ARTIK 710/710s Module Datasheet
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Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
MODULE OVERVIEW
The Samsung ARTIK™ 710/710s Module is a highly-integrated
System-in-Module that combines an eight-core ARM®
Cortex®-A53 processor packaged with DRAM and Flash
memory, a Security Subsystem, and a wide range of wireless
communication options—such as 802.11a/b/g/n/ac for Wi-Fi®,
Bluetooth® 4.0 (BLE+Classic), and 802.15.4 for Zigbee—all into
an extremely compact footprint. The many standard digital
control interfaces support external sensors and higher
performance peripherals to expand the module’s capabilities.
With the combination of 802.11, Bluetooth® and 802.15.4, the
ARTIK 710/710s Module is the perfect choice for home
automation and home hub devices, while also supporting a
rich UI/UX capability for camera and display requirements.
The inclusion of a hardware-based Secure Element works with
the ARM® TrustZone® and Trustware’s Trusted Execution
Environment (TEE) to provide end-to-end security.
Processor
CPU Octa-core ARM® Cortex®-A53@1.4GHz
GPU 3D graphics accelerator
Media
Camera I/F 4-lane MIPI CSI up to 5M (1920x1080@30fps)
Display 4-lane MIPI DSI and HDMI1.4a (1920x1080p@60fps)
or LVDS (1280×720p@60fps)
Audio Two I2S audio interfaces
Memory
DRAM 1GB DDR3 @ 800MHz
FLASH 4GB eMMC v4.5
Security
Secure Element Secure point to point authentication and data
transfer
Trusted Execution
Environment
Trustware
Radio
WLAN IEEE 802.11a/b/g/n/ac, dual-band SISO
Bluetooth® 4.0 (Classic+BLE)
LR_WPAN IEEE 802.15.4
Power Management
PMIC Provides all power of the ARTIK 710/710s Module
using onboard bucks and LDOs
Interfaces
Ethernet 10/100/1000Base-T MAC (External PHY required)
Analog and Digital I/O GPIO, UART, I2C, SPI, SDIO, USB Host, USB OTG,
HSIC, ADC, PWM, I2S, JTAG,
Figure 1. ARTIK™ 710/710s Modules Top View
ARTIK 710
ARTIK 710s
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
TABLE OF CONTENTS
3
Module Overview................................................................................................................................................................2
Version History .............................................................................................................................................................9
Block Diagram and Module Features............................................................................................................................... 10
ARTIK 710/710s Module Features................................................................................................................................ 11
ADC ....................................................................................................................................................................... 11
GPIO ..................................................................................................................................................................... 11
I2S ........................................................................................................................................................................ 12
PWM ..................................................................................................................................................................... 12
SPI ........................................................................................................................................................................ 12
UART .................................................................................................................................................................... 12
I2C ........................................................................................................................................................................ 13
Power Management ............................................................................................................................................ 13
Wi-Fi® ................................................................................................................................................................... 13
Bluetooth® ........................................................................................................................................................... 14
802.15.4 for Zigbee ............................................................................................................................................. 14
PCM ..................................................................................................................................................................... 14
USB OTG .............................................................................................................................................................. 14
USB HOST ............................................................................................................................................................ 15
HSIC ..................................................................................................................................................................... 15
MIPI CSI ............................................................................................................................................................... 15
MIPI DSI ............................................................................................................................................................... 16
HDMI .................................................................................................................................................................... 16
LVDS .................................................................................................................................................................... 16
Gigabit EMAC .......................................................................................................................................................17
SD/MMC ...............................................................................................................................................................17
Memory Controller ...............................................................................................................................................17
JTAG .................................................................................................................................................................... 18
Timer .................................................................................................................................................................... 18
Interrupt Controller ............................................................................................................................................. 18
DMA ..................................................................................................................................................................... 19
RTC ...................................................................................................................................................................... 19
Video Input Processor ........................................................................................................................................ 19
Scaler ................................................................................................................................................................... 19
Multiformat Codec ............................................................................................................................................. 20
Graphics Pipeline ............................................................................................................................................... 20
Security Subsystem ............................................................................................................................................ 21
Eight-Core Processor System ............................................................................................................................. 22
Module Pads .....................................................................................................................................................................23
Ball Table Column Definitions....................................................................................................................................24
North Ball Array ...................................................................................................................................................24
South Ball Array ...................................................................................................................................................26
East Ball Array .....................................................................................................................................................28
West Ball Array ................................................................................................................................................... 30
Center Ball Array ................................................................................................................................................. 31
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Functional Interfaces........................................................................................................................................................33
ADC.............................................................................................................................................................................33
Booting .......................................................................................................................................................................33
Bluetooth PCM............................................................................................................................................................33
MIPI CSI.......................................................................................................................................................................34
MIPI DSI.......................................................................................................................................................................34
GMAC..........................................................................................................................................................................34
GPIO............................................................................................................................................................................35
HDMI ...........................................................................................................................................................................36
HSIC ............................................................................................................................................................................37
I2C ...............................................................................................................................................................................37
I2S................................................................................................................................................................................37
JTAG............................................................................................................................................................................38
AliveGPIO....................................................................................................................................................................38
