Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad : Black Anodize Plastic (UL94-V0) T725 or others Performance 15x15 6.0 0.30 5.5 0.28 5.0 0.25 4.5 0.23 4.0 0.20 3.5 0.18 3.0 0.15 2.5 0.13 2.0 0.10 1.5 0.08 1.0 0.05 0.5 0.03 0.0 Pressure drop (in-H2O) Rsa (oC/W) Heat Source (LxW) 0.00 0 100 200 300 400 500 600 700 800 900 1000 Air Velocity (LFM) No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : http://www.malico.com.tw H=12 H=21 H=33