DATA SHEET
SV/F SERIES
SOLID TANTALUM CAPACITOR
Document No. EC0003EJ3V1DS00 (3rd edition)
Date Published June 1996 M CP(K)
Printed in Japan
The SV/F series features a built-in fuse to minimize circuit damage from over current by protection with less
than a half blow-out current of the former type.
This fuse-protected capacitor is suitable for noise absorption applications such as those required for comput-
ers, terminals and measuring instruments.
FEATURES
™Built-in fuse protection (2A)
™High-temperature durability for either wave soldering or reflow soldering applications
™The same excellent performance as NEC's R series
™Wide operating temperature range (–55˚C to +125˚C)
™High reliability (Failure rate = 1%/1 000H at 85˚C, DC rated voltage applied)
DIMENSIONS
Sur face mount resin molded chip
with Built-in fuse,
Low blow-out current (2A)
©
1992(1996)
LL
H
H
W1W1
W2W2ZZZZ
Y
+–
+–
[C and D case][B2 and D2 case]
Case Code L W1W2HZY
B2 3.5±0.2 2.8±0.2 2.3±0.1 1.9±0.2 0.8±0.3 –
C6.0±0.3 3.2±0.3 1.8±0.1 2.5±0.3 1.3±0.3 0.4C
D2 5.8±0.3 4.6±0.3 2.4±0.1 3.2±0.3 1.3±0.3 –
D7.3±0.3 4.3±0.3 2.4±0.1 2.8±0.3 1.3±0.3 0.5C
(Unit : mm)
MARKING
The information in this document is subject to change without notice.
FF
10
16 n
1
35 n
[C and D case]
[B2 and D2 case] Capacitance
( F)
Rated voltage
(V)
Polarity (anode)
and mark of built-in fuse
Date code
µ
2
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
PRODUCT LINE-UP AND MARKING CODE
10 16 20 25 35 50
1.0 B2 C
1.5 B2
2.2 B2 C
3.3 B2 C D2
4.7 B2 C C D2, D
6.8 C D2, D D
10 C D2, D D
15 C, D2 D2 D
22 D2, D D
33 D2, D D
47 D
PRODUCTION DATE CODE
1995
1996
1997
1998
Jan
a
n
A
N
Feb
b
p
B
P
Mar
c
q
C
Q
Apr
d
r
D
R
May
e
s
E
S
Jun
f
t
F
T
Jul
g
u
G
U
Aug
h
v
H
V
Sep
j
w
J
W
Oct
k
x
K
X
Nov
l
y
L
Y
Dec
m
z
M
Z
Month
Year
Date code will resume beginning in 1999.
Capacitance
(
µ
F)
UR
(Vdc)
UR : Rated voltage
PART NUMBER SYSTEM
BULK (Packed in poly bag) TAPE AND REEL
SVF B2 1V 105 M TE SVFB21V105M 8 R
⊕
Polarity mark
⊕
Polarity mark
Feed direction
Tape
Tape
R : (Standard)
Orientation
L : (Non-Standard)
Orientation Feed direction
Capacitance tolerance
M for ±20% Packing orientation
Tape and reel
Tape width
8 mm for B2 case
12 mm for C, D and D2 case
Part number of bulk
(see left)
Capacitance code in pF
First two digits represent significant
figures. Third digit specifies number
of zeros to follow.
Rated voltage 1H : 50 V
1V : 35 V
1E : 25 V
1D : 20 V
1C : 16 V
1A : 10 V
Case code
SVF series
SV/F SERIES
3DATA SHEET EC0003EJ3V1DS00
SPECIFICATIONS
No. Items
1 Operating Temp. Range
2 Rated Voltage
3 Surge Voltage
4 Derated Voltage
5 Capacitance Range
6 Capacitance Tolerance
7 Leakage Current
8 Tangent of loss angle
9 Surge Voltage Resistance
Temp.