LVDS ...........................................................................................................................................................................38
PWM ............................................................................................................................................................................39
SD/MMC......................................................................................................................................................................39
SPI ...............................................................................................................................................................................39
UART .......................................................................................................................................................................... 40
USB HOST/USB OTG ................................................................................................................................................. 40
802.15.4 for Zigbee ................................................................................................................................................... 40
Miscellaneous............................................................................................................................................................. 41
Power .......................................................................................................................................................................... 41
GPIO Alternate Functions.................................................................................................................................................42
Booting Selection ............................................................................................................................................................ 46
Power Sequence...............................................................................................................................................................47
Power States .....................................................................................................................................................................48
Antenna Connections...................................................................................................................................................... 49
Electrical Specifications .................................................................................................................................................. 50
Absolute Maximum Ratings ...................................................................................................................................... 50
Power Supply Operating Voltage Range.................................................................................................................. 50
Power Supply Requirements ..................................................................................................................................... 51
Power/Current Consumption ....................................................................................................................................55
DC Electrical Characteristics .....................................................................................................................................56
AC Electrical Characteristics .....................................................................................................................................59
SD/MMC AC Electrical Characteristics ..............................................................................................................59
SPI AC Electrical Characteristics ....................................................................................................................... 60
I2C AC Electrical Characteristics .......................................................................................................................63
RF Electrical Characteristics ..................................................................................................................................... 64
Wi-Fi, 2.4GHz Receiver RF Specifications ......................................................................................................... 64
Wi-Fi, 2.4GHz Transmitter RF Specifications .....................................................................................................65
Wi-Fi, 5GHz Receiver RF Specifications ............................................................................................................ 66
Wi-Fi, 5GHz Transmitter RF Specifications ........................................................................................................68
Bluetooth RF Specifications .............................................................................................................................. 69
802.15.4 Receiver RF Specifications ..................................................................................................................70
Thermal and Environmental Specifications......................................................................................................................71
Recommended Operating Conditions .......................................................................................................................71
Temperature Thresholds for Operating Frequency Throttling .................................................................................71
ESD Ratings .................................................................................................................................................................71
Mechanical Specifications ............................................................................................................................................... 72
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Certifications and Compliance ........................................................................................................................................75
Bluetooth ....................................................................................................................................................................75
CE................................................................................................................................................................................75
FCC .............................................................................................................................................................................75
IC.................................................................................................................................................................................76
KCC .............................................................................................................................................................................76
SRRC ...........................................................................................................................................................................76
HDMI Compliance ......................................................................................................................................................76
RoHS Compliance ......................................................................................................................................................76
FCC Regulatory Disclosures ......................................................................................................................................76
Industry Canada Regulatory Disclosures ..................................................................................................................78
Industry Canada Statement ................................................................................................................................78
EU Regulatory Disclosures .........................................................................................................................................78
Statement* .........................................................................................................................................................78
Wi-Fi Interoperability..................................................................................................................................................79
Zigbee.........................................................................................................................................................................79
Ordering Information ...................................................................................................................................................... 80
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
LIST OF FIGURES
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Figure 1. ARTIK™ 710/710s Modules Top View...................................................................................................................2
Figure 2. ARTIK 710/710s Module Functional Block Diagram ......................................................................................... 10
Figure 3. ARTIK 710/710s Module Top View Ball Organization .......................................................................................23
Figure 4. ARTIK 710/710s Module Power-On Sequence (Timing) Diagram....................................................................47
Figure 5. ARTIK 710/710s Module Power Management State Diagram ..........................................................................48
Figure 6. RF Connector for Bluetooth/Wi-Fi and Zigbee ............................................................................................... 49
Figure 7. ARTIK 710/710s Module Power Distribution ..................................................................................................... 51
Figure 8. High-Speed SD/MMC Interface Timing............................................................................................................59
Figure 9. SPI Interface Timing (CPHA = 0, CPOL = 1 (Format A)) ................................................................................... 60
Figure 10. I2C Interface Timing........................................................................................................................................63
Figure 11. ARTIK 710/710s Module Component Layout Top View................................................................................... 72
Figure 12. ARTIK 710/710s Module Mechanical Dimensions Top View...........................................................................73
Figure 13. ARTIK 710/710s Module Mechanical Dimensions Bottom View.....................................................................73
Figure 14. L-Shaped Pad Pins (Top View) ........................................................................................................................74
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
LIST OF TABLES
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Table 1. Ball Table Column Definition ..............................................................................................................................24
Table 2. North Ball Array...................................................................................................................................................24
Table 3. South Ball Array ..................................................................................................................................................26
Table 4. East Ball Array .....................................................................................................................................................28
Table 5. West Ball Array................................................................................................................................................... 30
