A2 A/D Input Channel 2. Connect a resistor divider to 5V supply to set MPPT update rate. Please refer to application section
for more information on setting the resistor value.
17 AVOUT A/D Input to sense the output voltage.
18 A4 A/D Input Channel 4. Connect a resistor divider to 5V supply to set the maximum output current. Please refer to
application section for more information on setting the resistor value.
19 AIIN A/D Input to sense input current.
20 A6 A/D Input Channel 6. Connect a resistor divider to 5V supply to set the maximum output voltage slew rate. Please refer to
application section for more information on setting the resistor value.
21 AIOUT A/D Input to sense the output current.
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: SM72441
SM72441
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
www.ti.com
Pin Descriptions (continued)
Pin Name Description
22 NC8 No Connect. This pin should be grounded using a 10k resistor.
23 NC9 No Connect. This pin should be connected with 150k pull-up resistor to 5V supply.
24 LIB Low side boost PWM output.
25 HIB High side boost PWM output.
26 HIA High side buck PWM output.
27 LIA Low side buck PWM output.
28 OVP Overvoltage Protection Pin. Active Low. SM72441 will reset once voltage on this pin drops below its threshold voltage.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Analog Supply Voltage VA(VDDA -VSSA) -0.3 to 6.0V
Analog Supply Voltage VD(VDDD -VSSD) -0.3 to VA+0.3V, max 6.0V
Voltage on Any Pin to GND -0.3 to VA+0.3V
Input Current at Any Pin (Note 3) ±10 mA
Package Input Current (Note 3) ±20 mA
Storage Temperature Range -65°C to +150°C
ESD Rating(3) Human Body Model 2 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings indicate conditions for which the device is intended to be functional, but
does not ensure specific performance limits. For specified performance limits and associated test conditions, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.
Recommended Operating Conditions
Operating Temperature -40°C to 105°C
VASupply Voltage +4.75V to +5.25V
VDSupply Voltage +4.75V to VA
Digital Input Voltage 0 to VA
Analog Input Voltage 0 to VA
Junction Temperature -40°C to 125°C
4Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: SM72441
SM72441
www.ti.com
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
Electrical Characteristics
Specifications in standard typeface are for TJ= 25°C, and those in boldface type apply over the full operating junction
temperature range.(1)
Symbol Parameter Conditions Min Typ Max Units
ANALOG INPUT CHARACTERISTICS
AVin, AIin Input Range - 0 to VA- V
AVout, AIout
IDCL DC Leakage Current - - ±1 µA
Track Mode - 33 - pF
CINA Input Capacitance(2) Hold Mode - 3 - pF
DC Voltage Measurement
VERR 0.1 %
Accuracy
DIGITAL INPUT CHARACTERISTICS
VIL Input Low Voltage - - 0.8 V
VIH Input High Voltage 2.8 - - V
CIND Digital Input Capacitance(2) - 2 4pF
IIN Input Current - ±0.01 ±1 µA
DIGITAL OUTPUT CHARACTERISTICS
VOH Output High Voltage ISOURCE = 200 µA VA= VD= 5V VD-0.5 - - V
VOL Output Low Voltage ISINK = 200 µA to 1.0 mA VA= VD= 5V - - 0.4 V
Hi-Impedance Output Leakage
IOZH , IOZL VA= VD= 5V ±1 µA
Current
Hi-Impedance Output
COUT 24pF
Capacitance(2)
POWER SUPPLY CHARACTERISTICS (CL= 10 pF)
Analog and Digital Supply
VA,VDVA≥VD4.75 55.25 V
Voltages
IA+ IDTotal Supply Current VA= VD= 4.75V to 5.25V 7 10 15 mA
PCPower Consumption VA= VD= 4.75V to 5.25V 50 78 mW
PWM OUTPUT CHARACTERISTICS
fPWM PWM switching frequency 210 kHz
tDEAD Dead time 38 ns
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Texas Instrument’s Average Outgoing Quality Level
(AOQL).
(2) Not tested. Specified by design.
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: SM72441
RESET
SOFT-START
MPPT
Buck
Boost
Iout >=
Iout_th
Iout < Iout_th
Iout >= Iout_th
RST Pin is low or
OVP Pin is low
Iout < Iout_th
SM72441
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
www.ti.com
OPERATION DESCRIPTION
OVERVIEW
The SM72441 is a programmable MPPT controller capable of outputting four PWM gate drive signals for a 4-
switch buck-boost converter. Refer to the Typical Application Circuit diagram (Figure 2).
