Features
•Single 2.3V - 3.6V or 2.7V - 3.6V Supply
•Serial Peripheral Interface (SPI) Compatible
– Supports SPI Modes 0 and 3
– Supports Atmel RapidS Operation
– Supports Dual-Input Program and Dual-Output Read
•Very High Operating Frequencies
– 100MHz for RapidS
– 85MHz for SPI
– Clock-to-Output (tV) of 5ns Maximum
•Flexible, Optimized Erase Architecture for Code + Data Storage Applications
– Uniform 4-Kbyte Block Erase
– Uniform 32-Kbyte Block Erase
– Uniform 64-Kbyte Block Erase
– Full Chip Erase
•Individual Sector Protection with Global Protect/Unprotect Feature
– 32 Sectors of 64-Kbytes Each
•Hardware Controlled Locking of Protected Sectors via WP Pin
•Sector Lockdown
– Make Any Combination of 64-Kbyte Sectors Permanently Read-Only
•128-Byte Programmable OTP Security Register
•Flexible Programming
– Byte/Page Program (1- to 256-Bytes)
•Fast Program and Erase Times
– 1.0ms Typical Page Program (256-Bytes) Time
– 50ms Typical 4-Kbyte Block Erase Time
– 250ms Typical 32-Kbyte Block Erase Time
– 400ms Typical 64-Kbyte Block Erase Time
•Program and Erase Suspend/Resume
•Automatic Checking and Reporting of Erase/Program Failures
•Software Controlled Reset
•JEDEC Standard Manufacturer and Device ID Read Methodology
•Low Power Dissipation
– 5mA Active Read Current (Typical at 20MHz)
– 5µA Deep Power-Down Current (Typical)
•Endurance: 100,000 Program/Erase Cycles
•Data Retention: 20 Years
•Complies with Full Industrial Temperature Range
•Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
– 8-lead SOIC (150-mil and 208-mil wide)
– 8-pad Ultra Thin DFN (5 x 6 x 0.6mm)
16-Megabit
2.3V or 2.7V
Minimum
SPI Serial Flash
Memory
Atmel AT25DF161
Not Recommended
for New Designs
Use AT25DF321A or
AT25DL161
3687E–DFLASH–11/10
2
3687E–DFLASH–11/10
Atmel AT25DF161
1. Description
The Atmel® AT25DF161 is a serial interface Flash memory device designed for use in a wide variety of high-volume
consumer based applications in which program code is shadowed from Flash memory into embedded or external RAM for
execution. The flexible erase architecture of the AT25DF161, with its erase granularity as small as 4-Kbytes, makes it ideal
for data storage as well, eliminating the need for additional data storage EEPROM devices.
The physical sectoring and the erase block sizes of the AT25DF161 have been optimized to meet the needs of today's
code and data storage applications. By optimizing the size of the physical sectors and erase blocks, the memory space can
be used much more efficiently. Because certain code modules and data storage segments must reside by themselves in
their own protected sectors, the wasted and unused memory space that occurs with large sectored and large block erase
Flash memory devices can be greatly reduced. This increased memory space efficiency allows additional code routines and
data storage segments to be added while still maintaining the same overall device density.
The AT25DF161 also offers a sophisticated method for protecting individual sectors against erroneous or malicious
program and erase operations. By providing the ability to individually protect and unprotect sectors, a system can
unprotect a specific sector to modify its contents while keeping the remaining sectors of the memory array securely
protected. This is useful in applications where program code is patched or updated on a subroutine or module basis, or in
applications where data storage segments need to be modified without running the risk of errant modifications to the
program code segments. In addition to individual sector protection capabilities, the AT25DF161 incorporates Global Protect
and Global Unprotect features that allow the entire memory array to be either protected or unprotected all at once. This
reduces overhead during the manufacturing process since sectors do not have to be unprotected one-by-one prior to
initial programming.
To take code and data protection to the next level, the AT25DF161 incorporates a sector lockdown mechanism that allows
any combination of individual 64-Kbyte sectors to be locked down and become permanently read-only. This addresses the
need of certain secure applications that require portions of the Flash memory array to be permanently protected against
malicious attempts at altering program code, data modules, security information, or encryption/decryption algorithms, keys,
and routines. The device also contains a specialized OTP (One-Time Programmable) Security Register that can be used for
purposes such as unique device serialization, system-level Electronic Serial Number (ESN) storage, locked key storage,
etc.
Specifically designed for use in 3V systems, the AT25DF161 supports read, program, and erase operations with a supply
voltage range of 2.3V to 3.6V or 2.7V to 3.6V. No separate voltage is required for programming and erasing.
3
3687E–DFLASH–11/10
Atmel AT25DF161
2. Pin Descriptions and Pinouts
Table 2-1. Pin Descriptions
Symbol Name and Function
Asserted
State Type
CS
CHIP SELECT: Asserting the CS pin selects the device. When the CS pin is deasserted, the device
will be deselected and normally be placed in standby mode (not Deep Power-Down mode), and the
SO pin will be in a high-impedance state. When the device is deselected, data will not be accepted on
the SI pin.
A high-to-low transition on the CS pin is required to start an operation, and a low-to-high transition is
required to end an operation. When ending an internally self-timed operation such as a program or
erase cycle, the device will not enter the standby mode until the completion of the operation.
Low Input
SCK
SERIAL CLOCK: This pin is used to provide a clock to the device and is used to control the flow of
data to and from the device. Command, address, and input data present on the SI pin is always latched
in on the rising edge of SCK, while output data on the SO pin is always clocked out on the falling edge
of SCK.
- Input
SI (SIO)
SERIAL INPUT (SERIAL INPUT/OUTPUT): The SI pin is used to shift data into the device. The SI
pin is used for all data input including command and address sequences. Data on the SI pin is always
latched in on the rising edge of SCK.
With the Dual-Output Read Array command, the SI pin becomes an output pin (SIO) to allow two bits
of data (on the SO and SIO pins) to be clocked out on every falling edge of SCK. To maintain
consistency with SPI nomenclature, the SIO pin will be referenced as SI throughout the document
with exception to sections dealing with the Dual-Output Read Array command in which it will be
referenced as SIO.
Data present on the SI pin will be ignored whenever the device is deselected (CS is deasserted).
- Input/Output
SO (SOI)
SERIAL OUTPUT (SERIAL OUTPUT/INPUT): The SO pin is used to shift data out from the device.
Data on the SO pin is always clocked out on the falling edge of SCK.
With the Dual-Input Byte/Page Program command, the SO pin becomes an input pin (SOI) to allow
two bits of data (on the SOI and SI pins) to be clocked in on every rising edge of SCK. To maintain
consistency with SPI nomenclature, the SOI pin will be referenced as SO throughout the document
with exception to sections dealing with the Dual-Input Byte/Page Program command in which it will
be referenced as SOI.
The SO pin will be in a high-impedance state whenever the device is deselected (CS is deasserted).
- Output/Input
WP
WRITE PROTECT: The WP pin controls the hardware locking feature of the device. Please refer to
“Protection Commands and Features” on page 18 for more details on protection features and the WP
pin.
The WP pin is internally pulled-high and may be left floating if hardware controlled protection will not
be used. However, it is recommended that the WP pin also be externally connected to VCC whenever
possible.
Low Input
HOLD
HOLD: The HOLD pin is used to temporarily pause serial communication without deselecting or
resetting the device. While the HOLD pin is asserted, transitions on the SCK pin and data on the SI pin
will be ignored, and the SO pin will be in a high-impedance state.
The CS pin must be asserted, and the SCK pin must be in the low state in order for a Hold condition to
start. A Hold condition pauses serial communication only and does not have an effect on internally self-
timed operations such as a program or erase cycle. Please refer to “Hold” on page 39 for additional
details on the Hold operation.
The HOLD pin is internally pulled-high and may be left floating if the Hold function will not be used.
However, it is recommended that the HOLD pin also be externally connected to VCC whenever
possible.
Low Input
VCC
DEVICE POWER SUPPLY: The VCC pin is used to supply the source voltage to the device.
Operations at invalid VCC voltages may produce spurious results and should not be attempted. - Power
GND GROUND: The ground reference for the power supply. GND should be connected to the system
ground. - Power
4
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 2-1. Pin Configurations
3. Block Diagram
Figure 3-1. Block Diagram
4. Memory Array
To provide the greatest flexibility, the memory array of the Atmel® AT25DF161 can be erased in four levels of granularity
including a full chip erase. In addition, the array has been divided into physical sectors of uniform size, of which each sector
can be individually protected from program and erase operations. The size of the physical sectors is optimized for both code
and data storage applications, allowing both code and data segments to reside in their own isolated regions. The Memory
Architecture Diagram illustrates the breakdown of each erase level as well as the breakdown of each physical sector.
VCC
HOLD
SCK
SI (SIO)
2
1
8-SOIC
Top View
CS
SO (SOI)
WP
GND
8-UDFN
5
6
7
8
4
3
VCC
HOLD
SCK
SI (SIO)
2
1
Top View
CS
SO (SOI)
WP
GND 5
6
7
8
4
3
CS
SCK
SI (SIO)
SO (SOI)
WP
HOLD
INTERFACE
CONTROL
AND
LOGIC
CONTROL AND
PROTECTION LOGIC
I/O BUFFERS
AND LATCHES
SRAM
DATA BUFFER
Y-GATING
FLASH
MEMORY
ARRAY
Y-DECODER
X-DECODER
ADDRESS LATCH
5
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 4-1. Memory Architecture Diagram
6
3687E–DFLASH–11/10
Atmel AT25DF161
5. Device Operation
The Atmel® AT25DF161 is controlled by a set of instructions that are sent from a host controller, commonly referred to as
the SPI Master. The SPI Master communicates with the AT25DF161 via the SPI bus which is comprised of four signal lines:
Chip Select (CS), Serial Clock (SCK), Serial Input (SI), and Serial Output (SO).
The AT25DF161 features a dual-input program mode in which the SO pin becomes an input. Similarly, the device also
features a dual-output read mode in which the SI pin becomes an output. In the Dual-Input Byte/Page Program command
description, the SO pin will be referred to as the SOI (Serial Output/Input) pin, and in the Dual-Output Read Array
command, the SI pin will be referenced as the SIO (Serial Input/Output) pin.
The SPI protocol defines a total of four modes of operation (mode 0, 1, 2, or 3) with each mode differing in respect to the
SCK polarity and phase and how the polarity and phase control the flow of data on the SPI bus. The AT25DF161 supports
the two most common modes, SPI Modes 0 and 3. The only difference between SPI Modes 0 and 3 is the polarity of the
SCK signal when in the inactive state (when the SPI Master is in standby mode and not transferring any data). With SPI
Modes 0 and 3, data is always latched in on the rising edge of SCK and always output on the falling edge of SCK.
Figure 5-1. SPI Mode 0 and 3
6. Commands and Addressing
A valid instruction or operation must always be started by first asserting the CS pin. After the CS pin has been asserted, the
host controller must then clock out a valid 8-bit opcode on the SPI bus. Following the opcode, instruction dependent
information such as address and data bytes would then be clocked out by the host controller. All opcode, address, and data
bytes are transferred with the most-significant bit (MSB) first. An operation is ended by deasserting the CS pin.
Opcodes not supported by the AT25DF161 will be ignored by the device and no operation will be started. The device will
continue to ignore any data presented on the SI pin until the start of the next operation (CS pin being deasserted and then
reasserted). In addition, if the CS pin is deasserted before complete opcode and address information is sent to the device,
then no operation will be performed and the device will simply return to the idle state and wait for the next operation.
Addressing of the device requires a total of three bytes of information to be sent, representing address bits A23-A0. Since
the upper address limit of the AT25DF161 memory array is 1FFFFFh, address bits A23-A21 are always ignored by the
device.