Table 6. Center Ball Array................................................................................................................................................. 31
Table 7. ADC .....................................................................................................................................................................33
Table 8. Booting................................................................................................................................................................33
Table 9. Bluetooth PCM....................................................................................................................................................33
Table 10. MIPI CSI .............................................................................................................................................................34
Table 11. MIPI DSI ..............................................................................................................................................................34
Table 12. GMAC.................................................................................................................................................................34
Table 13. GPIO...................................................................................................................................................................35
Table 14. HDMI ..................................................................................................................................................................36
Table 15. HSIC...................................................................................................................................................................37
Table 16. I2C ......................................................................................................................................................................37
Table 17. I2S.......................................................................................................................................................................37
Table 18. JTAG...................................................................................................................................................................38
Table 19. Key .....................................................................................................................................................................38
Table 20. LVDS..................................................................................................................................................................38
Table 21. PWM ...................................................................................................................................................................39
Table 22. SD/MMC ............................................................................................................................................................39
Table 23. SPI .....................................................................................................................................................................39
Table 24. UART................................................................................................................................................................. 40
Table 25. USB Host/USB OTG ........................................................................................................................................ 40
Table 26. 802.15.4 ........................................................................................................................................................... 40
Table 27. Miscellaneous ................................................................................................................................................... 41
Table 28. Power ................................................................................................................................................................ 41
Table 29. GPIO Alternate Functions—North Part............................................................................................................42
Table 30. GPIO Alternate Functions—South Part............................................................................................................43
Table 31. GPIO Alternate Functions—East Part................................................................................................................45
Table 32. GPIO Alternate Functions—West Part..............................................................................................................45
Table 33. Boot Selection Configuration ........................................................................................................................ 46
Table 34. Absolute Maximum Ratings ............................................................................................................................ 50
Table 35. Power Supply Operating Voltage Range........................................................................................................ 50
Table 36. DC-DC/LDOs Description.................................................................................................................................52
Table 37. AC/DC Characteristics LDO1 and LDO2 ..........................................................................................................52
Table 38. AC/DC Characteristics LDO1 and LDO2 Eco Mode.........................................................................................53
Table 39. AC/DC Characteristics LDO5...........................................................................................................................53
Table 40. AC/DC Characteristics LDO5 Eco Mode .........................................................................................................54
Table 41. AC/DC Characteristics LDO8 and LDO9 ..........................................................................................................54
Table 42. ARTIK 710/710s Module Power/Current Consumption ...................................................................................55
Table 43. I/O DC Electrical Characteristics GPIO ...........................................................................................................56
Table 44. I/O DC Electrical Characteristics 802.15.4...................................................................................................... 57
Table 45. I/O DC Electrical Characteristics PMIC ...........................................................................................................57
Table 46. I/O DC Electrical Characteristics PCM Signals ...............................................................................................57
Table 47. GPIO Pull-up Resistor Current..........................................................................................................................58
Table 48. Power-on Reset Timing Specifications............................................................................................................58
Table 49. High-Speed SD/MMC Interface Transmit/Receive Timing Constants ..........................................................59
Table 50. SPI Interface Transmit/ Receive Timing Constants with 15pF Load............................................................... 61
Table 51. SPI Interface Transmit/Receive Timing Constants with 30pF Load ...............................................................62
Table 52. I2C BUS Controller Module Signal Timing......................................................................................................63
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Table 53. Wi-Fi, 2.4GHz Receiver RF Specifications ...................................................................................................... 64
Table 54. Wi-Fi, 2.4GHz Transmitter RF Specifications...................................................................................................65
Table 55. Wi-Fi, 5GHZ Receiver RF Specifications ......................................................................................................... 66
Table 56. Wi-Fi, 5GHz Transmitter RF Specifications......................................................................................................68
Table 57. Bluetooth Receiver RF Specifications............................................................................................................. 69
Table 58. Bluetooth Transmitter RF Specifications........................................................................................................ 69
Table 59. Bluetooth Low Energy (BLE) RF Specifications .............................................................................................. 69
Table 60. 802.15.4 Receiver RF Specifications ...............................................................................................................70
Table 61. 802.15.4 Transmitter RF Specifications ...........................................................................................................70
Table 62. Recommended Operating Conditions .............................................................................................................71
Table 63. Application Processor Die Temperature vs Maximum Operating Frequency ................................................71
Table 64. ESD Ratings .......................................................................................................................................................71
Table 65. Shock and Vibration Ratings.............................................................................................................................71
Table 66. L-Shaped Ball Locations...................................................................................................................................74
Table 67. Wi-Fi Certifications ...........................................................................................................................................79
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Version History
Revision Date Description
V1.0 October 17, 2016 Initial release.
V1.01 November 15, 2016 Updated Page 1 ARTIK 710/710s Module Picture. Updated Figure 2, Figure 3. Updated Mechanical
Specification section. Updated Front Page. Updated ARTIK 710/710s Module ZigBee or Thread
section. Updated ARTIK 710/710s Module Wi-Fi/Bluetooth section.
V1.02 November 20, 2017 Updated block diagram.
In Functional Interfaces, each subsection describing an interface that has alternate functions
clarifies which are selected by hardware at power-on reset. Changed specifications in Wi-Fi®. Cross
references added to the appropriate tables in GPIO Alternate Functions.
Secure Element and Secure IP reorganized into Memory Controller section.
Changed format of default functions in tables of GPIO Alternate Functions to make it easier to see
which function number is the default.
Changed direction of LVDS signals in Table 20 from IO to O.
Booting Selection section rewritten for clarity.
Power Sequence section divided into Power Sequence and Power States. Simplified power
management state diagram.
Section Power/Current Consumption added.
Changed storage temperature range in Absolute Maximum Ratings.
Updated standards compliance in CE and EU Regulatory Disclosures.
V1.03 November 30, 2017 Added ARTIK 710s features in Module Overview, Block Diagram and Module Features, and,
Security Subsystem
V1.04 December 20, 2017 Mechanical Specifications: Changed pad names in Figure 14 and Table 66 to correlate with pad
organization shown in Figure 3. Note that the changes address a labeling consistency issue only; no
electrical or layout changes are required.
