SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74
SN7474. SN74LS74A, SN74S74
DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR
SDLS119 – DECEMBER 1983 – REVISED MARCH 1988
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/00205BCA OBSOLETE CDIP J 14 TBD Call TI Call TI
JM38510/00205BDA OBSOLETE CFP W 14 TBD Call TI Call TI
JM38510/00205BDA OBSOLETE CFP W 14 TBD Call TI Call TI
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/07101BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/07101BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102BDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102SCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
JM38510/30102SDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SN5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS74AJ ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54LS74AJ ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S74J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN54S74J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SN7474DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SN7474DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SN7474N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74AJ OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS74AJ OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS74AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74LS74AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74LS74AN3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74AN3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74LS74ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74S74N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74S74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74S74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S74NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74S74NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5474W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5474W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS74AW ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54LS74AW ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S74FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S74FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54S74J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S74J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S74W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SNJ54S74W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 3
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Oct-2005
Addendum-Page 4
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004