VN820-E High-side driver Features 10 Type RDS(on) IOUT VCC 1 PowerSO-10 VN820-E VN820SP-E VN820B5-E VN820SO-E VN820PT-E 40 m 9A PPAK 36 V PENTAWATT CMOS compatible input On-state open load detection Off-state open load detection Shorted load protection Under-voltage and over-voltage shutdown Protection against loss of ground Very low standby current Reverse battery protection (see Application schematic ) Table 1. P2PAK SO-16L Description The VN820-E is a monolithic device designed in STMicroelectronic's VIPower M0-3 technology. The VN820-E is intended for driving any type of load with one side connected to ground. The active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protects the device against over-load. The device detects the open load condition in both the on and off-state. In the off-state the device detects if the output is shorted to VCC. The device automatically turns off in the case where the ground pin becomes disconnected. Device summary Order codes Package Tube Tape and reel PENTAWATT VN820-E - PowerSO-10 VN820SP-E VN820SP13TR-E P2PAK VN820B5-E VN820B513TR-E PPAK VN820PT-E VN820PT13TR-E SO-16L VN820SO-E VN820SO13TR-E December 2008 Rev 5 1/48 www.st.com 48 Contents VN820-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 4 5 2/48 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18 3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 18 3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 19 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Open load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.5 PowerSO-10, P2PAK, PENTAWATT maximum demagnetization energy (VCC = 13.5V) 21 3.6 PPAK maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . 22 3.7 SO-16L maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . 23 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.1 SO-16L thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.2 P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.3 PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 4.4 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 5.2 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.3 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5.4 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.5 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.6 SO-16L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 VN820-E 6 Contents 5.7 PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.8 P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.9 PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.10 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3/48 List of tables VN820-E List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. 4/48 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Switching (VCC=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Open load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 SO-16L thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 P2PAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 PPAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PowerSO-10 thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SO-16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 VN820-E List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On-state resistance Vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Open load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Open load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Ilim Vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Open load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 PowerSO-10, P2PAK, PENTAWATT maximum turn-off current versus inductance . . . . . 21 PPAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-16L maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SO-16L PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 SO-16L Rthj-amb Vs PCB copper area in open box free air conditions . . . . . . . . . . . . . . 