Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches ADG901/ADG902 FEATURES Wideband Switch: -3 dB @ 4.5 GHz Absorptive/Reflective Switches High Off Isolation (40 dB @ 1 GHz) Low Insertion Loss (0.8 dB @1 GHz) Single 1.65 V to 2.75 V Power Supply CMOS/LVTTL Control Logic 8-Lead MSOP and Tiny 3 mm 3 mm LFCSP Packages Low Power Consumption (<1 A) FUNCTIONAL BLOCK DIAGRAMS ADG901 RF1 50 50 CTRL APPLICATIONS Wireless Communications General-Purpose RF Switching Dual-Band Applications High Speed Filter Selection Digital Transceiver Front End Switch IF Switching Tuner Modules Antenna Diversity Switching ADG902 RF1 RF2 CTRL GENERAL DESCRIPTION The ADG901/ADG902 are wideband switches that use a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG901 is an absorptive (matched) switch with 50 terminated shunt legs, while the ADG902 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and general-purpose high frequency switching. PRODUCT HIGHLIGHTS 1. -40 dB Off Isolation @ 1 GHz 2. 0.8 dB Insertion Loss @ 1 GHz 3. Tiny 8-Lead MSOP/LFCSP Packages 0 -10 RF2 -0.4 TA = 25C -0.6 -0.8 -20 -1.0 INSERTION LOSS (dB) ISOLATION (dB) -30 -40 -50 VDD = 2.5 V -60 -70 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -80 -2.6 -90 -2.8 VDD = 1.8 V -100 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G -3.0 10k VDD = 2.5V TA = 25C 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G Figure 1. Off Isolation vs. Frequency Figure 2. Insertion Loss vs. Frequency Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) 2004 Analog Devices, Inc. All rights reserved. REV. A = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, T to T , unless otherwise noted.) ADG901/ADG902-SPECIFICATIONS1 (Vall specifications DD MIN Parameter Symbol AC ELECTRICAL CHARACTERISTICS Operating Frequency3 -3 dB Frequency4 Input Power4 Conditions MAX Min B Version Typ2 Max DC Insertion Loss S21, S12 Isolation--RF1 to RF2 (CP Package) S21, S12 Isolation--RF1 to RF2 (RM Package) S21, S12 Return Loss (On Channel)4 S11, S22 Return Loss (Off Channel)4 S11, S22 On Switching Time4 Off Switching Time4 Rise Time4 Fall Time4 1 dB Compression4 Third Order Intermodulation Intercept Video Feedthrough5 tON tOFF tRISE tFALL P-1 dB IP3 0 V dc Bias +0.5 V dc Bias DC to 100 MHz; VDD = 2.5 V 10% 500 MHz; VDD = 2.5 V 10% 1000 MHz; VDD = 2.5 V 10% 100 MHz 60 500 MHz 43 1000 MHz 34 100 MHz 51 500 MHz 37.5 1000 MHz 31 DC to 100 MHz 20 500 MHz 23 1000 MHz 25 DC to 100 MHz 18 500 MHz 17 1000 MHz 15 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm 30 DC ELECTRICAL CHARACTERISTICS Input High Voltage VINH VINH Input Low Voltage VINL VINL Input Leakage Current II VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 VIN 2.75 V CAPACITANCE4 RF1/RF2, RF Port On Capacitance CTRL Input Capacitance CRF ON CCTRL f = 1 MHz f = 1 MHz POWER REQUIREMENTS VDD Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.4 0.5 0.8 61 45 40 60 47 37 28 29 28 23 21 19 3.6 5.8 3.1 6.0 17 36 2.5 2.5 4.5 7 16 0.7 0.8 1.25 6 9.5 5.5 8.5 1.7 0.65 VCC 0.1 0.7 0.35 VCC 1 1.2 2.1 1.65 0.1 Unit GHz GHz dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dBm dBm mV p-p V V V V A pF pF 2.75 1 V A NOTES 1 Temperature range B Version: -40C to +85C. 2 Typical values are at V DD = 2.5 V and 25C, unless otherwise stated. 3 Point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. Specifications subject to change without notice. -2- REV. A ADG901/ADG902 ABSOLUTE MAXIMUM RATINGS 1 LFCSP Package JA Thermal Impedance (2-layer board) . . . . . . . . . . 84C/W JA Thermal Impedance (4-layer board) . . . . . . . . . . 48C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV (TA = 25C, unless otherwise noted.) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +4 V Inputs to GND . . . . . . . . . . . . . . . . . . -0.5 V to VDD + 0.3 V2 Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C MSOP Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206C/W NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 RF1/2 Off Port Inputs to Ground ................................... -0.5 V to VDD - 0.5 V ORDERING GUIDE Model Temperature Range Package Description Package Option Branding ADG901BRM ADG901BRM-500RL7 ADG901BRM-REEL7 ADG901BCP-500RL7 ADG901BCP-REEL7 ADG902BRM ADG902BRM-500RL7 ADG902BRM-REEL7 ADG902BCP-500RL7 ADG902BCP-REEL7 EVAL-ADG901EB EVAL-ADG902EB -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Evaluation Board Evaluation Board RM-8 RM-8 RM-8 CP-8 CP-8 RM-8 RM-8 RM-8 CP-8 CP-8 W6B W6B W6B W6B W6B W7B W7B W7B W7B W7B CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. PIN CONFIGURATION 8-Lead MSOP (RM-8) 8-Lead 3 mm 3 mm LFCSP (CP-8) VDD 1 CTRL 2 ADG901/ ADG902 8 RF2 7 GND PIN FUNCTION DESCRIPTIONS GND 3 6 GND TOP VIEW (Not to Scale) 5 4 GND RF1 Table I. Truth Table REV. A CTRL Signal Path 0 1 RF1 isolated from RF2 RF1 to RF2 -3- Pin No. Mnemonic Function 1 VDD 2 CTRL 3, 5, 6, 7 GND 4 8 RF1 RF2 Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND. CMOS or TTL Logic Level. 0 RF1 Isolated from RF2 1 RF1 to RF2 Ground Reference Point for All Circuitry on the Part. RF1 Port. RF2 Port. ADG901/ADG902 TERMINOLOGY Parameter Description VDD IDD GND CTRL VINL VINH IINL (IINH) CIN tON tOFF tRISE tFALL Off Isolation Most positive power supply potential. Positive supply current. Ground (0 V) reference. Logic control input. Maximum input voltage for Logic 0. Minimum input voltage for Logic 1. Input current of the digital input. Digital input capacitance. Delay between applying the digital control input and the output switching on. Delay between applying the digital control input and the output switching off. Rise time. Time for the RF signal to rise from 10% to 90% of the ON level. Fall time. Time for the RF signal to fall from 90% to 10% of the ON level. The attenuation between input and output ports of the switch when the switch control voltage is in the OFF condition. Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the ON condition. 1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its P-1 dB low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB. Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced IP3 tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates degree of matching present at a switch RF port. Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to high without an RF signal present. -4- REV. A Typical Performance Characteristics-ADG901/ADG902 VDD = 2.25V -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 VDD = 2.75V -2.2 -2.4 TA = 25C -0.8 -0.55 -0.60 VDD = 2.5V VDD = 2.75V -0.65 -0.70 -0.75 -0.80 -0.85 -3.0 10k 100k -0.95 1M 10M 100M FREQUENCY (Hz) 1G 10G TPC 1. Insertion Loss vs. Frequency over Supplies (S12 and S21) -0.4 -1.00 10k -0.6 -0.8 +25C +85C -1.0 ISOLATION (dB) -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 VDD = 2.5V -3.0 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G TPC 4. Insertion Loss vs. Frequency over Temperature (S12 and S21) -1.2 -1.4 -1.6 -1.8 -2.0 VDD = 1.65V -2.2 -2.4 -2.6 TA = 25C 100k -2.8 1M 10M 100M FREQUENCY (Hz) 1G 0 -5 TA = 25C -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 VDD = 2.5V -60 -65 -70 -75 -80 -85 VDD = 1.8V -90 -95 -100 10k 100k 1M 10M 100M 1G FREQUENCY (Hz) 10G TPC 5. OFF Isolation vs. Frequency over Supplies (S12 and S21) TA = 25C -3.0 10k 10G TPC 2. Insertion Loss vs. Frequency over Supplies (S12 and S21) (Zoomed TPC 1 Plot) -40C VDD = 1.95V -1.0 VDD = 1.8V VDD = 2.25V 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G TPC 3. Insertion Loss vs. Frequency over Supplies (S12 and S21) ISOLATION (dB) -2.8 INSERTION LOSS (dB) -0.6 -0.50 -0.90 -2.6 -2.8 -0.45 INSERTION LOSS (dB) VDD = 2.5V INSERTION LOSS (dB) INSERTION LOSS (dB) -0.6 -0.8 -0.4 -0.40 -0.4 0 -5 VDD = 2.5V -10 -15 -20 -25 -30 -35 -40 -45 +85C -50 -55 -60 +25C -65 -70 -75 -80 -40C -85 -90 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G TPC 6. OFF Isolation vs. Frequency over Temperature (S12 and S21) 0 TA = 25C -5 VDD = 2.5V CH1 RETURN LOSS (dB) -10 -15 OFF SWITCH CTRL CH2 -20 RFx -25 -30 -35 10k ON SWITCH 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G TPC 7. Return Loss vs. Frequency (S11) REV. A CH1 = CTRL = 