SO
SI
SCK
CS
06% /6%
06% /6%
7
3687E–DFLASH–11/10
Atmel AT25DF161
Table 6-1. Command Listing
Command Opcode
Clock
Frequency
Address
Bytes
Dummy
Bytes
Data
Bytes
Read Commands
Read Array
1Bh 0001 1011 Up to 100MHz 3 2 1+
0Bh 0000 1011 Up to 85MHz 3 1 1+
03h 0000 0011 Up to 50MHz 3 0 1+
Dual-Output Read Array 3Bh 0011 1011 Up to 85MHz 3 1 1+
Program and Erase Commands
Block Erase (4-KBytes) 20h 0010 0000 Up to 100MHz 3 0 0
Block Erase (32-KBytes) 52h 0101 0010 Up to 100MHz 3 0 0
Block Erase (64-KBytes) D8h 1101 1000 Up to 100MHz 3 0 0
Chip Erase 60h 0110 0000 Up to 100MHz 0 0 0
C7h 1100 0111 Up to 100MHz 0 0 0
Byte/Page Program (1- to 256-Bytes) 02h 0000 0010 Up to 100MHz 3 0 1+
Dual-Input Byte/Page Program
(1- to 256-Bytes) A2h 1010 0010 Up to 100MHz 3 0 1+
Program/Erase Suspend B0h 1011 0000 Up to 100MHz 0 0 0
Program/Erase Resume D0h 1101 0000 Up to 100MHz 0 0 0
Protection Commands
Write Enable 06h 0000 0110 Up to 100MHz 0 0 0
Write Disable 04h 0000 0100 Up to 100MHz 0 0 0
Protect Sector 36h 0011 0110 Up to 100MHz 3 0 0
Unprotect Sector 39h 0011 1001 Up to 100MHz 3 0 0
Global Protect/Unprotect Use Write Status Register Byte 1 Command
Read Sector Protection Registers 3Ch 0011 1100 Up to 100MHz 3 0 1+
Security Commands
Sector Lockdown 33h 0011 0011 Up to 100MHz 3 0 1
Freeze Sector Lockdown State 34h 0011 0100 Up to 100MHz 3 0 1
Read Sector Lockdown Registers 35h 0011 0101 Up to 100MHz 3 0 1+
Program OTP Security Register 9Bh 1001 1011 Up to 100MHz 3 0 1+
Read OTP Security Register 77h 0111 0111 Up to 100MHz 3 2 1+
Status Register Commands
Read Status Register 05h 0000 0101 Up to 100MHz 0 0 1+
Write Status Register Byte 1 01h 0000 0001 Up to 100MHz 0 0 1
Write Status Register Byte 2 31h 0011 0001 Up to 100MHz 0 0 1
Miscellaneous Commands
Reset F0h 1111 0000 Up to 100MHz 0 0 1
Read Manufacturer and Device ID 9Fh 1001 1111 Up to 85MHz 0 0 1 to 4
Deep Power-Down B9h 1011 1001 Up to 100MHz 0 0 0
Resume from Deep Power-Down ABh 1010 1011 Up to 100MHz 0 0 0
8
3687E–DFLASH–11/10
Atmel AT25DF161
7. Read Commands
7.1 Read Array
The Read Array command can be used to sequentially read a continuous stream of data from the device by simply
providing the clock signal once the initial starting address has been specified. The device incorporates an internal address
counter that automatically increments on every clock cycle.
Three opcodes (1Bh, 0Bh, and 03h) can be used for the Read Array command. The use of each opcode depends on the
maximum clock frequency that will be used to read data from the device. The 0Bh opcode can be used at any clock
frequency up to the maximum specified by fCLK, and the 03h opcode can be used for lower frequency read operations up
to the maximum specified by fRDLF. The 1Bh opcode allows the highest read performance possible and can be used at any
clock frequency up to the maximum specified by fMAX; however, use of the 1Bh opcode at clock frequencies above fCLK
should be reserved to systems employing Atmel® RapidS™ protocol.
To perform the Read Array operation, the CS pin must first be asserted and the appropriate opcode (1Bh, 0Bh, or 03h)
must be clocked into the device. After the opcode has been clocked in, the three address bytes must be clocked in to
specify the starting address location of the first byte to read within the memory array. Following the three address bytes,
additional dummy bytes may need to be clocked into the device depending on which opcode is used for the Read Array
operation. If the 1Bh opcode is used, then two dummy bytes must be clocked into the device after the three address
bytes. If the 0Bh opcode is used, then a single dummy byte must be clocked in after the address bytes.
After the three address bytes (and the dummy bytes or byte if using opcodes 1Bh or 0Bh) have been clocked in,
additional clock cycles will result in data being output on the SO pin. The data is always output with the MSB of a byte first.
When the last byte (1FFFFFh) of the memory array has been read, the device will continue reading back at the beginning
of the array (000000h). No delays will be incurred when wrapping around from the end of the array to the beginning of
the array.
Deasserting the CS pin will terminate the read operation and put the SO pin into a high-impedance state. The CS pin can
be deasserted at any time and does not require that a full byte of data be read.
Figure 7-1. Read Array – 1Bh Opcode
SO
SI
SCK
06% 06%
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9
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 7-2. Read Array – 0Bh Opcode
Figure 7-3. Read Array – 03h Opcode
7.2 Dual-Output Read Array
The Dual-Output Read Array command is similar to the standard Read Array command and can be used to sequentially
read a continuous stream of data from the device by simply providing the clock signal once the initial starting address has
been specified. Unlike the standard Read Array command, however, the Dual-Output Read Array command allows two
bits of data to be clocked out of the device on every clock cycle rather than just one.
The Dual-Output Read Array command can be used at any clock frequency up to the maximum specified by fRDDO. To
perform the Dual-Output Read Array operation, the CS pin must first be asserted and the opcode of 3Bh must be clocked
into the device. After the opcode has been clocked in, the three address bytes must be clocked in to specify the starting
address location of the first byte to read within the memory array. Following the three address bytes, a single dummy byte
must also be clocked into the device.
After the three address bytes and the dummy byte have been clocked in, additional clock cycles will result in data being
output on both the SO and SIO pins. The data is always output with the MSB of a byte first, and the MSB is always output
on the SO pin. During the first clock cycle, bit seven of the first data byte will be output on the SO pin while bit six of the
same data byte will be output on the SIO pin. During the next clock cycle, bits five and four of the first data byte will be
output on the SO and SIO pins, respectively. The sequence continues with each byte of data being output after every four
clock cycles. When the last byte (1FFFFFh) of the memory array has been read, the device will continue reading back at
the beginning of the array (000000h). No delays will be incurred when wrapping around from the end of the array to the
beginning of the array.
SO
SI
SCK
CS
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10
3687E–DFLASH–11/10
Atmel AT25DF161
Deasserting the CS pin will terminate the read operation and put the SO and SIO pins into a high-impedance state. The CS
pin can be deasserted at any time and does not require that a full byte of data be read.
Figure 7-4. Dual-Output Read Array
8. Program and Erase Commands
8.1 Byte/Page Program
The Byte/Page Program command allows anywhere from a single byte of data to 256-bytes of data to be programmed
into previously erased memory locations. An erased memory location is one that has all eight bits set to the logical “1”
state (a byte value of FFh). Before a Byte/Page Program command can be started, the Write Enable command must have
been previously issued to the device (see “Write Enable” on page 18) to set the Write Enable Latch (WEL) bit of the
Status Register to a logical “1” state.
To perform a Byte/Page Program command, an opcode of 02h must be clocked into the device followed by the three
address bytes denoting the first byte location of the memory array to begin programming at. After the address bytes have
been clocked in, data can then be clocked into the device and will be stored in an internal buffer.
If the starting memory address denoted by A23-A0 does not fall on an even 256-byte page boundary (A7-A0 are not all
0), then special circumstances regarding which memory locations to be programmed will apply. In this situation, any data
that is sent to the device that goes beyond the end of the page will wrap around back to the beginning of the same page.
For example, if the starting address denoted by A23-A0 is 0000FEh, and three bytes of data are sent to the device, then
the first two bytes of data will be programmed at addresses 0000FEh and 0000FFh while the last byte of data will be
programmed at address 000000h. The remaining bytes in the page (addresses 000001h through 0000FDh) will not be
programmed and will remain in the erased state (FFh). In addition, if more than 256-bytes of data are sent to the device,
then only the last 256-bytes sent will be latched into the internal buffer.
When the CS pin is deasserted, the device will take the data stored in the internal buffer and program it into the
appropriate memory array locations based on the starting address specified by A23-A0 and the number of data bytes sent
to the device. If less than 256 bytes of data were sent to the device, then the remaining bytes within the page will not be
programmed and will remain in the erased state (FFh). The programming of the data bytes is internally self-timed and
should take place in a time of tPP or tBP if only programming a single byte.
The three address bytes and at least one complete byte of data must be clocked into the device before the CS pin is
deasserted, and the CS pin must be deasserted on even byte boundaries (multiples of eight bits); otherwise, the device
will abort the operation and no data will be programmed into the memory array. In addition, if the address specified by
A23-A0 points to a memory location within a sector that is in the protected state (see “Protect Sector” on page 19) or
locked down (see “Sector Lockdown” on page 25), then the Byte/Page Program command will not be executed, and
SO
SIO
SCK
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11
3687E–DFLASH–11/10
Atmel AT25DF161
the device will return to the idle state once the CS pin has been deasserted. The WEL bit in the Status Register will be
reset back to the logical “0” state if the program cycle aborts due to an incomplete address being sent, an incomplete
byte of data being sent, the CS pin being deasserted on uneven byte boundaries, or because the memory location to be
programmed is protected or locked down.
While the device is programming, the Status Register can be read and will indicate that the device is busy. For faster
throughput, it is recommended that the Status Register be polled rather than waiting the tBP or tPP time to determine if the
data bytes have finished programming. At some point before the program cycle completes, the WEL bit in the Status
Register will be reset back to the logical “0” state.
The device also incorporates an intelligent programming algorithm that can detect when a byte location fails to program
properly. If a programming error arises, it will be indicated by the EPE bit in the Status Register.
Figure 8-1. Byte Program
Figure 8-2. Page Program
8.2 Dual-Input Byte/Page Program
The Dual-Input Byte/Page Program command is similar to the standard Byte/Page Program command and can be used to
program anywhere from a single byte of data up to 256-bytes of data into previously erased memory locations. Unlike the
standard Byte/Page Program command, however, the Dual-Input Byte/Page Program command allows two bits of data to
be clocked into the device on every clock cycle rather than just one.
Before the Dual-Input Byte/Page Program command can be started, the Write Enable command must have been
previously issued to the device (see “Write Enable” on page 18) to set the Write Enable Latch (WEL) bit of the Status
Register to a logical “1” state. To perform a Dual-Input Byte/Page Program command, an opcode of A2h must be clocked
SO
SI
SCK
CS
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12
3687E–DFLASH–11/10
Atmel AT25DF161
into the device followed by the three address bytes denoting the first byte location of the memory array to begin
programming at. After the address bytes have been clocked in, data can then be clocked into the device two bits at a time
on both the SOI and SI pins.
The data is always input with the MSB of a byte first, and the MSB is always input on the SOI pin. During the first clock
cycle, bit seven of the first data byte would be input on the SOI pin while bit 6 of the same data byte would be input on the
SI pin. During the next clock cycle, bits five and four of the first data byte would be input on the SOI and SI pins,
respectively. The sequence would continue with each byte of data being input after every four clock cycles. Like the
standard Byte/Page Program command, all data clocked into the device is stored in an internal buffer.
If the starting memory address denoted by A23-A0 does not fall on an even 256-byte page boundary (A7-A0 are not all
0), then special circumstances regarding which memory locations to be programmed will apply. In this situation, any data
that is sent to the device that goes beyond the end of the page will wrap around back to the beginning of the same page.
For example, if the starting address denoted by A23-A0 is 0000FEh, and three bytes of data are sent to the device, then
the first two bytes of data will be programmed at addresses 0000FEh and 0000FFh while the last byte of data will be
programmed at address 000000h. The remaining bytes in the page (addresses 000001h through 0000FDh) will not be
programmed and will remain in the erased state (FFh). In addition, if more than 256-bytes of data are sent to the device,
then only the last 256-bytes sent will be latched into the internal buffer.
When the CS pin is deasserted, the device will take the data stored in the internal buffer and program it into the
appropriate memory array locations based on the starting address specified by A23-A0 and the number of data bytes sent
to the device. If less than 256-bytes of data were sent to the device, then the remaining bytes within the page will not be
programmed and will remain in the erased state (FFh). The programming of the data bytes is internally self-timed and
should take place in a time of tPP or tBP if only programming a single byte.
The three address bytes and at least one complete byte of data must be clocked into the device before the CS pin is
deasserted, and the CS pin must be deasserted on even byte boundaries (multiples of eight bits); otherwise, the device
will abort the operation and no data will be programmed into the memory array. In addition, if the address specified by
A23-A0 points to a memory location within a sector that is in the protected state (see “Protect Sector” on page 19) or
locked down (see “Sector Lockdown” on page 25), then the Byte/Page Program command will not be executed, and
the device will return to the idle state once the CS pin has been deasserted. The WEL bit in the Status Register will be
reset back to the logical “0” state if the program cycle aborts due to an incomplete address being sent, an incomplete
byte of data being sent, the CS pin being deasserted on uneven byte boundaries, or because the memory location to be
programmed is protected or locked down.
While the device is programming, the Status Register can be read and will indicate that the device is busy. For faster
throughput, it is recommended that the Status Register be polled rather than waiting the tBP or tPP time to determine if the
data bytes have finished programming. At some point before the program cycle completes, the WEL bit in the Status
Register will be reset back to the logical “0” state.
The device also incorporates an intelligent programming algorithm that can detect when a byte location fails to program
properly. If a programming error arises, it will be indicated by the EPE bit in the Status Register.
13
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 8-3. Dual-Input Byte Program
Figure 8-4. Dual-Input Page Program
8.3 Block Erase
A block of 4-, 32-, or 64-Kbytes can be erased (all bits set to the logical “1” state) in a single operation by using one of
three different opcodes for the Block Erase command. An opcode of 20h is used for a 4-Kbyte erase, an opcode of 52h is
used for a 32-Kbyte erase, and an opcode of D8h is used for a 64-Kbyte erase. Before a Block Erase command can be
started, the Write Enable command must have been previously issued to the device to set the WEL bit of the Status
Register to a logical “1” state.
