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Diodes Incorporated
PI3USB221E
Document Number DS40270 Rev 3-2
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s denitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are dened as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm
antimony compounds.
Features
ÎVDD Operation at 2.5 V and 3.3 V
ÎVI/O Accepts Signals up to 5.5 V
Î1.8-V Compatible Control-Pin Inputs
ÎLow-Power Mode When OE Is Disabled (2 µA)
ÎrON = 6Ω Maximum
ÎΔrON = 0.2Ω Typical
ÎCio(on) = 4pF Typical
ÎSupport Over Voltage Protection
ÎLow Power Consumption (50 µA Maximum)
ÎESD Performance
• IO Pins
• 12KV HBM
• 1KV CDM
• +/-8KV contact Discharge (IEC61000-4-2)
• VDD, GND, S, OE Pins
• 4KV HBM
• 1KV CDM
ÎHigh Bandwidth (1.6 GHz Typical)
ÎTotally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
ÎHalogen and Antimony Free. “Green” Device (Note 3)
ÎPackaging (Pb-free & Green):
• 10-contact, UDFN (ZW10)
• 10-contact, UQFN (ZUA10)
Description
e PI3USB221E is a high-bandwidth switch specially designed
for the switching of high-speed USB 2.0 signals in handset and
consumer applications, such as cell phones, digital cameras, and
notebooks with hubs or controllers with limited USB I/Os.
e wide bandwidth (1.1 GHz) of this switch allows signals
to pass with minimum edge and phase distortion. e device
multiplexes dierential outputs from a USB host device to one of
two corresponding outputs. e switch is bidirectional and oers
little or no attenuation of the high-speed signals at the outputs.
It is designed for low bit-to-bit skew and high channel-to-channel
noise isolation, and is compatible with various standards, such as
high-speed USB 2.0 (480 Mbps).
e PI3USB221E oer over voltage protection for the D+/D- pins
as per the USB 2.0 specication. With the chip power on or o
if D+/D- pins are shorted to VBus (5V+/-5%), a less than 3.8V
(typical) signal will transmit through 1D+/1D- and 2D+/2D-
output.
A product Line of
Diodes Incorporated
PI3USB221E
High-Speed USB2.0 1:2 Multiplexer/DeMultiplexer Switch with Signal Enable
Applications
ÎRoutes Signals for USB 1.0, 1.1, and 2.0
ÎMobile Industry Processor Interface (MIPI) Signal Routing
Block Diagram
D+
D-
1D+
1D-
2D+
2D-
S
OE
CONTROL
LOGIC
Truth Table
S OE Function
X H Disconnect
LLD = 1D
HLD = 2D
b
P
Lead-free Green
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Document Number DS40270 Rev 3-2
Pin Description
Name Description
OE Active LOW, Output enable
S Select input
D COM port
nD I/O for USB data path (port 1 and port 2)
Pin Configuration
1D+ 1
2
3
4
5
10
9
8
7
6
1D-
2D+
2D-
GND
VDD
S
D+
D-
OE
UDFN Package
(Top View)
UQFN Package
(Top View)
1
2
3
4
9
8
7
6
10
5
1D+
1D-
2D+
2D-
S
D+
D-
OE
VDD
GND
1
2
3
4
9
8
7
6
10
5
1D+
1D-
2D+
2D-
S
D+
D-
OE
VDD
GND
UQFN Package
(Bottom View)
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Document Number DS40270 Rev 3-2
VDD Supply Voltage Range ................................................. –0.5V to 4.6V
VIN Control Input Voltage Range(2, 3) ................................... –0.5V to 5.5V
VI/O Switch I/O Voltage Range(2, 3, 4) .................................... –0.5V to 5.5V
IIK Control Input Clamp Current (VIN < 0) .................................... –50mA
II/OK I/O Port Clamp Current (VI/O < 0) ......................................... –50mA
II/O ON-state Switch Current(5) ..................................................... ±120mA
Continuous Current through VDD or GND ................................... ±100mA
θJA Package Thermal Impedance
TLLGA Package .............................................................. 48.7°C/W
TDFN Package ................................................................. 243°C/W
Tstg Storage Temperature Range ............................................–65 to 150°C
Tj Junction Temperature ...................................................................125°C
Notes:
1. Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2. All voltages are with respect to ground, unless otherwise specied.
3. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
4. VI and VO are used to denote specic conditions for VI/O.
5. II and IO are used to denote specic conditions for II/O.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise noted)
Recommended Operating Conditions(1)
Symbol Description Parameter Min. Max. Unit
V
DD
Supply voltage 2.3 3.6
V
VIH High-level control input voltage VDD = 2.3 V to 2.7 V 1.3 -
VDD = 2.7 V to 3.6 V 1.4 -
VIL Low-level control input voltage VDD = 2.3 V to 2.7 V 0.6
VDD = 2.7 V to 3.6 V 0.6
VI/O
Data input/output voltage 0 4.6
TA
Operating free-air temperature –40 85 °C
Note:
1. All unused control inputs of the device must be held at VDD or GND to ensure proper device operation.
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Electrical Characteristics
Over operating free-air temperature range (unless otherwise noted)
Parameter Testing Conditions Min. Typ. Max. Unit
VIK VDD = 3.6V, 2.7V, II = –18 mA –1.2 V
IIN Control
Inputs VDD = 3.6V, 2.7V, 0V, VIN = 0V to 3.6V ±1
µA
IOZ(3) VDD = 3.6V, 2.7V, VIN = VDD or GND,
VO = 0V to 3.6V, VI = 0V, Switch OFF ±1
I(OFF) VDD = 0V VI/O = 0V to 3.6V ±2
VI/O = 0 to 2.7V ±1
ICC VDD = 3.6V, 2.7V, VIN = VDD or GND,
II/O = 0 V, Switch ON or OFF 25 50
ICC (low power
mode)
VDD = 3.6V, 2.7V, VIN = VDD or GND,
Switch disabled, (OE in high state) 4
DICC(4) Control
Inputs
VDD = 2.7V, S sweeps from
1.4V to 3.3V, OE/ = 0V 15
VDD = 2.7V, OE/ sweeps
from 1.4V to 3.3V, S = 0V 0.75
CIN Control
Inputs VDD = 3.3V, 2.5V, VIN = 3.3V or 0V 1 2
pF
Cio(OFF) VDD = 3.3V, 2.5V, VIN = 3.3V or 0V, Switch OFF 2 3
Cio(ON) VDD = 3.3V, 2.5V, VIN = 3.3V or 0V, Switch ON 4 6
rON(5) VDD = 3V, 2.3V VI = 0V, IO = 30 mA 4
Ω
VI = 2.4V, IO = –15 mA 6
DrON(6) VDD = 3V, 2.3V VI = 0V, IO = 30 mA 0.2
VI = 1.7V, IO = –15 mA 0.2
rON(at) VDD = 3V, 2.3V VI = 0V, IO = 30 mA 1
VI = 1.7V, IO = –15 mA 1
Vpass VDD = 2.5 - 3.3V VIN > 3.8V, IO = 10uA 2.8 3.8 4.2 V
Notes:
1. VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
2. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C.
3. For I/O ports, the parameter IOZ includes the input leakage current.
4. This is the increase in supply current for each input that is at the specied TTL voltage level, rather than VDD or GND.
5. Measured by the voltage drop between the input and output terminals at the indicated current through the switch. ON-state resistance is determined by the lower of
the voltages of the two terminals.
6. Dron is delta Ron between channels
Dynamic Electrical Characteristics
Over operating range, TA = –40°C to 85°C, VDD = 3.3 V ± 10%, GND = 0V
Symbol Parameter Test Conditions Typ.(1) Unit
XTALK Crosstalk RL = 50Ω, f = 250 MHz –40 dB
OIRR OFF isolation RL = 50Ω, f = 250 MHz –41
BW Bandwidth (–3 dB) RL = 50Ω1.6 GHz
Note:
1. For Max or Min conditions, use the appropriate value specied under Electrical Characteristics for the applicable device type.
