AH210 The Communications Edge TM 1 Watt, High Gain HBT Amplifier Product Features Preliminary Product Information Product Description * 1500 - 2300 MHz * 25 dB Gain @ 1960 MHz * +30 dBm P1dB * +49 dBm Output IP3 * Single Positive Supply (+5 V) * SOIC-8 SMT Package Functional Diagram The AH210 is a high gain, high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve superior performance over a broad frequency range with a gain of 25dB, +49 dBm OIP3 and +30 dBm of compressed 1-dB power. The part is housed in an industry standard SOIC-8 SMT package. All devices are 100% RF and dc tested. The product is targeted for use as driver amplifier for various current and next generation wireless technologies such as GPRS, GSM, CDMA, W-CDMA, and UMTS, where high gain, high linearity and high power are required. The internal active bias allows the AH210 to maintain high performance over temperature and the active bias circuitry allows it to operate directly off a +5 V supply. Target Specifications Parameters Frequency Range S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP32 Noise Figure IS-95 Channel Power @ -55 dBc ACPR, 9 Ch .Fwd., 1960 MHz IS-95 Channel Power @ -65 dBc ACPR, 9 Ch .Fwd., 1960 MHz W-CDMA Channel Power @ -50 dBc, 2140MHz, 64 DPCH W-CDMA Channel Power @ -55 dBc, 2140MHz, 64 DPCH Operating Current Range Device Voltage 1 8 Active Bias 2 7 3 6 4 5 Function Vc1 Vbias Input Bias Control Output / Vc2 GND Pin No. 1 2 3 4 5,6,7,8 Slug Typical Specifications Units Min Typ Max MHz dB dB dB dBm dBm dB 1500 1960 25 -15 -15 +30 +47 5.0 2300 dBm +21.5 dBm +19 dBm +20 dBm +19 mA V 440 5 Parameters Units Typical Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP32 Noise Figure Supply Bias MHz dB dB dB 1850 26 -14 -14 dBm dBm dB 30 47 5.0 1960 25 -15 -15 2140 24 -16 -17 +30 +29.5 +47 +49 5.0 5.0 +5 V @ 440 mA Typical parameters reflect performance in an application circuit: Test conditions unless otherwise noted. 1. T = 25C, Vsupply = +5 V, Frequency = 1960 MHz, in recommended application circuit. 2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Ordering Information Parameters Rating Part No. Description RF Input Power (continuous) dc Voltage +10 dBm +6 V AH210 1 Watt, High Linearity HBT Amplifier (Available in Tape & Reel) Operation of this device above any of these parameters may cause permanent damage. Thermal Information Parameters Operating Case Temperature Storage Temperature Thermal Resistance Rating -40 to +85 C -55 to +150 C 33 C/W . To ensure MTTF > 1x10e6 hrs This document contains information on a new product. Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com April 2003 AH210 1 Watt, High Gain HBT Amplifier Outline Drawing The Communications Edge TM Preliminary Product Information Product Marking The component will be marked with an "AH210" designator with a four- or five-digit alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part is located on the website in the "Application Notes" section. ESD / MSL Information Land Pattern ESD Classification: Value: Test: Standard: Class 1B Passes at 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Standard: Level 2 JEDEC Standard J-STD-020A Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. To ensure reliable operation, device ground paddle-toground pad solder joint is critical. 4. Add mounting screws near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. For optimal thermal performance, expose soldermask on backside where it contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. This document contains information on a new product. Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com April 2003