5 V, 3 A, Logic Controlled
High-Side Power Switch
Data Sheet ADP196
Rev. 0 Document Feedback
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FEATURES
Low RDSON: 10 mΩ (WLCSP) or 27 mΩ (LFCSP)
Wide input voltage range: 1.8 V to 5.5 V
Quick output discharge (QOD) circuit (ADP196-01)
3 A continuous operating current to 70°C
1.2 V logic-compatible enable input
Low 25 μA quiescent current, VIN = 1.8 V
Low 40 μA quiescent current, VIN = 5.5 V
Overtemperature and overcurrent protection
Ultralow shutdown current: <1 μA
Ultrasmall 1.0 mm × 1.5 mm, 0.5 mm pitch, 6-ball WLCSP
Tiny 2.0 mm × 2.0 mm × 0.55 mm, 0.65 mm pitch, 6-lead LFCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
TYPICAL APPLICATION CIRCUIT
GND
EN LOAD
V
IN
V
OUT
ADP196
CHARGE PUMP
OVERCURRENT
AND SLEW RATE
CONTROL
OFF
ON
10704-001
+
–
OVERTEMPERATURE
PROTECTION
Figure 1.
GENERAL DESCRIPTION
The ADP196 is a high-side load switch designed for operation
from 1.8 V to 5.5 V. This load switch provides power domain
isolation, helping to extend battery operation. The device contains
a low on-resistance, N-channel MOSFET that supports more
than 3 A of continuous current and minimizes power loss. In
addition, RDSON is constant, independent of the VIN voltage.
The low 25 μA quiescent current and ultralow shutdown current
make the ADP196 ideal for battery-powered portable equipment.
The built-in level shifter for enable logic makes the ADP196
compatible with many processors and GPIO controllers.
Overtemperature protection circuitry is activated if the junction
temperature exceeds 125°C, thereby protecting the ADP196 and
downstream circuits from potential damage. Overcurrent pro-
tection is provided in the form of constant current limiting.
The ADP196-01 incorporates an internal quick output discharge
circuit to discharge the output capacitance when the ADP196-01
output is disabled.
The ADP196 in the WLCSP package occupies minimal printed
circuit board (PCB) area with a footprint of less than 1.5 mm2
and a height of 0.60 mm.
The ADP196 is available in an ultrasmall, 1.0 mm × 1.5 mm,
0.5 mm pitch, 6-ball WLCSP and a 2.0 mm × 2.0 mm × 0.55 mm,
0.65 mm pitch, 6-lead LFCSP.
ADP196* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
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DOCUMENTATION
Data Sheet
•ADP196: 5V, 3A Logic Controlled High-Side Power Switch
Data Sheet
User Guides
•UG-414: Evaluating the ADP196 High-Side Load Switch
DESIGN RESOURCES
•ADP196 Material Declaration
•PCN-PDN Information
•Quality And Reliability
•Symbols and Footprints
DISCUSSIONS
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ADP196 Data Sheet
Rev. 0 | Page 2 of 12
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Typical Application Circuit ............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Diagram ........................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................9
Applications Information .............................................................. 10
Capacitor Selection .................................................................... 10
Ground Current .......................................................................... 10
Enable Feature ............................................................................ 10
Timing.......................................................................................... 11
Current-Limit and Thermal Overload Protection ................. 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 12
REVISION HISTORY
3/13—Revision 0: Initial Version
Data Sheet ADP196
Rev. 0 | Page 3 of 12
SPECIFICATIONS
VIN = 1.8 V, VEN = VIN, IOUT = 1 A, TA = 25°C, TJ = −40°C to +85°C for minimum/maximum specifications, unless otherwise noted.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE VIN TJ = −40°C to +85°C 1.8 5.5 V
EN INPUT
EN Input Logic High VIH VIN = 1.8 V to 5.5 V 1.2 V
EN Input Logic Low
V
IL
V
IN
= 1.8 V to 5.5 V
0.4
V
EN Input Pull-Down Current IEN VIN = 1.8 V 500 nA
CURRENT
Ground Current IGND VIN = 1.8 V 25 µA
VIN = 3.4 V 25 µA
VIN = 4.2 V 30 40 µA
VIN = 5.5 V 40 µA
Shutdown Current IOFF VEN = GND, VOUT = 0 V, VIN = 4.2 V 0.25 µA
VEN = GND, VOUT = 0 V, VIN = 1.8 V to 5.5 V 40 µA
Continuous Operating Current
1
I
OUT
V
IN
= 1.8 V to 5.5 V
3
A
VIN TO VOUT ON RESISTANCE RDSON
WLCSP VIN = 5.5 V 0.01 Ω
VIN = 4.2 V 0.01 Ω
VIN = 1.8 V 0.01 0.015 Ω
LFCSP VIN = 5.5 V 0.027 Ω
VIN = 4.2 V 0.027 Ω
VIN = 1.8 V 0.027 0.036 Ω
VOUT TURN-ON DELAY TIME See Figure 2
Turn-On Delay Time tON_D LY VIN = 1.8 V to 5.5 V, CLOAD = 1 µF 2 ms
ACTIVE PULL-DOWN RESISTANCE
(ADP196-01 OPTION ONLY)
RPULLDOWN VIN = 3.2 V 370 Ω
CURRENT-LIMIT THRESHOLD ILIM VIN = 1.8 V to 5.5 V, CLOAD = 1 µF 3.1 4 A
THERMAL SHUTDOWN
Thermal Shutdown Threshold
TS
SD
T
J
rising
125
°C
Thermal Shutdown Hysteresis TSSD-HYS 15 °C
1 At an ambient temperature of 85°C, the part can withstand a continuous current of 2.22 A. At a load current of 3 A, the operational lifetime derates to 2190 hours.
