SPECIFICATION
(Reference sheet)
· Supplier : Samsung electro-mechanics · Samsung P/N :
· Product : Multi-layer Ceramic Capacitor · Description : CAP, 6.8, 50V, ± 0. 25, C0G, 0603
CL 10 C6R8 C B 8 N N N C
⑧⑨⑩⑪
Series Samsung Multi-layer Ceramic Capacitor
Size 0603 (inch code) L: 1.60 ± 0.10 mm W: 0.80 ± 0.10 mm
Dielectric C0G Inner electrode
Capacitance 6.8
Termination
Capacitance Plating (Pb Free)
tolerance Product Normal
Rated Volt age 50 V Special Reserved for future use
Thickness 0.80 ± 0.10 mm Packaging Cardboard Type, 7" reel
B. Structure and dimension
Sn 100%
Cu
Ni
CL10C6R8CB8NNNC
A. Samsung Part Number
Samsung P/N
(Lead Free)
Dimension()
LWT
± 0.25
CL10C6R8CB8NNNC 1.60 ± 0.10 0.80 ± 0.10 0.80 ± 0.10 0.30 ± 0.20
BW
1
C. Samsung Reliability Test and Judgement condition
Capacitance Within specified tolerance
Q536 min
Insulation 10,000Mohm or 500Mohm×Rated Voltage 60~120 sec.
Resistance Whichever is smaller
Appearance No abnormal exterior appearance Microscop (X10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature C0G
Characteristics (From -55 to 125, Capacitance change should be within ±30PPM/)
Adhesive Strength No peeling shall be occur on the 500g×F, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : Bending to the limit (1mm)
within ±5% or ±0.5 whichever is large
r
with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5, 3±0.3sec.
(preheating : 80~120 for 10~30sec.)
Resistance t o Capacitance change : Solder pot : 270±5, 10±1sec.
Soldering h eat within ±2.5% or ±0.25 whichever is larger
Tan δ, IR : initial spec.
Vibration Test Capacitance change : Amplitude : 1.5mm
within ±2.5% or ±0.25 whichever is larger From 10 to 55 (return : 1min.)
Tan δ, IR : initial spec. 2hours ´ 3 direction (x, y, z)
Moisture Capacitance change : With rated voltage
Resistance within ±7.5% or ±0.75 whichever is larger 40±2, 90~95%RH, 500+12/-0hrs
Q : 122.67 min
IR : 500Mohm or 25Mohm ×
Whichever is smaller
High Temperature Capacitance change : With of the rated voltage
Resistance within ±3% or ±0.3 whichever is large
r
Max. operating temperature
Q : 268 min 1000+48/-0hrs
IR : 1,000Mohm or 50Mohm ×
Whichever is smaller
Temperature Capacitance change : 1 cycle condition
Cycling within ±2.5% or ±0.25 whichever is larger Min. operating temperature 25
Tan δ, IR : initial spec. Max. operating temperature 25
5 cycle test
The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
200%
1±10% / 0.5~5Vrms
Performance Test condition
300%
2
E. Recommended TEST PCB
( Adhesive strength of termination)
Size code Size (mm) a b c
02 0.4 × 0.2 0.20 0.17 0.26
03 0.6 × 0.3 0.30 0.30 0.30
05 1.0. × 0.5 0.40 0.55 0.50
10 1.6 × 0.8 1.00 1.00 1.20
21 2.0 × 1.25 1.20 1.40 1.65
31 3.2 × 1.6 2.20 1.40 2.00
32 3.2 × 2.5 2.20 1.40 2.90
43 4.5 × 3.2 3.50 1.75 3.70
55 5.7 × 5.0 4.50 1.75 5.60
(Substrate for bending strength test) (Substrate for Reliability test)
Size code Size (mm) a b c d e
02 0.4 × 0.2 0.2 0.6 0.2 5.0 5.5
03 0.6 × 0.3 0.3 0.9 0.3 5.0 5.5
05 1.0 × 0.5 0.4 1.5 0.5 5.0 5.5
10 1.6 × 0.8 1.0 3.0 1.2 5.0 5.5
21 2.0 × 1.25 1.2 4.0 1.65 5.0 5.5
31 3.2 × 1.6 2.2 5.0 2.0 5.0 5.5
32 3.2 × 2.5 2.2 5.0 2.9 5.0 5.5
43 4.5 × 3.2 3.5 7.0 3.7 5.0 5.5
55 5.7 × 5.0 4.5 8.0 5.6 5.0 5.5
Material : Glass epoxy substrate Thickness : T=1.6 (T= 0.8 for 03/05)
: Copper foil (T=0.035) : Solder resist
Caution : Abnormality can occur if lead-based solder (KSD 6704) with 3% silver is used.
