PowerDI is a registered trademark of Diodes Incorporated.
RS1MSP1
Document number: DS38080 Rev. 3 - 2
1 of 5
www.diodes.com
September 2016
© Diodes Incorporated
RS1MSP1
ADVANCED I NF ORMATION
1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
POWERDI123
Product Summary (@ TA = +25°C)
VRRM (V)
IO (A)
IR Max (µA)
1,000
1
10
Description and Applications
The RS1MSP1 is a rectifier packaged in the PowerDI123 package.
Providing fast recovery time for high efficiency, this device is ideal for
use in applications such as:
Switching Mode Power Supply Applications
DC-DC Converter Applications
AC-DC Adaptors/Chargers
Mobile Devices
Features and Benefits
Glass Passivated Die Construction
Fast Recovery Time For High Efficiency
Low Profile Design, Package Height Less than 1.0mm
Ideally Suited for Automated Assembly
Low Reverse Leakage Current
Exceptional Thermal Transfer Based on Exposed Heat Sink on
the Underside of the Device
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: PowerDI123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Weight: 0.01 grams (Approximate)
Ordering Information (Note 4)
Part Number
Compliance
Case
Packaging
RS1MSP1-7
Commercial
PowerDI123
3,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2015
2016
2017
2018
2019
2020
2021
2022
Code
C
D
E
F
G
H
I
J
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Top View
Green
R2 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex.: C = 2015)
M = Month (ex: 9 = September)
PowerDI123
PowerDI123
PowerDI is a registered trademark of Diodes Incorporated.
RS1MSP1
Document number: DS38080 Rev. 3 - 2
2 of 5
www.diodes.com
September 2016
© Diodes Incorporated
RS1MSP1
ADVANCED I NF ORMATION
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VRM
1,000
V
RMS Reverse Voltage
VR(RMS)
700
V
Average Rectified Output Current @ TA = +30°C
IO
1.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single Half Sine-Wave Superimposed on Rated Load
IFSM
25
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Typical Thermal Resistance, Junction to Case (Note 5)
RθJC
24
°C/W
Typical Thermal Resistance, Junction to Soldering Point (Note 6)
RθJS
7
°C/W
Typical Thermal Resistance Junction to Ambient (Note 5)
RθJA
152
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 7)
V(BR)R
1,000
—
—
V
IR = 5µA
Forward Voltage Drop
VF
—
1.1
0.97
1.3
—
V
IF = 1A, TJ = +25°C
IF = 1A, TJ = +125°C
Leakage Current (Note 7)
IR
—
0.3
22
10
200
µA
VR = 1,000V, TJ = +25°C
VR = 1,000V, TJ = +125°C
Reverse Recovery Time
tRR
—
200
500
ns
IF = 0.5A, IR = 1.0A,
IRR = 0.25A
Total Capacitance
CT
—
4
—
pF
VR = 4.0VDC, f = 1MHz
Notes: 5. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes’ website at http://www.diodes.com/package-outlines.html. TA = +25°C.
6. Theoretical RJS calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
7. Short duration test pulse used to minimize self-heating effect.
PowerDI is a registered trademark of Diodes Incorporated.
RS1MSP1
Document number: DS38080 Rev. 3 - 2
3 of 5
www.diodes.com
September 2016
© Diodes Incorporated
RS1MSP1
ADVANCED I NF ORMATION
0
0.4
1.2
025 50 75 100 125 150
I , DC FORWARD CURRENT (A)
F
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 DC Forward Current Derating
0.2
0.6
0.8
1.0
Note 5
0.00001
0.0001
0.001
0.01
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
V , INSTANTANEOUS FORWARD VOLTAGE (V)
FFigure 2 Typical Forward Characteristics
T =125°C
A
T =85°C
A
T =150°C
A
T =25°C
A
T =-55°C
A
I , INSTANTANEOUS FORWARD CURRENT (A)
F
0.001
0.01
0.1
1
10
100
0100 200 300 400 500 600 700 800 900 1000
IR, LEAKAGE CURRENT(mA)
VR, REVERSE VOLTAGE (V)
Figure 3 Typical Reverse Characteristics
-55℃
25℃
85℃
150℃
125℃
0
1
2
3
4
5
6
7
8
9
10
0 5 10 15 20 25 30 35 40
CT, TOTAL CAPACITANCE (pF)
VR, REVERSE VOLTAGE (V)
Figure 4 Typical Total Capacitance
f=1MHz
(Note 8)
(Note 9)
8.
9.
PowerDI is a registered trademark of Diodes Incorporated.
RS1MSP1
Document number: DS38080 Rev. 3 - 2
4 of 5
www.diodes.com
September 2016
© Diodes Incorporated
RS1MSP1
ADVANCED I NF ORMATION
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI123
PowerDI123
Dim
Min
Max
Typ
A
0.93
1.00
0.98
A3
0.15
0.25
0.20
b
0.85
1.25
1.00
b2
1.025
1.125
1.10
D
1.63
1.93
1.78
E
3.50
3.90
3.70
E1
2.60
3.00
2.80
L
0.40
0.50
0.45
L1
1.25
1.40
1.35
L3
0.125
0.275
0.20
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI123
Dimensions
Value
(in mm)
G
0.65
X
1.05
X1
2.40
X2
4.10
Y
1.50
Y1
1.50
Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance
distances between device terminals and PCB tracking.
D
E
L1
L3
L3
L(2X)
E1
A
A3
b2
b
XX1
Y1
G
Y
X2
PowerDI is a registered trademark of Diodes Incorporated.
RS1MSP1
Document number: DS38080 Rev. 3 - 2
5 of 5
www.diodes.com
September 2016
© Diodes Incorporated
RS1MSP1
ADVANCED I NF ORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for
use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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