December 2015
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This is information on a product in full production.
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STTH2002C
High efficiency ultrafast diode
Datasheet - production data
Features
Suited for SMPS
Low losses
Low forward and reverse recovery times
Low leakage current
High junction temperature
Insulated package: TO-220FPAB
Insulating voltage = 2000 VRMS sine
ECOPACK®2 compliant component for
D²PAK on demand
Description
Dual center tap rectifier suited for switch mode
power supplies and high frequency DC/DC
converters.
Packaged in TO-220AB, TO-220FPAB, I2PAK or
D2PAK, this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
Table 1: Device summary
Symbol
Value
IF(AV)
2 x 10 A
VRRM
200 V
Tj (max)
175 °C
VF (typ)
0.78 V
trr (typ)
22 ns
KK
A1 A1
A2 A2
D2PAK
A1 K
A2
A1KA2
TO-220AB
A1
KA2
TO-220FPAB
A1
KA2
I2PAK
K
K
Characteristics
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DocID10176 Rev 3
1 Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
200
V
IF(RMS)
Forward rms current
30
A
IF(peak)
Average
forward current
δ = 0.5, square
wave
TO-220AB,
D2PAK, I2PAK
TC = 150 °C
Per diode
10
A
TC = 140 °C
Per device
20
TC = 130 °C
Per diode
15
TC = 115 °C
Per device
30
TO-220FPAB
TC = 120 °C
Per diode
10
TC = 85 °C
Per device
20
IFSM
Surge non
repetitive
forward current
tp = 10 ms sinusoidal
90
A
Tstg
Storage temperature range
-65 to + 175
°C
Tj
Maximum operating junction temperature (1)
175
°C
Notes:
(1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameter
Symbol
Parameter
Value
Unit
Rth(j-c)
Junction to case
TO-220AB, D2PAK, I2PAK
Per diode
2.5
°C/W
Per device
1.6
TO-220FPAB
Per diode
5
Per device
3.8
Rth(c)
Coupling
TO-220AB, D2PAK, I2PAK
-
0.7
°C/W
TO-220FPAB
2.5
When the diodes 1 and 2 are used simultaneously:
ΔTj(diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c)
STTH2002C
Characteristics
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Table 4: Static electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IR(1)
Reverse leakage current
Tj = 25 °C
VR = VRRM
-
10
µA
Tj = 125 °C
-
6
100
VF(2)
Forward voltage drop
Tj = 25 °C
IF = 10 A
-
1.1
V
IF = 20 A
-
1.25
Tj = 150 °C
IF = 10 A
-
0.78
0.89
IF = 20 A
-
1.05
Notes:
(1)Pulse test: tp = 5 ms, δ < 2%
(2)Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.73 x IF(AV) + 0.020 IF2(RMS)
Table 5: Dynamic electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
trr
Reverse recovery
time
Tj= 25 °C
IF= 1 A, VR= 30 V,
dIF/dt= 100 A/µs
-
22
27
ns
tfr
Forward recovery
time
Tj = 25 °C
IF = 10 A,
dIF/dt = 100 A/µs,
VFR = 1.1 x VFmax,
-
200
ns
VFP
Forward recovery
voltage
Tj = 25 °C
IF = 10 A,
dIF/dt = 100 A/µs
-
2.4
V
IRM
Reverse recovery
current
Tj = 125 °C
IF = 10 A, VR = 160 V,
dIF/dt = 200 A/µs
-
7.0
9.0
A
Characteristics
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1.1 Characteristics (curves)
Figure 1: Peak current versus duty cycle (per
diode)
Figure 2: Forward voltage drop versus forward
current (typical values, per diode)
Figure 3: Forward voltage drop versus forward
current (maximum values, per diode)
Figure 4: Relative variation of thermal impedance
junction to case versus pulse duration
Figure 5: Relative variation of thermal impedance
junction to case versus pulse duration
Figure 6: Junction capacitance versus reverse
voltage applied (typical values, per diode)
0
10
20
30
40
50
60
70
80
0.00.10.20.30.40.50.60.70.80.9 1.0
I (A)
M
T
δ=tp/T tp
IM
P = 20W
P = 10W
P = 5W
δ
Z/R
th(j-c) th(j-c)
0.1
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
t (s)
p
TO-220AB,D2PAK,I2PAK
0.0
0.1
1.0
1.E-03 1.E-02 1.E-01 1.E+0 0 1.E+01
Z/R
th(j-c) th(j-c)
Single pulse
t (s)
p
TO-220FPAB
10
100
0 50 100150200
C(pF)
V (V)
R
f=1MHz
V =30mV
T =25°C
OSC RMS
j
STTH2002C
Characteristics
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0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
SCu(cm²)
Rth(j-a)(°C/W)
D²PAK
Epoxy printed board FR4, eCU= 35 µm
Figure 7: Reverse recovery charges versus dIF/dt
(typical values, per diode)
Figure 8: Reverse recovery time versus dIF/dt
(typical values, per diode)
Figure 9: Peak reverse recovery current versus
dIF/dt (typical values, per diode)
Figure 10: Dynamic parameters versus junction
temperature
Figure 11: Thermal resistance junction to ambient versus copper surface under tab
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100125150
IRM
Qrr
T(°C)
j
Q ;
rr I [T]/Q ;I [T=125°C]
RM j rr RM j
I =10A
F
V =160V
R
Package information
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DocID10176 Rev 3
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque value: 0.55 N·m (for TO-220AB and TO-220FPAB)
Maximum torque value: 0.7 N·m (for TO-220AB and TO-220FPAB)
STTH2002C
Package information
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2.1 D²PAK package information
Figure 12: D²PAK package outline
This package drawing may slightly differ from the physical package. However, all
the specified dimensions are guaranteed.