1V/DIV CH2 = RFx = 100mV/DIV tRISE = 2.8ns tFALL = 5.1ns CH2 pk-pk 2.016mV CH1 500mV TPC 8. Switch Timing -5- CH2 1mV 10.0ns TPC 9. Video Feedthrough ADG901/ADG902 40 20 35 18 16 30 P-1dB (dBm) IP3 (dBm) 14 25 20 15 12 10 8 6 10 4 5 0 250 VDD = 2.5V TA = 25C VDD = 2.5V TA = 25C 2 0 350 450 550 650 750 FREQUENCY (MHz) TPC 10. IP3 vs. Frequency 850 0 250 500 750 1000 1250 1500 FREQUENCY (MHz) TPC 11. P-1dB vs. Frequency -6- REV. A ADG901/ADG902 Test Circuits* VDD 0.1F VDD 0.1F ADG901 RL 50 VDD VOUT VDD RF1 VS RF2 VOUT RL 50 CTRL RF1 50% VS 50 50 10% 90% VOUT 50 RF2 50% VCTRL NETWORK ANALYZER CTRL GND GND tON VCTRL tOFF INSERTION LOSS = 20 LOG Test Circuit 1. Switching Timing: tON, tOFF VOUT VS Test Circuit 4. Insertion Loss VDD 0.1F VDD 0.1F ADG901 VDD RF2 RF1 VS RF1 50% 50% RL 50 CTRL OSCILLOSCOPE VOUT VDD RF2 VCTRL VOUT 90% 10% 50 90% 50 10% CTRL GND GND VCTRL tRISE tFALL Test Circuit 2. Switch Timing: tRISE, tFALL Test Circuit 5. Video Feedthrough VDD 0.1F ADG901 RL 50 VDD RF1 VOUT 50 RF2 VS 50 50 NETWORK ANALYZER CTRL GND VCTRL OFF ISOLATION = 20 LOG VOUT VS Test Circuit 3. Off Isolation *Similiar setups for ADG902. REV. A -7- NC ADG901/ADG902 VDD VDD 0.1F 0.1F RF SOURCE ADG901 SPECTRUM ANALYZER VDD ADG901 SPECTRUM ANALYZER COMBINER RF1 RF2 VDD RF2 RF1 RF SOURCE VS 50 50 50 50 RF SOURCE CTRL CTRL GND GND VCTRL VCTRL Test Circuit 7. P-1dB Test Circuit 6. IP3 -8- REV. A ADG901/ADG902 APPLICATIONS ADG9xx EVALUATION BOARD The ADG901/ADG902 are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. The ADG9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. To prove that these devices meet user requirements, the user requires only a power supply and a network analyzer along with the evaluation board. An application note is available with the evaluation board and provides complete information on operating the evaluation board. Applications include switching between high frequency filters, ASK generator, and FSK generator. The RF1 port (see Figure 3) is connected through a 50 transmission line to the top left SMA connector J1. RF2 is connected through a 50 transmission line to the top SMA connector J2. J3 is connected to GND. A through transmission line connects J4 and J5 and this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. Absorptive vs. Reflective Switches The ADG901 is an absorptive (matched) switch with 50 terminated shunt legs, and the ADG902 is a reflective switch with 0 terminated shunts to ground. The ADG901 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through signal to the common port. The ADG901 is therefore ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The board is constructed of a 4-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 inches. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, clearance to ground plane of 0.030 inches, dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches. The ADG902 reflective switch is suitable for applications where high off port VSWR does not matter and the switch has some other desired performance feature. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. Figure 3. ADG9xx Evaluation Board Top View REV. A -9- ADG901/ADG902 OUTLINE DIMENSIONS 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters 3.00 BSC 8 5 4.90 BSC 3.00 BSC 1 4 PIN 1 0.65 BSC 1.10 MAX 0.15 0.00 0.38 0.22 COPLANARITY 0.10 0.80 0.60 0.40 8 0 0.23 0.08 SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-187AA 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm 3 mm Body (CP-8) Dimensions shown in millimeters 3.00 BSC SQ 0.50 0.40 0.30 0.60 MAX PIN 1 INDICATOR 0.45 PIN 1 INDICATOR 0.90 0.85 0.80 8 TOP VIEW 2.75 BSC SQ 0.50 BSC 0.25 MIN 0.80 MAX 0.65 TYP 12 MAX SEATING PLANE 1 1.50 REF BOTTOM VIEW 5 1.90 1.75 1.60 4 1.60 1.45 1.30 0.05 MAX 0.02 NOM 0.30 0.23 0.18 0.20 REF -10- REV. A ADG901/ADG902 Revision History Location Page 10/04--Data Sheet changed from REV. 0 to REV. A. Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Change to ADG9xx EVALUATION BOARD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 REV. A -11- -12- C03336-0-10/04(A)