V1.05 February 2, 2018 Module Overview: Corrected inconsistent information about Bluetooth specification support.
V1.06 February 20, 2018 Table 28: Corrected note about VCC3P3_SYS pads. Deleted text indicating that the pads are
switched off during sleep mode, which does not apply to this product family. The note still indicates
these pads should not be used to drive external devices.
V1.07 March 22, 2018 I2C: Removed support for slave mode.
Table 3: Changed UART port from port 0 to port 5 so that the data for this pad is now consistent in
the datasheet. Marked pad PAL15 for internal use only.
Table 26: Marked pad PAL15 for internal use only.
Table 30: Corrected GPIO functions associated with pad PAL24. Removed pad PAL15 because it is
reserved for internal use only.
V1.08 April 5, 2018 Added Temperature Thresholds for Operating Frequency Throttling under new section
Thermal and Environmental Specifications.
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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BLOCK DIAGRAM AND MODULE FEATURES
Figure 2 shows the functional block diagram of the ARTIK 710/710s Module. It consists of an octa-core ARM®
Cortex®-A53 application processor with 1GBof DDR3 and 4GB eMMC Flash, PMIC power management, Security
Subsystem, 802.11 for Wi-Fi®, Bluetooth®, 802.15.4 for Zigbee, and RF connectors.
Figure 2. ARTIK 710/710s Module Functional Block Diagram
ARTIK710/710sMODULE
4GB eMMC v4.5
POWER
MANAGEMENT 1GB DDR3
BLUETOOTH
802.11a/b/g/n/ac
802.15.4
CAMERA
MIPICSI
LCD
MIPI DSI
HDMI
6×ADC
HSIC
LVDS
USBHOST
USB OTG
GPIO
AUDIO
2× PWM,
2× I
2
S
BOOTSELECT
GMAC
JTAG
2× SPI
3× UART
(2‐pin)
3× I
2
C
SD/MMC
PROCESSORSYSTEM
512KBL2CACHE
UNIVERSALSCALER
VIDEOINPUTPROCESSOR
MULTIFORMAT CODEC
GRAPHICS
PIPELINE
RTC
TIMER
INTERRUPT
CONTROLLER
DMA
CONTROLLER
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEX A53@1.4 GHz
32KBI‐CACHE
32KBD‐CACHE
512KBL2CACHE
SECURITYSUBSYSTEM
SECUREELEMENT SECURITYCONTROLLER
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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ARTIK 710/710s Module Features
The following subsections describe the functions of the various ARTIK 710/710s Module blocks depicted in Figure 2.
ADC
The ADC interface controls one 28nm low-power CMOS 1.8V 12-bit ADC. The key features of the ADC sub-system are
• Up to six channels of analog input can be selected
• Conversion of analog input into 12-bit binary code up to 1 Mega Sample Per Second (MSPS)
• 1.0mW power consumption when running 1MSPS
• Input frequency up to 100kHz
GPIO
The ARTIK 710/710s Module provides a GPIO system with up to 110 GPIOs multiplexed with other I/O interface lines,
as shown in Figure 2 to support a wide variety of use-cases. The key features of the GPIO system are as follows:
• Programmable pull-up control
• Both edge detect and level detect functionality
• Support for programmable pull-up resistors
• Support for fast or normal slew operation
• Drive strength can be set from a register:
• Support for interrupt generation that can be triggered on one of the following:
– Rising edge
– Falling edge
– High level detection
–Low level detection
• The I/O data is clocked up to 50MHz
Value Drive Strength *
*. Assumes the reference I/O voltage is 3.3V.
All drive-strength values are approximate.
02.6mA approximately (default)
15.2mA approximately
210.4mA approximately
315.6mA approximately
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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I2S
The ARTIK 710/710s Module provides two 5-line Inter-IC Sound (I2S) channels. I2S is one of the most popular digital
audio interfaces. The I2S bus handles audio data and other signals, such as subcoding and control. It is possible to
transmit data between two I2S buses. The key features of the I2S sub-system are
• One-port stereo (1 channel) I2S-bus for audio with DMA based operation
• Serial data transfer of 16/24 bits per channel in Master and Slave mode
•A variety of interface modes:
–I
2S, Left justified, Right justified, DSP mode
PWM
The ARTIK 710/710s Module provides two pulse width modulation (PWM) instances with the following key features:
• Two individual PWM channels with independent duty control and polarity
• Two 32-bit PWM timers, one per channel
• Support for static as well as dynamic setup
• Support for auto-reload and one shot pulse mode
• Dead zone generator
• Level interrupt generation
SPI
The ARTIK 710/710s Module provides two Serial Peripheral Interface (SPI) portsthat transfer serial data. SPI support
includes 8-bit/16-bit shift registers to transmit and receive data. During an SPI transfer, data is simultaneously
transmitted (shifted out serially) and received (shifted in serially). The SPI implementation adheres to the protocols
described by Texas Instruments Synchronous Serial Interface, National Semiconductor’s Microwire, and Motorola’s
Serial Peripheral Interface. The key features of the SPI sub-system are
• Support for full-duplex
• 8-bit/16-bit shift register for Tx and Rx
• Compliant with the SPI protocol described by Texas Instruments, National Semiconductor and Motorola
• Support for independent 16-bit wide transmit and receive FIFOs 8 locations deep
• Support for master mode and slave mode
• Support for receive-without-transmit operation
• Max operating frequency :
– Master Mode : Supports Tx up to 50MHz, Rx up to 20MHz
– Slave Mode : Supports Tx up to 8MHz, Rx up to 8MHz
UART
The ARTIK 710/710s Module provides three 2-pin universal asynchronous receiver transmitters (UARTs). The key
features of the UART sub-system are
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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• Separate 64×8 Tx and 64×8 Rx FIFO memory buffers
• Support for DMA-mode and interrupt-based mode of operation
• All independent channels support IrDA 1.0
• Each UART channel contains:
– Programmable baud-rates
– 1 or 2 stop bit insertion
– 5-bit, 6-bit, 7-bit, or 8-bit data width
–Parity checking
I2C
The ARTIK 710/710s Module provides three generic I2C blocks supporting both 100kb/s and 400kb/s speed modes.