Package information
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Table 6: D²PAK package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.36
4.60
0.172
0.181
A1
0.00
0.25
0.000
0.010
b
0.70
0.93
0.028
0.037
b2
1.14
1.70
0.045
0.067
c
0.38
0.69
0.015
0.027
c2
1.19
1.36
0.047
0.053
D
8.60
9.35
0.339
0.368
D1
6.90
8.00
0.272
0.311
D2
1.10
1.50
0.043
0.060
E
10.00
10.55
0.394
0.415
E1
8.10
8.90
0.319
0.346
E2
6.85
7.25
0.266
0.282
e
2.54 typ.
0.100
e1
4.88
5.28
0.190
0.205
H
15.00
15.85
0.591
0.624
J1
2.49
2.90
0.097
0.112
L
1.90
2.79
0.075
0.110
L1
1.27
1.65
0.049
0.065
L2
1.30
1.78
0.050
0.070
R
0.4 typ.
0.015
V2
0°
8°
0°
8°
STTH2002C
Package information
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Figure 13: D²PAK recommended footprint (dimensions in mm)
Package information
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2.2 I²PAK package information
Figure 14: I²PAK package outline
Table 7: I²PAK package mechanical data
Dim.
mm
Min.
Typ.
Max.
A
4.40
–
4.60
A1
2.40
–
2.72
b
0.61
–
0.88
b1
1.14
–
1.70
c
0.49
–
0.70
c2
1.23
–
1.32
D
8.95
–
9.35
e
2.40
–
2.70
e1
4.95
–
5.15
E
10
–
10.40
L
13
–
14
L1
3.50
–
3.93
L2
1.27
–
1.40
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount
device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.
STTH2002C
Package information
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2.3 TO-220AB type A (DZ) package information
Figure 15: TO-220AB package outline
Package information
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Table 8: TO-220AB package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
b
0.61
0.88
0.24
0.035
b1
1.14
1.70
0.045
0.067
c
0.48
0.70
0.019
0.028
D
15.25
15.75
0.600
0.620
D1
1.27 typ.
0.050 typ.
E
10
10.40
0.394
0.409
e
2.4
2.7
0.094
0.106
e1
4.95
5.15
0.195
0.203
F
1.23
1.32
0.048
0.052
H1
6.20
6.60
0.244
0.260
J1
2.4
2.72
0.094
0.107
L
13.0
14.0
0.512
0.551
L1
3.5
3.93
0.138
0.155
L20
16.40 typ.
0.646 typ.
L30
28.90 typ.
1.138 typ.
θP
3.75
3.85
0.148
0.152
Q
2.65
2.95
0.104
0.116
STTH2002C
Package information
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2.4 TO-220FPAB package information
Figure 16: TO-220FPAB package outline
H
A
B
Dia
L7
L6
L5
F1
F2
F
D
E
L4
G1
G
L2
L3
Package information
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Table 9: TO-220FPAB package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.50
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1.0
0.03
0.039
F1
1.15
1.70
0.045
0.067
F2
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.40
2.70
0.094
0.106
H
10.00
10.40
0.393
0.409
L2
16.00 typ.
0.63 typ.
L3
28.60
30.60
1.126
1.205
L4
9.80
10.6
0.386
0.417
L5
2.90
3.60
0.114
0.142
L6
15.90
16.40
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia
3.0
3.20
0.118
0.126
STTH2002C
Ordering information
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3 Ordering information
Table 10: Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STTH2002CT
STTH2002CT
TO-220AB
1.9g
50
Tube
STTH2002CG
STTH2002CG
D2PAK
1.38g
50
Tube
STTH2002CG-TR
STTH2002CG
D2PAK
1.38g
1000
Tape and reel
STTH2002CR
STTH2002CR
I2PAK
1.5g
50
Tube
STTH2002CFP
STTH2002CFP
TO-220FPAB
1.9g
50
Tube
4 Revision history
Table 11: Document revision history
Date
Revision
Changes
Feb-2004
1
First issue.
23-Jun-2010
2
Updated Table 1.
Updated ECOPACK statement.
14-Dec-2015
3
Updated features, Table 1: "Device summary" and packages
silhouette in cover page.
Updated Section 1: "Characteristics" and Table 10: "Ordering
information"
Updated Section 2.2: "D²PAK package information".
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