How It Works Features
0.50mm and 0.65mm Pitch
BGA Socket Adapter System
5 Energy Way, West Warwick, Rhode Island 02893 USA
Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723
E-mail: info@advanced.com | Web: www.advanced.com
www.advanced.com
This micro-BGA Socket Adapter System
in 0.50mm and 0.65mm pitch from
Advanced is a breakthrough in fine pitch
socket technology. The patented design
alternates male and female pins in
an interstitial pattern – offering the
reliability of screw-machined terminals
with multi-finger contacts in a compact
SMT socket.
At only 2.00mm larger than the device
package, this compact design is perfect
for development and validation of BGA
and LGA devices, production level
socketing, and SMT board to board
connector applications.
© 2009, Advanced Interconnections Corp. Specifications subject to change without notice. Products shown covered by U.S. Pat. 7,179,108 and 7,419,398. Additional U.S. and international patents pending.
■ Superior electrical performance – very low signal attenuation
up to 1.9 GHz for 0.50mm pitch or 3.5 GHz for 0.65mm pitch
■ Advanced’s field-proven screw-machined terminals with multi-finger
contacts, arranged in an interstitial male/female pin pattern are gold
plated for gold/gold interconnect
■ Small overall size – only 2.00mm larger than the device in standard
configuration (1.00mm per side; consult factory for even smaller sizes)
■ Same footprint as device
■ No external hold-downs required
■ Standard eutectic Tin/Lead or lead-free
Tin/Silver/Copper solder ball terminals for
RoHS Compliant applications
■ Unique alignment pins protect pin field and
aid in hand placement with optional stand-offs available
■ Sockets and Adapters are provided with protective covers which
facilitate automated pick-and-place and protect pins during storage
(before & after assembly)
■ Available in any 0.50mm or 0.65mm pitch footprint
DEVICE
ADAPTER
SOCKET
Adapter matches footprint of BGA/LGA
device and plugs into mating socket
using unique male/female terminals in an
interstitial pattern (patented).
Socket matches footprint of BGA/LGA
device. Use alignment pins to align
Device/Adapter assembly during
insertion into board-mounted Socket.
Reflow solder
device to
Adapter.
Reflow solder
Socket to
PC Board.
Image shown is
only partially mated
to show pin field.
Solder ball terminals for
superior SMT processing.
Electrical performance
specifications & models
available online.
Small enough for device
validation on production-level
boards. Shown here in cell
phone application.
Footprint Dash #
If Applicable*
X F M S XXX - 833 G - X X
Packaging Option
Terminal/Contact Plating
Alignment Pin Option Code
Body Type
RoHS Compliant Insulator:
F - FR-4
Number of Positions
No code - Std. alignment pins
1 - Alignment pins & stand-offs
2 - Dual alignment pins
RoHS Compliant:
G - Gold
T - Tape & Reel
Pitch
M = .0197/(0.50mm)
L = .0256/(0.65mm)
Model Type
A - Adapter (device side)
S - Socket (board side)
*See footprints online or submit device mechanical specs.
Note: If no packaging code is indicated, parts are supplied in standard trays.
Both sockets and adapters are supplied with protective covers.
Extraction Tool is available separately; order P/N 8794.
Terminal Type
See terminal options
0.50mm and 0.65mm Pitch
BGA Socket Adapter System
5 Energy Way, West Warwick, Rhode Island 02893 USA
Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723
E-mail: info@advanced.com | Web: www.advanced.com
www.advanced.com
Specifications subject to change without notice. Products shown covered by U.S. Pat. 7,179,108 and 7,419,398 and additional patents pending. Dim. shown: inch/(mm)
Item MICROBGA-TECH09 (Rev. 2/09)
Performance
Code 2
Dual alignment pins
(4 on top; 3 on
bottom with stand-
off in A1)
STANDARD & SMT ADAPTERS TERMINAL OPTIONS
Adapter (A)
with Standard Terminals
Mates with Socket (S) for:
■ BGA device socketing
Table of Models
FMA
FMS
Socket (S)
with SMT Terminals
Mates w/either Adapter for:
■ BGA/LGA socketing
■ Board to board connector
Type -834
Gold plated pad
Type -833
Sn/Ag/Cu Solder Ball
Type -832
Sn/Pb Solder Ball
How To Order
Body Size
Device + 0.079/(2.00mm) in standard
configuration
[1.00mm per side; consult
factory for even smaller sizes]
Mated Height
0.214/(5.44mm)* approx. (
*will vary based on
reflow profile, paste volume and PC board pad size
)
Insertion/Extraction Force
35g avg. Insertion & 30g Withdrawal (per pin)
Insulator
FR-4 Glass Epoxy, U.L. Rated 94V-0
Terminal
Brass - Copper Alloy (C36000) ASTM-B-16
Contact
Beryllium Copper (C17200) ASTM-B-194
Solder Ball
0.50mm Pitch: 0.012/(0.30mm) Dia.
0.65mm Pitch: 0.014/(0.36mm) Dia.
Standard: 63Sn/37Pb
(not RoHS Compliant)
Lead-free: 95.5Sn/4.0Ag/0.5Cu
(0.65mm pitch)
Lead-free: 96.5Sn/3.0Ag/0.5Cu
(0.50mm pitch)
Terminal Plating
Gold over Nickel
Gold per ASTM-B-488
Nickel per QQ-N-290
Note: Alignment pins are Nickel plated.
ALIGNMENT PIN OPTIONS
FMA
Adapter (A)
with SMT Terminals
Mates with Socket (S) for:
■ LGA socketing
■ Board to board connector
Type -833
Sn/Ag/Cu Solder Ball
Type -832
Sn/Pb Solder Ball
SMT SOCKET TERMINAL OPTIONS
Specifications
Code 1
Four alignment pins
(top) with four
stand-offs (bottom).
No Code
Alignment pin in
each corner.
Superior Electrical Performance
Even with adjacent aggressor excitation,
our socket system provides a Differential
Data path of +/- 175mV @ 100psec and a
Single-ended Data path of +/- 125mV @
140psec.
Patented hybrid design ensures that
adjacent terminal electromagnetic coupling
is trivial; greatly reducing NeXT & FeXT,
while creating a pseudo-matched
impedance environment; stabilizing the
Insertion & Return Loss response rates.
Differential Differential
Insertion Loss Return Loss
-0.40dB @ 1.0 GHz -15.0dB @ 1.0 GHz
-0.55dB @ 1.9 GHz -10.0dB @ 1.9 GHz
-0.25dB @ 3.5 GHz -14.0dB @ 3.5 GHz
Additional electrical performance, signal integrity analysis
data and models available online.
0.65mm 0.50mm