24 SO-16L thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . 25 Thermal fitting model of a single channel HSD in SO-16L . . . . . . . . . . . . . . . . . . . . . . . . . 25 P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 P2PAK Rthj-amb Vs. PCB copper area in open box free air conditions . . . . . . . . . . . . . . 27 P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 27 Thermal fitting model of a single channel HSD in P2PAK. . . . . . . . . . . . . . . . . . . . . . . . . . 28 PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PPAK Rthj-amb Vs. PCB copper area in open box free air conditions . . . . . . . . . . . . . . . 29 PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 30 Thermal fitting model of a single channel HSD in PPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PowerSO-10 Rthj-amb Vs PCB copper area in open box free air conditions . . . . . . . . . . 32 PowerSO-10 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . 32 Thermal fitting model of a single channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . 33 SO-16L package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5/48 List of figures Figure 49. Figure 50. Figure 51. Figure 52. Figure 53. Figure 54. Figure 55. Figure 56. Figure 57. Figure 58. Figure 59. Figure 60. 6/48 VN820-E PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 SO-16L tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 SO-16L tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 P2PAK tape and reel (suffix "13TR"). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 PPAK tape and reel (suffix "13TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 PowerSO-10 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 VN820-E 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC OVER-VOLTAGE DETECTION VCC CLAMP UNDER-VOLTAGE DETECTION GND Power CLAMP DRIVER INPUT OUTPUT LOGIC CURRENT LIMITER ON-STATE OPEN LOAD DETECTION STATUS OVER-TEMPERATURE DETECTION Figure 2. OFF-STATE OPEN LOAD AND OUTPUT SHORTED TO VCC DETECTION Configuration diagram (top view) VCC GROUND INPUT 6 5 OUTPUT 5 7 4 4 STATUS N.C. N.C. 8 3 OUTPUT OUTPUT 9 2 OUTPUT 2 10 1 OUTPUT 1 OUTPUT STATUS VCC INPUT GND 3 1 16 OUTPUT GND OUTPUT INPUT OUTPUT STATUS N.C. OUTPUT OUTPUT OUTPUT N.C. 11 VCC VCC PowerSO-10 Table 2. PPAK / P2PAK/ PENTAWATT VCC N.C. 8 9 VCC SO-16L Suggested connections for unused and not connected pins Connection / pin Status N.C. Output Input Floating X X X X To ground X Through 10K resistor 7/48 Electrical specifications 2 VN820-E Electrical specifications Figure 3. Current and voltage conventions IS VF IIN VCC INPUT ISTAT IOUT STATUS VCC OUTPUT GND VIN VSTAT 2.1 VOUT IGND Absolute maximum ratings Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document. Table 3. Absolute maximum ratings Value Symbol VCC DC supply voltage - VCC SO-16L PowerSO-10 PENTAWATT P2PAK PPAK Unit 41 V Reverse DC supply voltage - 0.3 V - Ignd DC reverse ground pin current - 200 mA IOUT DC output current Internally limited A -9 A DC input current +/- 10 mA ISTAT DC Status current +/- 10 mA VESD Electrostatic discharge (human body model: R = 1.5K; C = 100pF) - INPUT - STATUS - OUTPUT - VCC 4000 4000 5000 5000 V V V V - IOUT IIN 8/48 Parameter Reverse DC output current VN820-E Electrical specifications Table 3. Absolute maximum ratings (continued) Value Symbol Parameter EMAX Maximum switching energy (L = 4mH; RL= 0; Vbat = 13.5V; Tjstart = 150C; IL = 13A) - 481 - 481 - mJ EMAX Maximum switching energy (L = 3.7mH; RL = 0; Vbat = 13.5V; Tjstart = 150C; IL = 13A) 438 - - - - mJ EMAX Maximum switching energy (L = 4.48mH; RL = 0; Vbat = 13.5V; Tjstart = 150C; IL = 13A) - - - - 526 mJ Ptot Power dissipation TC = 25C 8.3 65.8 65.8 65.8 65.8 W Tj Junction operating temperature Tc Tstg 2.2 SO-16L PowerSO-10 PENTAWATT P2PAK PPAK Unit Internally limited C Case operating temperature - 40 to 150 C Storage temperature - 55 to 150 C Thermal data Table 4. Thermal data Max. value Symbol Parameter Unit SO-16L PowerSO-10 PENTAWATT P2PAK PPAK Rthj-case Thermalresistance junction-case - 1.9 1.9 1.9 1.9 C/W Rthj-lead Thermalresistance junction-lead 15 - - - - C/W Thermalresistance junction-ambient 65(1) 51.9(2) 61.9(2) 51.9(2) 76.9(2) C/W Rthj-amb - 37(4) 45(4) C/W 1. 