co0304_reli-RP2
co0304_reli_e-01
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
10. Withstanding : between wires and core
CM-RA/BU-RA Type
CM-RB Type
TLH, TLF Type No abnormality(except TLH, TLF10UAH Type)
【Test method and remarks】
TLF : Applied voltage : 2000VAC (TLF (except TLF9UB))
: 500VDC (TLF9UB)
Duration : 60sec.
12. Resistance to vibration
CM-RA/BU-RA Type
CM-RB Type Appearance : No abnormality Inductance change : Within ±15%
TLH, TLF Type TLF9U : Inductance change : Within ±5% TLH, TLF (except TLF9U) : Within the specified range
【Test method and remarks】
CM, TLH, TLF : According to JIS C 0040
Direction : 2hrs each in X, Y and Z direction Total : 6hrs
Frequency range : 10 to 55 to 10Hz (1 min.)
Amplitude : 1.5mm (shall not exceed acceleration 196m/s2)
Mounting method : soldering onto PC board
Recovery : 2 to 24 hrs of recovery under the standard condition after the test. (CM-RB)
: At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2hrs. (TLH, TLF)
13. Solderability
CM-RA/BU-RA Type At least 75% of terminal electrode is covered by new solder.
CM-RB Type
TLH, TLF Type Solder shall be uniformly adhered onto immersed surfaces.
【Test method and remarks】
CM : Solder temperature : 235±5℃
Duration : 2±0.5sec.
Immersion depth : According to detailed specification.
TLH, TLF : Solder temperature : 245±5℃
Duration : 4±1sec.
Immersion depth : Up to 1.0 to 1.5mm from PBC mounted level.
14. Resistance to soldering heat
CM-RA/BU-RA Type Appearance : No abnormality Inductance change : Refer to individual specification
CM-RB Type
TLH, TLF Type TLF9UA : Inductance change : Within ±5% TLF14CB : Within the specified range
【Test method and remarks】
CM : Solder temperature : 260±5℃
Duration : 5±0.5sec.
Immersion depth : Up to 2~2.5mm from terminal root.
Recovery : 1 to 2 hrs of recovery under the standard condition after the test.
TLH, TLF : Solder temperature : 260±5℃
Duration : 10±1sec.
Immersion depth : Up to 1.0 to 1.5mm from PBC mounted level.
Recovery : At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2hrs.
11. Rated voltage
CM-RA/BU-RA Type
Within the specified rangeCM-RB Type
TLH, TLF Type
【Test method and remarks】
TLH, TLF (except TLF9UB) : 250VAC
TLF9UB : 50VDC
■ RELIABILITY DATA
16. Damp heat
CM-RA/BU-RA Type
CM-RB Type
TLH, TLF Type TLF9UA : Inductance change : Within ±15%
TLH, TLF (except TLF9UA) : Withstanding voltage : No abnormality Insulation resistance : No abnormality
【Test method and remarks】
TLH, TLF : Temperature : 60±2℃
40±2℃ (※TLF14CB)
Humidity : 90~95%RH
Duration : 500 hrs
Recovery : At least 1hr of recovery under the standard removal from test chamber followed by the measurement within 2 hrs.
15. Thermnal shock
CM-RA/BU-RA Type Appearance : No abnormality Inductance change : Refer to individual specification
CM-RB Type
TLH, TLF Type TLF9UA : Inductance change : Within ±15%
TLH, TLF (except TLF9UA) : Withstanding voltage : No abnormality Insulation resistance : No abnormality
【Test method and remarks】
CM, TLH, TLF :
According to JIS C 0025
Conditions for 1 cycle
Step Temperature 〔℃〕 Durration 〔min〕
1ー25±3 30±3
2 Room Temperature Within 3
3+85±2 30±3
4 Room Temperature Within 3
Number of cycles : 10
Recovery : At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the measurement within 2 hrs.