The key features of the I2C sub-system are
• Support for multi-master mode
• 7-bit addressing mode only
• Serial, 8-bit oriented and bi-directional data transfer
• Up to 100 kb/s in the standard mode
• Up to 400 kb/s in the fast mode
• Support for both interrupt and polling events
Power Management
The ARTIK 710/710s Module power requirements are managed using a power management integrated circuit (PMIC).
This PMIC device has five fully-integrated fixed-frequency current-mode synchronous PWM step-down converters
that can achieve peak efficiencies of up to 97%.The regulators operate at a fixed high frequency, minimizing noise in
sensitive applications and allowing the use of small form factor components. These five regulators fully satisfy the
power and control requirements of the ARTIK 710/710s Module. Dynamic Voltage Scaling (DVS) of the various core
voltages is supported using I2C control.
In addition, the ARTIK 710/710s Module provides up to five low-noise LDOs for external use.
Wi-Fi®
The ARTIK 710/710s Module has a fully integrated WLAN block covering IEEE 802.11 a/b/g/n/ac. The most important
hardware features of the module are
• 802.11 a/b/g/n/ac dual-band SISO that is 2.4GHz/5GHz-compliant
•1T1R 2.4GHz/5GHz band
• Support for 20MHz, 40MHz, and 80MHz bandwidth (86.7/433.3Mbps PHY rate)
• Enhanced 802.11/Bluetooth coexistence control to improve transmission quality in different profiles
• Use of an SDIO interface
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Bluetooth®
The ARTIK 710/710s Module has a fully integrated 4.0 block (BLE+Classic). The most important hardware features of
the module are
• Bluetooth 4.0 (BLE+Classic)
• Enhanced 802.11/Bluetooth Coexistence control to improve transmission quality in different profiles
802.15.4 for Zigbee
The ARTIK 710/710s Module carries fully-integrated 802.15.4 functionality. The most important hardware features are
• Fully integrated 2.4 GHz, IEEE 802.15.4-compliant transceiver
• Complete system-on-chip using 32-bit ARM® Cortex®-M3 processor
•Flash and RAM memory and peripherals.
• Extremely low power consumption.
• Excellent RF performance.
• Supported Protocols:
– ZigBee®
–Thread
PCM
The ARTIK 710/710s Module provides one PCM channel. The PCM interface provides a bi-directional serial interface
that can be connected to an external audio codec. The key features of the PCM subsystem are
• Supports both Master and Slave mode external audio codecs
• Supports both short and long frame synchronization
• Supports a variety of data formats with a default format of 13-bit 2’s complement, left justified, clock MSB
first
USB OTG
The ARTIK 710/710s Module provides one USB2.0 OTG interface supporting both device and host functionality. The
key features of the USB2.0 OTG sub-system are
• Compliant with the USB 2.0 on-the-go specification revision 1.3a and 2.0
• High-speed (480Mbps) mode
• Full-speed (12Mbps) mode
• Low-speed (1.5Mbps) mode (host only)
• Support for session request protocol (SRP) and host negotiation protocol (HNP)
• One control endpoint 0 for control transfer
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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• Up to 15 device-programmable endpoints:
– Programmable endpoint type: Bulk, Isochronous, Interrupt
– Programmable In/Out direction
•16 host channels
USB HOST
The ARTIK 710/710s Module provides one USB2.0 controller that is fully compliant with the USB 2.0 Host
specifications, and the enhanced host controller Interface (EHCI) specification. The key features of the USB2.0 Host
sub-system are
• Detecting the attachment and removal of USB devices
• Collecting status and activity statistics
• Controlling power supply to attached USB devices
• In compliance with the UTMI+ Level 3 revision 1.0
• Controlling the association to either the open host controller interface (OHCI) or the EHCI via a port router
• Root Hub functionality to support upstream/downstream port
HSIC
The ARTIK 710/710s Module provides one high-speed inter-chip (HSIC) version 1.0 module. The key features of the
HSIC sub-system are
• Support for ping and split transactions
• Up to 30MHz operation for a 16-bit interface
•Up to 60MHz operation for a 8-bit interface
• Support for HSIC version 1.0
MIPI CSI
The ARTIK 710/710s Module provides one 4-lane mobile industry processor interface (MIPI) interface that complies
with the MIPI camera serial interface (CSI) standard specification V1.01r06 and D-PHY standard specification v1.0.