48 (3) 37(4) When mounted on FR4 printed circuit board with 0.5cm2 of Cu (at least 35m thick) connected to all VCC pins. 2. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). 3. When mounted on FR4 printed circuit board with 6cm2 of Cu (at least 35m thick) connected to all VCC pins. 4. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35m thick). 9/48 Electrical specifications 2.3 VN820-E Electrical characteristics Values specified in this section are for 8V < VCC < 36V; -40C < Tj < 150C, unless otherwise stated. Table 5. Symbol Parameter Min. Typ. VCC Operating supply voltage 5.5 13 36 V VUSD Under-voltage shutdown 3 4 5.5 V VUSDhyst Under-voltage shutdown hysteresis VOV Over-voltage shutdown RON On-state resistance IS Supply current Test conditions Max. Unit 0.5 V 36 V IOUT = 3A; Tj = 25C; VCC > 8V IOUT = 3A; VCC > 8V 40 80 m m Off-state; VCC = 13V; VIN = VOUT = 0V 10 25 A Off-state; VCC = 13V; VIN = VOUT = 0V; Tj = 25C 10 20 A On-state; VCC = 13V; VIN = 5V; IOUT = 0A 2 3.5 mA 0 50 A -75 0 A IL(off1) Off-state output current VIN = VOUT = 0V IL(off2) Off-state output current VIN = 0V; VOUT = 3.5V IL(off3) Off-state output current VIN = VOUT = 0V; VCC = 13V; Tj = 125C 5 A IL(off4) Off-state output current VIN = VOUT = 0V; VCC = 13V; Tj = 25C 3 A Table 6. Symbol 10/48 Power Switching (VCC=13V) Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time RL = 4.3 from VIN rising edge to VOUT = 1.3V 30 s td(off) Turn-off delay time RL = 4.3 from VIN falling edge to VOUT = 11.7V 30 s dVOUT/dt(on) Turn-on voltage slope RL = 4.3 from VOUT = 1.3V to VOUT=10.4V See Figure 21. V/s dVOUT/dt(off) Turn-off voltage slope RL = 4.3 from VOUT = 11.7V to VOUT = 1.3V See Figure 22. V/s VN820-E Electrical specifications Table 7. Symbol Input pin Parameter VIL Input low-level IIL Low-level input current VIH Input high-level IIH High-level input current Vhyst Input hysteresis voltage VICL Input clamp voltage Table 8. Test conditions VIN = 1.25V Max. Unit 1.25 V 1 A 3.25 V 10 0.5 IIN = 1mA IIN = -1mA A V 6 6.8 - 0.7 8 V V Max. Unit 0.6 V Max. Unit VCC output diode Parameter Test conditions VF Forward on voltage - IOUT = 2A; Tj = 150C Symbol Typ. VIN = 3.25V Symbol Table 9. Min. Min. Typ. Status pin Parameter Test conditions Min. Typ. VSTAT Status low output voltage ISTAT = 1.6mA 0.5 V ILSTAT Status leakage current Normal operation; VSTAT = 5V 10 A CSTAT Status pin input capacitance Normal operation; VSTAT = 5V 100 pF VSCL Status clamp voltage 8 V V Table 10. Protections(1) Symbol Parameter 6 ISTAT = 1mA ISTAT = - 1mA Min. Typ. Max. Unit Shutdown temperature 150 175 200 C TR Reset temperature 135 Thyst Thermal hysteresis 7 tSDL Status delay in over-load condition Ilim Current limitation TTSD Vdemag Turn-off output clamp voltage Test conditions 6.8 - 0.7 C 15 Tj > Tjsh 9V < VCC < 36V 5.5V < VCC < 36V IOUT = 3 A; VIN = 0V; L = 6mH 9 13 C 20 ms 20 20 A A VCC - 41 VCC - 48 VCC - 55 V 1. To ensure long term reliability under heavy over-load or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles. 11/48 Electrical specifications Table 11. Symbol VN820-E Open load detection Parameter Test conditions Min. Typ. Max. Unit 70 150 300 mA 200 s 3.5 V 1000 s IOL Open load on-state detection threshold VIN = 5V tDOL(on) Open load on-state detection delay IOUT = 0A VOL Open load off-state voltage detection threshold VIN = 0V tDOL(off) Open load detection delay at turn-off Figure 4. 1.5 Status timings OPEN LOAD STATUS TIMING (with external pull-up) IOUT< IOL VOUT > VOL OVER-TEMP STATUS TIMING Tj > Tjsh VIN VIN VSTAT VSTAT tDOL(off) Figure 5. 