d
e
a
c
b
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MLCC Product Manual
1. Packaging
This specification applies to taping of MLCC
When customers require, the specification may be changed under the agreement.
1-1. Figure
1-2. Quantity
[unit:pcs]
Type Size Code
Inch(mm)
Chip
Thickness
Tap ing Typ e Pitch Plastic
7 inches reel
Plastic
10 inches reel
Plastic
13 inches reel
MLCC
0402 (01005) 0.2 mm PAPER 2mm 20k - 100K
0603 (0201) 0.3 mm PAPER 2mm 10K - 50K
1005 (0402) 0.5 mm PAPER 2mm 10K - 50K
1608 (0603) 0.8 mm PAPER 4mm 4K 10K 15K / 10K
2012 (0805) T≤0.85 mm PAPER 4mm 4K 10K 15K / 10K
T≥1.0 mm EMBOSSED 4mm 2K 6K 10K
3216 (1206) T≤0.85 mm PAPER 4mm 4K 10K 10K
T≥1.0 mm EMBOSSED 4mm 2K 4K 10K
3225 (1210) T≤1.6 mm EMBOSSED 4mm 2K 4K 10K
T≥2.0 mm EMBOSSED 4mm 1K 4K 4K
4520 (1808) T≤1.6 mm EMBOSSED 8mm 2k - 8k
T≥2.0 mm EMBOSSED 8mm 1k - 4k
4532 (1812) T≤2.0 mm EMBOSSED 8mm - - 4K
T>2.0 mm EMBOSSED 8mm - - 2K
5750 (2220) T≥2.5 mm EMBOSSED 8mm - - 2K
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MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard(Paper) tape : 4mm pitch
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t
0603
(1608)
1.00
±0.10
1.90
±0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
0805
(2012)
1.55
±0.10
2.30
±0.10
1206
(3216)
2.05
±0.10
3.60
±0.10
The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard(Paper) tape : 2mm pitch
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t
01005
(0402)
0.25
±0.02
0.46
±0.02
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0.25
±0.02
0201
(0603)
0.38
±0.03
0.68
±0.03
0.35
±0.03
0402
(1005)
0.62
±0.05
1.12
±0.05
0.60
±0.05
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
0.37
±0.03
The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
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MLCC Product Manual
1-3-3. Embossed(Plastic) tape
[unit:mm]
Size
Inch(mm) A B W F E P1 P2 P0 D t1 t0
01005
(0402)
0.23
±0.02
0.45
±0.02
4.00
±0.05
1.80
±0.02
0.90
±0.05
1.00
±0.02
1.00
±0.02
2.00
±0.03
φ0.80
±0.04 0.35
Below
0.50
Below
015008
(05025)
0.32
±0.03
0.58
±0.03
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0603
(1608)
1.05
±0.15
1.90
±0.15
4.00
±0.10
φ1.50
+0.10
/-0
2.50
Below
0.60
Below
0805
(2012)
1.45
±0.20
2.30
±0.20
1206
(3216)
1.90
±0.20
3.50
±0.20
1210
(3225)
2.80
±0.20
3.60
±0.20
1808
(4520)
2.30
±0.20
4.90
±0.20
12.0
±0.30
5.60
±0.05
8.00
±0.10
3.80
Below
1812
(4532)
3.60
±0.20
4.90
±0.20
2220
(5750)
5.50
±0.20
6.20
±0.20
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10 8.00
±0.30
3.50
±0.05
4.00
±0.10
2.50
Below
0306
(0816)
1.10
±0.20
1.90
±0.20
The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
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MLCC Product Manual
1-3-4. Reel Size
[unit:mm]
Symbol Tape Width A B C D E W t
7”Reel
4mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 5±0.5 1.2±0.2
8mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.9±0.2
12mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 13±0.5 1.2±0.2
10”Reel 8mm φ258±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2
13”Reel 8mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2
12mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 13±0.5 2.2±0.2
1-4. Cover tape peel-off force
1-4-1. Peel-off force
10 g.f peel-off force 70 g.f
1-4-2. Measurement Method
-Taping Packaging design : Packaging design follows IEC 60286-3 standard.