The key features of the MIPI CSI sub-system are
• 1, 2, 3 or 4 data lanes
• Support for the following image formats:
– YUV420, YUV420 (Legacy), YUV420 (CSPS), 8-bit YUV422, 10-bit YUV422
– User-defined byte-based data packet
– Compatible to PPI (Protocol to PHY interface)
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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MIPI DSI
The ARTIK 710/710s Module provides one 4-lane MIPI interface that complies with the MIPI DSI standard specification
V1.01r11. The key features of the MIPI DSI sub-system are
• Maximum resolution ranges up to 1920×1080
• Supports 1, 2, 3 or 4 data lanes
• Supports pixel format:
– 16bpp, 18bpp packed, 18bpp loosely packed (3 byte), 24bpp
• Supported interfaces are
– Protocol-to-PHY Interface (PPI) up to 1.5Gbps, in MIPI D-PHY
– RGB Interface for video image input from display controller
– PMS control interface for PLL to configure byte clock frequency
– Prescaler to generate escape clock from byte clock
HDMI
The ARTIK 710/710s Module provides one HDMI v1.4a interface. The key features of the HDMI sub-system are
•Support for v1.4a spec
• Up to 1080p video resolution
•HDMI Link + HDMI PHY
• Support for the following video formats:
–480p@59.94/60Hz
–576p@50Hz
–720p@50/59.94/60Hz
– 1080p@50/59.94/60Hz (No support for interlaced format)
• Support for 4:4:4 RGB
• Support for up to 8-bits per color
LVDS
The ARTIK 710/710s Module provides five low voltage differential signaling (LVDS) output channels with one clock
channel. The key features of the LVDS channel system are
• Output clock range 30–125MHz
• Support for 630 Mbps per channel
• Up to 393.75MB/s data transport
• Support for power down mode
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
17
Gigabit EMAC
The ARTIK 710/710s Module provides one Gigabit EMAC interface. The most important features of the Ethernet MAC
module are
• Standard compliance
– IEEE 802.3az-2010: energy efficient Ethernet (EEE)
– RGMII v2.6
• MAC supports the following features:
– 10/100/1000 Mbps data transfer rates with an RGMII interface to communicate with external Gigabit PHY
– Full duplex operation
– Half duplex operation
– Flexible address filtering
– Additional frame filtering
SD/MMC
The ARTIK 710/710s Module provides one SD/MMC interface. The Mobile Storage Host is an interface between the
system and the SD/MMC. The key features of mobile storage host sub-system are as follows:
SD
• Support for Secure Digital I/O (SDIO – version 3.0)
• Support for Secure Digital Memory (SDMEM – version 3.0)
• Consumer Electronics Advanced Transport Architecture (CE-ATA-version 1.1)
• Support 4-bit SDR mode up to 50MHz
• Support for PIO and DMA mode data transfer
• Support for 4- bit data bus width
MMC
• Support for Multimedia Cards (MMC – version 4.41)
• Support for Embedded Multimedia Cards (eMMC – version 4.5)
• Support for 4-bit SDR mode up to 50MHz
• Support for PIO and DMA mode data transfer
• Support for 4- bit data bus width
Memory Controller
The ARTIK 710/710s Module has one DDR3 memory interface. The key features are
• One 32-bit DDR3 memory interface
• Two 512MB DDR3 16-bit memory chips, for a total of 1GB
• Up to 800MHz DDR3 speed with a maximum throughput of 6.4GB/s
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
18
JTAG
The JTAG core provides debug capabilities for the developer and is compliant with the IEEE 1149 standard.
Timer
The ARTIK 710/710s Module has four dedicated timer channels. The most important features of the Timer module are
• Timer or watchdog timer modes
• Four dedicated Timer channels with watchdog timer
• Normal interval timer mode with interrupt request
• Reset on timer countdown
• Level-triggered interrupt mechanism
Interrupt Controller
The ARTIK 710/710s Module has one interrupt controller module. The most important features of the interrupt
module are
• Vectored interrupt controller
• Support for four interrupt types
– Sixteen software generated interrupts
– Six external Private Peripheral Interrupts (PPIs) per processor
– One internal PPI for each processor
– 128 shared peripheral interrupts
• For each interrupt source the following properties are available:
– Fixed hardware interrupt priority level
– Programmable interrupt priority level
– Hardware interrupt priority level masking
– IRQ and FIQ generation
– Software interrupt generation
– Test registers
– Raw interrupt status
– Interrupt request status
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
19
DMA
The ARTIK 710/710s Module has one scatter-gather DMA module. The most important features of the DMA module
are
• 16 channels of dedicated DMA
•16 DMA request lines
• Various operating modes
– Single DMA mode
–Burst DMA mode
– Memory-to-memory transfer
– Memory-to-peripheral transfer
– Peripheral-to-memory transfer
– Peripheral-to-peripheral transfer
• Support for 8/16/32 bit wide transactions
• Big endian and little endian (default) support
RTC
The ARTIK 710/710s Module has one real time clock (RTC) module. The most important features are
• Four spread-spectrum PLLs
• Two external crystals: one 24MHz crystal for the PLLs and one 32.768KHz crystal for the RTC
• One 32-bit RTC counter
• Support for alarm interrupt using RTC
• Support for various power modes:
– Normal, Idle, and Sleep (Suspend to RAM)
Video Input Processor
The ARTIK 710/710s Module provides one video input processor (VIP). The key features of the VIP sub-system are
• Support for external 8-bit and 16-bit MIPI
• Support for internal MIPI-CSI
•Support for images up to 8192×8192
• Support for clipping and scale-down
• Support for YUV420 memory format
Scaler
The ARTIK 710/710s Module provides one universal scaler. The key features of the scaler are
• Support for different input formats:
– YUV420, YUV422, YUV444
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
20
•Flexible size, from 8×8 up to 1920×1080 with a granularity of 8
•Upscale ratio from 8×8 to 1920×1080
• Downscale ratio from 1920×1080 to 8×8
• Low pass filter available after upscale or before downscale
• Horizontal 5-tab filter with 64 sets of coefficients
• Vertical 3-tab filter with 32 sets of coefficients
Multiformat Codec
The ARTIK 710/710s Module provides one integrated Multiformat Codec (MFC) module. The key features of the MFC
sub-system are
•Decoder:
– H.264 : BP, MP, HP Level 4.2 up to 1920×1080, up to 50MBps
– MPEG4 : Advanced Simple Profile (ASP) up to 1920×1080, at up to 40Mbps
– H.263 : Profile 3 up to 1920×1080, up to 20Mbps
– MPEG 1,2 : Main Profile, High Level up to 1920×1080, up to 80MBps
•Encoder:
– H.264 : Baseline profile, Level 4.0 up to 1080p, up to 20Mbps
– MPEG4 : Simple profile, Level 5.6 up to 1080p, up to 20Mbps
– H.263 : Profile 3, Level 70 up to 1080p, up to 20Mbps
Graphics Pipeline
The ARTIK 710/710s Module provides one 2D and 3D graphics pipeline module. The key features of the graphics
pipeline are
• Two pixel processors:
– Tile oriented processing
– Alpha blending
– Texture support, non-power-of-2
–Cube mapping
– Fast dynamic branching
– Trigonometric acceleration
– Full floating-point arithmetic
– Line, quad, triangle and point sprites
– Perspective correct texturing
– Point sampling, bilinear and trilinear filtering
– 8-bit stencil buffering
– 4-level hierarchical Z and stencil operation
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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• Geometry processor:
– Programmable vertex shader
– Flexible input and output formats
– Autonomous operation tile list generation
– Indexed and non-indexed geometry input
– Primitive constructions with points, lines, triangles and quads
•Support for OpenGL ES 1.0 and 2.0
Security Subsystem
In addition to the Secure Element, the main processor on the module provides additional security features. The key
features of the Security Controller sub-system are
• Secure 128-bit die ID (available to the ARTIK 710s Module only)
• Secure JTAG featuring a secure 128-bit JTAG ID (available to the ARTIK 710s Module only)
• Secure boot featuring a 128-bit boot ID (available to the ARTIK 710s Module only)
• Security Controller (available to the ARTIK 710s Module only)
• Secure Element (all features in ARTIK 710s Module; limited features in ARTIK 710 Module)
Security Controller
The Security Controller provides ARM TrustZone features and hardware cryptographic accelerators as follows:
•ARM TrustZone
– TZPC (TrustZone Platform Controller)
– TZASC (TrustZone Address Space Controller)
– TZMA (TrustZone Memory Adapter)
• Hardware cryptographic accelerators
–DES, Triple DES
–AES
–SHA-1
–MD5
Secure Element
The ARTIK 710/710s Module has a dedicated Secure Element to assure end-to-end authentication and
communication between nodes in an IoT setting. The most important hardware features of the Secure Element are
• An ISO/IEC 7816 14443-compliant interface.
• Dedicated 16-bit SecuCalm CPU core
• Crypto co-processor
– Modular exponential accelerator
–RSA 2080 bits
– ECC 512 bits
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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• Data security
– Memory encryption for all memory
– 256B read-only and 256B nonerasable Flash area
– Selective reset operation if abnormal voltages/frequencies are detected
• Embedded tamper-free memory
–32KB ROM
– 264KB Flash
– 2.5KB cryptographic memory
• Serial interfaces:
– ISO 7816-3-compliant interface
– Asynchronous half-duplex character receive/transmit serial interface
Eight-Core Processor System
The processor system architecture that resides on the ARTIK 710/710s Module is a system-on-a-chip (SoC) based on
a 32/64-bit RISC architecture. Designed using the 28nm low power process, the processor system architecture
provides superior performance using an eight-core CORTEX®-A53 CPU. The key features of the ARTIK 710/710s
Module are
• Eight-core ARM® Cortex®-A53, RISC architecture
•Maximum core speed 1.4GHz
• 32KB I-Cache per core
• 32KB D-Cache per core
• 1024KB L2-Cache shared between eight cores
• Support for dynamic virtual-address mapping
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
23
MODULE PADS
The ARTIK 710/710s Module utilizes signal and ground balls providing all the relevant signaling. Figure 3 shows how
the balls are oriented and how signal coordinates are assigned to the PADs of the ARTIK 710/710s Module. Table 2–
Table 6 describe the relation between the ball coordinates and the ball signal names. These tables also provide
detailed characteristics for each ball signal name.