2.5 tDOL(on) tSDL tSDL Switching time waveforms VOUT 90% 80% dVOUT/dt(off) dVOUT/dt(on) 10% t VIN td(on) td(off) t 12/48 VN820-E Electrical specifications Table 12. Truth table Conditions Input Output Status Normal operation L H L H H H Current limitation L H H L X X H (Tj < TTSD) H (Tj > TTSD) L Over-temperature L H L L H L Under-voltage L H L L X X Over-voltage L H L L H H Output voltage > VOL L H H H L H Output current < IOL L H L H H L Table 13. Electrical transient requirements Test level ISO T/R 7637/1 Test pulse I II III IV Delays and impedance 1 - 25V(1) - 50V(1) - 75V(1) - 100V(1) 2ms, 10 2 (1) + 50V(1) 75V(1) + 100V(1) 0.2ms, 10 - 50V(1) - 150V(1) 0.1s, 50 + 50V(1) + 100V(1) 0.1s, 50 3a 3b + 25V - 25V(1) + 25V (1) + - 100V(1) + 75V(1) 4 - 4V(1) - 5V(1) - 6V(1) - 7V(1) 5 26.5V(1) 46.5V(2) 66.5V(2) 86.5V(2) + + + + 100ms, 0.01 400ms, 2 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device. 13/48 Electrical specifications Figure 6. VN820-E Waveforms NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDER-VOLTAGE VUSDhyst VCC VUSD INPUT LOAD VOLTAGE STATUS undefined OVER-VOLTAGE VCC<VOV VCC > VOV VCC INPUT LOAD VOLTAGE STATUS OPEN LOAD with external pull-up INPUT VOUT > VOL LOAD VOLTAGE VOL STATUS OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS Tj INPUT LOAD CURRENT STATUS 14/48 TTSD TR OVER-TEMPERATURE VN820-E 2.4 Electrical specifications Electrical characteristics curves Figure 7. Off-state output current IL(off1) (A) Figure 8. Iih (uA) 5 5 4.5 4.5 Off state Vcc=36V Vin=Vout=0V 4 3.5 High-level input current Vin=3.25V 4 3.5 3 3 2.5 2.5 2 2 1.5 1.5 1 1 0.5 0.5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 Tc (C ) Figure 9. 75 100 125 150 175 Tc (C ) Input clamp voltage Figure 10. Status leakage current Ilstat (uA) Vicl (V) 8 0.05 7.8 Iin=1mA 7.6 0.04 Vstat=5V 7.4 0.03 7.2 7 0.02 6.8 6.6 0.01 6.4 6.2 0 6 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) Tc (C ) Figure 11. Status low output voltage Figure 12. Status clamp voltage Vscl (V) Vstat (V) 8 0.8 7.8 0.7 Istat=1.6mA Istat=1mA 7.6 0.6 7.4 0.5 7.2 7 0.4 6.8 0.3 6.6 0.2 6.4 0.1 6.2 0 6 -50 -25 0 25 50 75 Tc (C ) 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) 15/48 Electrical specifications VN820-E Figure 13. On-state resistance Vs Tcase Figure 14. On-state resistance Vs VCC R on (mOhm) R on (mOhm) 100 100 90 90 Iout=3A Vcc=8V; 13V; 36V 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 Tc=150C Tc=25C Tc=- 40C 0 -50 -25 0 25 50 75 100 125 150 175 5 10 15 20 Tc (C ) 25 30 35 40 Vcc (V) Figure 15. Open load on-state detection Figure 16. Input high-level threshold Iol (mA) Vih (V) 150 3.6 140 3.4 Vcc=13V Vin=5V 130 3.2 120 3 110 2.8 100 90 2.6 80 2.4 70 2.2 60 2 50 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 50 75 100 125 150 175 Tc (C ) Tc (C ) Figure 17. Input low-level Figure 18. Input hysteresis voltage Vil (V) Vhyst (V) 2.6 1.5 1.4 2.4 1.3 2.2 1.2 2 1.1 1.8 1 0.9 1.6 0.8 1.4 0.7 1.2 0.6 1 0.5 -50 -25 0 25 50 75 Tc (C ) 16/48 100 125 150 175 -50 -25 0 25 50 75 Tc (C ) 100 125 150 175 VN820-E Electrical specifications Figure 19. Over-voltage shutdown Figure 20. Open load off-state voltage detection threshold Vov (V) Vol (V) 50 5 48 4.5 46 4 44 3.5 42 3 40 2.5 38 2 36 1.5 Vin=0V 34 1 32 0.5 0 30 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) Tc (C ) Figure 21. Turn-on voltage slope Figure 22. Turn-off voltage slope dVout/dt/(on) (V/ms) dVout/dt(off) (V/ms) 1000 1000 900 900 Vcc=13V Rl=6.5Ohm 800 Vcc=13V Rl=4.3Ohm 800 700 700 600 600 500 500 400 400 300 300 200 200 100 100 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) Tc (C ) Figure 23. Ilim Vs Tcase Ilim (A) 20 18 Vcc=13V 16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) 17/48 Application information 3 VN820-E Application information Figure 24. Application schematic +5V +5V VCC Rprot STATUS Dld C Rprot INPUT OUTPUT GND VGND RGND DGND 3.1 GND protection network against reverse battery 3.1.1 Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1. RGND 600mV / (IS(on)max). 