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Document Number DS40270 Rev 3-2
Switching Characteristics
Over operating range, TA = –40°C to 85°C, VDD = 3.3 V ± 10%, GND = 0V
Symbol Parameter Min. Typ.(1) Max. Unit
tpd Propagation Delay (2,3) 0.25
ns
tON Line enable time S to D, nD 125
OE to D, nD 100
tOFF Line disable time S to D, nD 12
OE to D, nD 12
tSK(O) Output skew between center port to any other port(2) 0.1 0.2
tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH)(2) 0.1 0.2
tVPASS OVP response time 53 ns
Notes:
1. For Max or Min conditions, use the appropriate value specied under Electrical Characteristics for the applicable device type.
2. Specied by design
3. The switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch
alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propaga-
tional delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and
its interactions with the load on the driven side.
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Application Information
Figure 1: HS Eye Test Setup
Test Result: High-speed, Up-stream, Near-end Eye of PI3USB221E
Test Result
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Document Number DS40270 Rev 3-2
C
L(2)
R
L
V
IN
V
DD
GND
1D or 2DV
OUT1
or V
OUT2
V
CTRL
1D or 2D
D
Logic
Input
(1)
V
+
V
COM
R
L
C
L
50 pFt
ON
TEST
V
+
50 pFt
OFF
50%
t
ON
t
OFF
50%
90% 90%
Logic
Input
(V
I
)
1.8 V
Switch
Output
(V
OUT1
or V
OUT2
)
0
C
L(2)
R
L
S
(1)
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z
O
= 50-Ohm , t
r
< 5 ns, t
f
< 5 ns.
(2)
C
L
includes probe and jig capacitance.
V
OH
V
OL
1D
2D
D
V
OUT1
V
IN
Channel OFF: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-Ohm load)
DC Bias = 350 mV
V
DD
GND
50
Network Analyzer
Source
Signal
V
CTRL
+
V
CTRL
= V
DD
or GND
S
Turn-On (tON) and Turn-Off Time (tOFF)
OFF Isolation (OISO)
-Ohm
50
-Ohm
50
-Ohm
500-Ohm
500-Ohm
Figure 2.
Figure 3.
Parameter Measurement Information
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Document Number DS40270 Rev 3-2
1D
2D
50
50
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50- load)
DC Bias = 350 mV
50
V
DD
GND
V
OUT2
Source
Signal
Channel OFF: 2D to D
Network Analyzer
V
CTRL
+
V
CTRL
= V
DD
or GND
S
V
DD
GND
1D
V
CTRL
2D
D
50
50
V
OUT1
V
IN
Channel ON: 1D to D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50- load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
+
V
CTRL
= V
DD
or GND
S
400 mV
Crosstalk (XTALK)
Figure 5. Bandwidth (BW)
Figure 6. Propagation Delay
Figure 4.