To perform a Block Erase, the CS pin must first be asserted and the appropriate opcode (20h, 52h, or D8h) must be
clocked into the device. After the opcode has been clocked in, the three address bytes specifying an address within the 4-
, 32-, or 64-Kbyte block to be erased must be clocked in. Any additional data clocked into the device will be ignored. When
the CS pin is deasserted, the device will erase the appropriate block. The erasing of the block is internally self-timed and
should take place in a time of tBLKE.
Since the Block Erase command erases a region of bytes, the lower order address bits do not need to be decoded by the
device. Therefore, for a 4-Kbyte erase, address bits A11-A0 will be ignored by the device and their values can be either a
logical “1” or “0”. For a 32-Kbyte erase, address bits A14-A0 will be ignored, and for a 64-Kbyte erase, address bits
A15-A0 will be ignored by the device. Despite the lower order address bits not being decoded by the device, the
complete three address bytes must still be clocked into the device before the CS pin is deasserted, and the CS pin must be
deasserted on an even byte boundary (multiples of eight bits); otherwise, the device will abort the operation and no erase
operation will be performed.
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14
3687E–DFLASH–11/10
Atmel AT25DF161
If the address specified by A23-A0 points to a memory location within a sector that is in the protected or locked down
state, then the Block Erase command will not be executed, and the device will return to the idle state once the CS pin has
been deasserted.
The WEL bit in the Status Register will be reset back to the logical “0” state if the erase cycle aborts due to an incomplete
address being sent, the CS pin being deasserted on uneven byte boundaries, or because a memory location within the
region to be erased is protected or locked down.
While the device is executing a successful erase cycle, the Status Register can be read and will indicate that the device is
busy. For faster throughput, it is recommended that the Status Register be polled rather than waiting the tBLKE time to
determine if the device has finished erasing. At some point before the erase cycle completes, the WEL bit in the Status
Register will be reset back to the logical “0” state.
The device also incorporates an intelligent erase algorithm that can detect when a byte location fails to erase properly. If an
erase error occurs, it will be indicated by the EPE bit in the Status Register.
Figure 8-5. Block Erase
8.4 Chip Erase
The entire memory array can be erased in a single operation by using the Chip Erase command. Before a Chip Erase
command can be started, the Write Enable command must have been previously issued to the device to set the WEL bit
of the Status Register to a logical “1” state.
Two opcodes, 60h and C7h, can be used for the Chip Erase command. There is no difference in device functionality when
utilizing the two opcodes, so they can be used interchangeably. To perform a Chip Erase, one of the two opcodes (60h or
C7h) must be clocked into the device. Since the entire memory array is to be erased, no address bytes need to be
clocked into the device, and any data clocked in after the opcode will be ignored. When the CS pin is deasserted, the
device will erase the entire memory array. The erasing of the device is internally self-timed and should take place in a time
of tCHPE.
The complete opcode must be clocked into the device before the CS pin is deasserted, and the CS pin must be deasserted
on an even byte boundary (multiples of eight bits); otherwise, no erase will be performed. In addition, if any sector of the
memory array is in the protected or locked down state, then the Chip Erase command will not be executed, and the device
will return to the idle state once the CS pin has been deasserted. The WEL bit in the Status Register will be reset back to
the logical “0” state if the CS pin is deasserted on uneven byte boundaries or if a sector is in the protected or locked down
state.
While the device is executing a successful erase cycle, the Status Register can be read and will indicate that the device is
busy. For faster throughput, it is recommended that the Status Register be polled rather than waiting the tCHPE time to
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15
3687E–DFLASH–11/10
Atmel AT25DF161
determine if the device has finished erasing. At some point before the erase cycle completes, the WEL bit in the Status
Register will be reset back to the logical “0” state.
The device also incorporates an intelligent erase algorithm that can detect when a byte location fails to erase properly. If an
erase error occurs, it will be indicated by the EPE bit in the Status Register.
Figure 8-6. Chip Erase
8.5 Program/Erase Suspend
In some code plus data storage applications, it is often necessary to process certain high-level system interrupts that
require relatively immediate reading of code or data from the Flash memory. In such an instance, it may not be possible for
the system to wait the microseconds or milliseconds required for the Flash memory to complete a program or erase cycle.
The Program/Erase Suspend command allows a program or erase operation in progress to a particular 64-Kbyte sector of
the Flash memory array to be suspended so that other device operations can be performed. For example, by suspending
an erase operation to a particular sector, the system can perform functions such as a program or read operation within
another 64-Kbyte sector in the device. Other device operations, such as a Read Status Register, can also be performed
while a program or erase operation is suspended. Table 8-1 outlines the operations that are allowed and not allowed
during a program or erase suspend.
Since the need to suspend a program or erase operation is immediate, the Write Enable command does not need to be
issued prior to the Program/Erase Suspend command being issued. Therefore, the Program/Erase Suspend command
operates independently of the state of the WEL bit in the Status Register.
To perform a Program/Erase Suspend, the CS pin must first be asserted and the opcode of B0h must be clocked into the
device. No address bytes need to be clocked into the device, and any data clocked in after the opcode will be ignored.
When the CS pin is deasserted, the program or erase operation currently in progress will be suspended within a time of
tSUSP. The Program Suspend (PS) bit or the Erase Suspend (ES) bit in the Status Register will then be set to the logical
“1” state to indicate that the program or erase operation has been suspended. In addition, the RDY/BSY bit in the Status
Register will indicate that the device is ready for another operation. The complete opcode must be clocked into the device
before the CS pin is deasserted, and the CS pin must be deasserted on an even byte boundary (multiples of eight bits);
otherwise, no suspend operation will be performed.
Read operations are not allowed to a 64-Kbyte sector that has had its program or erase operation suspended. If a read is
attempted to a suspended sector, then the device will output undefined data. Therefore, when performing a Read Array
operation to an unsuspended sector and the device’s internal address counter increments and crosses the sector boundary
to a suspended sector, the device will then start outputting undefined data continuously until the address counter
increments and crosses a sector boundary to an unsuspended sector.
A program operation is not allowed to a sector that has been erase suspended. If a program operation is attempted to an
erase suspended sector, then the program operation will abort and the WEL bit in the Status Register will be reset back to
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16
3687E–DFLASH–11/10
Atmel AT25DF161
the logical “0” state. Likewise, an erase operation is not allowed to a sector that has been program suspended. If
attempted, the erase operation will abort and the WEL bit in the Status Register will be reset to a logical “0” state.
During an Erase Suspend, a program operation to a different 64-Kbyte sector can be started and subsequently suspended.
This results in a simultaneous Erase Suspend/Program Suspend condition and will be indicated by the states of both the ES
and PS bits in the Status Register being set to the logical “1” state.
If a Reset operation (see “Reset” on page 35) is performed while a sector is erase suspended, the suspend operation will
abort and the contents of the block in the suspended sector will be left in an undefined state. However, if a Reset is
performed while a sector is program suspended, the suspend operation will abort but only the contents of the page that
was being programmed and subsequently suspended will be undefined. The remaining pages in the 64-Kbyte sector will
retain their previous contents.
If an attempt is made to perform an operation that is not allowed during a program or erase suspend, such as a Protect
Sector operation, then the device will simply ignore the opcode and no operation will be performed. The state of the WEL
bit in the Status Register, as well as the SPRL (Sector Protection Registers Locked) and SLE (Sector Lockdown Enabled)
bits, will not be affected..
Table 8-1. Operations Allowed and Not Allowed During a Program or Erase Suspend
Command
Operation During
Program Suspend
Operation During
Erase Suspend
Read Commands
Read Array (All Opcodes) Allowed Allowed
Program and Erase Commands
Block Erase Not Allowed Not Allowed
Chip Erase Not Allowed Not Allowed
Byte/Page Program (All Opcodes) Not Allowed Allowed
Program/Erase Suspend Not Allowed Allowed
Program/Erase Resume Allowed Allowed
Protection Commands
Write Enable Not Allowed Allowed
Write Disable Not Allowed Allowed
Protect Sector Not Allowed Not Allowed
Unprotect Sector Not Allowed Not Allowed
Global Protect/Unprotect Not Allowed Not Allowed
Read Sector Protection Registers Allowed Allowed
Security Commands
Sector Lockdown Not Allowed Not Allowed
Freeze Sector Lockdown State Not Allowed Not Allowed
Read Sector Lockdown Registers Allowed Allowed
Program OTP Security Register Not Allowed Not Allowed
Read OTP Security Register Allowed Allowed
Status Register Commands
Read Status Register Allowed Allowed
Write Status Register (All Opcodes) Not Allowed Not Allowed
17
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 8-7. Program/Erase Suspend
8.6 Program/Erase Resume
The Program/Erase Resume command allows a suspended program or erase operation to be resumed and continue
programming a Flash page or erasing a Flash memory block where it left off. As with the Program/Erase Suspend
command, the Write Enable command does not need to be issued prior to the Program/Erase Resume command being
issued. Therefore, the Program/Erase Resume command operates independently of the state of the WEL bit in the Status
Register.
To perform a Program/Erase Resume, the CS pin must first be asserted and the opcode of D0h must be clocked into the
device. No address bytes need to be clocked into the device, and any data clocked in after the opcode will be ignored.
When the CS pin is deasserted, the program or erase operation currently suspended will be resumed within a time of tRES.
The PS bit or the ES bit in the Status Register will then be reset back to the logical “0” state to indicate that the program
or erase operation is no longer suspended. In addition, the RDY/BSY bit in the Status Register will indicate that the device
is busy performing a program or erase operation. The complete opcode must be clocked into the device before the CS pin
is deasserted, and the CS pin must be deasserted on an even byte boundary (multiples of eight bits); otherwise, no
resume operation will be performed.
During a simultaneous Erase Suspend/Program Suspend condition, issuing the Program/Erase Resume command will
result in the program operation resuming first. After the program operation has been completed, the Program/Erase
Resume command must be issued again in order for the erase operation to be resumed.
While the device is busy resuming a program or erase operation, any attempts at issuing the Program/Erase Suspend
command will be ignored. Therefore, if a resumed program or erase operation needs to be subsequently suspended again,
the system must either wait the entire tRES time before issuing the Program/Erase Suspend command, or it must check the
status of the RDY/BSY bit or the appropriate PS or ES bit in the Status Register to determine if the previously suspended
program or erase operation has resumed.
Miscellaneous Commands
Reset Allowed Allowed
Read Manufacturer and Device ID Allowed Allowed
Deep Power-Down Not Allowed Not Allowed
Resume from Deep Power-Down Not Allowed Not Allowed
Table 8-1. Operations Allowed and Not Allowed During a Program or Erase Suspend (Continued)
Command
Operation During
Program Suspend
Operation During
Erase Suspend
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18
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 8-8. Program/Erase Resume
9. Protection Commands and Features
9.1 Write Enable
The Write Enable command is used to set the Write Enable Latch (WEL) bit in the Status Register to a logical “1” state.
The WEL bit must be set before a Byte/Page Program, erase, Protect Sector, Unprotect Sector, Sector Lockdown, Freeze
Sector Lockdown State, Program OTP Security Register, or Write Status Register command can be executed. This makes
the issuance of these commands a two step process, thereby reducing the chances of a command being accidentally or
erroneously executed. If the WEL bit in the Status Register is not set prior to the issuance of one of these commands, then
the command will not be executed.
To issue the Write Enable command, the CS pin must first be asserted and the opcode of 06h must be clocked into the
device. No address bytes need to be clocked into the device, and any data clocked in after the opcode will be ignored.
When the CS pin is deasserted, the WEL bit in the Status Register will be set to a logical “1”. The complete opcode must
be clocked into the device before the CS pin is deasserted, and the CS pin must be deasserted on an even byte boundary
(multiples of eight bits); otherwise, the device will abort the operation and the state of the WEL bit will not change.
Figure 9-1. Write Enable
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19
3687E–DFLASH–11/10
Atmel AT25DF161
9.2 Write Disable
The Write Disable command is used to reset the Write Enable Latch (WEL) bit in the Status Register to the logical "0"
state. With the WEL bit reset, all Byte/Page Program, erase, Protect Sector, Unprotect Sector, Sector Lockdown, Freeze
Sector Lockdown State, Program OTP Security Register, and Write Status Register commands will not be executed. Other
conditions can also cause the WEL bit to be reset; for more details, refer to the WEL bit section of the Status Register
description.
To issue the Write Disable command, the CS pin must first be asserted and the opcode of 04h must be clocked into the
device. No address bytes need to be clocked into the device, and any data clocked in after the opcode will be ignored.
When the CS pin is deasserted, the WEL bit in the Status Register will be reset to a logical “0”. The complete opcode must
be clocked into the device before the CS pin is deasserted, and the CS pin must be deasserted on an even byte boundary
(multiples of eight bits); otherwise, the device will abort the operation and the state of the WEL bit will not change.
Figure 9-2. Write Disable
9.3 Protect Sector
Every physical 64-Kbyte sector of the device has a corresponding single-bit Sector Protection Register that is used to
control the software protection of a sector. Upon device power-up, each Sector Protection Register will default to the
logical “1” state indicating that all sectors are protected and cannot be programmed or erased.
Issuing the Protect Sector command to a particular sector address will set the corresponding Sector Protection Register to
the logical “1” state. The following table outlines the two states of the Sector Protection Registers.