2. RGND (- VCC) / (- IGND) where - IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power Dissipation in RGND (when VCC < 0: during reverse battery situations) is: PD= (- VCC)2/ RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below). 18/48 VN820-E 3.1.2 Application information Solution 2: diode (DGND) in the ground line A resistor (RGND = 1k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift ( 600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected. 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 3.3 MCU I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended values: Rprot =10k . 3.4 Open load detection in off-state Off-state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1. no false open load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT= (VPU / (RL+RPU)) RL < VOlmin. 2. no misdetection when load is disconnected: in this case the VOUT has to be higher than VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2). 19/48 Application information VN820-E Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched off when the module is in standby. The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics section. Figure 25. Open load detection in off-state V batt. VPU V CC R PU INP UT DRIVER + LOGIC IL(off2) OUT + S TATUS R V OL G R OUND 20/48 RL VN820-E 3.5 Application information PowerSO-10, P2PAK, PENTAWATT maximum demagnetization energy (VCC = 13.5V) Figure 26. PowerSO-10, P2PAK, PENTAWATT maximum turn-off current versus inductance ILMAX (A) 100 A 10 B C 1 0.1 1 L (mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL =0 .In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 21/48 Application information 3.6 VN820-E PPAK maximum demagnetization energy (VCC = 13.5V) Figure 27. PPAK maximum turn-off current versus inductance ILMAX (A) 100 A B 10 C 1 0.1 1 10 100 Demagnetization Demagnetization L (mH) A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization t Note: 22/48 Values are generated with RL =0 .In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. VN820-E 3.7 Application information SO-16L maximum demagnetization energy (VCC = 13.5V) Figure 28. SO-16L maximum turn-off current versus inductance IL MAX (A ) 100 A B 10 C 1 0.1 1 L(mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL =0 .In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 23/48 Package and PCB thermal data VN820-E 4 Package and PCB thermal data 4.1 SO-16L thermal data Figure 29. SO-16L PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 41mm x 48mm, PCB thickness = 2mm, Cu thickness = 35m, Copper areas: 0.5cm2, 6cm2). Figure 30. SO-16L Rthj-amb Vs PCB copper area in open box free air conditions 70 RTH j-amb (C/W) 65 60 55 50 45 40 0 1 2 3 4 5 PCB Cu heatsink area (cm^2) 24/48 6 7 VN820-E Package and PCB thermal data Figure 31. SO-16L thermal impedance junction ambient single pulse ZTH (C/W) 1000 100 0.5 cm2 6 cm2 10 1 0.1 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 32. Thermal fitting model of a single channel HSD in SO-16L Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd T_amb 25/48 Package and PCB thermal data Table 14. 4.2 VN820-E SO-16L thermal parameters Area / island (cm2) Footprint R1 (C/W) 0.04 R2 (C/W) 0.25 R3 (C/W) 2.2 R4 (C/W) 12 R5 (C/W) 15 R6 (C/W) 37 C1 (W.s/C) 0.0008 C2 (W.s/C) 7E-03 C3 (W.s/C) 1.5E-02 C4 (W.s/C) 0.14 C5 (W.s/C) 1 C6 (W.s/C) 3 6 22 5 P2PAK thermal data Figure 33. P2PAK PC board Note: 26/48 Layout condition of Rth and Zth measurements (PCB FR4 area = 60mm x 60mm, PCB thickness = 2 mm, Cu thickness = 35m , Copper areas: 0.97cm2, 8cm2). VN820-E Package and PCB thermal data Figure 34. P2PAK Rthj-amb Vs. PCB copper area in open box free air conditions RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) Figure 35. P2PAK thermal impedance junction ambient single pulse ZTH (C /W) 1000 100 0.97 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 27/48 Package and PCB thermal data VN820-E Equation 2: pulse calculation formula Z TH = R TH +Z THtp ( 1 - ) where = tP/T Figure 36. Thermal fitting model of a single channel HSD in P2PAK Table 15. 