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50% 50%
50%
50%
50%
50%50%
50%
50%
SK(P)
SK(P)
= t t
SK(P) PHL PLH
| – |
t = t t
SK(O) PLH1 PLH2
| – | or | – |
t t
PHL1 PHL2
Input
Input
Output
VOL
VOL
VOL
VOH
VOH
VOH
tPLH
tSK(O) tSK(O)
tPHL2
tPLH2
tPLH1 tPHL1
tPHL
V
DD
I
IN
ron
VIN VOUT2 or VOUT1
IIN
GND
Channel ON
1D
V
CTRL
2D
DV
IN
V
CTRL
= V
IH
or V
IL
V
OUT2
V
OUT1
+
+
S
Figure 7. Skew Test
Figure 8. ON-State Resistance (r
on
)
t
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Channel OFF
OFF-State Leakage Current
V
CTRL
= V
IH
or V
IL
V
DD
GND
1D
V
CTRL
2D
DV
IN
V
OUT2
V
OUT1
+
+
+
S
V
DD
GND
V
BIAS
V
CTRL
V
CTRL
= V
DD
or GND
V
BIAS
= V
DD
or GND
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
Capacitance
Meter
V
IN
V
OUT2
V
OUT1
D
2D
1D
S
Figure 9. OFF-State Leakage Current
Figure 10. Capacitance
Part Marking
ZW Paclage ZUA Package
PI3USB
221EZW
ZYWXX
Z : Die Rev
Y : Year
W : Workweek
1st X: Assembly Code
2nd X: Fab Code
YU
YW
Y : Shorten Year Code
W : Shorten Workweek Code
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PKG. DIMENSIONS(MM)
SYMBOL Min NOM
A1 0.00
A3
D1.45 1.50
b
b1 0.15 0.20
b2
e
0.02
A0.50 0.60
E1.95 2.00
0.50 BSC
0.20 0.25
0.15 REF
0.25 0.30
Max
1.55
0.25
0.05
0.65
2.05
0.30
0.35
L0.25 0.35 0.45
A
A1
A3
D
E
L1(2X)
L(8X)
b1(4X)
e
b2(2X)
b(4X)
L1 0.30 0.40 0.50
2.31
0.64
0.30(4X)
0.25(4X)
0.53(8X)
0.50BSC
0.63(2X)
0.35(2X)
1.81
TOP VIEW BOTTOM VIEW RECOMMENDED LAND PATTERN(unit:mm)
SIDE VIEW
DATE: 01/06/17
DESCRIPTION: 10-Pin, UQFN, 1.5X2.0
PACKAGE CODE: ZUA(ZUA10)
DOCUMENT CONTROL#: PD-2220 REVISION: --
Notes:
1. Ref: JEDEC MO-288B.
N1
N4
N6
N9
17-0002
Packaging Mechanical: 10-UQFN (ZUA)
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E
D
A3
A
A1
1.35
2.40
2.78
0.63(10X)
0.50BSC
0.30(10X)
b e
D1
E1
PKG. DIMENSIONS(MM)
SYMBOL Min NOM
A1 0.00
A3
D2.90 3.00
D1
E1 1.50 1.60
b
e
0.02
A0.50 0.60
E2.90 3.00
0.50 BSC
2.30 2.40
0.15 REF
0.18 0.25
Max
3.10
1.70
0.05
0.65
3.10
2.50
0.30
L0.25 0.40 0.55
L
DATE: 01/06/17
DESCRIPTION: 10-Pin, UDFN, 3X3
PACKAGE CODE: ZW(ZW10)
DOCUMENT CONTROL#: PD-2219 REVISION: --
Notes:
1. Comply with JEDEC MO-229F, except 'L' Max and 'L' Min.
TOP VIEW BOTTOM VIEW RECOMMENDED LAND PATTERN(unit:mm)
SIDE VIEW
N1
N5
N6 N10
17-0001
Ordering Information
Ordering Number Package Code Package Description
PI3USB221EZUAEX ZUA 10-Pin, 1.5x2.0 (UQFN)
PI3USB221EZWEX ZW 10-Pin, 3x3 (UDFN)
Packaging Mechanical: 10-UDFN (ZW)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s denitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are dened as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm
antimony compounds.
4. E = Pb-free and Green
5. X sufx = Tape/Reel
For latest package info.
please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE
LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modications, enhancements, improvements, corrections or other changes without further notice
to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any
product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of
this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incor-
porated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may
also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the nal and determina-
tive format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specically not authorized for use as critical components in life support devices or systems without the express written approval of
the Chief Executive Ofcer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in signicant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramications of their life support devices or systems, and acknowledge and
agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products
in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incor-
porated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated
products in such safety-critical, life support devices or systems.
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