TIMING DIAGRAM
VEN
VOUT
TURN-ON
RISE
90%
10%
TURN-OFF
DELAY
TURN-OFF
FALL
TURN-ON
DELAY
10704-002
Figure 2. Timing Diagram
ADP196 Data Sheet
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN to GND −0.3 V to +6.5 V
VOUT to GND −0.3 V to VIN
EN to GND −0.3 V to +6.5 V
Continuous Drain Current
TA = 25°C ±4 A
TA = 85°C ±2.22 A
Continuous Diode Current −50 mA
Storage Temperature Range
−65°C to +150°C
Operating Junction Temperature Range −40°C to +105°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 3. Typical θJA and ΨJB Values
Package Type θJA ΨJB Unit
6-Ball WLCSP 260 58 °C/W
6-Lead LFCSP 68.9 44.1 °C/W
ESD CAUTION
Data Sheet ADP196
Rev. 0 | Page 5 of 12
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VIN VOUT
1 2
VIN
A
BVOUT
ENC GND
TOP VI EW
(No t t o Scal e)
ADP196
10704-003
Figure 3. 6-Ball WLCSP Pin Configuration
Table 4. 6-Ball WLCSP Pin Function Descriptions
Pin No. Mnemonic Description
A1, B1 VIN Input Voltage.
A2, B2 VOUT Output Voltage.
C1 EN Enable Input. Drive EN high to turn on the switch, or drive EN low to turn off the switch.
C2 GND Ground.
3GND
1VOUT1
2VOUT2
4 EN
6VIN1
5VIN2
10704-004
ADP196
TOP VIEW
NOTES
1. EXPOSED PAD MUST BE CONNECTED
TO GROUND.
Figure 4. 6-Lead LFCSP Pin Configuration
Table 5. 6-Lead LFCSP Pin Function Descriptions
Pin No. Mnemonic Description
1 VOUT1 Output Voltage. Connect VOUT1 and VOUT2 together.
2 VOUT2 Output Voltage. Connect VOUT1 and VOUT2 together.
3 GND Ground.
4 EN Enable Input. Drive EN high to turn on the switch, or drive EN low to turn off the switch.
5 VIN2 Input Voltage. Connect VIN1 and VIN2 together.
6 VIN1 Input Voltage. Connect VIN1 and VIN2 together.
EP The exposed pad must be connected to ground.
