DMN601DMK
Document number: DS30657 Rev. 6 - 2
1 of 7
www.diodes.com
October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
RDS(ON) Max
ID Max
TA = 25°C
60V
2.4 @ VGS = 10V
510mA
4.0Ω @ VGS = 4V
390mA
Features and Benefits
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 2kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)), yet maintain superior switching performance,
making it ideal for high-efficiency power management applications.
DC-DC Converters
Power Management Functions
Analog Switch
Mechanical Data
Case: SOT26
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish Matte Tin Annealed over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.015 grams (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
DMN601DMK-7
SOT26
3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
SOT26
Top View
Top View
Internal Schematic
Equivalent Circuit
Per Element
ESD PROTECTED TO 2kV
D1
S1
G1
Gate Protection
Diode
D2
S2
G2
Gate Protection
Diode
S2
D2
D1
S1
G2
G1
DMN601DMK
Document number: DS30657 Rev. 6 - 2
2 of 7
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October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
Marking Information
Date Code Key
Year
2005
---
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
Code
S
---
B
C
D
E
F
G
H
I
J
K
L
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) (VGS = 10V)
Steady
State
TA = +25°C
TA = +70°C
ID
510
400
mA
t<10s
TA = +25°C
TA = +70°C
ID
580
470
mA
Continuous Drain Current (Note 6) (VGS = 4V
Steady
State
TA = +25°C
TA = +70°C
ID
390
300
mA
t<10s
TA = +25°C
TA = +70°C
ID
440
340
mA
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
IDM
850
mA
Maximum Body Diode Continuous Current
IS
1.2
A
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
0.7
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
157
°C/W
t<10s
121
Total Power Dissipation (Note 6)
PD
0.98
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
113
°C/W
t<10s
88
Thermal Resistance, Junction to Case (Note 6)
RθJC
26
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
K7K = Marking Code
YM = Date Code Marking
Y or Y = Year (ex: S = 2005)
M = Month (ex: 9 = September)
K7K YM
K7K YM
DMN601DMK
Document number: DS30657 Rev. 6 - 2
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October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
60
V
VGS = 0V, ID = 10µA
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
10
µA
VGS = 20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
1.0
1.6
2.5
V
VDS = 10V, ID = 1mA
Static Drain-Source On-Resistance
RDS(ON)
2.4
4.0
VGS = 10V, ID = 200mA
VGS = 4V, ID = 200mA
Forward Transfer Admittance
|Yfs|
100
mS
VDS =10V, ID = 200mA
Diode Forward Voltage
VSD
0.5
1.4
V
VGS = 0V, IS = 115mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
30
50
pF
VDS = 25V, VGS = 0V
f = 1.0MHz
Output Capacitance
Coss
5
25
pF
Reverse Transfer Capacitance
Crss
3
5.0
pF
Gate Resistance
Rg
133
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
304
nC
VGS = 4.5V, VDS = 10V,
ID = 250mA
Gate-Source Charge
Qgs
84
Gate-Drain Charge
Qgd
203
Turn-On Delay Time
tD(ON)
3.9
nS
VDS = 30V, ID = 0.2A,
VGS = 10V, RG = 25, RL = 150
Turn-On Rise Time
tR
3.4
Turn-Off Delay Time
tD(OFF)
15.7
Turn-Off Fall Time
tF
9.9
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN601DMK
Document number: DS30657 Rev. 6 - 2
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October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
0
0.2
0.4
0.6
0.8
1.0
0 1 2 3 4 5
V , DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
DS
I , DRAIN CURRENT (A)
D
V , GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
GS
T , CHANNEL TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage
vs. Channel Temperature
ch
0
0.5
1
1.5
2
-50 -25 025 50 75 100 125 150
V = 10V
I = 1mA
Pulsed
DS
D
V , GATE THRESHOLD VOLTAGE (V)
GS(TH)
0.1
I DRAIN CURRENT(A)
Fig. 4 Static Drain-Source On-Resistance
vs. Drain Current
D,
1
10
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
1
I , DRAIN CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance
vs. Drain Current
D
10
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
0
V GATE-SOURCE VOLTAGE (V)
Fig. 6 Static Drain-Source On-Resistance
vs. Gate-Source Voltage
GS,
R , STATIC DRAIN-SOURCE
ON-RESISTANCE ( )
DS(ON)
DMN601DMK
Document number: DS30657 Rev. 6 - 2
5 of 7
www.diodes.com
October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
0
T , CHANNEL TEMPERATURE ( C)
Fig. 7
CH °
Static Drain-Source On-State Resistance
vs. Channel Temperature
R , STATIC DRAIN-SOURCE
ON-STATE RESISTANCE ( )
DS(ON)
I , REVERSE DRAIN CURRENT (A)
DR
1
I , REVERSE DRAIN CURRENT (A)
DR
1
I , DRAIN CURRENT (A)
D
Fig.10 Forward Transfer Admittance vs. Drain Current
|Y |, FORWARD TRANSFER ADMITTANCE (S)
fs
DMN601DMK
Document number: DS30657 Rev. 6 - 2
6 of 7
www.diodes.com
October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
SOT26
Dim
Min
Max
Typ
A1
0.013
0.10
0.05
A2
1.00
1.30
1.10
A3
0.70
0.80
0.75
b
0.35
0.50
0.38
c
0.10
0.20
0.15
D
2.90
3.10
3.00
e
0.95
e1
1.90
E
2.70
3.00
2.80
E1
1.50
1.70
1.60
L
0.35
0.55
0.40
a
a1
All Dimensions in mm
Dimensions
Value (in mm)
C
2.40
C1
0.95
G
1.60
X
0.55
Y
0.80
Y1
3.20
a1
D
e
E1 E
b
A2 A1
Seating Plane
L
c
a
e1
A3
C1
Y1 G
X
Y
C
SOT26
SOT26
DMN601DMK
Document number: DS30657 Rev. 6 - 2
7 of 7
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October 2015
© Diodes Incorporated
DMN601DMK
NEW PROD UCT
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