(IEC 60286-3 Packaging of components for automatic handling - parts 3)
* If the static electricity of SMT process causes any problems, please contact us.
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MLCC Product Manual
1-5. BOX package
1-5-1. Packaging Label
REEL & Box Type
Label includes the information as below.
1) Chip size
2) Temperature Characteristics
3) Nominal Capacitance
4) Model Name
5) LOT Number & Reel Number
6) Q’ty
1-5-2. Box Packaging
1) Double packaging with the paper type of inner box and outer box.
2) Avoid any damages during transportation by car, airplane and ship.
3) Remark information of contents on inner box and outer box
※ If special packaging is required, please contact us.
1-5-3. 7" Box packaging
[ Unit : mm ]
- Inner Box (7" x 5 REEL ) - Inner Box (7" x 10 REEL)
- Outer Box (7" x 20 REEL) - Outer Box (7" x 60 REEL)
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MLCC Product Manual
1-5-4. 13” Box packaging
- Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL)
1-6. Chip Weight
Size(L/W)
Inch(mm)
Size(T)
(mm) Temp. Weight
(mg/pc)
Size(L/W)
Inch(mm)
Size(T)
(mm) Temp. Weight
(mg/pc)
01005
(0402)
0.20 C0G 0.082 0201
(0603)
0.30 C0G 0.233
0.20 X7R 0.083 0.30 X7R 0.285
0.20 X5R 0.093 0.30 X5R 0.317
0402
(1005)
0.50 C0G 1.182 0603
(1608)
0.80 C0G 4.615
0.50 X7R 1.559 0.80 X7R 5.522
0.50 X5R 1.560 0.80 X5R 5.932
0805
(2012)
0.65 C0G 7.192 1206
(3216)
1.25 C0G 28.086
1.25 X7R 16.523 1.60 X7R 54.050
1.25 X5R 16.408 1.60 X5R 45.600
1210
(3225)
2.50 X7R 116.197 1808
(4520)
1.25 C0G 47.382
2.50 X5R 121.253 1.25 X7R 63.136
1812
(4532) 1.25 X7R 96.697 2220
(5750) 1.60 X7R 260.897
The weight of product is typical value per size, for more details, please contact us.
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MLCC Product Manual
2. Product Characteristic data
2-1. Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change.
Due to the fact that the capacitance may be subject to change with the measured voltage and
frequency, it is highly recommended to measure the capacitance based on the following
conditions.
2-1-1. Measure capacitance with voltage and frequency specified in this document.
Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,
please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance
range.
[The voltage and frequency condition according to MLCC the capacitance range]
Class I
Capacitance Frequency Voltage
1,000 pF 1 MHz ± 10%
0.5 ~ 5 Vrms
> 1,000 pF 1 kHz ± 10%
Class II
Capacitance Frequency Voltage
10 1 kHz ± 10% 1.0 ± 0.2 Vrms
> 10 120 Hz ± 20% 0.5 ± 0.1 Vrms
Exception* 1 kHz ± 10% 0.5 ± 0.1 Vrms
Capacitance shall be measured after the heat treatment of 150+0/-10℃
for 1hr, leaving at room temperature for 24±2hr. (Class II)
2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of
measurement equipment can be lower than the setting voltage due to the equipment limitation.
