F15133_DEMO-2X2MX-C - Ledil

Multilayer Ceramic Capacitors Approval Sheet

Page 1 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

*Contents in this sheet are subject to change without prior notice.

MULTILAYER CERAMIC CAPACITORS

Safety Certified X1/Y2, S2 Series

1808 to 2220 Sizes

NP0 & X7R Dielectrics

Halogen Free &

RoHS Compliance

Multilayer Ceramic Capacitors Approval Sheet

Page 2 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

1. DESCRIPTION

WTC’s SAFETY CERTIFIED CAPACITORS are designed for surge or lightning immunity in modem facsimile and

other equipments. The capacitors of series S2 are class X1/Y2 compliant respectively.

The green type capacitors in S2 and S3 series are manufactured by using environmentally friendly materials without

lead or cadmium.

The terminations are composed of plated nickel and pure tin to feature the superior leaching resistance during

soldering.

4. HOW TO ORDER

S2 42 N 100 J 502 C T

Series

S2=X1/Y2

Safety

Certified

Size

42=1808 (4520)

43=1812 (4532)

52=2211 (5728)

55=2220 (5750)

Dielectric

N=NP0

B=X7R

Capacitance

Two significant

digits followed by

no. of zeros. And R

is in place of

decimal point.

eg.:

0R5=0.5pF

1R0=1.0pF

100=10x10

0

=10pF

Tolerance

D= ±0.5pF

F= ±1.0%

G= ±2.0%

J= ±5.0%

K= ±10%

M= ±20%

Rated voltage

Two significant digits

followed by no. of

zeros. And R is in

place of decimal

point.

502: 5000V

Impulse Voltage

602: 6000V

Impulse Voltage

Termination

C=Cu/Ni/Sn

Packaging

T=7” reeled

G=13” reeled

2. FEATURES

a. High reliability and stability.

b. Small size and high capacitance

c. RoHS compliant

d. Safety standard approval by

EN 60384-14 : 2013

IEC 60384-14 : 2013

UL 60384-14 (Ed 2.0)

e. Certificate number:

TUV: R50195920, TUV: R50381780

UL: E182369

f. HALOGEN compliant.

3. APPLICATIONS

a. Modem.

b. Facsimile.

c. Telephone.

d. Other electronic equipment for lighting or surge

protection and isolation

Multilayer Ceramic Capacitors Approval Sheet

Page 3 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

5. EXTERNAL DIMENSIONS & STRUCTURE

6. GENERAL ELECTRICAL DATA

Dielectric NP0 X7R

Size 1808, 1812, 2211 1808, 1812, 2211, 2220

Capacitance 3pF to 680pF 100pF to 4700pF

Capacitance tolerance Cap.<10pF: D (±0.5pF)

Cap.≥10pF: F (±1%), G (±2%), J (±5%),

K (±10%), M (±20%) J (±5%), K (±10%), M (±20%)

Rated voltage (WVAC) 250Vac

Q/ DF(Tan δ) Cap<30pF: Q≥400+20C

Cap≥30pF: Q≥1000 DF≤2.5%

Insulation resistance at Ur ≥10GΩ

Peak impulse voltage 5000V ~ 6000V

Operating temperature -55 to +125°C

Capacitance characteristic ±30ppm/°C ±15%

Termination Ni/Sn (lead-free termination)

Certified number TUV: R50195920, TUV: R50381780, UL: E182369

Test standard EN 60384-14 : 2013, IEC 60384-14 : 2013, UL 60384-14 (Ed 2.0)

* NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF, at 25°C ambient temperature.

* X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature.

7. PACKAGE DIMENSION AND QUANTITY

Size Thickness (mm)/Symbol Plastic tape

7” reel 13” reel

1808 (4520) 1.40±0.15 F 2k -

1.60±0.20 G 2k 8k

2.00±0.20 K 1k 6k

1812 (4532)

1.25±0.10 D 1k -

1.60±0.20 G 1k

2.00±0.20 K 1k -

2.50±0.30 M 0.5k 3k

2211 (5728)

1.60±0.20 G 1k -

2.00±0.20 K 1k -

2.50±0.30 M 0.5k -

2.80±0.30 U 0.5k -

2220 (5750) 2.00±0.20 K 1k -

2.50±0.30 M 0.5k 2k

Unit: pieces

T

W

L

M

B

M

B

CP

Fig. 1 The outline of MLCC

Size

Inch (mm)

L (mm) W (mm) T (mm) CP

(mm)

M

B

(mm)

1808 (4520)

4.50 +0.5/-0.3

2.03±0.25

1.25±0.10 (D)

1.40±0.15 (F)

1.60±0.20 (G)

2.00±0.20 (K)

2.50±0.30 (M)

2.80±0.30 (U)

≥3.5

0.50±0.25

1812 (4532)