C/C
Tangent of
loss angle
Leakage
Current
11
Repid change of temperature
12 Resistance to soldering
13 Damp Heat (Steady state)
14 Endurance
15
Specifications
–55 to +125˚C
10 16 20 25 35 50 Vdc
13 20 26 33 46 65 Vdc
6.3 10 13 16 22 32 Vdc
1.0 to 4.7
µ
F
±20%
0.01 CV (
µ
A) or 0.5
µ
A whichever is greater
1.0 to 4.7
µ
F : 0.04 max.
6.8 to 47
µ
F : 0.06 max.
C/C : ±5%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
–55˚C +85˚C +125˚C
%% %
1.0 to 4.7
µ
F : 0.08 Initial 1.0 to 4.7
µ
F : 0.06
6.8 to 47
µ
F : 0.10 requirement 6.8 to 47
µ
F : 0.08
0.1 CV or 5
µ
A 0.125 CV or 6.25
–– whichever is
µ
A whichever is
greater greater
C/C : ±5%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
C/C : ±5%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
C/C : ±5%
Tangent of loss angle : 150% of Intial requirement
Leakage Current : Initial requirement
C/C : ±10%
Tangent of loss angle : Initial requirement
Leakage Current : 125% of Initial requirement
B2 : 2A – 5 sec. max.
C : 2A – 10 sec. max.
D2, D : 2A – 20 sec. max.
Test Conditions
Over 85˚C, applied voltage shall be derated
on the basis of the Derated Voltage at
125˚C specified in this table item no.4
up to 85˚C
up to 85˚C
at 125˚C
at 120 Hz
at 120 Hz
5 min. after rated voltage applied
at 25˚C, 120 Hz
at 85˚C
Surge voltage for 30 sec. (Rs = 1 kΩ)
Discharge for 4 min. 30 sec.
1 000 cycles
Step1 : +25˚C
Step2 : –55˚C
Step3 : +25˚C
Step4 : +85˚C
Step5 : +125˚C
Step6 : +25˚C
IEC68-2-14 Test N and IEC68-2-33
Guidance
–55 to +125˚C
5 cycles
IEC68-2-58 Test Td
Fully immersion to solder at 260˚C for
5 sec.
IEC68-2-3 Test Ca
at 40˚C, 90 to 95% RH, for 500H
at 85˚C
Rated Voltage applied for 2 000 H
at 25˚C
0
–12 +12
0 +15
0
∆
∆
∆
∆
∆
10
∆
Fuse Blow-out
Characteristics
LEGEND
CV : Product of capacitance in
µ
F and voltage in V
C/C : Capacitance change ratio
∆
Characteris-
tics at high
and low
temperature
4
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
PART NUMBER WITH FUNDAMENTAL PERFORMANCE
Rated
Voltage
(Vdc)
10
16
20
25
35
50
Capacitance
(
µ
F)
4.7
15
15
33
33
47
3.3
4.7
6.8
10
15
22
22
33
2.2
4.7
10
10
15
22
1.5
3.3
6.8
6.8
10
1.0
2.2
4.7
4.7
6.8
1.0
3.3
Tangent of loss angle
max.
0.04
0.06
0.06
0.06
0.06
0.06
0.04
0.04
0.06
0.06
0.06
0.06
0.06
0.06
0.04
0.04
0.06
0.06
0.06
0.06
0.04
0.04
0.06
0.06
0.06
0.04
0.04
0.04
0.04
0.06
0.04
0.04
Leakage Current
(
µ
A) max.
