BAL-CC25-01D3 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun Datasheet production data Description STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC25xx and CC85xx RF transceivers. It's a design using STMicroelectronics IPD (integrated passive device) technology on nonconductive glass substrate to optimize RF performance. )OLS&KLSSDFNDJH EXPSV Figure 1. Pin configuration (top view) Features 2.45 GHz balun with integrated matching network Matching optimized for following chip-sets: - CC2530, CC2531, CC2533 - CC2540 - CC2543, CC2544, CC2545 - CC2570, CC2571 - CC8520, CC8521 - CC8530, CC82531 Low insertion loss Low amplitude imbalance RF_N SE RF_P GND Figure 2. Application schematic (top view) 3RZHU6XSSO\ Low phase imbalance Coated Flip-Chip on glass &&&&&& && &&&&&& &&&& &&&& &&&& Small footprint: < 0.88 mm Benefits %$/&&' 5)B1 5)B3 Very low profile 5)B1 6( 2SWLRQDO ILOWHULQJ = 5)B3 *1' High RF performance PCB space saving versus discrete solution BOM count reduction Efficient manufacturability November 2015 This is information on a product in full production. DocID024657 Rev 4 1/10 www.st.com 10 Characteristics 1 BAL-CC25-01D3 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PPEAK Input power RFIN Typ. Max. 20 dBm ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 kair discharge) 2000 VESD TOP ESD ratings machine model (MM: C = 200 pF, R = 25L = 500 nH) 500 ESD ratings charged device model (CDM, JESD22-C101D) 500 Operating temperature -40 V +125 C Table 2. Electrical characteristics - RF performance (Tamb = 25 C) Value Symbol Parameter Unit Min. ZOUT Max. Nominal input impedance Conjugate match to CC25xx, CC85xx F Frequency range (bandwidth) 2379 IL Insertion loss in bandwidth ZIN 2507 0.66 dB Single ended return loss in bandwidth 19 dB Differential ended return loss in bandwidth 19 dB imb Phase imbalance 14 Aimb Amplitude imbalance 0.3 dB RL_SE RL_DIFF 2/10 Nominal differential output impedance Typ. DocID024657 Rev 4 BAL-CC25-01D3 Characteristics Figure 3. Insertion loss (Tamb = 25 C) -0.5 IL (dB) -0.6 -0.7 -0.8 -0.9 F (GHz) -1.0 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 Figure 4. Return loss (Tamb = 25 C) RL_SE (dB) -10 -12.5 -15 -17.5 -20 -22.5 -25 -27.5 F (GHz) -30 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 Figure 5. Return loss (Tamb = 25 C) RL_DIFF (dB) -10 -12.5 -15 -17.5 -20 -22.5 -25 -27.5 F (GHz) -30 2.38 2.40 2.42 2.44 DocID024657 Rev 4 2.46 2.48 2.50 2.52 3/10 Characteristics BAL-CC25-01D3 Figure 6. Amplitude imbalance (Tamb = 25 C) AMPL(dB) 0.5 0.4 0.3 0.2 0.1 F (GHz) 0.0 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 Figure 7. Phase imbalance (Tamb = 25 C) PHASE(deg) 20.0 17.5 15 12.5 10 7.5 5 2.5 F (GHz) 0.0 2.38 4/10 2.40 2.42 2.44 DocID024657 Rev 4 2.46 2.48 2.50 2.52 BAL-CC25-01D3 2 Package information Package information Epoxy meets UL94, V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Flip-Chip package information Figure 8. Flip-Chip package outline 7RSYLHZ ' VLGHYLHZ %RWWRPYLHZ $ $ $ $ FFF & ' 2.1 ( & ( 6( % % E ' I' I( $ Table 3. Flip-Chip package mechanical data Description Parameter Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm A1 Bump height 0.155 0.205 0.255 mm A2 Substrate thickness 0.400 mm b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 0.890 0.940 0.990 mm D1 Y pitch 0.500 E X dimension of the die E1 X pitch SE 0.890 0.940 mm 0.990 mm 0.500 mm 0.250 mm fD Distance from bump to edge of die on Y axis 0.220 mm fE Distance from bump to edge of die on X axis 0.220 mm ccc 0.05 $ 0.025 DocID024657 Rev 4 mm mm 5/10 Package information BAL-CC25-01D3 Figure 9. Footprint PP " PP PP # Figure 10. Footprint - 3 mils stencil -non solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 12. Footprint - 5 mils stencil -non solder mask defined 6/10 Figure 11. Footprint - 3 mils stencil - solder mask defined Figure 13. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP DocID024657 Rev 4 BAL-CC25-01D3 Package information Figure 14. PCB layout recommendation Pad diameter 250m 850 m 280 m 850 m 127 m GND aperture 100 m 250 m Figure 15. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) Note: x x z y ww More information is available in the STMicroelectronics Application note: AN2348 Flip-Chip: "Package description and recommendations for use" DocID024657 Rev 4 7/10 Package information BAL-CC25-01D3 2.0 0.05 O 1.55 0.10 4.0 0.1 1.0 0.05 8.0 0.3 0.20 0.015 ST ST ST ST ST ST ST xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww 2.0 0.05 1.0 0.05 0.73 0.05 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the application note: AN2348: "Flip Chip: package description and recommendations for use" 8/10 DocID024657 Rev 4 3.5 0.05 Dot identifying Pin A1 location 1.75 0.1 Figure 16. Flip Chip tape and reel specifications BAL-CC25-01D3 3 Ordering information Ordering information Table 4. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode BAL-CC25-01D3 SL Flip Chip 1.07 mg 5000 Tape and reel (7") Revision history Table 5. Document revision history Date Revision Changes 23-May-2013 1 Initial release 11-Jul-2013 2 Updated Figure 14. 04-Sep-2015 3 Updated Figure 8. Added Figure 10, Figure 11, Figure 12, Figure 13 and Table 3. 12-Nov-2015 4 Updated Table 1. DocID024657 Rev 4 9/10 BAL-CC25-01D3 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2015 STMicroelectronics - All rights reserved 10/10 DocID024657 Rev 4