4.50 +0.5/-0.3

3.20±0.40 ≥3.5

0.50±0.25

2211 (5728)

5.70±0.40 2.80±0.30 ≥4.0

0.60±0.30

2220 (5750)

5.70±0.40 5.00±0.40 ≥4.0

0.60±0.30

# Reflow soldering only is recommended.

Multilayer Ceramic Capacitors Approval Sheet

Page 4 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

8. CAPACITANCE RANGE

DIELECTRIC NP0

SIZE 1808 1812 2211 2211

PEAK IMPULSE VOLTAGE

5000 6000

Capacitance

3.0pF (3R0)

F

3.3pF (3R3)

F

3.9pF (3R9)

F

4.0pF (4R0)

F

K

4.7pF (4R7)

F

K

5.0pF (5R0)

F

K

5.6pF (5R6)

F

K

6.0pF (6R0)

F

K

6.8pF (6R8)

F

K

7.0pF (7R0)

F

K

8.0pF (8R0)

F

K

8.2pF (8R2)

F

K

10pF (100)

F

D

K

12pF (120)

F

D

K

15pF (150)

F

D

K

18pF (180)

F

D

K

22pF (220)

F

D

K

27pF (270)

F

D

K

33pF (330)

F

D

K

39pF (390)

G

D

K

47pF (470)

G

D

K

56pF (560)

G

D

K

68pF (680)

G

D

K

M

82pF (820)

G

D

K

M

100pF (101)

K

D

K

U

120pF (121)

K

D

M

150pF (151)

K

D

M

160pF (161)

K

D

M

180pF (181)

K

D

M

220pF (221)

K

M

270pF (271)

K

M

330pF (331)

K

M

390pF (391)

K

M

470pF (471)

K

M

560pF (561)

M

680

pF (681)

M

720pF (721)

1. The letter in cell is expressed the symbol of product thickness.

2. For more information about products with special capacitance or other data, please contact WTC local representative.

DIELECTRIC X7R

SIZE 1808 1812 2211 2220

PEAK IMPULSE VOLTAGE

5000

Capacitance

100pF (101)

G

120pF (121)

G

150pF (151)

G

180pF (181)

G

K

220pF (221)

G

K

270pF (271)

K

G

K

330pF (331)

K

G

K

390pF (391)

K

G

K

470pF (471)

K

G

K

560pF (561)

K

G

K

680pF (681)

K

820pF (821)

K

1,000pF (102)

K

M

K

1,200pF (122)

M

1,500pF (152)

M

1,800pF (182)

M

2,200pF (222)

M

2,700pF (272)

M

3,300

pF (332)

M

3,900pF (392)

M

4,700pF (472)

M

Multilayer Ceramic Capacitors Approval Sheet

Page 5 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item Standard

Method Test Condition Requirements

1.

Visual

examination

and

Dimensions

IEC 60384-1

4.1 * No remarkable defect.

* Dimensions to confirm to individual specification

sheet.

2.

Capacitance

IEC 60384-1

4.2.2 * Class I : (C0G)

Cap.≤1000pF, 1.0±0.2Vrms, 1MHz±10%.

Cap.>1000pF, 1.0±0.2Vrms, 1KHz±10%.

* Class II : (X7R)

1.0±0.2Vrms, 1KHz±10%.

* Capacitance is within specified tolerance.

* C

R

means rated capacitance for conform to the E6

series of preferred values given in IEC 60063.

3.

D.F.

(Dissipation

Factor)

Tangent of

loos angle

IEC 60384-1

4.2.3

Dielectric Q/D.F. Remark

Class I (C0G)

Q≥1000 Cap.≥30pF

Q≥400+20C Cap.<30pF

Class II (X7R) D.F.≤2.5%

4.

Temperature

Coefficient IEC

60384-21/22

4.6

With no electrical load.

T.C. Operating Temp

C0G(NP0) -55~125°C at 25°C

X7R -55~125°C at 25°C

T.C. Capacitance Change

C0G(NP0) Within ±30ppm/℃

X7R Within ±15%

5.

Voltage proof

(Dielectric

Strength)

IEC 60384-14

4.2.1 * To apply voltage :

X Capacitor : 1075Vdc (4.3U

R

).

Y Capacitor : 1500Vac.

* Duration : 60 sec.

* The charge current shall not exceed 0.05A.

* The voltage shall be raised from the near zero to

the test voltage a rate not exceeding

150V(r.m.s.)/sec.

* No evidence of damage or flash over during

test.

6.

Insulation

Resistance

IEC

60384

-21/22

4.5.3

Rated

Vol.(V)

Apply

Voltage

Charge

Current

Charge

Time

>500 500Vdc

≤50mA

60 sec.

Dielectric Requirements

Class I (C0G)

≥100GΩ or RxC≥1000Ω-F,

whichever is smaller

Class II (X7R)

≥10GΩ or RxC≥500Ω-F,

whichever is smaller

7.