0.5
1.5
1.5
3.3
3.3
4.7
0.5
0.7
1.0
1.6
2.4
3.5
3.5
5.2
0.5
0.9
2.0
2.0
3.0
4.4
0.5
0.8
1.7
1.7
2.5
0.5
0.7
1.6
1.6
2.3
0.5
1.7
Part Number
SVFB21A475M
SVFC1A156M
SVFD21A156M
SVFD21A336M
SVFD1A336M
SVFD1A476M
SVFB21C335M
SVFC1C475M
SVFC1C685M
SVFC1C106M
SVFD21C156M
SVFD21C226M
SVFD1C226M
SVFD1C336M
SVFB21D225M
SVFC1D475M
SVFD21D106M
SVFD1D106M
SVFD1D156M
SVFD1D226M
SVFB21E155M
SVFC1E335M
SVFD21E685M
SVFD1E685M
SVFD1E106M
SVFB21V105M
SVFC1V225M
SVFD21V475M
SVFD1V475M
SVFD1V685M
SVFC1H105M
SVFD21H335M
Case Code
B2
C
D2
D2
D
D
B2
C
C
C
D2
D2
D
D
B2
C
D2
D
D
D
B2
C
D2
D
D
B2
C
D2
D
D
C
D2
SV/F SERIES
5DATA SHEET EC0003EJ3V1DS00
TAPE AND REEL SPECIFICATION
[Carrier Tape Specification and Packaging Quantity]
sprocket hole embossed cavity
feed direction
D
0
A
0
FE
W
P
1
K
tP
2
P
0
B
0
Tape width
8
12
(Unit : mm)
A
φ
178±2.0
φ
178±2.0
N
φ
50 min.
φ
50 min.
C
φ
13±0.5
φ
13±0.5
D
φ
21±0.5
φ
21±0.5
B
20±0.5
20±0.5
W1
10.0±1.0
14.5±1.0
W2
14.5 max.
18.5 max.
R
1
1
A0±0.2
3.3
3.7
5.1
4.8
B0±0.2
3.8
6.4
6.2
7.7
W±0.3
8.0
12.0
12.0
12.0
F±0.05
3.5
5.5
5.5
5.5
E±0.1
1.75
1.75
1.75
1.75
P1±0.1
4.0
8.0
8.0
8.0
P2±0.05
2.0
2.0
2.0
2.0
(Unit : mm)
Case Code
B2
C
D2
D
D0
φ
1.5
φ
1.5
φ
1.5
φ
1.5
K±0.2
2.1
3.0
3.6
3.3
t
0.2
0.3
0.4
0.3
Q'ty/Reel
2 000
500
500
500
P0±0.1
4.0
4.0
4.0
4.0
Case Code
B2
C
D2
D
[Reel Specification]
W2
C
N
A
D
B
R
W
1
+0.1
0
6
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
CHARACTERISTICS DATA
Characteristics at high and low temperature
12
8
4
0
C/C (%)
–4
–8
–12
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001 25˚C25˚C85˚C
35 V/1 F
µ
125˚C25˚C–55˚C
12
8
4
0
C/C (%)
–4
–8
–12
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001 25˚C25˚C85˚C
10 V/33 F
µ
125˚C25˚C–55˚C
Leakage Current ( A)
µ
Leakage Current ( A)
µ
SV/F SERIES
7DATA SHEET EC0003EJ3V1DS00
Resistance to soldering (immersing at 260˚C for 10 sec.)
(reference data)
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
35 V/1 F
µ
FinalInitial
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
10 V/33 F
µ
FinalInitial
Leakage Current ( A)
µ
Leakage Current ( A)
µ
8
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
Damp heat (steady state) (65˚C, 90 to 95% RH)
(reference data)
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
35 V/1 F
µ
0 h 1 000 h500 h 0 h 1 000 h500 h
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
10 V/33 F
µ
Leakage Current ( A)
µ
Leakage Current ( A)
µ
SV/F SERIES
9DATA SHEET EC0003EJ3V1DS00
Endurance (85˚C, Rated Voltage × 1.3 applied)
(reference data)
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
35 V/1 F
µ
Leakage Current ( A)
µ
Leakage Current ( A)
µ
0 h 1 000 h500 h 0 h 1 000 h500 h
6
4
2
0
C/C (%)
–2
–4
–6
0.08
0.06
0.04
0.02
Tangent of loss angle
0
0.1
0.01
0.001
10 V/33 F
µ
10
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
Fuse Blow-out Characteristics
Impedance – Frequency characteristics (reference data)
1
0.1
1
10
100
3
Current (A) 5
C Case
1
0.1
1
10
100
3
Current (A) 5
D2 Case
B2 Case
1
0.1
1
10
100
3
Current (A)
Time (sec.)