Note that when capacitance or measurement frequency is excessively high, the measurement
equipment may show ALC off warning and provide a lower output voltage than the setting
voltage even with ALC option selected. It is necessary to ensure the output voltage of
measurement equipment is the same as the setting voltage before measuring capacitance.
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MLCC Product Manual
2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC
voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC-
bias voltage characteristics when applying MLCC to the actual circuit.
2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002.
2-2. Tan δ (DF)
2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of
electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and
typically being calculated as percentage.
2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy.
The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is
presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is
presented in DF.
2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss
such as coupling circuit, filter circuit and time constant circuit.
2-3. Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at
the initial stage of measurement. While the charging current decreases, and insulation resistance
(IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after
applying the rated voltage.
2-4. Capacitance Aging
The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance
value over time. It is also necessary to consider the aging characteristic with voltage and
temperature characteristics when Class II MLCC is used in circuitry.
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MLCC Product Manual
2-4-1. In general, aging causes capacitance to decrease linearly with the log of time as shown in the
following graph. Please check with SEMCO for more details, since the value may vary between
different models.
2-4-2. After heat treatment (150 °C, 1hour), the capacitance decreased by aging is recovered, so aging
should be considered again from the time of heat treatment.
[ Example of Capacitance Aging ]
* Sample : C0G, X7R, X5R
2-5. Temperature Characteristics of Capacitance (TCC)
Please consider temperature characteristics of capacitance since the electrical characteristics such as
capacitance changes which is caused by a change in ceramic dielectric constant by temperature.
2-5-1. It is necessary to check the values specified in section “C. Reliability test Condition–Temperature
Characteristics” for the temperature and capacitance change range of MLCC.
[ Example of Temperature Characteristics (X5R) ] [ Example of Bias TCC ]
* Sample : 10uF, Rated voltage 6.3V * Sample : 10uF, Rated voltage 6.3V
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MLCC Product Manual
2-5-2. When selecting MLCC, it is necessary to consider the heat characteristics of a system, room
temperature and TCC of MLCC, since the applied temperature may change the capacitance of
MLCC.
2-5-3. In addition, Bias TCC of MLCC should be taken into account when DC voltage is applied to MLCC.
2-6. Self-heating Temperature
It is necessary to design the system, with considering self-heating generated by the ESR
(Equivalent Series Resistance) of MLCC when AC voltage or pulse voltage is applied to MLCC.
2-6-1. When MLCC is used in an AC voltage or pulse voltage circuit, self-heating is generated when AC
or pulse current flows through MLCC. Short-circuit may be occurred by the degradation of MLCC’s
insulating properties.
2-6-2. The reliability of MLCC may be affected by MLCC being used in an AC voltage or pulse voltage
circuit, even the AC voltage or the pulse voltage is within the range of rated voltage.
Therefore, make sure to check the following conditions.
1) The surface temperature of MLCC must stay within the maximum operating temperature after
AC or Pulse voltage is applied.
2) The rise in increase by self-heating of MLCC must not exceed 20℃
[ Example of Ripple current ]
* Sample : X5R 10uF, Rated voltage 6.3V
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MLCC Product Manual
2-7. DC & AC Voltage Characteristics
It is required to consider voltage characteristics in the circuit since the capacitance value of high
dielectric constant MLCC(Class II) is changed by applied DC & AC voltage.
2-7-1. Please ensure the capacitance change is within the allowed operating range of a system. In
particular, when high dielectric constant type MLCC (Class II) is used in circuit with narrow allowed
capacitance tolerance, a system should be designed with considering DC voltage, temperature
characteristics and aging characteristics of MLCC.
[ Example of DC Bias characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
2-7-2. It is necessary to consider the AC voltage characteristics of MLCC and the AC voltage of a system,
since the capacitance value of high dielectric constant type MLCC (Class II) varies with the applied
AC voltage.
[ Example of AC voltage characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
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MLCC Product Manual
2-8. Impedance Characteristic
Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a
current (I) when a voltage (V) is applied. It is defined as the ratio of the voltage to the current
(Z=V/I). Impedance extends the concept of resistance to AC circuits and is a complex number
consisting of the real part of resistance (R) and the imaginary part of reactance (X) as Z=R+jX.