Solderability

IEC

60384

-21/22

4.10

* Solder temperature: 235±5°C(0201~1210).

* Solder temperature: 245±5°C(1808~2225).

* Dipping time : 2±0.5 sec.

* 75% min. coverage of all metalized area.

8.

Resistance

to Soldering

Heat

IEC 60384-14

4.4

IEC

60384-21/22

4.9

* Solder temperature : 260±5°C.

* Dipping time : 10±1 sec.

* Preheating : 120 to 150°C for 1 minute before

immerse the capacitor in a eutectic solder.

* Measurement to be made after keeping at room

temperature for 24±2 hrs.

Dielectric

I.R. Cap. Change Q/D.F.

Class I

(C0G) ≥1GΩ

Within ±2.5% or

±0.25pF, whichever

is larger

≤100% of

initial

requireme

nt

Class II

(X7R) ≥1GΩ

Within ±7.5%

9.

Temperature

Cycle IEC

60384-21/22

4.11

* Conduct the five cycles according to the

temperatures and time.

Step Temp.(°C) Time(min.)

1 Min. operating

temp. +0/-3 30±3

2 Room temp. 2~3

3 Max.operating

temp. +3/-0 30±3

4 Room temp. 2~3

* Measurement to be made after keeping at room

temperature for 24±2 hrs.

Dielectric

I.R. Cap. Change

Q/D.F.

Class I

(C0G) To meet

initial

require

ment

Within ±2.5%

or ±0.25pF,

whichever is

larger

≤1.0(Q) ×

initial

requirement

Class II

(X7R) Within ±7.5%

≤1.5(D.F.) ×

initial

requirement

Multilayer Ceramic Capacitors Approval Sheet

Page 6 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

No.

Item Standard

Method Test Condition Requirements

10.

Humidity

(Damp Heat)

Steady State

IEC 60384-14

4.12 * Test temp. : 40±2°C.

* Humidity : 90~95% RH.

* Test time : 500 +24/-0hrs.

* Applied voltage : 250Vac.

* Measurement to be made after keeping at room

temp. for 24±2 hrs (Class I) and 48±4 hrs (Class

II).

* No remarkable damage.

Dielectr

ic I.R. Cap. Change Q/D.F.

Class I

(C0G)

≥1GΩ or

RxC≥

25Ω-F,

whichever

is

smaller

Within ±3.0% or

±2pF, whichever

is larger

≤0.25%

Class II

(X7R)

Within ±15%

≤2.0(D.F.)

× initial

requireme

nt

11.

Passive

Flammability

IEC 60384-14

4.17

IEC 60384-1

4.38

* Volume sample: 21.56 mm

3

* Flame exposure time: 5 sec Max.

* Category of flammability : C.

* Capacitor didn’t burn at all.

12.

Active

Flammability

IEC

60384-21/22

4.18

* The capacitors applied UR (250Vac). Then each

sample shall be subjected to 20 discharges from a

tank capacitor, charge to a voltage that, when

discharged, plase Ui 2500V for X1Y2 across the

capacitor under test. The interval between

successive discharges shall be 5 sec.

* The cheese cloth shall not burn with a flame.

13.

High

Temperature

Load

(Endurance)

IEC 60384-14

4.14 * Impulse Voltage :

Each individual capacitor shall be subjected to a Vp

= 5.0KV (X1Y2 Class Impulse 5KV) & Vp = 6.0KV

(X1Y2 Class Impulse 6KV) impulse for three times

before applied to endurance test.

* Test temp. : 125±3°C.

* Test time: 1000 +48/-0 hrs.

* Applied voltage :

X capacitor: 1.25UR (312.5Vac).

Y capacitor: 1.70UR (425Vac).

Once every hour the voltage shall be increased to

1000Vrms for 0.1 sec.

* Measurement to be made after keeping at room

temp. for 24±2 hrs (Class I) and 48±4 hrs (Class

II).

* Appearance :

No mechanical damage.

* Cap. change :

C0G within ±5% or ±0.5pF, whichever is larger.

X7R within ±20%.

* D.F. value :

C0G≤0.25%.

X7R≤5.0%.

* I.R.≥1GΩ.

* Dielectric strength satisfies the specified initial

value.

14.

Resistance

to Flexure of

Substrate

IEC

60384-21/22

4.8

* Capacitors mounted on a substrate. The board

shall be bent 1mm with a rate of 1mm/sec.

* No remarkable damage.

Dielectric Cap. Change

Class I

(C0G) Within ±3.0% or ±2pF, whichever is

larger

Class II

(X7R) Within ±12.5%

(This capacitance change means the change of

capacitance under specified flexure of substrate

from the capacitance measured before the test)

R = 230

20

50

45±1 45±1

1mm

Multilayer Ceramic Capacitors Approval Sheet

Page 7 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

No.