5
Note : “ ” is not for blow-out.
100
10
1
0.1
1 k 10 k 1 M100 k
Frequency (Hz)
Z (Ω)
10 M
16 V/3.3 F
µ
16 V/22 F
µ
16 V/10 F
µ
SV/F SERIES
11DATA SHEET EC0003EJ3V1DS00
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage
current mode.
SV/F series features a built-in-fuse to minimize circuit damage from short circuiting current, but the fuse may
not work under some environmental conditions.
Refer to the following in detail for reliable circuit design.
1. Expecting Reliability
SV/F series tantalum chip capacitors are typically applied to decoupling, blocking, bypassing and filtering.
The SV/F series has a very high reliability (low failure rate) in the field. For example, the maximutn field failure
rate of an SV/F series capacitor with a DC rated voltage of 16 V is 0.0004%/1000 hour (4 Fit) at an applied voltage
of 5 V, operating temperature of 25˚C and series resistance of 3 Ω.
The maximum failure rate in the field is estimated by the following expression :
λ: Maximum field failure rate
λ0: 1% 1000 hour (The failure rate of the SV/F series at the full DC rated voltage at operating
temperature of 85˚C and series resistance of 3 Ω.)
V : Applied voltage in actual use
V0: DC Rated voltage
T : Operating temperature in actual use
T0: 85˚C
120
10
2
7
4
2
10
1
7
4
2
10
0
7
4
2
10
–1
7
0.2
0.1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
4
2
10
–2
7
4
2
10
–3
7
4
2
10
–4
7
4
2
10
–5
110
100
90
Operating temperature T (˚C)
Failure rate multiplier F
Applied voltage ratio V/ V
0
80
70
60
50
40
30
20
The nomograph is provided for quick estimation of
maximum fieid failure rates.
Connect operating temperature T and applied
voltage ratio V/V
0
of interest with a straight line.
The failure rate multiplier F is given at the inter-
section of this line with the model scale. The failure
rate is obtained as λ = λ
0•
F.
Examples :
Given V/V
0
= 0.4 and T = 45˚C, read
F = 4 × 10
–3
Hence, λ = 0.004%/1000 hour (40 Fit)
Given V/V
0
= 0.3 and T = 25˚C, read
F = 4 × 10
–4
Hence, λ = 0.0004%/1000 hour (4 Fit)
V
V0
λ = λ0
3
× 2
T-T0
10
12
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
2. Built-in-fuse characteristics
The briefing of the built-in-fuse characteristics is that:
(1) Fuse may not work under some environmental conditions.
(2) When the built fuse blows, slight smoking may occur.
(3) Fuse blowout data is as shown on page 10.
(4) The ESR (equivalent series resistance) is larger than the conventional tantalum capacitor by the built-in-
fuse resistance.
Taking notice the above, refer to the following in detail for reliable circuit design.
3. Series resistance
As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 Ω/V into circuits
where current flow is momentary (switching circuits, charge/discharge circuits, etc).
If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to
1/3 of the DC rated voltage.
4. Ripple voltage
The sum of DC voltage and peak ripple voltage should not exceed the rated DC rated voltage of the capacitor.
0.1 1
Frequency (kHz)
Figure 2 Permissible ripple voltage vs. frequency
10
0.1
1
10
Ripple voltage (Vrms)
100
100
35 V
Case : B2, @ 25˚C
25 V
20 V
16 V
10 V
0.1 1
Frequency (kHz) 10
0.1
1
10
Ripple voltage (Vrms)
100
100
50 V Case : C, D2,D
@ 25˚C
35 V
25 V
20 V
10 V
16 V
Figure 2 is based on an ambient temperature of 25˚C. For higher temperature, permissible ripple voltage shall
be derated as follows.