ADP196 Data Sheet
Rev. 0 | Page 6 of 12
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 1.8 V, VEN = VIN, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
RDSON (Ω)
–40 –30 –20 –10 010 20 30 40 50 60 70 80 90
TEMPERATURE ( °C)
0.2V
1.0V
3.0V
5.5V
10704-005
Figure 5. RDSON vs. Temperature, IOUT = 50 mA, Different Input Voltages (VIN)
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
RDS
ON
(Ω)
–40 –30 –20 –10 010 20 30 40 50 60 70 80 90
TEMPERATURE ( °C)
0.2V
1.0V
3.0V
5.5V
10704-006
Figure 6. RDSON vs. Temperature, IOUT = 3 A, Different Input Voltages (VIN)
0
0.005
0.010
0.015
0.020
0.025
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
RDS
ON
(Ω)
V
IN
(V)
50mA
100mA
200mA
500mA
1000mA
3000mA
10704-007
Figure 7. RDSON vs. Input Voltage (VIN), Different Load Currents
0
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
VOLTAGE DROP (V)
V
IN
(V)
10704-008
50mA
100mA
200mA
500mA
1000mA
3000mA
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Figure 8. Voltage Drop vs. Input Voltage (VIN), Different Load Currents
0
5
10
15
20
25
30
35
40
45
50
–40 –5 25 55 85
GROUND CURRENT (µA)
TEMPERATURE ( °C)
10704-009
100mA
200mA
500mA
1000mA
3000mA
Figure 9. Ground Current vs. Temperature, Different Load Currents,
VIN = 1.8 V
0
5
10
15
20
25
30
35
40
45
50
GROUND CURRENT (µA)
–40
–5 25 55 85
TEMPERATURE ( °C)
10704-010
100mA
200mA
500mA
1000mA
3000mA
Figure 10. Ground Current vs. Temperature, Different Load Currents,
VIN = 3.3 V
Data Sheet ADP196
Rev. 0 | Page 7 of 12
0
5
10
15
20
25
30
35
40
45
50
–40 –5 25 55 85
GROUND CURRENT (µA)
TEMPERATURE ( °C)
10704-011
100mA
200mA
500mA
1000mA
3000mA
Figure 11. Ground Current vs. Temperature, Different Load Currents,
VIN = 5.5 V
0
5
10
15
20
25
30
35
40
45
50
10 100 1000 10000
GROUND CURRENT (µA)
LOAD CURRENT ( mA)
1.8V
1.9V
2.0V
2.4V
2.8V
3.2V
3.6V
4.0V
5.0V
5.5V
10704-012
Figure 12. Ground Current vs. Load Current, Different Input Voltages (VIN)
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
–40 –20 020 40 60 80 100
SHUT DOWN CURRE NT (µ A)
TEMPERATURE ( °C)
10704-013
1.8V
1.9V
2.0V
2.4V
2.8V
3.2V
3.6V
4.0V
5.0V
5.5V
Figure 13. Shutdown Current vs. Temperature, Output Open,
Different Input Voltages (VIN)
TEMPERATURE ( °C)
0.01
0.1
1.0
10
100
–40 –20 020 40 60 80 100
SHUT DOWN CURRE NT (µA)
10704-014
1.8V
1.9V
2.0V
2.4V
2.8V
3.2V
3.6V
4.0V
5.0V
5.5V
Figure 14. Shutdown Current vs. Temperature, VOUT = 0 V,
Different Input Voltages (VIN)
CH1 20mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 500mV
BW
10704-016
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 15. Typical Turn-On Time and Inrush Current, VIN = 1.8 V,
COUT = 47 μF, 330 Ω Load
CH1 50mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 500mV
BW
10704-015
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 16. Typical Turn-On Time and Inrush Current, VIN = 1.8 V,
COUT = 100 µF, 330 Ω Load
ADP196 Data Sheet
Rev. 0 | Page 8 of 12
CH1 20mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 1V
BW
10704-018
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 17. Typical Turn-On Time and Inrush Current, VIN = 3.3 V,
COUT = 47 μF, 330 Ω Load
CH1 50mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 1V
BW
10704-017
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 18. Typical Turn-On Time and Inrush Current, VIN = 3.3 V,
COUT = 100 μF, 330 Ω Load
CH1 20mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 2V
BW
10704-020
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 19. Typical Turn-On Time and Inrush Current, VIN = 5 V,
COUT = 47 μF, 330 Ω Load
CH1 50mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 2V
BW
10704-019
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 20. Typical Turn-On Time and Inrush Current, VIN = 5 V,
COUT = 100 μF, 330 Ω Load
Data Sheet ADP196
Rev. 0 | Page 9 of 12
THEORY OF OPERATION
The ADP196 is a high-side NMOS load switch controlled by an
internal charge pump. The ADP196 is designed to operate with
power supply voltages from 1.8 V to 5. 5 V.
An internal charge pump biases the NMOS switch to achieve a
relatively constant, ultralow on resistance of 10 mΩ across the
entire input voltage range (6-ball WLCSP package). The use of the
internal charge pump also allows for controlled turn-on times.
Turning the NMOS switch on and off is controlled by the enable
input, EN, which is capable of interfacing directly to 1.2 V logic
signals.