Before the Protect Sector command can be issued, the Write Enable command must have been previously issued to set
the WEL bit in the Status Register to a logical “1”. To issue the Protect Sector command, the CS pin must first be asserted
and the opcode of 36h must be clocked into the device followed by three address bytes designating any address within
the sector to be protected. Any additional data clocked into the device will be ignored. When the CS pin is deasserted, the
Sector Protection Register corresponding to the physical sector addressed by A23-A0 will be set to the logical “1” state,
and the sector itself will then be protected from program and erase operations. In addition, the WEL bit in the Status
Register will be reset back to the logical “0” state.
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Table 9-1. Sector Protection Register Values
Value Sector Protection Status
0 Sector is unprotected and can be programmed and erased.
1 Sector is protected and cannot be programmed or erased. This is the default state.
20
3687E–DFLASH–11/10
Atmel AT25DF161
The complete three address bytes must be clocked into the device before the CS pin is deasserted, and the CS pin must
be deasserted on an even byte boundary (multiples of eight bits); otherwise, the device will abort the operation. When
the device aborts the Protect Sector operation, the state of the Sector Protection Register will be unchanged, and the WEL
bit in the Status Register will be reset to a logical “0”.
As a safeguard against accidental or erroneous protecting or unprotecting of sectors, the Sector Protection Registers can
themselves be locked from updates by using the SPRL (Sector Protection Registers Locked) bit of the Status Register
(please refer to the Status Register description for more details). If the Sector Protection Registers are locked, then any
attempts to issue the Protect Sector command will be ignored, and the device will reset the WEL bit in the Status Register
back to a logical “0” and return to the idle state once the CS pin has been deasserted.
Figure 9-3. Protect Sector
9.4 Unprotect Sector
Issuing the Unprotect Sector command to a particular sector address will reset the corresponding Sector Protection
Register to the logical “0” state (see Table 9-1 for Sector Protection Register values). Every physical sector of the device
has a corresponding single-bit Sector Protection Register that is used to control the software protection of a sector.
Before the Unprotect Sector command can be issued, the Write Enable command must have been previously issued to set
the WEL bit in the Status Register to a logical “1”. To issue the Unprotect Sector command, the CS pin must first be
asserted and the opcode of 39h must be clocked into the device. After the opcode has been clocked in, the three address
bytes designating any address within the sector to be unprotected must be clocked in. Any additional data clocked into the
device after the address bytes will be ignored. When the CS pin is deasserted, the Sector Protection Register
corresponding to the sector addressed by A23-A0 will be reset to the logical “0” state, and the sector itself will be
unprotected. In addition, the WEL bit in the Status Register will be reset back to the logical “0” state.
The complete three address bytes must be clocked into the device before the CS pin is deasserted, and the CS pin must
be deasserted on an even byte boundary (multiples of eight bits); otherwise, the device will abort the operation, the state
of the Sector Protection Register will be unchanged, and the WEL bit in the Status Register will be reset to a logical “0”.
As a safeguard against accidental or erroneous locking or unlocking of sectors, the Sector Protection Registers can
themselves be locked from updates by using the SPRL (Sector Protection Registers Locked) bit of the Status Register
(please refer to the Status Register description for more details). If the Sector Protection Registers are locked, then any
attempts to issue the Unprotect Sector command will be ignored, and the device will reset the WEL bit in the Status
Register back to a logical “0” and return to the idle state once the CS pin has been deasserted.
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3687E–DFLASH–11/10
Atmel AT25DF161
Figure 9-4. Unprotect Sector
9.5 Global Protect/Unprotect
The Global Protect and Global Unprotect features can work in conjunction with the Protect Sector and Unprotect Sector
functions. For example, a system can globally protect the entire memory array and then use the Unprotect Sector
command to individually unprotect certain sectors and individually reprotect them later by using the Protect Sector
command. Likewise, a system can globally unprotect the entire memory array and then individually protect certain sectors
as needed.
Performing a Global Protect or Global Unprotect is accomplished by writing a certain combination of data to the Status
Register using the Write Status Register Byte 1 command (see “Write Status Register Byte 1” on page 33 for command
execution details). The Write Status Register command is also used to modify the SPRL (Sector Protection Registers
Locked) bit to control hardware and software locking.
To perform a Global Protect, the appropriate WP pin and SPRL conditions must be met, and the system must write a logical
“1” to bits five, four, three, and two of the first byte of the Status Register. Conversely, to perform a Global Unprotect, the
same WP and SPRL conditions must be met but the system must write a logical “0” to bits five, four, three, and two of the
first byte of the Status Register. Table 9-2 details the conditions necessary for a Global Protect or Global Unprotect to be
performed.
Sectors that have been erase or program suspended must remain in the unprotected state. If a Global Protect operation is
attempted while a sector is erase or program suspended, the protection operation will abort, the protection states of all
sectors in the Flash memory array will not change, and WEL bit in the Status Register will be reset back to a logical “0”.
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22
3687E–DFLASH–11/10
Atmel AT25DF161
Essentially, if the SPRL bit of the Status Register is in the logical “0” state (Sector Protection Registers are not locked),
then writing a 00h to the first byte of the Status Register will perform a Global Unprotect without changing the state of the
SPRL bit. Similarly, writing a 7Fh to the first byte of the Status Register will perform a Global Protect and keep the SPRL bit
in the logical “0” state. The SPRL bit can, of course, be changed to a logical “1” by writing an FFh if software-locking or
hardware-locking is desired along with the Global Protect.
If the desire is to only change the SPRL bit without performing a Global Protect or Global Unprotect, then the system can
simply write a 0Fh to the first byte of the Status Register to change the SPRL bit from a logical “1” to a logical “0”
provided the WP pin is deasserted. Likewise, the system can write an F0h to change the SPRL bit from a logical “0” to a
Table 9-2. Valid SPRL and Global Protect/Unprotect Conditions
WP
State
Current
SPRL
Value
New Write Status
Register Byte 1
Data
Protection Operation
New
SPRL
Value
Bit
7 6 5 4 3 2 1 0
00
0 x 0 0 0 0 x x
0 x 0 0 0 1 x x
0 x 1 1 1 0 x x
0 x 1 1 1 1 x x
1 x 0 0 0 0 x x
1 x 0 0 0 1 x x
1 x 1 1 1 0 x x
1 x 1 1 1 1 x x
Global Unprotect – all Sector Protection Registers reset to 0
No change to current protection.
No change to current protection.
No change to current protection.
Global Protect – all Sector Protection Registers set to 1
Global Unprotect – all Sector Protection Registers reset to 0
No change to current protection.
No change to current protection.
No change to current protection.
Global Protect – all Sector Protection Registers set to 1
0
0
0
0
0
1
1
1
1
1
0 1 x x x x x x x x
No change to the current protection level. All sectors currently protected will remain protected and
all sectors currently unprotected will remain unprotected.
The Sector Protection Registers are hard-locked and cannot be changed when the WP pin is LOW
and the current state of SPRL is 1. Therefore, a Global Protect/Unprotect will not occur. In addition,
the SPRL bit cannot be changed (the WP pin must be HIGH in order to change SPRL back to a 0).
10
0 x 0 0 0 0 x x
0 x 0 0 0 1 x x
0 x 1 1 1 0 x x
0 x 1 1 1 1 x x
1 x 0 0 0 0 x x
1 x 0 0 0 1 x x
1 x 1 1 1 0 x x
1 x 1 1 1 1 x x
Global Unprotect – all Sector Protection Registers reset to 0
No change to current protection.
No change to current protection.
No change to current protection.
Global Protect – all Sector Protection Registers set to 1
Global Unprotect – all Sector Protection Registers reset to 0
No change to current protection.
No change to current protection.
No change to current protection.
Global Protect – all Sector Protection Registers set to 1
0
0
0
0
0
1
1
1
1
1
11
0 x 0 0 0 0 x x
0 x 0 0 0 1 x x
0 x 1 1 1 0 x x
0 x 1 1 1 1 x x
1 x 0 0 0 0 x x
1 x 0 0 0 1 x x
1 x 1 1 1 0 x x
1 x 1 1 1 1 x x
No change to the current protection level. All sectors currently protected will remain
protected, and all sectors currently unprotected will remain unprotected.
The Sector Protection Registers are soft-locked and cannot be changed when the current
state of SPRL is 1. Therefore, a Global Protect/Unprotect will not occur. However, the
SPRL bit can be changed back to a 0 from a 1 since the WP pin is HIGH. To perform a
Global Protect/Unprotect, the Write Status Register command must be issued again after
the SPRL bit has been changed from a 1 to a 0.
0
0
0
0
0
1
1
1
1
1
23
3687E–DFLASH–11/10
Atmel AT25DF161
logical “1” without affecting the current sector protection status (no changes will be made to the Sector Protection
Registers).
When writing to the first byte of the Status Register, bits five, four, three, and two will not actually be modified but will be
decoded by the device for the purposes of the Global Protect and Global Unprotect functions. Only bit seven, the SPRL bit,
will actually be modified. Therefore, when reading the first byte of the Status Register, bits five, four, three, and two will not
reflect the values written to them but will instead indicate the status of the WP pin and the sector protection status. Please
refer to “Read Status Register” on page 30 and Table 11-1 on page 30 for details on the Status Register format and what
values can be read for bits five, four, three, and two.
9.6 Read Sector Protection Registers
The Sector Protection Registers can be read to determine the current software protection status of each sector. Reading
the Sector Protection Registers, however, will not determine the status of the WP pin.
To read the Sector Protection Register for a particular sector, the CS pin must first be asserted and the opcode of 3Ch must
be clocked in. Once the opcode has been clocked in, three address bytes designating any address within the sector must
be clocked in. After the last address byte has been clocked in, the device will begin outputting data on the SO pin during
every subsequent clock cycle. The data being output will be a repeating byte of either FFh or 00h to denote the value of
the appropriate Sector Protection Register.
At clock frequencies above fCLK, the first byte of data output will not be valid. Therefore, if operating at clock frequencies
above fCLK, at least two bytes of data must be clocked out from the device in order to determine the correct status of the
appropriate Sector Protection Register.
Deasserting the CS pin will terminate the read operation and put the SO pin into a high-impedance state. The CS pin can
be deasserted at any time and does not require that a full byte of data be read.
In addition to reading the individual Sector Protection Registers, the Software Protection Status (SWP) bits in the Status
Register can be read to determine if all, some, or none of the sectors are software protected (refer to “Read Status
Register” on page 30 for more details).
Figure 9-5. Read Sector Protection Register
Table 9-3. Read Sector Protection Register – Output Data
Output Data Sector Protection Register Value
00h Sector Protection Register value is 0 (sector is unprotected)
FFh Sector Protection Register value is 1 (sector is protected)
SO
SI
SCK
CS
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3687E–DFLASH–11/10
Atmel AT25DF161
9.7 Protected States and the Write Protect (WP) Pin
The WP pin is not linked to the memory array itself and has no direct effect on the protection status or lockdown status of
the memory array. Instead, the WP pin, in conjunction with the SPRL (Sector Protection Registers Locked) bit in the Status
Register, is used to control the hardware locking mechanism of the device. For hardware locking to be active, two
conditions must be met-the WP pin must be asserted and the SPRL bit must be in the logical “1” state.
When hardware locking is active, the Sector Protection Registers are locked and the SPRL bit itself is also locked. Therefore,
sectors that are protected will be locked in the protected state, and sectors that are unprotected will be locked in the
unprotected state. These states cannot be changed as long as hardware locking is active, so the Protect Sector, Unprotect
Sector, and Write Status Register commands will be ignored. In order to modify the protection status of a sector, the WP
pin must first be deasserted, and the SPRL bit in the Status Register must be reset back to the logical “0” state using the
Write Status Register command. When resetting the SPRL bit back to a logical “0”, it is not possible to perform a Global
Protect or Global Unprotect at the same time since the Sector Protection Registers remain soft-locked until after the Write
Status Register command has been executed.
If the WP pin is permanently connected to GND, then once the SPRL bit is set to a logical “1”, the only way to reset the
bit back to the logical “0” state is to power-cycle the device. This allows a system to power-up with all sectors software
protected but not hardware locked. Therefore, sectors can be unprotected and protected as needed and then hardware
locked at a later time by simply setting the SPRL bit in the Status Register.
When the WP pin is deasserted, or if the WP pin is permanently connected to VCC, the SPRL bit in the Status Register can
still be set to a logical “1” to lock the Sector Protection Registers. This provides a software locking ability to prevent
erroneous Protect Sector or Unprotect Sector commands from being processed. When changing the SPRL bit to a logical
“1” from a logical “0”, it is also possible to perform a Global Protect or Global Unprotect at the same time by writing the
appropriate values into bits five, four, three, and two of the first byte of the Status Register.
Tables 9-4 and 9-5 detail the various protection and locking states of the device.
Note: 1. “n” represents a sector number
Table 9-4. Sector Protection Register States
WP
Sector Protection Register
n(1)
Sector
n(1)
X
(Don't Care)
0 Unprotected
1 Protected
Table 9-5. Hardware and Software Locking
WP SPRL Locking SPRL Change Allowed Sector Protection Registers
0 0 Can be modified from 0 to 1 Unlocked and modifiable using the Protect and Unprotect Sector
commands. Global Protect and Unprotect can also be performed.
