(DOC# 14-02-042 ReI I ECN# 01-1374
The specifications of this device are subject to change without notice. For latest documentation see http://www.amis.com.
N04L1630C2B
Advance InformationAMI Semiconductor, Inc.
Absolute Maximum Ratings1
1. Stresses greater than those listed above may cause permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
Item Symbol Rating Unit
Voltage on any pin relative to VSS VIN,OUT –0.3 to VCC+0.3 V
Voltage on VCC Supply Relative to VSS VCC –0.3 to 4.5 V
Power Dissipation PD500 mW
Storage Temperature TSTG –40 to 125 oC
Operating Temperature TA-40 to +85 oC
Soldering Temperature and Time TSOLDER 260oC, 10sec oC
Operating Characteristics (Over Specified Temperature Range)
Item Symbol Test Conditions Min. Typ1
1. Typical values are measured at Vcc=Vcc Typ., TA=25°C and not 100% tested.
Max Unit
Supply Voltage VCC 2.7 3.0 3.6 V
Data Retention Voltage VDR Chip Disabled31.8 V
Input High Voltage VIH 0.7Vcc VCC+0.3 V
Input Low Voltage VIL –0.3 0.6 V
Output High Voltage VOH
IOH = -100uA VCC–0.2 V
IOH = -1mA 2.4 V
Output Low Voltage VOL
IOL = 100uA 0.2 V
IOL = 2.1mA 0.4
Input Leakage Current ILI VIN = 0 to VCC 0.5 µA
Output Leakage Current ILO OE = VIH or Chip Disabled 0.5 µA
Read/Write Operating Supply Current
@ 1 µs Cycle Time2
2. This parameter is specified with the outputs disabled to avoid external loading effects. The user must add current required to drive output capacitance
expected in the actual system.
ICC1
VCC=VCCMax, VIN=VIH or VIL
Chip Enabled, IOUT = 0 2.5 3.0 mA
Read/Write Operating Supply Current
@ 70 ns Cycle Time2ICC2
VCC=VCCMax, VIN=VIH or VIL
Chip Enabled, IOUT = 0 10 15.0 mA
Page Mode Operating Supply Current
@ 70ns Cycle Time2 (Refer to Power
Savings with Page Mode Operation)
ICC3
VCC=VCCMax, VIN=VIH or VIL
Chip Enabled, IOUT = 0 48mA
Maximum Standby Current3
3. This device assumes a standby mode if the chip is disabled (CE1 high or CE2 low). In order to achieve low standby current all inputs must be within
0.2 volts of either VCC or VSS.
ISB1
VIN = VCC or 0V
Chip Disabled
tA= 85oC, VCC = 3.6 V
110.0µA
Maximum Data Retention Current3IDR
Vcc = 1.8V, VIN = VCC or 0
Chip Disabled, tA= 85oC5µA