GND
EN
VIN VOUT
10704-022
CHARGE P UM P
OV E RCURRE NT AND
SL E W RATE CONT ROL
OVERTEMPERATURE
PROTECTION
QOD ADP196-01 ONL Y
Figure 21. Functional Block Diagram
The ADP196 supports 3 A of continuous current as long as TJ is
less than 70°C. At 85°C, the rated current decreases to 2.22 A.
Overcurrent protection limits the output current to 4 A.
The overtemperature protection circuit is activated if the load
current causes the junction temperature to exceed 125°C. When
this occurs, the overtemperature protection circuitry disables
the output until the junction temperature falls below approximately
110°C, at which point the output is reenabled. If the fault condition
persists, the output cycles off and on until the fault is removed.
Additional protection is provided by an overcurrent limit that
forces the device into a constant current mode of operation.
The ADP196-01 incorporates a quick output discharge (QOD)
circuit to discharge the output capacitance when the ADP196-01
output is disabled.
ESD protection structures are shown in the block diagram as
Zener diodes (see Figure 21).
The ADP196 is a low quiescent current device with a nominal
4 MΩ pull-down resistor on its enable pin (EN).
The ADP196 is available in a space-saving 1.0 mm × 1.5 mm,
0.5 mm pitch, 6-ball WLCSP and a tiny 2.0 mm × 2.0 mm ×
0.55 mm, 0.65 mm pitch, 6-lead LFCSP.
ADP196 Data Sheet
Rev. 0 | Page 10 of 12
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP196 is designed for operation with small, space-saving
ceramic capacitors but functions with most commonly used
capacitors when the effective series resistance (ESR) value is
carefully considered. The ESR of the output capacitor affects the
response to load transients. A typical 1 µF capacitor with an ESR of
0.1 Ω or less is recommended for good transient response. Using a
larger value of output capacitance improves the transient response
to large changes in load current.
Input Bypass Capacitor
Connecting at least 1 µF of capacitance from VIN to GND reduces
the circuit sensitivity to the PCB layout, especially when high
source impedance or long input traces are encountered. When
more than 1 µF of output capacitance is required, increase the
input capacitance to match it.
GROUND CURRENT
The major source of ground current in the ADP196 is the internal
charge pump for the FET drive circuitry. Figure 22 shows the
typical ground current when VEN = VIN and varies from 1.8 V
to 5.5 V.
0
5
10
15
20
25
30
35
40
45
50
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
GROUND CURRENT (µA)
V
IN
(V)
10704-023
50mA
100mA
200mA
500mA
1000mA
3000mA
Figure 22. Ground Current vs. Input Voltage (VIN) for Different Load Currents
ENABLE FEATURE
The ADP196 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 23,
when a rising voltage (VEN) on the EN pin crosses the active
threshold, VOUT turns on. When a falling voltage (VEN) on
the EN pin crosses the inactive threshold, VOUT turns off.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
00.2 0.4 0.6 0.8 1.0 1.2
V
OUT
(V)
ENABL E V OLTAGE (V)
V
EN
FALLING V
EN
RIS ING
V
OUT
AT 3.6V
10704-024
Figure 23. Typical EN Pin Operation
As shown in Figure 23, the EN pin has built-in hysteresis. The
hysteresis prevents on/off oscillations that can occur due to
noise on the EN pin as it passes through the threshold points.
The EN pin active/inactive thresholds are derived from the VIN
voltage; therefore, these thresholds vary with changing input
voltage. Figure 24 shows the typical EN active/inactive thresholds
when the input voltage varies from 1.8 V to 5.5 V.
0
0.2
0.4
0.6
0.8
1.0
1.2
1.8 2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0 5.4
ENABLE THRESHOLD (V)
INPUT VOLTAGE (V)
EN RISE
EN FALL
10704-025
Figure 24. Typical EN Thresholds vs. Input Voltage (VIN)
Data Sheet ADP196
Rev. 0 | Page 11 of 12
TIMING
Turn-on delay is defined as the interval between the time that
VEN exceeds the rising threshold voltage and when VOUT rises to
~10% of its final value. The ADP196 includes circuitry that has
a typical 2 ms turn-on delay and a controlled rise time to limit
the VIN inrush current. As shown in Figure 25 and Figure 26,
the turn-on delay is nearly independent of the input voltage.