01
Hardware
Locked Locked
Locked in current state. Protect and Unprotect Sector commands
will be ignored. Global Protect and Unprotect cannot be
performed.
1 0 Can be modified from 0 to 1 Unlocked and modifiable using the Protect and Unprotect Sector
commands. Global Protect and Unprotect can also be performed.
11
Software
Locked Can be modified from 1 to 0
Locked in current state. Protect and Unprotect Sector commands
will be ignored. Global Protect and Unprotect cannot be
performed.
25
3687E–DFLASH–11/10
Atmel AT25DF161
10. Security Commands
10.1 Sector Lockdown
Certain applications require that portions of the Flash memory array be permanently protected against malicious attempts
at altering program code, data modules, security information, or encryption/decryption algorithms, keys, and routines. To
address these applications, the device incorporates a sector lockdown mechanism that allows any combination of individual
64-Kbyte sectors to be permanently locked so that they become read only. Once a sector is locked down, it can never be
erased or programmed again, and it can never be unlocked from the locked down state.
Each 64-Kbyte physical sector has a corresponding single-bit Sector Lockdown Register that is used to control the
lockdown status of that sector. These registers are nonvolatile and will retain their state even after a device power-cycle or
reset operation. The following table outlines the two states of the Sector Lockdown Registers.
Issuing the Sector Lockdown command to a particular sector address will set the corresponding Sector Lockdown Register
to the logical “1” state. Each Sector Lockdown Register can only be set once; therefore, once set to the logical “1” state,
a Sector Lockdown Register cannot be reset back to the logical “0” state.
Before the Sector Lockdown command can be issued, the Write Enable command must have been previously issued to set
the WEL bit in the Status Register to a logical “1”. In addition, the Sector Lockdown Enabled (SLE) bit in the Status
Register must have also been previously set to the logical “1” state by using the Write Status Register Byte 2 command
(see “Write Status Register Byte 2” on page 34). To issue the Sector Lockdown command, the CS pin must first be
asserted and the opcode of 33h must be clocked into the device followed by three address bytes designating any address
within the 64-Kbyte sector to be locked down. After the three address bytes have been clocked in, a confirmation byte of
D0h must also be clocked in immediately following the three address bytes. Any additional data clocked into the device
after the first byte of data will be ignored. When the CS pin is deasserted, the Sector Lockdown Register corresponding to
the sector addressed by A23-A0 will be set to the logical “1” state, and the sector itself will then be permanently locked
down from program and erase operations within a time of tLOCK. In addition, the WEL bit in the Status Register will be reset
back to the logical “0” state.
The complete three address bytes and the correct confirmation byte value of D0h must be clocked into the device before
the CS pin is deasserted, and the CS pin must be deasserted on an even byte boundary (multiples of eight bits);
otherwise, the device will abort the operation. When the device aborts the Sector Lockdown operation, the state of the
corresponding Sector Lockdown Register as well as the SLE bit in the Status Register will be unchanged; however, the
WEL bit in the Status Register will be reset to a logical “0”.
As a safeguard against accidental or erroneous locking down of sectors, the Sector Lockdown command can be enabled
and disabled as needed by using the SLE bit in the Status Register. In addition, the current sector lockdown state can be
frozen so that no further modifications to the Sector Lockdown Registers can be made (see “Freeze Sector Lockdown
State” below). If the Sector Lockdown command is disabled or if the sector lockdown state is frozen, then any attempts to
issue the Sector Lockdown command will be ignored, and the device will reset the WEL bit in the Status Register back to a
logical “0” and return to the idle state once the CS pin has been deasserted.
Table 10-1. Sector Lockdown Register Values
Value Sector Lockdown Status
0 Sector is not locked down and can be programmed and erased. This is the default state.
1 Sector is permanently locked down and can never be programmed or erased again
26
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 10-1. Sector Lockdown
10.2 Freeze Sector Lockdown State
The current sector lockdown state can be permanently frozen so that no further modifications to the Sector Lockdown
Registers can be made; therefore, the Sector Lockdown command will be permanently disabled, and no additional sectors
can be locked down aside from those already locked down. Any attempts to issue the Sector Lockdown command after
the sector lockdown state has been frozen will be ignored.
Before the Freeze Sector Lockdown State command can be issued, the Write Enable command must have been
previously issued to set the WEL bit in the Status Register to a logical “1”. In addition, the Sector Lockdown Enabled
(SLE) bit in the Status Register must have also been previously set to the logical “1” state. To issue the Freeze Sector
Lockdown State command, the CS pin must first be asserted and the opcode of 34h must be clocked into the device
followed by three command specific address bytes of 55AA40h. After the three address bytes have been clocked in, a
confirmation byte of D0h must be clocked in immediately following the three address bytes. Any additional data clocked
into the device will be ignored. When the CS pin is deasserted, the current sector lockdown state will be permanently
frozen within a time of tLOCK. In addition, the WEL bit in the Status Register will be reset back to the logical “0” state, and
the SLE bit will be permanently reset to a logical “0” to indicate that the Sector Lockdown command is permanently
disabled.
The complete and correct three address bytes and the confirmation byte must be clocked into the device before the CS
pin is deasserted, and the CS pin must be deasserted on an even byte boundary (multiples of eight bits); otherwise, the
device will abort the operation. When the device aborts the Freeze Sector Lockdown State operation, the WEL bit in the
Status Register will be reset to a logical “0”; however, the state of the SLE bit will be unchanged.
Figure 10-2. Freeze Sector Lockdown State
SO
SI
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CS
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27
3687E–DFLASH–11/10
Atmel AT25DF161
10.3 Read Sector Lockdown Registers
The Sector Lockdown Registers can be read to determine the current lockdown status of each physical 64-Kbyte sector.
To read the Sector Lockdown Register for a particular 64-Kbyte sector, the CS pin must first be asserted and the opcode of
35h must be clocked in. Once the opcode has been clocked in, three address bytes designating any address within the 64-
Kbyte sector must be clocked in. After the address bytes have been clocked in, data will be output on the SO pin during
every subsequent clock cycle. The data being output will be a repeating byte of either FFh or 00h to denote the value of
the appropriate Sector Lockdown Register.
At clock frequencies above fCLK, the first byte of data output will not be valid. Therefore, if operating at clock frequencies
above fCLK, at least two bytes of data must be clocked out from the device in order to determine the correct status of the
appropriate Sector Lockdown Register.
Deasserting the CS pin will terminate the read operation and put the SO pin into a high-impedance state. The CS pin can
be deasserted at any time and does not require that a full byte of data be read.
Figure 10-3. Read Sector Lockdown Register
10.4 Program OTP Security Register
The device contains a specialized OTP (One-Time Programmable) Security Register that can be used for purposes such as
unique device serialization, system-level Electronic Serial Number (ESN) storage, locked key storage, etc. The OTP
Security Register is independent of the main Flash memory array and is comprised of a total of 128-bytes of memory
divided into two portions. The first 64-bytes (byte locations 0 through 63) of the OTP Security Register are allocated as a
one-time user-programmable space. Once these 64-bytes have been programmed, they cannot be erased or
reprogrammed. The remaining 64-bytes of the OTP Security Register (byte locations 64 through 127) are factory
programmed by Atmel® and will contain a unique value for each device. The factory programmed data is fixed and cannot
be changed.
Table 10-2. Read Sector Lockdown Register – Output Data
Output Data Sector Lockdown Register Value
00h Sector Lockdown Register value is 0 (sector is not locked down)
FFh Sector Lockdown Register value is 1 (sector is permanently locked down).
SO
SI
SCK
CS
06% 06%
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28
3687E–DFLASH–11/10
Atmel AT25DF161
The user-programmable portion of the OTP Security Register does not need to be erased before it is programmed. In
addition, the Program OTP Security Register command operates on the entire 64-byte user-programmable portion of the
OTP Security Register at one time. Once the user-programmable space has been programmed with any number of bytes,
the user-programmable space cannot be programmed again; therefore, it is not possible to only program the first two
bytes of the register and then program the remaining 62-bytes at a later time.
Before the Program OTP Security Register command can be issued, the Write Enable command must have been
previously issued to set the WEL bit in the Status Register to a logical “1”. To program the OTP Security Register, the CS
pin must first be asserted and an opcode of 9Bh must be clocked into the device followed by the three address bytes
denoting the first byte location of the OTP Security Register to begin programming at. Since the size of the user-
programmable portion of the OTP Security Register is 64-bytes, the upper order address bits do not need to be decoded
by the device. Therefore, address bits A23-A6 will be ignored by the device and their values can be either a logical “1” or
“0”. After the address bytes have been clocked in, data can then be clocked into the device and will be stored in the
internal buffer.
If the starting memory address denoted by A23-A0 does not start at the beginning of the OTP Security Register memory
space (A5-A0 are not all 0), then special circumstances regarding which OTP Security Register locations to be
programmed will apply. In this situation, any data that is sent to the device that goes beyond the end of the 64-byte user-
programmable space will wrap around back to the beginning of the OTP Security Register. For example, if the starting
address denoted by A23-A0 is 00003Eh, and three bytes of data are sent to the device, then the first two bytes of data
will be programmed at OTP Security Register addresses 00003Eh and 00003Fh while the last byte of data will be
programmed at address 000000h. The remaining bytes in the OTP Security Register (addresses 000001h through
00003Dh) will not be programmed and will remain in the erased state (FFh). In addition, if more than 64-bytes of data
are sent to the device, then only the last 64-bytes sent will be latched into the internal buffer.
When the CS pin is deasserted, the device will take the data stored in the internal buffer and program it into the
appropriate OTP Security Register locations based on the starting address specified by A23-A0 and the number of data
bytes sent to the device. If less than 64-bytes of data were sent to the device, then the remaining bytes within the OTP
Security Register will not be programmed and will remain in the erased state (FFh). The programming of the data bytes
is internally self-timed and should take place in a time of tOTPP. It is not possible to suspend the programming of the OTP
Security Register.
The three address bytes and at least one complete byte of data must be clocked into the device before the CS pin is
deasserted, and the CS pin must be deasserted on even byte boundaries (multiples of eight bits); otherwise, the device
will abort the operation and the user-programmable portion of the OTP Security Register will not be programmed. The
WEL bit in the Status Register will be reset back to the logical “0” state if the OTP Security Register program cycle aborts
due to an incomplete address being sent, an incomplete byte of data being sent, the CS pin being deasserted on uneven
byte boundaries, or because the user-programmable portion of the OTP Security Register was previously programmed.
While the device is programming the OTP Security Register, the Status Register can be read and will indicate that the
device is busy. For faster throughput, it is recommended that the Status Register be polled rather than waiting the tOTPP
time to determine if the data bytes have finished programming. At some point before the OTP Security Register
programming completes, the WEL bit in the Status Register will be reset back to the logical “0” state.
If the device is powered-down during the OTP Security Register program cycle, then the contents of the 64-byte user
programmable portion of the OTP Security Register cannot be guaranteed and cannot be programmed again.
Table 10-3. OTP Security Register
Security Register
Byte Number
01. . . 62 63 64 65 . . . 126 127
One-Time User Programmable Factory Programmed by Atmel
29
3687E–DFLASH–11/10
Atmel AT25DF161
The Program OTP Security Register command utilizes the internal 256-buffer for processing. Therefore, the contents of
the buffer will be altered from its previous state when this command is issued.
Figure 10-4. Program OTP Security Register
10.5 Read OTP Security Register
The OTP Security Register can be sequentially read in a similar fashion to the Read Array operation up to the maximum
clock frequency specified by fMAX. To read the OTP Security Register, the CS pin must first be asserted and the opcode of
77h must be clocked into the device. After the opcode has been clocked in, the three address bytes must be clocked in to
specify the starting address location of the first byte to read within the OTP Security Register. Following the three address
bytes, two dummy bytes must be clocked into the device before data can be output.
After the three address bytes and the dummy bytes have been clocked in, additional clock cycles will result in OTP Security
Register data being output on the SO pin. When the last byte (00007Fh) of the OTP Security Register has been read, the
device will continue reading back at the beginning of the register (000000h). No delays will be incurred when wrapping
around from the end of the register to the beginning of the register.
Deasserting the CS pin will terminate the read operation and put the SO pin into a high-impedance state. The CS pin can
be deasserted at any time and does not require that a full byte of data be read.
Figure 10-5. Read OTP Security Register
SO
SI
SCK
CS
06% 06%
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SI
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30
3687E–DFLASH–11/10
Atmel AT25DF161
11. Status Register Commands
11.1 Read Status Register
The two-byte Status Register can be read to determine the device’s ready/busy status, as well as the status of many other
functions such as Hardware Locking and Software Protection. The Status Register can be read at any time, including during
an internally self-timed program or erase operation.
To read the Status Register, the CS pin must first be asserted and the opcode of 05h must be clocked into the device. After
the opcode has been clocked in, the device will begin outputting Status Register data on the SO pin during every
subsequent clock cycle. After the second byte of the Status Register has been clocked out, the sequence will repeat itself
starting again with the first byte of the Status Register as long as the CS pin remains asserted and the clock pin is being
pulsed. The data in the Status Register is constantly being updated, so each repeating sequence will output new data. The
RDY/BSY status is available for both bytes of the Status Register and is updated for each byte.