Permissible voltage at 50˚C = 0.7 × permissible voltage at 25˚C
Permissible voltage at 85˚C = 0.5 × permissible voltage at 25˚C
Permissible voltage at 125˚C = 0.3 × permissible voltage at 25˚C
10
1
Mafnification of failure
0.1
0.1 1
Series Resistance (Ω/V)
Figure 1 Effects of series resistance
10 100
SV/F SERIES
13DATA SHEET EC0003EJ3V1DS00
5. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied.
If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very
short time and should not exceed the following.
10% of DC rated voltage at 25˚C
5% of DC rated voltage at 85˚C
1% of DC rated voltage at 125˚C
6. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SV/F series solid tantalum capacitors are larger in size and subject to more force than the chip
multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum
capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board
may adversely affect the solderability.
(b) Pattern design
a
b
ca
Case a b c
B2 3.0 2.8 1.6
C 4.1 2.3 2.4
D2 5.4 2.9 2.4
D 5.2 2.9 3.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(c) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature …260˚C max.
Time ……………………… 5 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and
density of the components on the board (also take into consideration generation of flux gas).
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
14
SV/F SERIES
DATA SHEET EC0003EJ3V1DS00
(2) Reflow soldering
Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate:
(a) Pattern design
The above dimensions are for reference only. Note that if the pattern is too big, the component may not be
mounted in place.
(b) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature …… 260˚C max.
Time : 10 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak
temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven
or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal
temperature of the capacitor may rise beyond the surface temperature.
(3) Using soldering iron
When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron
is very difficult. However, it is recommended that the following temperature and time be observed to maintain
the reliability of the capacitor:
lron temperature …… 300˚C max.
Time……………………… 3 seconds max.
Iron power …………… 30 W max.
Case a b c
B2 1.6 2.8 1.6
C 2.4 2.3 2.4
D2 2.4 2.9 2.4
D 2.4 2.9 3.7
a
b
ca
SV/F SERIES
15DATA SHEET EC0003EJ3V1DS00
7. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering.
Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor
cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two
or more may be used in combination. The temperature of the organic solvent may vary from room temperature
to several 10˚C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning
effect, however, the marking on the electronic component cleaned may be erased, the appearance of the com-
ponent may be damaged, and in the worst case, the component may be functionally damaged. It is therefore
recommended that the SV/F series solid tantalum capacitor be cleaned under the following conditions:
[Recommended conditions of flux cleaning]
(1) Cleaning solvent……… Chlorosen, isopropyl alcohol
(2) Cleaning method …… Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time ………… 5 minutes max.
∗ Ultrasonic cleaning
This cleaning method is extremely effective for eliminating dust that has been generated as a result of me-
chanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted
by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some
ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor termi-
nals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output
power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However,
it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conver-
sion efficiency of the ultrasonic oscillator, transfer ef ficiency of the cleaning bath, difference in cleaning effect
depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned,
and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning
be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the
cleaning. For further information, consult NEC.
8. Others
(1) Do not apply excessive vibration and shock to the capacitor.
(2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (–5 to +40˚C) room
temperature and (40 to 60% RH) humidity.
(3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is
deformed, the capacitor may not be automatically mounted by a chip mounter).
SV/F SERIES
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which
may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellec-
tual property rights of third parties by or arising from use of a device described herein or any other
liability arising from use of such device. No license, either express, implied or otherwise, is granted
under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its electronic
components, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or
injury to persons or property arising from a defect in an NEC electronic component, customers must
incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-
failure features. NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based
on a customer designated "quality assurance program" for a specific application. The recommended
applications of a device depend on its quality grade, as indicated below. Customers must check the
quality grade of each device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically de-
signed for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC electronic component products" means any electronic component product developed or manufac-
tured by or for NEC (as defined above). DE0202