CH1 20mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 500mV BW
10704-026
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 25. Typical Turn-On Time and Inrush Current, VIN = 1.8 V,
COUT = 47 μF, 330 Ω Load
CH1 20mAΩCH2 1V M1ms A CH2 1.18V
1
T 10.6%
BW
CH3 2V
BW
10704-027
BW
T
VOUT
INP UT CURRENT
ENABLE
2
3
Figure 26. Typical Turn-On Time and Inrush Current, VIN = 5 V,
COUT = 47 μF, 330 Ω Load
The rise time is defined as the time it takes the output voltage
to rise from 10% to 90% of VOUT reaching its final value. The rise
time is dependent on the rise time of the internal charge pump.
For very large values of output capacitance, the RC time constant
(where C is the load capacitance, CLOAD, and R is the RDSON||RLOAD)
can become a factor in the rise time of the output voltage. Because
RDSON is much smaller than RLOAD, an adequate approximation
for RC is RDSON × CLOAD. An input or load capacitor is not required
for the ADP196; however, capacitors can be used to suppress noise
on the board.
The turn-off time is defined as the time it takes for the output
voltage to fall from 90% to 10% of VOUT reaching its final value.
The turn-off time is also dependent on the RC time constant
of the output capacitance and load resistance. Figure 27 shows
typical turn-off times with VIN = 1.8 V to 5 V, COUT = 47 μF, and
RLOAD = 330 Ω.
0
1.0
2.0
3.0
4.0
5.0
6.0
00.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10
TIME (SEC)
V
OUT
(V)
V
EN
V
IN
= 5.0V
V
IN
= 3.3V
V
IN
= 1.8V
10704-028
Figure 27. Typical Turn-Off Time
CURRENT-LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP196 is protected against damage due to excessive power
dissipation by current-limit and thermal overload protection
circuits. The ADP196 is designed to limit current when the output
load reaches 4 A (typical). When the output load exceeds 4 A,
the output voltage is reduced to maintain a constant current limit.
Thermal overload protection is included, which limits the junction
temperature to a maximum of 125°C (typical). Under extreme
conditions (that is, high ambient temperature and/or high power
dissipation) when the junction temperature starts to rise above
125°C, the output is turned off, reducing the output current to
zero. When the junction temperature falls below 110°C, the
output is turned on again, and the output current is restored to
its operating value.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP196 current limits so that only 4 A is
conducted into the short. If self-heating of the junction is great
enough to cause its temperature to rise above 125°C, thermal
shutdown is activated, turning off the output and reducing the
output current to zero. As the junction temperature cools and
falls below 110°C, the output turns on and conducts 4 A into
the short, again causing the junction temperature to rise above
125°C. This thermal oscillation between 110°C and 125°C causes a
current oscillation between 4 A and 0 mA that continues as long
as the short remains at the output.
Current-limit and thermal overload protections are intended to
protect the device against accidental overload conditions. For
reliable operation, device power dissipation must be externally
limited so that the junction temperature does not exceed 125°C.
ADP196 Data Sheet
Rev. 0 | Page 12 of 12
OUTLINE DIMENSIONS
11-08-2012-B
A
B
C
0.675
0.595
0.515
0.380
0.355
0.330
0.270
0.240
0.210
1.000
0.950
0.900
1.500
1.450
1.400
12
BOTTOM VIEW
(BALL SI DE UP)
TOP VIEW
(BALL SI DE DOW N)
SIDE VIEW
0.345
0.295
0.245
1.00
REF
0.50
BSC
BALLA1
IDENTIFIER
SEATING
PLANE
0.50 BS C
COPLANARITY
0.075
Figure 28. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
6
1
4
3
0.35
0.30
0.25
BOTTOM VIEW
PI N 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 RE F
0.05 M AX
0.02 NOM
0.65 BS C
EXPOSED
PAD
PI N 1
INDICATOR
(R 0. 15)
FOR PRO P E R CONNECTION O F
THE EXPOSED PAD, REFER TO
THE P IN CONFI GURATIO N AND
FUNCTION DES CRIPT IO NS
SECTION OF THIS DATA SHEET.
02-06-2013-D
0.15 RE F
2.10
2.00 S Q
1.90
0.20 M IN
Figure 29. 6-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-6-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Branding
ADP196ACBZ-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 AW
ADP196ACPZN-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-6-3 AW
ADP196ACBZ-01-R7 −40°C to +85°C 6-Ball Wafer Level Chip Scale Package [WLCSP],
Quick Output Discharge Option
CB-6-2 BK
ADP196ACPZN-01-R7 −40°C to +85°C 6-Lead Lead Frame Chip Scale Package [LFCSP_UD],
Quick Output Discharge Option
CP-6-3 BK
ADP196CP-EVALZ Evaluation Board
1 Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D10704-0-3/13(0)