At clock frequencies above fCLK, the first two bytes of data output from the Status Register will not be valid. Therefore, if
operating at clock frequencies above fCLK, at least four bytes of data must be clocked out from the device in order to read
the correct values of both bytes of the Status Register.
Deasserting the CS pin will terminate the Read Status Register operation and put the SO pin into a high-impedance state.
The CS pin can be deasserted at any time and does not require that a full byte of data be read.
Notes: 1. Only bit 7 of Status Register Byte 1 will be modified when using the Write Status Register Byte 1 command
2. R/W = Readable and writeable
R = Readable only
Table 11-1. Status Register Format – Byte 1
Bit(1) Name Type(2) Description
7 SPRL Sector Protection Registers Locked R/W
0 Sector Protection Registers are unlocked (default).
1 Sector Protection Registers are locked.
6 RES Reserved for future use R 0 Reserved for future use.
5 EPE Erase/Program Error R
0 Erase or program operation was successful.
1 Erase or program error detected.
4 WPP Write Protect (WP) Pin Status R
0WP is asserted.
1WP is deasserted.
3:2 SWP Software Protection Status R
00 All sectors are software unprotected (all Sector
Protection Registers are 0).
01
Some sectors are software protected. Read individual
Sector Protection Registers to determine which sectors
are protected.
10 Reserved for future use.
11 All sectors are software protected (all Sector Protection
Registers are 1 – default).
1 WEL Write Enable Latch Status R
0 Device is not write enabled (default).
1 Device is write enabled.
0 RDY/BSY Ready/Busy Status R
0 Device is ready.
1 Device is busy with an internal operation.
31
3687E–DFLASH–11/10
Atmel AT25DF161
Notes: 1. Only bits 4 and 3 of Status Register Byte 2 will be modified when using the Write Status Register Byte 2 command
2. R/W = Readable and writeable
R = Readable only
11.1.1 SPRL Bit
The SPRL bit is used to control whether the Sector Protection Registers can be modified or not. When the SPRL bit is in
the logical “1” state, all Sector Protection Registers are locked and cannot be modified with the Protect Sector and
Unprotect Sector commands (the device will ignore these commands). In addition, the Global Protect and Global
Unprotect features cannot be performed. Any sectors that are presently protected will remain protected, and any sectors
that are presently unprotected will remain unprotected.
When the SPRL bit is in the logical “0” state, all Sector Protection Registers are unlocked and can be modified (the Protect
Sector and Unprotect Sector commands, as well as the Global Protect and Global Unprotect features, will be processed as
normal). The SPRL bit defaults to the logical “0” state after device power-up. The Reset command has no effect on the
SPRL bit.
The SPRL bit can be modified freely whenever the WP pin is deasserted. However, if the WP pin is asserted, then the
SPRL bit may only be changed from a logical “0” (Sector Protection Registers are unlocked) to a logical “1” (Sector
Protection Registers are locked). In order to reset the SPRL bit back to a logical “0” using the Write Status Register Byte 1
command, the WP pin will have to first be deasserted.
The SPRL bit is the only bit of Status Register Byte 1 that can be user modified via the Write Status Register Byte 1
command.
11.1.2 EPE Bit
The EPE bit indicates whether the last erase or program operation completed successfully or not. If at least one byte during
the erase or program operation did not erase or program properly, then the EPE bit will be set to the logical “1” state. The
EPE bit will not be set if an erase or program operation aborts for any reason such as an attempt to erase or program a
protected region or a locked down sector, an attempt to erase or program a suspended sector, or if the WEL bit is not set
prior to an erase or program operation. The EPE bit will be updated after every erase and program operation.
Table 11-2. Status Register Format – Byte 2
Bit(1) Name Type(2) Description
7 RES Reserved for future use R 0 Reserved for future use
6 RES Reserved for future use R 0 Reserved for future use
5 RES Reserved for future use R 0 Reserved for future use
4 RSTE Reset Enabled R/W
0 Reset command is disabled (default)
1 Reset command is enabled
3 SLE Sector Lockdown Enabled R/W
0Sector Lockdown and Freeze Sector Lockdown State
commands are disabled (default)
1Sector Lockdown and Freeze Sector Lockdown State
commands are enabled
2 PS Program Suspend Status R
0 No sectors are program suspended (default)
1 A sector is program suspended
1 ES Erase Suspend Status R
0 No sectors are erase suspended (default)
1 A sector is erase suspended
0 RDY/BSY Ready/Busy Status R
0 Device is ready
1 Device is busy with an internal operation
32
3687E–DFLASH–11/10
Atmel AT25DF161
11.1.3 WPP Bit
The WPP bit can be read to determine if the WP pin has been asserted or not.
11.1.4 SWP Bits
The SWP bits provide feedback on the software protection status for the device. There are three possible combinations of
the SWP bits that indicate whether none, some, or all of the sectors have been protected using the Protect Sector
command or the Global Protect feature. If the SWP bits indicate that some of the sectors have been protected, then the
individual Sector Protection Registers can be read with the Read Sector Protection Registers command to determine which
sectors are in fact protected.
11.1.5 WEL Bit
The WEL bit indicates the current status of the internal Write Enable Latch. When the WEL bit is in the logical “0” state,
the device will not accept any Byte/Page Program, erase, Protect Sector, Unprotect Sector, Sector Lockdown, Freeze
Sector Lockdown State, Program OTP Security Register, or Write Status Register commands. The WEL bit defaults to the
logical “0” state after a device power-up or reset operation. In addition, the WEL bit will be reset to the logical “0” state
automatically under the following conditions:
•Write Disable operation completes successfully
•Write Status Register operation completes successfully or aborts
•Protect Sector operation completes successfully or aborts
•Unprotect Sector operation completes successfully or aborts
•Sector Lockdown operation completes successfully or aborts
•Freeze Sector Lockdown State operation completes successfully or aborts
•Program OTP Security Register operation completes successfully or aborts
•Byte/Page Program operation completes successfully or aborts
•Block Erase operation completes successfully or aborts
•Chip Erase operation completes successfully or aborts
•Hold condition aborts
If the WEL bit is in the logical “1” state, it will not be reset to a logical “0” if an operation aborts due to an incomplete or
unrecognized opcode being clocked into the device before the CS pin is deasserted. In order for the WEL bit to be reset
when an operation aborts prematurely, the entire opcode for a Byte/Page Program, erase, Protect Sector, Unprotect
Sector, Sector Lockdown, Freeze Sector Lockdown State, Program OTP Security Register, or Write Status Register
command must have been clocked into the device.
11.1.6 RSTE Bit
The RSTE bit is used to enable or disable the Reset command. When the RSTE bit is in the logical “0” state (the default
state after power-up), the Reset command is disabled and any attempts to reset the device using the Reset command will
be ignored. When the RSTE bit is in the logical “1” state, the Reset command is enabled.
The RSTE bit will retain its state as long as power is applied to the device. Once set to the logical “1” state, the RSTE bit
will remain in that state until it is modified using the Write Status Register Byte 2 command or until the device has been
power cycled. The Reset command itself will not change the state of the RSTE bit.
11.1.7 SLE Bit
The SLE bit is used to enable and disable the Sector Lockdown and Freeze Sector Lockdown State commands. When the
SLE bit is in the logical “0” state (the default state after power-up), the Sector Lockdown and Freeze Sector Lockdown
commands are disabled. If the Sector Lockdown and Freeze Sector Lockdown commands are disabled, then any attempts
to issue the commands will be ignored. This provides a safeguard for these commands against accidental or erroneous
33
3687E–DFLASH–11/10
Atmel AT25DF161
execution. When the SLE bit is in the logical “1” state, the Sector Lockdown and Freeze Sector Lockdown State
commands are enabled.
Unlike the WEL bit, the SLE bit does not automatically reset after certain device operations. Therefore, once set, the SLE bit
will remain in the logical “1” state until it is modified using the Write Status Register Byte 2 command or until the device
has been power cycled. The Reset command has no effect on the SLE bit.
If the Freeze Sector Lockdown State command has been issued, then the SLE bit will be permanently reset in the logical
“0” state to indicate that the Sector Lockdown command has been disabled.
11.1.8 PS Bit
The PS bit indicates whether or not a sector is in the Program Suspend state.
11.1.9 ES Bit
The ES bit indicates whether or not a sector is in the Erase Suspend state.
11.1.10 RDY/BSY Bit
The RDY/BSY bit is used to determine whether or not an internal operation, such as a program or erase, is in progress. To
poll the RDY/BSY bit to detect the completion of a program or erase cycle, new Status Register data must be continually
clocked out of the device until the state of the RDY/BSY bit changes from a logical “1” to a logical “0”.
Figure 11-1. Read Status Register
11.2 Write Status Register Byte 1
The Write Status Register Byte 1 command is used to modify the SPRL bit of the Status Register and/or to perform a
Global Protect or Global Unprotect operation. Before the Write Status Register Byte 1 command can be issued, the Write
Enable command must have been previously issued to set the WEL bit in the Status Register to a logical “1”.
To issue the Write Status Register Byte 1 command, the CS pin must first be asserted and the opcode of 01h must be
clocked into the device followed by one byte of data. The one byte of data consists of the SPRL bit value, a don’t care bit,
four data bits to denote whether a Global Protect or Unprotect should be performed, and two additional don’t care bits
(see Table 11-3). Any additional data bytes that are sent to the device will be ignored. When the CS pin is deasserted, the
SPRL bit in the Status Register will be modified, and the WEL bit in the Status Register will be reset back to a logical “0”.
The values of bits five, four, three, and two and the state of the SPRL bit before the Write Status Register Byte 1 command
was executed (the prior state of the SPRL bit) will determine whether or not a Global Protect or Global Unprotect will be
performed. Please refer to “Global Protect/Unprotect” on page 21 for more details.
The complete one byte of data must be clocked into the device before the CS pin is deasserted, and the CS pin must be
deasserted on even byte boundaries (multiples of eight bits); otherwise, the device will abort the operation, the state of
SO
SI
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CS
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34
3687E–DFLASH–11/10
Atmel AT25DF161
the SPRL bit will not change, no potential Global Protect or Unprotect will be performed, and the WEL bit in the Status
Register will be reset back to the logical “0” state.
If the WP pin is asserted, then the SPRL bit can only be set to a logical “1”. If an attempt is made to reset the SPRL bit to
a logical “0” while the WP pin is asserted, then the Write Status Register Byte 1 command will be ignored, and the WEL
bit in the Status Register will be reset back to the logical “0” state. In order to reset the SPRL bit to a logical “0”, the WP
pin must be deasserted.
Figure 11-2. Write Status Register Byte 1
11.3 Write Status Register Byte 2
The Write Status Register Byte 2 command is used to modify the RSTE and SLE bits of the Status Register. Using the Write
Status Register Byte 2 command is the only way to modify the RSTE and SLE bits in the Status Register during normal
device operation, and the SLE bit can only be modified if the sector lockdown state has not been frozen. Before the Write
Status Register Byte 2 command can be issued, the Write Enable command must have been previously issued to set the
WEL bit in the Status Register to a logical “1”.
To issue the Write Status Register Byte 2 command, the CS pin must first be asserted and the opcode of 31h must be
clocked into the device followed by one byte of data. The one byte of data consists of three don’t care bits, the RSTE bit
value, the SLE bit value, and three additional don’t care bits (see Table 11-4). Any additional data bytes that are sent to
the device will be ignored. When the CS pin is deasserted, the RSTE and SLE bits in the Status Register will be modified,
and the WEL bit in the Status Register will be reset back to a logical “0”. The SLE bit will only be modified if the Freeze
Sector Lockdown State command has not been previously issued.
The complete one byte of data must be clocked into the device before the CS pin is deasserted, and the CS pin must be
deasserted on even byte boundaries (multiples of eight bits); otherwise, the device will abort the operation, the state of
the RSTE and SLE bits will not change, and the WEL bit in the Status Register will be reset back to the logical “0” state.
Table 11-3. Write Status Register Byte 1 Format
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SPRL X Global Protect/Unprotect X X
SO
SI
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CS
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Table 11-4. Write Status Register Byte 2 Format
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
X X X RSTE SLE X X X
35
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 11-3. Write Status Register Byte 2
12. Other Commands and Functions
12.1 Reset
In some applications, it may be necessary to prematurely terminate a program or erase cycle early rather than wait the
hundreds of microseconds or milliseconds necessary for the program or erase operation to complete normally. The Reset
command allows a program or erase operation in progress to be ended abruptly and returns the device to an idle state.
Since the need to reset the device is immediate, the Write Enable command does not need to be issued prior to the Reset
command being issued. Therefore, the Reset command operates independently of the state of the WEL bit in the Status
Register.
The Reset command can only be executed if the command has been enabled by setting the Reset Enabled (RSTE) bit in
the Status Register to a logical “1”. If the Reset command has not been enabled (the RSTE bit is in the logical “0” state),
then any attempts at executing the Reset command will be ignored.