28/48 P2PAK thermal parameters Area/island (cm2) 0.97 R1 (C/W) 0.04 R2 (C/W) 0.25 R3 (C/W) 0.3 R4 (C/W) 4 R5 (C/W) 9 R6 (C/W) 37 C1 (W*s/C) 0.0008 C2 (W*s/C) 0.007 C3 (W*s/C) 0.015 C4 (W*s/C) 0.4 C5 (W*s/C) 2 C6 (W*s/C) 3 6 22 5 VN820-E 4.3 Package and PCB thermal data PPAK thermal data Figure 37. PPAK PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 60mm x 60mm, PCB thickness = 2 mm, Cu thickness=35m , Copper areas: 0.44 cm2, 8 cm2). Figure 38. PPAK Rthj-amb Vs. PCB copper area in open box free air conditions RTHj_amb (C/W) 90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 29/48 Package and PCB thermal data VN820-E Figure 39. PPAK thermal impedance junction ambient single pulse ZTH (C /W) 1000 100 0.44 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 Equation 3: pulse calculation formula Z TH = R TH +Z THtp ( 1 - ) where = tP/T Figure 40. Thermal fitting model of a single channel HSD in PPAK 30/48 1000 VN820-E Package and PCB thermal data Table 16. 4.4 PPAK thermal parameters Area/island (cm2) 0.44 R1 (C/W) 0.04 R2 (C/W) 0.25 R3 (C/W) 0.3 R4 (C/W) 2 R5 (C/W) 15 R6 (C/W) 61 C1 (W*s/C) 0.0008 C2 (W*s/C) 0.007 C3 (W*s/C) 0.02 C4 (W*s/C) 0.3 C5 (W*s/C) 0.45 C6 (W*s/C) 0.8 6 24 5 PowerSO-10 thermal data Figure 41. PowerSO-10 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35m, Copper areas: from minimum pad lay-out to 8cm2). 31/48 Package and PCB thermal data VN820-E Figure 42. PowerSO-10 Rthj-amb Vs PCB copper area in open box free air conditions RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) Figure 43. PowerSO-10 thermal impedance junction ambient single pulse ZTH (C/W) 100 0.5 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 32/48 10 100 1000 VN820-E Package and PCB thermal data Equation 4: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 44. Thermal fitting model of a single channel HSD in PowerSO-10 Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd T_amb Table 17. PowerSO-10 thermal parameters Area / island (cm2) Footprint R1 (C/W) 0.04 R2 (C/W) 0.25 R3 (C/W) 0.25 R4 (C/W) 0.8 R5 (C/W) 12 R6 (C/W) 37 C1 (W.s/C) 0.0008 C2 (W.s/C) 7E-03 C3 (W.s/C) 0.015 C4 (W.s/C) 0.3 C5 (W.s/C) 0.75 C6 (W.s/C) 3 6 22 5 33/48 Package and packing information VN820-E 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 45. SO-16L package dimensions Table 18. SO-16L mechanical data mm. DIM. Min. Typ. A a1 2.65 0.1 0.2 a2 34/48 Max. 2.45 b 0.35 0.49 b1 0.23 0.32 C 0.5 c1 45 (typ.) VN820-E Package and packing information Table 18. SO-16L mechanical data (continued) mm. DIM. Min. Typ. D 10.1 10.5 E 10.0 10.65 e 1.27 e3 8.89 F 7.4 7.6 L 0.5 1.27 M S 5.2 Max. 0.75 8 (max.) PENTAWATT mechanical data Figure 46. PENTAWATT package dimensions 35/48 Package and packing information Table 19. VN820-E PENTAWATT mechanical data mm Dim. Min. Typ. A 4.8 C 1.37 D 2.4 2.8 D1 1.2 1.35 E 0.35 0.55 F 0.8 1.05 F1 1 1.4 G 3.2 3.4 3.6 G1 6.6 6.8 7 H2 H3 10.4 10.05 10.4 L 17.85 L1 15.75 L2 21.4 L3 22.5 L5 2.6 3 L6 15.1 15.8 L7 6 6.6 M 4.5 M1 4 Diam. 36/48 Max. 3.65 3.85 VN820-E 5.3 Package and packing information P2PAK mechanical data Figure 47. P2PAK package dimensions P010R 37/48 Package and packing information VN820-E P2PAK mechanical data Table 20. mm Dim. Min. Max. A 4.30 4.80 A1 2.40 2.80 A2 0.03 0.23 b 0.80 1.05 c 0.45 0.60 c2 1.17 1.37 D 8.95 9.35 D2 E 8.00 10.00 E1 10.40 8.50 e 3.20 3.60 e1 6.60 7.00 L 13.70 14.50 L2 1.25 1.40 L3 0.90 1.70 L5 1.55 2.40 0.40 R V2 Package weight 38/48 Typ. 0 8 1.40 Gr (typ) VN820-E 5.4 Package and packing information PPAK mechanical data Figure 48. PPAK package dimensions Table 21. PPAK mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 B 0.40 0.60 B2 5.20 5.40 C 0.45 0.60 C2 0.48 0.60 D1 5.1 D 6.00 6.20 E 6.40 6.60 39/48 Package and packing information Table 21. VN820-E PPAK mechanical data (continued) mm