Therefore, it is required to design circuit with consideration of the impedance characteristics of
MLCC based on the frequency ( Z = R + jX )
2-8-1. MLCC operates as a capacitor in the low frequency and its reactance (XC) decreases as frequency
increases ( X_C=1/j2πfC ) where f is frequency and C is capacitance.
The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency mainly comes
from the loss of its dielectric material.
2-8-2. MLCC operates as an inductor in the high frequency and the inductance of MLCC is called ESL
(Equivalent Series Inductance). The reactance (XL) of MLCC in the high frequency increases as
frequency increases ( X_L=j2πf∙ESL ). The resistance (ESR) of MLCC in the high frequency mainly
comes from the loss of its electrode metal.
2-8-3. SRF (Self Resonant Frequency) of MLCC is the frequency where its capacitive reactance (XC) and
inductive reactance(XL) cancel each other and the impedance of MLCC has only ESR at SRF.
2-8-4. The impedance of MLCC can be measured by a network analyzer or an impedance analyzer.
When using the network analyzer, please note that the small-signal input may lead to the
impedance of low capacitance caused by the AC voltage characteristic of MLCC.
[ Example of Impedance characteristics ]
* Sample : X5R 1uF, Rated voltage 6.3V
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MLCC Product Manual
3. Electrical & Mechanical Caution
3-1. Derating
MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test
are labeled as “derated MLCC.” For this type of MLCC, the voltage and temperature should be
derated as shown in the following graph for the equivalent life time of a normal MLCC with the
test voltage at 150% of the rated voltage in the high temperature resistance test.
3-1-1. The derated MLCC should be applied with the derating voltage and temperature as shown in the
following graph.
3-1-2. The “Temperature of MLCC” in the x-axis of the graph below indicates the surface temperature of
MLCC including self-heating effect. The “Voltage Derating Ratio” in the y-axis of the graph below
gives the maximum operating voltage of MLCC with reference to the maximum voltage (Vmax) as
defined in section “3-2. Applied Voltage.”
[Example of derating graph for derated MLCC]
* Vmax Derated Voltage
* Only the Derating marked models
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MLCC Product Manual
3-2. Applied Voltage
The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications.
3-2-1. Cautions by types of voltage applied to MLCC
· For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should
not exceed the rated voltage of MLCC.
· For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage
should not exceed the rated voltage of MLCC.
· Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of
MLCC.
[Types of Voltage Applied to the Capacitor]
DC Voltage AC Voltage DC+AC Voltage 1 DC+AC Voltage 2 DC+Pulse Voltage
3-2-2. Effect of EOS (Electrical Overstress)
· Electrical Overstress such as a surge voltage or EOS can cause damages to MLCC, resulting in
the electrical short failure caused by the dielectric breakdown in MLCC.
· Down time of MLCC is varied with the applied voltage and the room temperature and a
dielectric shock caused by EOS can accelerate heating on the dielectric. Therefore, it can bring
about a failure of MLCC in a market at the early stage.
· Please use caution not to apply excessive electrical overstress including spike voltage MLCC when
preparing MLCC for testing or evaluating.
(1) Surge
When the overcurrent caused by surge is applied to MLCC, the influx of current into MLCC can
induce the overshooting phenomenon of voltage as shown in the graph below and result in the
electrical short failure in MLCC. Therefore, it is necessary to be careful to prevent the influx of
surge current into MLCC.
(2) ESD (Electrostatic Discharge)
Since the voltage of the static electricity is very high but the quantity of electric charge is small
compared to the surge, ESD can cause damage to MLCC with low capacitance as shown in the
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MLCC Product Manual
following graph, whereas surge with lots of electric charge quantity can cause damages to even
high capacitance MLCC.
[ Example of Surge applied to MLCC ] [ Example of ESD applied to MLCC ]
* Simulation for ESD 8kV
3-3. Vibration
Please check the types of vibration and shock, and the status of resonance.
Manage MLCC not to generate resonance and avoid any kind of impact to terminals.