To perform a Reset, the CS pin must first be asserted and the opcode of F0h must be clocked into the device. No address
bytes need to be clocked in, but a confirmation byte of D0h must be clocked into the device immediately after the opcode.
Any additional data clocked into the device after the confirmation byte will be ignored. When the CS pin is deasserted, the
program or erase operation currently in progress will be terminated within a time of tRST. Since the program or erase
operation may not complete before the device is reset, the contents of the page being programmed or the block being
erased cannot be guaranteed to be valid.
The Reset command has no effect on the states of the Sector Protection Registers, the Sector Lockdown Registers, or the
SPRL, RSTE, and SLE bits in the Status Register. The WEL, PS, and ES bits, however, will be reset back to their default
states. If a Reset operation is performed while a sector is erase suspended, the suspend operation will abort, and the
contents of the block being erased in the suspended sector will be left in an undefined state. If a Reset is performed while
a sector is program suspended, the suspend operation will abort, and the contents of the page that was being
programmed and subsequently suspended will be undefined. The remaining pages in the 64-Kbyte sector will retain their
previous contents.
The complete opcode and confirmation byte must be clocked into the device before the CS pin is deasserted, and the CS
pin must be deasserted on an even byte boundary (multiples of eight bits); otherwise, no Reset operation will be
performed.
SO
SI
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CS
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36
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 12-1. Reset
12.2 Read Manufacturer and Device ID
Identification information can be read from the device to enable systems to electronically query and identify the device
while it is in system. The identification method and the command opcode comply with the JEDEC standard for
“Manufacturer and Device ID Read Methodology for SPI Compatible Serial Interface Memory Devices”. The type of
information that can be read from the device includes the JEDEC defined Manufacturer ID, the vendor specific Device ID,
and the vendor specific Extended Device Information.
The Read Manufacturer and Device ID command is limited to a maximum clock frequency of fCLK. Since not all Flash devices
are capable of operating at very high clock frequencies, applications should be designed to read the identification
information from the devices at a reasonably low clock frequency to ensure that all devices to be used in the application
can be identified properly. Once the identification process is complete, the application can then increase the clock
frequency to accommodate specific Flash devices that are capable of operating at the higher clock frequencies.
To read the identification information, the CS pin must first be asserted and the opcode of 9Fh must be clocked into the
device. After the opcode has been clocked in, the device will begin outputting the identification data on the SO pin during
the subsequent clock cycles. The first byte that will be output will be the Manufacturer ID followed by two bytes of Device
ID information. The fourth byte output will be the Extended Device Information String Length, which will be 00h indicating
that no Extended Device Information follows. After the Extended Device Information String Length byte is output, the SO
pin will go into a high-impedance state; therefore, additional clock cycles will have no affect on the SO pin and no data will
be output. As indicated in the JEDEC standard, reading the Extended Device Information String Length and any
subsequent data is optional.
Deasserting the CS pin will terminate the Manufacturer and Device ID read operation and put the SO pin into a high-
impedance state. The CS pin can be deasserted at any time and does not require that a full byte of data be read.
SO
SI
SCK
CS
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Table 12-1. Manufacturer and Device ID Information
Byte No. Data Type Value
1 Manufacturer ID 1Fh
2 Device ID (Part 1) 46h
3 Device ID (Part 2) 02h
4 Extended Device Information String Length 00h
37
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 12-2. Read Manufacturer and Device ID
12.3 Deep Power-Down
During normal operation, the device will be placed in the standby mode to consume less power as long as the CS pin
remains deasserted and no internal operation is in progress. The Deep Power-Down command offers the ability to place
the device into an even lower power consumption state called the Deep Power-Down mode.
When the device is in the Deep Power-Down mode, all commands including the Read Status Register command will be
ignored with the exception of the Resume from Deep Power-Down command. Since all commands will be ignored, the
mode can be used as an extra protection mechanism against program and erase operations.
Entering the Deep Power-Down mode is accomplished by simply asserting the CS pin, clocking in the opcode of B9h, and
then deasserting the CS pin. Any additional data clocked into the device after the opcode will be ignored. When the CS pin
is deasserted, the device will enter the Deep Power-Down mode within the maximum time of tEDPD.
The complete opcode must be clocked in before the CS pin is deasserted, and the CS pin must be deasserted on an even
byte boundary (multiples of eight bits); otherwise, the device will abort the operation and return to the standby mode
once the CS pin is deasserted. In addition, the device will default to the standby mode after a power-cycle.
Table 12-2. Manufacturer and Device ID Details
Data Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Hex
Value Details
Manufacturer ID
JEDEC Assigned Code
1Fh JEDEC Code: 0001 1111 (1Fh for Atmel)
00011111
Device ID (Part 1)
Family Code Density Code
46h Family Code: 010 (AT25DF/26DFxxx series)
Density Code: 00110 (16-Mbit)
01000110
Device ID (Part 2)
Sub Code Product Version Code
02h Sub Code: 000 (Standard series)
Product Version:00010 (Second major version)
00000010
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Note: Each transition shown for SI and SO represents one byte (8 bits)
38
3687E–DFLASH–11/10
Atmel AT25DF161
The Deep Power-Down command will be ignored if an internally self-timed operation such as a program or erase cycle is
in progress. The Deep Power-Down command must be reissued after the internally self-timed operation has been
completed in order for the device to enter the Deep Power-Down mode.
Figure 12-3. Deep Power-Down
12.4 Resume from Deep Power-Down
In order to exit the Deep Power-Down mode and resume normal device operation, the Resume from Deep Power-Down
command must be issued. The Resume from Deep Power-Down command is the only command that the device will
recognized while in the Deep Power-Down mode.
To resume from the Deep Power-Down mode, the CS pin must first be asserted and opcode of ABh must be clocked into
the device. Any additional data clocked into the device after the opcode will be ignored. When the CS pin is deasserted, the
device will exit the Deep Power-Down mode within the maximum time of tRDPD and return to the standby mode. After the
device has returned to the standby mode, normal command operations such as Read Array can be resumed.
If the complete opcode is not clocked in before the CS pin is deasserted, or if the CS pin is not deasserted on an even byte
boundary (multiples of eight bits), then the device will abort the operation and return to the Deep Power-Down mode.
SO
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39
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 12-4. Resume from Deep Power-Down
12.5 Hold
The HOLD pin is used to pause the serial communication with the device without having to stop or reset the clock
sequence. The Hold mode, however, does not have an affect on any internally self-timed operations such as a program or
erase cycle. Therefore, if an erase cycle is in progress, asserting the HOLD pin will not pause the operation, and the erase
cycle will continue until it is finished.
The Hold mode can only be entered while the CS pin is asserted. The Hold mode is activated simply by asserting the HOLD
pin during the SCK low pulse. If the HOLD pin is asserted during the SCK high pulse, then the Hold mode won’t be started
until the beginning of the next SCK low pulse. The device will remain in the Hold mode as long as the HOLD pin and CS pin
are asserted.
While in the Hold mode, the SO pin will be in a high-impedance state. In addition, both the SI pin and the SCK pin will be
ignored. The WP pin, however, can still be asserted or deasserted while in the Hold mode.
To end the Hold mode and resume serial communication, the HOLD pin must be deasserted during the SCK low pulse. If
the HOLD pin is deasserted during the SCK high pulse, then the Hold mode won’t end until the beginning of the next SCK
low pulse.
If the CS pin is deasserted while the HOLD pin is still asserted, then any operation that may have been started will be
aborted, and the device will reset the WEL bit in the Status Register back to the logical “0” state.
SO
SI
SCK
CS
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40
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 12-5. Hold Mode
13. Atmel RapidS Implementation
To implement Atmel® RapidS™ and operate at clock frequencies higher than what can be achieved in a viable SPI
implementation, a full clock cycle can be used to transmit data back and forth across the serial bus. The Atmel AT25DF161
is designed to always clock its data out on the falling edge of the SCK signal and clock data in on the rising edge of SCK.
For full clock cycle operation to be achieved, when the AT25DF161 is clocking data out on the falling edge of SCK, the host
controller should wait until the next falling edge of SCK to latch the data in. Similarly, the host controller should clock its data
out on the rising edge of SCK in order to give the AT25DF161 a full clock cycle to latch the incoming data in on the next
rising edge of SCK.
Implementing RapidS allows a system to run at higher clock frequencies since a full clock cycle is used to accommodate a
device’s clock-to-output time, input setup time, and associated rise/fall times. For example, if the system clock frequency is
100MHz (10ns cycle time) with a 50% duty cycle, and the host controller has an input setup time of 2ns, then a standard
SPI implementation would require that the slave device be capable of outputting its data in less than 3ns to meet the 2ns
host controller setup time [(10ns x 50%) – 2ns] not accounting for rise/fall times. In an SPI mode 0 or 3 implementation,
the SPI master is designed to clock in data on the next immediate rising edge of SCK after the SPI slave has clocked its data
out on the preceding falling edge. This essentially makes SPI a half-clock cycle protocol and requires extremely fast clock-
to-output times and input setup times in order to run at high clock frequencies. With a RapidS implementation of this
example, however, the full 10ns cycle time is available which gives the slave device up to 8ns, not accounting for rise/fall
times, to clock its data out. Likewise, with RapidS, the host controller has more time available to output its data to the slave
since the slave device would be clocking that data in a full clock cycle later.
HOLD
SCK
CS
+ROG +ROG+ROG
41
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 13-1. Atmel RapidS Operation
14. System Considerations
In an effort to continue our goal of maintaining world-class quality leadership, Atmel® has been performing extensive
testing on the Atmel AT25DF161 that would not normally be done with a Serial Flash device. The testing that has been
performed on the AT25DF161 involved extensive, non-stop reading of the memory array on pre-conditioned devices. The
pre-conditioning of the devices, which entailed erasing and programming the entire memory array 10,000 times, was
done to simulate a customer environment and to exercise the memory cells to a certain degree.
The non-stop reading of the devices was done in three levels of granularity, with the first level involving a continuous,
looped read of 256-bytes (a single page) of memory, the second level involving a continuous, looped-read of a 4-Kbyte
(16 pages) portion of memory, and the third level entailing non-stop reading of the entire memory array. Read operations
were performed at both +25°C and +125°C and with a supply voltage of 3.7V, which exceeds the specified datasheet
operating voltage range.
The results of all of the extensive tests indicate that the contents of a portion of memory being read continuously could be
altered after 800,000,000 read operations only if that portion of the memory was not erased or reprogrammed at all
during the 800,000,000 read operations. If that portion of memory was reprogrammed at some point, then it would take
another 800,000,000 read operations after reprogramming before the contents could potentially be altered. For example,
if the Serial Flash is being used for boot code storage, then it would take 800,000,000 boot operations before that boot
code may become altered, provided that the boot code was not updated or reprogrammed. If an application was to read
the entire memory array non-stop at a clock frequency of 10MHz, it would take over 5 years to reach 800,000,000 read
operations.
Atmel firmly believes that this extended testing result should not be a cause for concern. We also believe that most, if not
all, applications will never read the same portion of memory 800,000,000 times throughout the life of the application
without ever updating that portion of memory.
MOSI
MISO
SCK
Slave CS
t
V
1234567812345678
ABC D E
FG
1
H
BYTE A
MSB LSB
BYTE B
MSB LSB
I
MOSI = Master Out, Slave In MISO = Master In, Slave Out
The Master is the ASIC/MCU and the Slave is the memory device.
The Master always clocks data out on the rising edge of SCK and always clocks data in on the falling edge of SCK.
The Slave always clocks data out on the falling edge of SCK and always clocks data in on the rising edge of SCK.
