
CREAT BY ART
◇Designed for mounting on small surface
◇Extremely thin/leadless package
◇High mounting capability, strong surage with stand,
high reliability
◇Pb free version and RoHS compliant
◇Halogen free
◇Case:1206 standard package, molded plastic
◇Terminal:Gold plated, solderable per
MIL-STD-750, method 2026 guaranteed
◇High temperature soldering guaranteed : 260
o
C/10s
◇Polarity:Indicated by cathode band
◇Weight:0.010 g (approximately)
Maxi mum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Maximum Ratings Symbol Units
P
D
mW
V
RSM
V
V
RRM
V
I
FRM
mA
I
O
mA
R
θJA
℃/W
T
J
, T
STG o
C
Electrical Characteristics Symbol Units
Reverse Breakdown Voltage V
(BR)
V
Forward Voltage V
F
V
nA
μA
C
J
pF
Reverse Recovery Time Trr ns
Document Number:S1308001 Version:I13
Parameter
75
Reverse Leakage Current
I
F
=100mA
V
R
=20V
V
R
=75V I
R
4
-
500Power Dissipation
1
100Non-Repetitive Peak Reverse Voltage
Value
(Note 2)
-25
-
4.0Junction Capacitance
5
V
R
=0, f=1.0MHz
75
Small Signal Product
Note: 1 Valid provided that electrodes are kept at ambient temperature
Note: 2 Test Condition:I
R
=100μA
Note: 3 Test Condition:I
F
=10mA, I
R
=1mA, R
L
=100Ω
375
Junction and Storage Temperature Range - 65 to + 175
Min Max
(Note 3)
TS4148 RXG
Features
Mechanical Data
1206
500mW High Speed SMD Switching Diode
300
A0.5
2.0
Mean Forward Current 150
Non-Repetitive Peak Forward Surge Current
Tp = 1sec square waveform
Tp = 8.3ms single half sine waveform
Parameter
-
I
FSM
Thermal Resistance form Junction Ambient (Note 1)
Repetitive Peak Reverse Voltage
Repetitive Peak Forward Current