The SM72441 uses an advanced digital controller to generate its PWM signals. A maximum power point tracking
(MPPT) algorithm monitors the input current and voltage and controls the PWM duty cycle to maximize energy
harvested from the photovoltaic module. MPPT performance is very fast. Convergence to the maximum power
point of the module typically occurs within 0.01s. This enables the controller to maintain optimum performance
under fast-changing irradiance conditions.
Transitions between buck, boost, and buck-boost modes are smoothed, and advanced digital PWM dithering
techniques are employed to increase effective PWM resolution. Output voltage and current limiting functionality
are integrated into the digital control logic. The controller is capable of handling both shorted and no-load
conditions and will recover smoothly from both.
Figure 4. High Level State Diagram for Startup
STARTUP
SM72441 has a soft start feature that will ramp its output voltage for a fixed time of 250ms. MPPT mode will be
entered during soft start if the load current exceeded the minimum current threshold. Otherwise, buck-boost
operation is entered after soft-start is finished where the ratio between input and output voltage is 1:1. Refer to
Figure 4 for a high level state diagram of startup. The current threshold to transition between MPPT to standby
(buck-boost) mode and vice versa can be set by feeding the output of current sensing amplifier (Figure 2) to the
AIIN and AIOUT pin. For an appropriate voltage level, refer to the AIIN AND AIOUT PIN section of this
datasheet.
6Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: SM72441
VOUT_MAX = 5 x RB1
RT1 + RB1 x(RFB1 + RFB2)
RFB2
SM72441
www.ti.com
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
Figure 5. Start-Up Waveforms of Controlled Output
MAXIMUM OUTPUT VOLTAGE
Maximum output voltage on the SM72441 is set by resistor divider ratio on pin A0. (Please refer to Figure 2
Typical Application Circuit).
(1)
Where RT1 and RB1 are the resistor divider on the ADC pin A0 and RFB1 and RFB2 are the output voltage
feedback resistors. A typical value for RFB2 is about 2 kΩ.
CURRENT LIMIT SETTING
Maximum output current can be set by changing the resistor divider on A4 (pin 18). (Refer to Figure 2 ).
Overcurrent at the output is detected when the voltage on AIOUT (pin 21) equals to the voltage on A4 (pin 18).
The voltage on A4 can be set by a resistor divider connected to 5V whereas a current sense amplifier output can
be used to set the voltage on AIOUT.
AIIN AND AIOUT PIN
These two pins are used to set current threshold from standby (buck-boost mode) to MPPT mode and from
MPPT mode into standby mode.
In order to transition from standby to MPPT mode, the following conditions have to be satisfied:
1) AIIN and AIOUT voltage > 0.488V
2) Iout < Iout_max
On the other hand, in order to transition from MPPT to standby mode, the following condition have to be
satisfied:
1) AIIN and AIOUT voltage < 0.293V
2) Iout < Iout_max
Current limit is triggered when AIOUT (pin 21) voltage is equal to A4 (pin 18).
AVIN PIN
AVIN pin is an A/D input to sense the input voltage of SM72441. A resistor divider can be used to scale the max
voltage to about 4V, which is 80% of the full scale of the A/D input.
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: SM72441
SM72441
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
www.ti.com
CONFIGURABLE SETTINGS
The voltage on A0 sets the max output voltage; whereas the voltage on A2 enables MPPT update rate and limits
the max boost ratio when output current is below the standby threshold. Output current limit is set by the voltage
on A4 and output voltage slew rate limit is set on A6. In order to set a slew rate limit of 125V/sec, the ratio of the
two resistors in A6 should be 9:1.
The low current condition is detected if the voltage on AIIN is less than 0.488V (rising) and 0.293 (falling) + ΔI or
if the voltage on AIOUT is less than 0.488 V (rising) and 0.293 (falling) + ΔI. If low current is detected, the
converter operates in standby mode and limit the maximum duty cycle to either a 1 (buck-boost), 1.15 (boost) or
1.25 (boost) conversion ratio (programmable). In this case no MPPT will be performed.
The actual value of current will depend on the gain of the current sensing amplifier circuitry that feeds the AIIN
and AIOUT pins.
For more complete information on the various settings based on the voltage level of A2, please refer to Table 1
below. Vfs denotes the full scale voltage of the ADC which is equal to VDDA where VDDA is a reference voltage
to analog ground.
A typical value for top configuration resistors (RT1 to RT4) should be 20 kΩ.