A. Master clocks out first bit of BYTE A on the rising edge of SCK
B. Slave clocks in first bit of BYTE A on the next rising edge of SCK
C. Master clocks out second bit of BYTE A on the same rising edge of SCK
D. Last bit of BYTE A is clocked out from the Master
E. Last bit of BYTE A is clocked into the slave
F. Slave clocks out first bit of BYTE B
G. Master clocks in first bit of BYTE B
H. Slave clocks out second bit of BYTE B
I. Master clocks in last bit of BYTE B
42
3687E–DFLASH–11/10
Atmel AT25DF161
15. Electrical Specifications
15.1 Absolute Maximum Ratings*
15.2 DC and AC Operating Range
15.3 DC Characteristics
Temperature under Bias . . . . . . . . . . . . . .-55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Storage Temperature. . . . . . . . . . . . . . . . .-65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground . . . . . . . . . . . . . . . . -0.6V to +4.1V
All Output Voltages
with Respect to Ground . . . . . . . . . . . .-0.6V to VCC + 0.5V
Atmel AT25DF161 (2.3V Version) Atmel AT25DF161
Operating Temperature (Case) Ind. -40°C to 85°C -40°C to 85°C
VCC Power Supply 2.3V to 3.6V 2.7V to 3.6V
Symbol Parameter Condition Min Typ Max Units
ISB Standby Current CS, WP, HOLD = VCC,
all inputs at CMOS levels 25 50 µA
IDPD Deep Power-down Current CS, WP, HOLD = VCC,
all inputs at CMOS levels 510µA
ICC1 Active Current, Read Operation
f = 100MHz; IOUT = 0mA;
CS = VIL, VCC = Max 12 19
mA
f = 85MHz; IOUT = 0mA;
CS = VIL, VCC = Max 10 17
f = 66MHz; IOUT = 0mA;
CS = VIL, VCC = Max 814
f = 50MHz; IOUT = 0mA;
CS = VIL, VCC = Max 712
f = 33MHz; IOUT = 0mA;
CS = VIL, VCC = Max 610
f = 20MHz; IOUT = 0mA;
CS = VIL, VCC = Max 58
ICC2 Active Current, Program Operation CS = VCC, VCC = Max 10 15 mA
ICC3 Active Current, Erase Operation CS = VCC, VCC = Max 12 18 mA
ILI Input Leakage Current VIN = CMOS levels 1 µA
ILO Output Leakage Current VOUT = CMOS levels 1 µA
VIL Input Low Voltage 0.3 x VCC V
VIH Input High Voltage 0.7 x VCC V
VOL Output Low Voltage IOL = 1.6mA; VCC = Min 0.4 V
VOH Output High Voltage IOH = -100µA; VCC = Min VCC - 0.2V V
43
3687E–DFLASH–11/10
Atmel AT25DF161
15.4 AC Characteristics – Maximum Clock Frequencies
15.5 AC Characteristics – All Other Parameters
Symbol Parameter
Atmel
AT25DF161
(2.3V Version)
Atmel
AT25DF161
UnitsMin Max Min Max
Atmel RapidS and SPI Operation
fMAX
Maximum Clock Frequency for All Operations – Atmel RapidS Operation Only
(excluding 0Bh, 03h, 3Bh, and 9F opcodes) 100 100 MHz
fCLK
Maximum Clock Frequency for All Operations
(excluding 03h and 3Bh opcodes) 85 85 MHz
fRDLF Maximum Clock Frequency for 03h Opcode (Read Array – Low Frequency) 50 50 MHz
fRDDO Maximum Clock Frequency for 3Bh Opcode (Dual-Output Read) 85 85 MHz
Symbol Parameter
Atmel
AT25DF161
(2.3V Version)
Atmel
AT25DF161
UnitsMin Max Min Max
tCLKH Clock High Time 4.3 4.3 ns
tCLKL Clock Low Time 4.3 4.3 ns
tCLKR(1) Clock Rise Time, Peak-to-Peak (Slew Rate) 0.1 0.1 V/ns
tCLKF(1) Clock Fall Time, Peak-to-Peak (Slew Rate) 0.1 0.1 V/ns
tCSH Chip Select High Time 50 50 ns
tCSLS Chip Select Low Setup Time (relative to Clock) 5 5 ns
tCSLH Chip Select Low Hold Time (relative to Clock) 5 5 ns
tCSHS Chip Select High Setup Time (relative to Clock) 5 5 ns
tCSHH Chip Select High Hold Time (relative to Clock) 5 5 ns
tDS Data In Setup Time 2 2 ns
tDH Data In Hold Time 1 1 ns
tDIS(1) Output Disable Time 7 5 ns
tV(2) Output Valid Time 7 5 ns
tOH Output Hold Time 2 2 ns
tHLS HOLD Low Setup Time (relative to Clock) 5 5 ns
tHLH HOLD Low Hold Time (relative to Clock) 5 5 ns
tHHS HOLD High Setup Time (relative to Clock) 5 5 ns
tHHH HOLD High Hold Time (relative to Clock) 5 5 ns
tHLQZ(1) HOLD Low to Output High-Z 5 5 ns
tHHQX(1) HOLD High to Output Low-Z 5 5 ns
tWPS(1)(3) Write Protect Setup Time 20 20 ns
tWPH(1)(3) Write Protect Hold Time 100 100 ns
44
3687E–DFLASH–11/10
Atmel AT25DF161
Notes: 1. Not 100% tested (value guaranteed by design and characterization)
2. 15pF load at frequencies above 70MHz, 30pF otherwise
3. Only applicable as a constraint for the Write Status Register Byte 1 command when SPRL = 1
15.6 Program and Erase Characteristics
Notes: 1. Maximum values indicate worst-case performance after 100,000 erase/program cycles
2. Not 100% tested (value guaranteed by design and characterization)
15.7 Power-up Conditions
tSECP(1) Sector Protect Time (from Chip Select High) 20 20 ns
tSECUP(1) Sector Unprotect Time (from Chip Select High) 20 20 ns
tLOCK(1) Sector Lockdown and Freeze Sector Lockdown State Time (from Chip Select
High) 200 200 µs
tEDPD(1) Chip Select High to Deep Power-Down 1 1 µs
tRDPD(1) Chip Select High to Standby Mode 30 30 µs
tRST Reset Time 30 30 µs
Symbol Parameter
Atmel
AT25DF161
(2.3V Version)
Atmel
AT25DF161
UnitsMin Max Min Max
Symbol Parameter Min Typ Max Units
tPP(1) Page Program Time (256-Bytes) 1.0 3.0 ms
tBP Byte Program Time 7 µs
tBLKE(1) Block Erase Time
4-Kbytes 50 200
ms32-Kbytes 250 600
64-Kbytes 400 950
tCHPE(1)(2
)Chip Erase Time 16 28 sec
tSUSP Suspend Time
Program 10 20
µs
Erase 25 40
tRES Resume Time
Program 10 20
µs
Erase 12 20
tOTPP(1) OTP Security Register Program Time 200 500 µs
tWRSR(2) Write Status Register Time 200 ns
Symbol Parameter Min Max Units
tVCSL Minimum VCC to Chip Select Low Time 100 µs
tPUW Power-up Device Delay Before Program or Erase Allowed 10 ms
VPOR Power-on Reset Voltage 1.5 2.2 V
45
3687E–DFLASH–11/10
Atmel AT25DF161
15.8 Input Test Waveforms and Measurement Levels
15.9 Output Test Load
16. AC Waveforms
Figure 16-1. Serial Input Timing
Figure 16-2. Serial Output Timing
AC
DRIVING
LEVELS
AC
MEASUREMENT
LEVEL
0.1VCC
VCC/2
0.9VCC
tR, tF < 2 ns (10% to 90%)
DEVICE
UNDER
TEST 15pF (frequencies above 70MHz)
or
30pF
SO
SI
SCK
CS
06%
+,*+,03('$1&(
06%/6%
W&6/6
W&/.+ W&/./ W&6+6
W&6++
W'6 W'+
W&6/+
W&6+
SO
SI
SCK
CS
W9
W&/.+ W&/./ W',6
W9
W2+
46
3687E–DFLASH–11/10
Atmel AT25DF161
Figure 16-3. WP Timing for Write Status Register Byte 1 Command When SPRL = 1
Figure 16-4. HOLD Timing – Serial Input
Figure 16-5. HOLD Timing – Serial Output
SO
SI
SCK
WP
CS

+,*+,03('$1&(
06%;
W:36 W:3+
/6%2)
:5,7(67$7865(*,67(5
'$7$%<7(
06%2)
:5,7(67$7865(*,67(5
%<7(23&2'(
06%2)
1(;723&2'(
SO
SI
HOLD
SCK
CS
W
+++
W
+/6
W
+/+
W
++6
+,*+,03('$1&(
SO
SI
HOLD
SCK
CS
W+++ W+/6
W+/4=
W+/+ W++6
W++4;
47
3687E–DFLASH–11/10
Atmel AT25DF161
17. Ordering Information
17.1 Ordering Code Detail
17.2 Green Package Options (Pb/Halide-free/RoHS Compliant)
Note: The shipping carrier option code is not marked on the devices
Atmel Designator
Product Family
Device Density
Interface
Shipping Carrier Option
Device Grade
Package Option
1 = Serial
16 = 16-megabit
B = Bulk (tubes)
Y = Bulk (trays)
T = Tape and reel
H = Green, NiPdAu lead finish
Industrial Temperature range
(-40°C to +85°C)
SS = 8-lead, 0.150” wide SOIC
S = 8-lead, 0.208” wide SOIC
M = 8-pad, 5 x 6 x 0.6mm UDFN
Operating Voltage
Blank = 2.7V minimum (2.7V to 3.6V)
F = 2.3V minimum (2.3V to 3.6V)
AT25DF161-SSHF-B
Atmel Ordering Code Package
Lead (Pad)
Finish
Operating
Voltage
Max. Freq.
(MHz) Operation Range
AT25DF161-MH-Y
AT25DF161-MH-T 8MA1
NiPdAu 2.7V to 3.6V 100 Industrial
(-40°C to +85°C)
AT25DF161-SSH-B
AT25DF161-SSH-T 8S1
AT25DF161-SH-B
AT25DF161-SH-T 8S2
AT25DF161-MHF-Y
AT25DF161-MHF-T 8MA1
NiPdAu 2.3V to 3.6V 100 Industrial
(-40°C to +85°C)
AT25DF161-SSHF-B
AT25DF161-SSHF-T 8S1
AT25DF161-SHF-B
AT25DF161-SHF-T 8S2
Package Type
8MA1 8-pad (5 x 6 x 0.6mm Body), Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.208” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
48
3687E–DFLASH–11/10
Atmel AT25DF161
18. Packaging Information
18.1 8MA1 – UDFN
Package Drawing Contact:
packagedrawings@atmel.com
DRAWING NO. REV. TITLE GPC
Notes: 1. This package conforms to JEDEC reference MO-229,
Saw Singulation
2. The terminal #1 ID is a Laser-marked Feature
8MA1 D
4/15/08
8MA1, 8-pad (5 x 6 x 0.6mm Body), Thermally
Enhanced Plastic Ultra Thin Dual Flat No Lead
Package (UDFN)
YFG
Top View
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
0.45
0.00
0.35
4.90
3.80
5.90
3.20
0.50
0.00
0.20
A
A1
b
C
D
D2
E
E2
e
L
y
K
0.55
0.02
0.40
0.152 REF
5.00
4.00
6.00
3.40
1.27
0.60
–
–
0.60
0.05
0.48
5.10
4.20
6.10
3.60
0.75
0.08
–
Pin 1 ID
E
D
A1
A
y
C
Bottom View
E2
D2
L
b
e
1
2
3
4
8
7
6
5
Pin #1 Notch
(0.20 R)
K
Pin #1
Chamfer
(C 0.35)
Option A
(Option B)
49
3687E–DFLASH–11/10
Atmel AT25DF161
18.2 8S1 – JEDEC SOIC
Package Drawing Contact:
packagedrawings@atmel.com
DRAWING NO. REV. TITLE GPC
8S1 E
12/11/09
8S1, 8-lead, (0.150” Wide Body),
Plastic Gull Wing Outline (JEDEC SOIC) SWB
–
–
–
–
–
–
–
1.27 BSC
–
–
1.75
0.25
0.51
0.25
5.05
3.99
6.20
1.27
8˚
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
1.35
0.10
0.31
0.17
4.80
3.81
5.79
0.40
0˚
A
A1
b
C
D
E1
E
e
L
θ
Notes: 1. These drawings are for general information only. Refer
to JEDEC Drawing MS-012, Variation AA for proper
dimensions, tolerances, datums, etc.
E
1234
8765
GND NC NC NC
SDA SCL NC VCC
Ø
C
E1
L
A
b
A1
e
D
End ViewTop View
Side View
50
3687E–DFLASH–11/10
Atmel AT25DF161
18.3 8S2 – EIAJ SOIC
Package Drawing Contact:
packagedrawings@atmel.com
DRAWING NO. REV. TITLE GPC
1
1
N
N
E
E
q
q
C
C
E1
E1
L
L
A
A
b
b
A1
A1
e
e
D
D
Notes: 1. This drawing is for general information only; refer to
EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs
are not included.
3. Determines the true geometric position.
4. Values b,C apply to plated terminal. The standard
thickness of the plating layer shall measure between
0.007 to .021 mm.
8S2 F
4/15/08
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ) STN
End View
Top View
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
1.70
0.05
0.35
0.15
5.13
5.18
7.70
0.51
0˚
A
A1
b
C
D
E1
E
L
q
e 1.27 BSC
2.16
0.25
0.48
0.35
5.35
5.40
8.26
0.85
8˚
4
4
2
3
51
3687E–DFLASH–11/10
Atmel AT25DF161
19. Revision History
Doc. Rev. Date Comments
3687A 04/2008 Initial document release
3687B 11/2008
Changed Standby Current value
– Increased maximum value from 35µA to 50µA
Changed Deep Power-Down Current values
– Increased typical value from 1µA to 5µA
– Increased maximum value from 5µA to 10µA
Corrected clock frequency values in Table 6-1
3687C 07/2009 Added System Considerations section
3687D 04/2010 Remove Preliminary and update template
3687E 11/2010 Added 2.3V to 3.6V operating range
3687E 05/2012 Not Recommended for New Designs
Product Contact
Product Line
dataflash@atmel.com
Sales Contact
www.atmel.com/contacts
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: (+1) (408) 441-0311
Fax: (+1) (408) 487-2600
www.atmel.com
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418 Kwun Tong Road
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1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
JAPAN
Tel: (+81) (3) 3523-3551
Fax: (+81) (3) 3523-7581
© 2010 Atmel Corporation. All rights reserved. / Rev.: 3687E–DFLASH–11/10
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