0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance specifications & models available online. an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, this compact design is perfect for development and validation of BGA Image shown is only partially mated to show pin field. and LGA devices, production level socketing, and SMT board to board connector applications. Solder ball terminals for superior SMT processing. How It Works Features Superior electrical performance - very low signal attenuation up to 1.9 GHz for 0.50mm pitch or 3.5 GHz for 0.65mm pitch Advanced's field-proven screw-machined terminals with multi-finger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold interconnect Small overall size - only 2.00mm larger than the device in standard configuration (1.00mm per side; consult factory for even smaller sizes) Same footprint as device No external hold-downs required Standard eutectic Tin/Lead or lead-free Tin/Silver/Copper solder ball terminals for RoHS Compliant applications DEVICE ADAPTER SOCKET Reflow solder device to Adapter. Reflow solder Socket to PC Board. Adapter matches footprint of BGA/LGA device and plugs into mating socket using unique male/female terminals in an interstitial pattern (patented). Socket matches footprint of BGA/LGA device. Use alignment pins to align Device/Adapter assembly during insertion into board-mounted Socket. (c) 2009, Advanced Interconnections Corp. Small enough for device validation on production-level boards. Shown here in cell phone application. Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available Sockets and Adapters are provided with protective covers which facilitate automated pick-and-place and protect pins during storage (before & after assembly) Available in any 0.50mm or 0.65mm pitch footprint Specifications subject to change without notice. 5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 E-mail: info@advanced.com | Web: www.advanced.com Products shown covered by U.S. Pat. 7,179,108 and 7,419,398. Additional U.S. and international patents pending. 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com Performance Table of Models Superior Electrical Performance Even with adjacent aggressor excitation, our socket system provides a Differential Data path of +/- 175mV @ 100psec and a Single-ended Data path of +/- 125mV @ 140psec. STANDARD & SMT ADAPTERS Adapter (A) with Standard Terminals 0.50mm -15.0dB @ 1.0 GHz -10.0dB @ 1.9 GHz 0.65mm -0.25dB @ 3.5 GHz -14.0dB @ 3.5 GHz Adapter (A) with SMT Terminals Body Size Device + 0.079/(2.00mm) in standard configuration [1.00mm per side; consult factory for even smaller sizes] Mated Height 0.214/(5.44mm)* approx. (*will vary based on reflow profile, paste volume and PC board pad size) Insertion/Extraction Force 35g avg. Insertion & 30g Withdrawal (per pin) Insulator FR-4 Glass Epoxy, U.L. Rated 94V-0 Terminal Brass - Copper Alloy (C36000) ASTM-B-16 Contact Type -833 Sn/Ag/Cu Solder Ball Mates with Socket (S) for: LGA socketing Board to board connector Type -832 Sn/Pb Solder Ball FMA SMT SOCKET TERMINAL OPTIONS Socket (S) with SMT Terminals Type -833 Sn/Ag/Cu Solder Ball Mates w/either Adapter for: Additional electrical performance, signal integrity analysis data and models available online. Specifications BGA device socketing FMA Differential Return Loss -0.40dB @ 1.0 GHz -0.55dB @ 1.9 GHz Type -834 Gold plated pad Mates with Socket (S) for: Patented hybrid design ensures that adjacent terminal electromagnetic coupling is trivial; greatly reducing NeXT & FeXT, while creating a pseudo-matched impedance environment; stabilizing the Insertion & Return Loss response rates. Differential Insertion Loss TERMINAL OPTIONS FMS BGA/LGA socketing Board to board connector Type -832 Sn/Pb Solder Ball How To Order X F M S XXX - 833 G - X X Footprint Dash # Packaging Option T - Tape & Reel If Applicable* Body Type Alignment Pin Option Code No code - Std. alignment pins 1 - Alignment pins & stand-offs 2 - Dual alignment pins RoHS Compliant Insulator: F - FR-4 Pitch M = .0197/(0.50mm) L = .0256/(0.65mm) Terminal/Contact Plating RoHS Compliant: Model Type A - Adapter (device side) S - Socket (board side) Number of Positions G - Gold Terminal Type See terminal options *See footprints online or submit device mechanical specs. Note: If no packaging code is indicated, parts are supplied in standard trays. Both sockets and adapters are supplied with protective covers. Extraction Tool is available separately; order P/N 8794. Beryllium Copper (C17200) ASTM-B-194 Solder Ball 0.50mm Pitch: 0.012/(0.30mm) Dia. 0.65mm Pitch: 0.014/(0.36mm) Dia. Standard: 63Sn/37Pb (not RoHS Compliant) Lead-free: 95.5Sn/4.0Ag/0.5Cu (0.65mm pitch) Lead-free: 96.5Sn/3.0Ag/0.5Cu (0.50mm pitch) ALIGNMENT PIN OPTIONS No Code Alignment pin in each corner. Code 1 Four alignment pins (top) with four stand-offs (bottom). Code 2 Dual alignment pins (4 on top; 3 on bottom with standoff in A1) Terminal Plating Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290 Note: Alignment pins are Nickel plated. 5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 E-mail: info@advanced.com | Web: www.advanced.com Specifications subject to change without notice. Products shown covered by U.S. Pat. 7,179,108 and 7,419,398 and additional patents pending. Dim. shown: inch/(mm) Item MICROBGA-TECH09 (Rev. 2/09)