Table 1. List of Configurable Modes on ADC Channel 2
Low Current
ADC Channel 2 MPPT Update Time Slew Rate Detection Initial Boost Ratio Delta I
Detection
0 < VADC2 < Vfs/16 1.2 ms Disabled Disabled N/A N/A
1Vfs/16 < VADC2 <2Vfs/16 38 ms Disabled Disabled N/A N/A
2Vfs/16 < VADC2 <3Vfs/16 77 ms Disabled Disabled N/A N/A
3Vfs/16 < VADC2 <4Vfs/16 38 ms Enabled Disabled N/A N/A
4Vfs/16 < VADC2 <5Vfs/16 38 ms Enabled Enabled 1.15 60 (0.3 A)
5Vfs/16 < VADC2 <6Vfs/16 38 ms Enabled Enabled 1.15 90 (0.45 A)
6Vfs/16 < VADC2 <7Vfs/16 38 ms Enabled Enabled 1.15 120(0.6 A)
7Vfs/16 < VADC2 <8Vfs/16 38 ms Enabled Enabled 1.25 60
8Vfs/16 < VADC2 <9Vfs/16 38 ms Enabled Enabled 1.25 90
9Vfs/16 < VADC2 <10Vfs/16 38 ms Enabled Enabled 1.25 120
10Vfs/16 < VADC2 <11Vfs/16 77 ms Enabled Enabled 1.15 60
11Vfs/16 < VADC2 <12Vfs/16 77 ms Enabled Enabled 1.15 90
12Vfs/16 < VADC2 <13Vfs/16 77 ms Enabled Enabled 1.15 120
13Vfs/16 < VADC2 <14Vfs/16 77 ms Enabled Enabled 1.25 60
14Vfs/16 < VADC2 <15Vfs/16 77 ms Enabled Enabled 1.25 90
15Vfs/16 < VADC2 <16Vfs/16 77 ms Enabled Enabled 1.25 120
8Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: SM72441
VIN
VA
C1
D1
D2
R1C2
3 pF
30 pF
Conversion Phase: Switch Open
Track Phase: Switch Close
SM72441
www.ti.com
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
RESET PIN
When the reset pin is pulled low, the chip will cease its normal operation and turn-off all of its PWM outputs.
Below is an oscilloscope capture of a forced reset condition.
Figure 6. Reset Operational Behavior
As seen in Figure 6, the initial value for output voltage and load current are 28V and 1A respectively. After the
reset pin is grounded, both the output voltage and load current decreases immediately. MOSFET switching on
the buck-boost converter also stops immediately. VLOB indicates the low side boost output from the SM72295.
ANALOG INPUT
An equivalent circuit for one of the ADC input channels is shown in Figure 7. Diode D1 and D2 provide ESD
protection for the analog inputs. The operating range for the analog inputs is 0V to VA. Going beyond this range
will cause the ESD diodes to conduct and result in erratic operation.
The capacitor C1 in Figure 7 has a typical value of 3 pF and is mainly the package pin capacitance. Resistor R1
is the on resistance of the multiplexer and track / hold switch; it is typically 500Ω. Capacitor C2 is the ADC
sampling capacitor; it is typically 30 pF. The ADC will deliver best performance when driven by a low-impedance
source (less than 100Ω). This is especially important when sampling dynamic signals. Also important when
sampling dynamic signals is a band-pass or low-pass filter which reduces harmonic and noise in the input. These
filters are often referred to as anti-aliasing filters.
Figure 7. Equivalent Input Circuit
DIGITAL INPUTS AND OUTPUTS
The digital input signals have an operating range of 0V to VA, where VA= VDDA - VSSA. They are not prone to
latch-up and may be asserted before the digital supply VD, where VD= VDDD - VSSD, without any risk. The
digital output signals operating range is controlled by VD. The output high voltage is VD– 0.5V (min) while the
output low voltage is 0.4V (max).
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: SM72441
SM72441
SNOSB64G –OCTOBER 2010–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: SM72441
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SM72441MT/NOPB ACTIVE TSSOP PW 28 48 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 S72441
SM72441MTE/NOPB ACTIVE TSSOP PW 28 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 S72441
SM72441MTX/NOPB ACTIVE TSSOP PW 28 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 S72441
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2017
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SM72441MTE/NOPB TSSOP PW 28 250 178.0 16.4 6.8 10.2 1.6 8.0 16.0 Q1
SM72441MTX/NOPB TSSOP PW 28 2500 330.0 16.4 6.8 10.2 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SM72441MTE/NOPB TSSOP PW 28 250 210.0 185.0 35.0
SM72441MTX/NOPB TSSOP PW 28 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
