e
EPAD
TM
®
N
A
B
L
E
D
E
ADVANCED
LINEAR
DEVICES, INC.
ORDERING INFORMATION
*N/C pins are internally connected.
Connect to V- to reduce noise
PC, SC PACKAGES
PA, SA PACKAGES
PIN CONFIGURATION
QUAD/DUAL N-CHANNEL ENHANCEMENT MODE EPAD®
MATCHED PAIR MOSFET ARRAY VGS(th)= +0.8V
ALD110808/ALD110808A/ALD110908/ALD110908A
GENERAL DESCRIPTION
ALD1 10808A/ALD1 10808/ALD1 10908A/ALD1 10908 are monolithic quad/
dual N-Channel MOSFETs matched at the factory using ALD’s proven
EPAD® CMOS technology. These devices are intended for low voltage,
small signal applications.
These MOSFET devices are built on the same monolithic chip, so they
exhibit excellent temperature tracking characteristics. They are versatile
as circuit elements and are useful design component for a broad range of
analog applications. They are basic building blocks for current sources,
differential amplifier input stages, transmission gates, and multiplexer
applications. For most applications, connect V- and N/C pins to the most
negative voltage potential in the system and V+ pin to the most positive
voltage potential (or left open unused). All other pins must have voltages
within these voltage limits.
ALD1 10808/ALD110908 devices are built for minimum offset voltage and
differential thermal response, and they are suited for switching and ampli-
fying applications in +1.0V to +10V (+/- 5 V) systems where low input bias
current, low input capacitance and fast switching speed are desired. As
these are MOSFET devices, they feature very large (almost infinite) cur-
rent gain in a low frequency, or near DC, operating environment.
These devices are suitable for use in precision applications which require
very high current gain, beta, such as current mirrors and current sources.
The high input impedance and the high DC current gain of the Field Effect
Transistors result from extremely low current loss through the control gate.
The DC current gain is limited by the gate input leakage current, which is
specified at 30pA at room temperature. For example, DC beta of the
device at a drain current of 3mA and input leakage current of 30pA at
25°C is = 3mA/30pA = 100,000,000.
FEATURES
• Enhancement-mode (normally off)
• Standard Gate Threshold Voltages: +0.8V
• Matched MOSFET to MOSFET characteristics
• Tight lot to lot parametric control
• Low input capacitance
• VGS(th) match to 2mV and 10mV
• High input impedance — 1012 typical
• Positive,zero, and negative VGS(th) temperature coefficient
• DC current gain >108
• Low input and output leakage currents
Operating Temperature Range*
0°C to +70°C0°C to +70°C
16-Pin 16-Pin 8-Pin 8Pin
Plastic Dip SOIC Plastic Dip SOIC
Package Package Package Package
ALD110808APC ALD110808ASC ALD110908APA ALD110908ASA
ALD110808 PC ALD110808SC ALD110908PA ALD110908SA
APPLICATIONS
• Precision current mirrors
• Precision current sources
• Voltage choppers
• Differential amplifier input stage
• Voltage comparator
• Voltage bias circuits
• Sample and Hold
• Analog inverter
• Level shifters
• Source followers and buffers
• Current multipliers
Analog switches / multiplexers
N/C*
1
2
314
15
16
413
512
N/C*
6
7
8
10
11
GN1
DN1
N/C*
DN4
N/C*
GN4
9
GN3
DN3
DN2
GN2
V
+
S34
S12
V
-
V
+
V
-
ALD110808
M 4 M 3
M 1 M 2
V
-
V
-
V
-
V
-
V-
G
N1
D
N1
N/C*
S
12
D
N2
G
N2
ALD110908
1
2
36
7
8
45
M 1 M 2
V-
N/C*
V-
V-
Rev 1.0-0506 ©2 005 Advanced Linear Devices, Inc. 415 Tasman Drive, Sunnyvale, California 94089-1706 Tel: (408) 747-1155 Fax: (408) 747-1286
www.aldinc.com
* Contact factory for industrial or military temp. ranges or user-specified threshold voltage values.
ALD110808/ALD110808A/ALD110908/ALD110908A Advanced Linear Devices 2
Notes: 1 Consists of junction leakage currents
ABSOLUTE MAXIMUM RATINGS
Drain-Source voltage, VDS 10.6V
Gate-Source voltage, VGS 10.6V
Power dissipation 500 mW
Operating temperature range PA, SA, PC, SC package 0°C to +70°C
Storage temperature range -65°C to +150°C
Lead temperature, 10 seconds +260°C
OPERATING ELECTRICAL CHARACTERISTICS
V+ = +5V (or open) V- = GND TA = 25°C unless otherwise specified
CAUTION: ESD Sensitive Device. Use static control procedures in ESD controlled environment.
ALD110808A / ALD110908A ALD110808/ ALD110908
Parameter Symbol Min Typ Max Min Typ Max Unit Test Condition
Gate Threshold Voltage VGS(th) 0.78 0.80 0.82 0.78 0.80 0.82 V IDS =1µA
VDS = 0.1V
Offset Voltage VOS 12 310mVI
DS=1µA
VGS1-VGS2
VGS1-VGS2 Tempco VOS 55µV/ °CV
DS1= VDS2
-1.7 -1.7 ID= 1µA
GateThreshold Tempco VGS(th) 0.0 0.0 mV/ °CI
D= 20µA VDS = 0.1V
+1.6 +1.6 ID= 40µA
On Drain Current IDS (ON) 12.0 12.0 mA VGS= +10.3V
3.0 3.0 VGS= +4.8V
VDS= +5V
Forward T ransconductance GFS 1.4 1.4 mmho VGS = +4.8V
VDS = +9.8V
Transconductance Mismatch GFS 1.8 1.8 %
Output Conductance GOS 68 68 µmho VGS =+4.8V
VDS = +9.8V
Drain Source On Resistance RDS (ON) 500 500 VDS = 0.1V
VGS = +4.8V
Drain Source On Resistance RDS (ON) 0.5 0.5 %
Mismatch
Drain Source Breakdown BVDSX 10 10 V IDS = 1.0µA
Voltage VGS = -0.2V
Drain Source Leakage Current1IDS (OFF) 10 100 10 100 pA VGS = -0.2V
44nAV
DS =10V, TA = 125°C
Gate Leakage Current1 IGSS 330 330pAV
DS = 0V VGS = 10V
11nAT
A =125°C
Input Capacitance CISS 2.5 2.5 pF
Transfer Reverse Capacitance CRSS 0.1 0.1 pF
Turn-on Delay Time ton 10 10 ns V+ = 5V RL= 5K
Turn-off Delay Time toff 10 10 ns V+ = 5V RL= 5K
Crosstalk 60 60 dB f = 100KHz