111
Small size
General Use type
Big size
General Use type
Detector
Slide
Push
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT SwitchTM
SSSS2 100℃ max. 60s max. 260±5℃3±1s
Dip soldering
Soldering time
300
200
100
A max.
B
D
C
E
Time (s)
F max.
Pre-heating
Room
temperature
Temperature (C )
Slide Switches Soldering Conditions
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Notes
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2 φ CA(K)or CC(T)at soldering portion(copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
SSAC
SSSF, SSSU, SSSB
SSAA
SSSS9
SSAC
SSSS2
Vertical 1-pole, 3-positions
Vertical 1-pole, 2-positions
Horizontal
1-pole, 2-positions
1-pole, 3-positions
2-poles, 3-positions
SSSS7
SSAH, SSAG, SSAJ, SSAL, SSSS8
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
300±5℃
150
SSAH, SSAG, SSAJ, SSAL, SSSS8, SSSS7
SSSS9
SSSS2
SSSF, SSSU, SSSB, SSAA
Series(Reow type)
Series
Series
250
260
230
40
350±10℃
120℃ max. 60s max.
3+1 / 0s
260±5℃5+ 0 / -1s
(2times)
350±10℃
100℃ max. 60s max.
4s max.
260±5℃10±1s
350±10℃
———
3s max.
260±5℃10±1s
350±5℃
———
3s max.
260±5℃5±1s
2s max.
180
120
A
(℃)
3s max. B
(℃) C
(s)
Soldering temperature
Items
D
(℃) E
(℃) F
(s)
Reference for Hand Soldering
Reference for Dip Soldering
(For PC board terminal types)
260
250