Dim. Min. Typ. E1 4.7 e 1.27 G 4.90 5.25 G1 2.38 2.70 H 9.35 10.10 L2 0.8 L4 0.60 0.2 V2 0 8 Package weight Gr. 0.3 PowerSO-10 mechanical data Figure 49. PowerSO-10 package dimensions B 0.10 A B 10 H E E E2 1 E4 S EATING P LANE e B DETAIL "A" A C 0.25 h D = D1 = = = S EATING PLANE A F A1 A1 L DETAIL "A" 40/48 1.00 1.00 R 5.5 Max. VN820-E Package and packing information Table 22. PowerSO-10 mechanical data mm Dim. Min. Typ. Max. A 3.35 3.65 A(1) 3.4 3.6 A1 0 0.10 B 0.40 0.60 B(1) 0.37 0.53 C 0.35 0.55 C(1) 0.23 0.32 D 9.40 9.60 D1 7.40 7.60 E 9.30 9.50 E2 7.20 7.60 E2(1) 7.30 7.50 E4 5.90 6.10 E4(1) 5.90 6.30 e 1.27 F 1.25 1.35 F(1) 1.20 1.40 H 13.80 14.40 H(1) 13.85 14.35 h 0.50 L 1.20 1.80 L(1) 0.80 1.10 0 8 (1) 2 8 1. Muar only POA P013P. 41/48 Package and packing information 5.6 VN820-E SO-16L packing information Figure 50. SO-16L tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) C B 50 1000 532 3.5 13.8 0.6 All dimensions are in mm. A Figure 51. SO-16L tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 16.4 60 22.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 16 4 12 1.5 1.5 7.5 6.5 2 End Start Top cover tape No components Components Empty components pockets saled with cover tape. User direction of feed 42/48 No components 500mm min 500mm min VN820-E 5.7 Package and packing information PENTAWATT packing information Figure 52. PENTAWATT tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) B C 50 1000 532 18 33.1 1 All dimensions are in mm. A 5.8 P2PAK packing information Figure 53. P2PAK tube shipment (no suffix) B C Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) 50 1000 532 18 33.1 1 All dimensions are in mm. A 43/48 Package and packing information VN820-E Figure 54. P2PAK tape and reel (suffix "13TR") REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 12 1.5 1.5 11.5 6.5 2 All dimensions are in mm. End Start Top cover tape No components Components 500mm min Empty components pockets saled with cover tape. User direction of feed 5.9 PPAK packing information Figure 55. PPAK suggested pad layout 3 44/48 1.8 No components 6.7 500mm min VN820-E Package and packing information Figure 56. PPAK tube shipment (no suffix) A Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) C B 75 3000 532 6 21.3 0.6 All dimensions are in mm. Figure 57. PPAK tape and reel (suffix "13TR") REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 16 4 8 1.5 1.5 7.5 2.75 2 End Start Top cover tape No components Components No components 500mm min Empty components pockets saled with cover tape. 500mm min User direction of feed 45/48 Package and packing information 5.10 VN820-E PowerSO-10 packing information Figure 58. PowerSO-10 suggested Figure 59. PowerSO-10 tube shipment pad layout (no suffix) 14.6 - 14.9 10.8 - 11 CASABLANCA B MUAR C 6.30 C A A 0.67 - 0.73 1 9.5 10 9 8 2 3 7 4 5 6 B 0.54 - 0.6 All dimensions are in mm. 1.27 Base Q.ty Bulk Q.ty Casablanca Muar 50 50 1000 1000 Tube length ( 0.5) 532 532 A B 10.4 16.4 4.9 17.2 C ( 0.1) 0.8 0.8 Figure 60. PowerSO-10 tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 24 4 24 1.5 1.5 11.5 6.5 2 End Start Top cover tape No components Components 500mm min Empty components pockets saled with cover tape. User direction of feed 46/48 No components 500mm min VN820-E 6 Revision history Revision history Table 23. Document revision history Date Revision 07-Dec-2004 1 Initial release. 09-Feb-2005 2 Text changed. 23-Mar-2005 3 Configuration diagram (PowerSO-10) modification. 03-May-2006 4 SO-16L mechanical and shipment data insertion. 5 Document reformatted and restructured. Added content, list of figures and tables. Added ECOPACK(R) packages information. Updated Figure 54.: P2PAK tape and reel (suffix "13TR"): - changed component spacing (P) in tape dimensions table from 16 mm to 12 mm. 17-Dec-2008 Changes 47/48 VN820-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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