When MLCC is used in a vibration environment, please make sure to contact us for the situation
and consider special MLCC such as Soft-term, etc.
3-4. Shock
Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC
Do not use a dropped MLCC to avoid any quality and reliability deterioration.
When piling up or handling printed circuit boards, do not hit MLCC with the corners of a PCB to
prevent cracks or any other damages to the MLCC.
3-5. Piezo-electric Phenomenon
MLCC may generate a noise due to vibration at specific frequency when using the high dielectric
constant MLCC (Class Ⅱ) at AC or Pulse circuits.
MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks.
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MLCC Product Manual
4. Process of Mounting and Soldering
4-1. Mounting
4-1-1. Mounting position
It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress
is applied.
Not recommended Recommended
4-1-2. Cautions during mounting near the cutout
Please take the following measures to effectively reduce the stress generated from the cutting of
PCB. Select the mounting location shown below, since the mechanical stress is affected by a
location and a direction of MLCC mounted near the cutting line.
4-1-3. Cautions during mounting near screw
If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque.
Mount MLCC as far from the screw holes as possible.
Not recommended Recommended
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MLCC Product Manual
4-2. Caution before Mounting
4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from
the reel.
4-2-2. Check the capacitance characteristics under actual applied voltage.
4-2-3. Check the mechanical stress when actual process and equipment is in use.
4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.
Heat treatment must be done prior to measurement of capacitance.
4-2-5. Check the solderability of MLCC that has passed shelf life before use.
4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
4-3. Cautions during Mounting with Mounting (pick-and-place) Machines
4-3-1. Mounting Head Pressure
Excessive pressure may cause cracks in MLCC.
It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.
Additional conditions must be set for both thin film and special purpose MLCC.
4-3-2. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before
mounting on the other side due to the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
4-3-3. Suction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of
the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during
positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and
mounting claw should be conducted.
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MLCC Product Manual
4-4. Reflow soldering
MLCC is in a direct contact with the dissolved solder during soldering, which may be exposed to
potential mechanical stress caused by the sudden temperature change.
Therefore, MLCC may be contaminated by the location movement and flux.
For the reason, the mounting process must be closely monitored.
Method Classification
Reflow soldering
Overall heating
Infrared rays
Hot plate
VPS(Vapor phase)
Local heating
Air heater
Laser
Light beam
4-4-1. Reflow Profile
[Reflow Soldering Conditions]
Use caution not to exceed the peak temperature (260℃) and time (30sec) as shown.
Pre-heating is necessary for all constituents including the PCB to prevent the mechanical damages
on MLCC. The temperature difference between the PCB and the component surface must be kept
to the minimum.
As for reflow soldering, it is recommended to keep the number of reflow soldering to less than
three times. Please check with us when the number of reflow soldering needs to exceed three
times. Care must be exercised especially for the ultra-small size, thin film and high capacitance
MLCC as they can be affected by thermal stress more easily.
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MLCC Product Manual
4-4-2. Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than
the reflow temperature recommended by a solder manufacturer. The specified peak temperature
must be maintained after taking into consideration the factors such as the placement of
peripheral constituent and the reflow temperature.
Drop in solder wettability
Solder voids
Potential occurrence of whisker
Drop in adhesive strength
Drop in self-alignment properties
Potential occurrence of tombstones
4-4-3. Cooling
Natural cooling with air is recommended.
4-4-4. Optimum solder flux for reflow soldering
· Overly the thick application of solder pastes results in an excessive solder fillet height.
This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which
may cause cracks in MLCC.
· Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to
isolate from PCB
· Check if solder has been applied uniformly after soldering is completed.
· It is required to design a PCB with consideration of a solder land pattern and its size to apply an
appropriate amount of solder to MLCC. The amount of the solder at the edge may impact
directly on cracks in MLCC.
· The design of a suitable solder land is necessary since the more the solder amount is,
the larger the force MLCC experiences and the higher the chance MLCC cracks.
Too Much Solder
large stress may cause cracks
Not enough solder
Weak holding force may cause bad
connections or detaching of the capacitor
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