Item Standard

Method Test Condition Requirements

15.

Adhesive

Strength of

Termination

IEC

60384-21/22

4.15

IEC 60384-1

4.13

* Capacitors mounted on a substrate. A force of 10N

applied perpendicular to the place of substrate

and parallel the line joining the center of

terminations for 10±1 sec.

* No remarkable damage or removal of the

terminations.

16.

Vibration

IEC 60384-1

4.17

* Reflow solder the capacitors on P. C. Board before

test.

* Vibration frequency : 10~55 Hz/min.

* Total amplitude : 1.5mm.

* Repeat the conditions for 2 hours each in 3

perpendicular directions.

* No remarkable damage.

* Cap. change and Q/D.F. : To meet initial spec.

17.

Impulse

Voltage

IEC

60384-14

4.13

* X1 : 4.0KV

* Y2 : 5.0KV.

* Number of impulse : 24 max.

* There shall be no permanent breakdown or

flashover.

Multilayer Ceramic Capacitors Approval Sheet

Page 8 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

EMBOSSED TAPE DIMENSIONS

Size 1808 1812 2211 2220

Chip

Thickness

1.25±

±±

±0.10

1.40±

±±

±0.15

1.60±

±±

±0.20

2.00±

±±

±0.20

1.25±

±±

±0.10

1.60±

±±

±0.20

2.00±

±±

±0.20

2.50±

±±

±0.30

1.60±

±±

±0.20

2.00±

±±

±0.20

2.50±

±±

±0.30

2.80±

±±

±0.30

2.00±

±±

±0.20

2.50±

±±

±0.30

A

0

<2.50 <2.50 <3.90 <3.90 <3.30 <3.30 <5.80 <5.80

B

0

<5.30 <5.30 <5.30 <5.30 <6.50 <6.50 <6.50 <6.50

T 0.25±0.10

0.25±0.10

0.30±0.10

K

0

<2.50 <2.50 <2.50 <3.50 <2.50 <3.50 <2.50 <3.50

W 12.0±0.30

12.0±0.30

P

0

4.00±0.10

10xP

0

40.0±0.20

40.00±0.20

40.0±0.20

40.00±0.20

P

1

4.00±0.10

8.00±0.10

P

2

2.00±0.10

D

0

1.50+0.10/-0

D

1

1.50±0.10

E 1.75±0.10

1.75±0.10

F 5.50±0.10

5.50±0.10

Size 1808, 1812, 2211, 2220

Reel size 7” 13”

C 13.0+0.5/-0.2 13.0+0.5/-0.2

W

1

12.4+2.0/-0 12.4+2.0/-0

A 178.0±1.0 330.0±1.0

N 60.0+1.0/-0 100±1.0

Fig. 3 The dimension of reel

Fig. 2 The dimension of plastic tape

Multilayer Ceramic Capacitors Approval Sheet

Page 9 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

APPLICATION NOTES

◙ Storage

To prevent the damage of solderability of terminations, the following storage conditions are recommended:

Indoors under 5 ~ 40°C and 20% ~ 70% RH.

No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.

Packaging should not be opened until the capacitors are required for use. If opened, the pack should be

re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might

promote deterioration in tape or adhesion performance. The product is recommended to be used within 12

months after shipment and checked the solderability before use.

◙ Handling

Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical

damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination

or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual

placement. Tape and reeled packages are suitable for automatic pick and placement machine.

◙ Preheat

In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.

The rate of preheat should not exceed 3°C per secon d.

◙ Soldering

Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each

solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between

solder, chips, and substrate.

a.) Hand soldering :

Fig. 4.1

Hand Soldering Profile

Chip Size Pre-Heat temp. ∆T Max. soldering iron temp.

≤1206 ≥150°C ≤150°C ≤350°C

1210~2225 ≥150°C ≤130°C ≤280°C

* Soldering iron tip diameter ≤1.0 mm and wattage max. 20W.

* The Capacitors shall be pre-heated and that the temperature gradient between the devices and the tip of the

soldering iron.

* The required amount of solder shall be melted on the soldering tip.

* The tip of iron should not contact the ceramic body directly.

* The Capacitors shall be cooled gradually at room temperature after soldering.

* Forced air cooling is not allowed.

Multilayer Ceramic Capacitors Approval Sheet

Page 10 of 10 ASC Safety Certified X1/Y2_(S2)_010W_AS Dec. 2018

b.) Reflow soldering :

Fig. 4.2 Reflow soldering profile

For Sn/Ag/Cu Series solder paste (Pb-Free)

◙ Cooling

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is

recommended to minimize stress in the solder joint.

◙ Cleaning

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate

contamination that could cause electrolytic surface corrosion. Good results can be obtained by using

ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as

component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove

flux residues and contamination from under the chips is very important.