Figure 3. ARTIK 710/710s Module Top View Ball Organization
PC
1
PAJ
1
PAJ
2
PAH
1
PAH
2
PAG
1
PAG
2
PAF
1
PAF
2
PAE
1
PAE
2
PAD
1
PAD
2
PAC
1
PAC
2
PAB
1
PAB
2
PAA
1
PAA
2
PY
1
PY
2
PW
1
PW
2
PV
1
PU
1
PT
1
PT
2
PR
1
PR
2
PP
1
PN
1
PN
2
PM
1
PM
2
PL
1
PL
2
PK
1
PK
2
PH
1
PG
1
PF
1
PF
2
PE
1
PE
2
PD
1
PJ
1
PJ
2
PAL
1
PAL
2
PAL
3
PAL
4
PAL
5
PAL
6
PAL
7
PAL
8
PAL
9
PAL
10
PAL
11
PAL
12
PAL
13
PAL
14
PAL
15
PAL
16
PAL
17
PAL
18
PAL
19
PAL
21
PAL
22
PAL
23
PAL
24
PAL
25
PAL
26
PAL
27
PAL
28
PAL
29
PAL
30
PAL
31
PAL
32
PAL
33
PAL
34
PAL
35
PAL
36
PAL
37
PAL
38
PAL
39
PAL
40
PAL
41
PAK
1
PAK
2
PAK
3
PAK
4
PAK
5
PAK
6
PAK
7
PAK
8
PAK
9
PAK
10
PAK
11
PAK
12
PAK
13
PAK
14
PAK
15
PAK
16
PAK
17
PAK
18
PAK
19
PAK
21
PAK
22
PAK
23
PAK
24
PAK
25
PAK
26
PAK
27
PAK
28
PAK
29
PAK
30
PAK
31
PAK
32
PAK
33
PAK
34
PAK
35
PAK
36
PAK
37
PAK
38
PAK
39
PAK
40
PAK
41
PB
1
PB
2
PB
3
PB
4
PB
5
PB
6
PB
7
PB
8
PB
9
PB
10
PB
11
PB
12
PB
13
PB
14
PB
15
PB
16
PB
17
PB
18
PB
19
PB
21
PB
22
PB
23
PB
24
PB
25
PB
26
PB
27
PB
28
PB
29
PB
30
PB
31
PB
32
PB
33
PB
34
PB
35
PB
36
PB
37
PB
38
PB
39
PB
40
PB
41
PA
1
PA
2
PA
3
PA
5
PA
6
PA
7
PA
8
PA
9
PA
10
PA
11
PA
12
PA
13
PA
14
PA
15
PA
16
PA
17
PA
18
PA
19
PA
21
PA
22
PA
23
PA
24
PA
25
PA
26
PA
27
PA
28
PA
29
PA
30
PA
31
PA
32
PA
33
PA
34
PA
35
PA
36
PA
37
PA
38
PA
39
PA
40
PA
41
PA
4
PB
42
PA
42
PAL
43
PAK
43
PAL
42
PAK
42
PC
42
PAH
42
PAG
42
PAF
42
PAE
42
PAD
42
PAC
42
PAB
42
PAA
42
PY
42
PW
42
PV
42
PU
42
PT
42
PR
42
PP
42
PN
42
PM
42
PL
42
PK
42
PJ
42
PH
42
PG
42
PF
42
PE
42
PD
42
PAJ
42
PC
43
PAH
43
PAG
43
PAF
43
PAE
43
PAD
43
PAC
43
PAB
43
PAA
43
PY
43
PW
43
PV
42
PU
42
PT
43
PR
43
PP
43
PN
43
PM
43
PL
43
PK
43
PJ
43
PH
43
PG
43
PF
43
PE
43
PD
43
PAJ
43
PB
43
PA
43
TP
297
TP
296
TP
295
TP
294
TP
293
TP
292
TP
282
TP
283
TP
284
TP
301
TP
300
TP
285
TP
286
TP
287
TP
288
TP
289
TP
290
TP
291
TP
299
TP
298
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
24
Ball Table Column Definitions
The meaning of the various columns used in Table 2 - Table 6 is explained in Table 1.
North Ball Array
Table 1. Ball Table Column Definition
Column Name Column Definition
Ball Loc. Ball location on the ARTIK 710/710s Module as shown in Figure 3.
Ball Name The ball name on the ARTIK 710/710s Module.
Voltage Voltage level on the ball.
Default Default function of the main SoC at hardware power-on.
Type S: Signal ball, P: Power ball, G: GND ball.
I/O I: Input, O: Output, IO: Input/Output to/from module
PU/PD Indicates the presence of module-internal pull-up or pull-down. PU: Pull-Up, PD: Pull-Down, N: No Pull-Up/Pull-Down.
Group Nominal function group set according to pad name. For more information see the ARTIK 710/710s Module Hardware
User Guide. Usually the function of the pin can be reprogrammed.
Function Explanation on the function of the ball.
Table 2. North Ball Array
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
PA1 GMAC_TXEN 3.3V SIO NGMAC GMAC Transmit Enable
PA2 GMAC_TXD1 3.3V SIO NGMAC GMAC Transmit Data 1
PA3 GMAC_TXD3 3.3V SIO NGMAC GMAC Transmit Data 3
PA4 GND 0.0V G – – GND Ground
PA5 GMAC_GTXCLK 3.3V SIO NGMAC GMAC Transmit Clock
PA6 GMAC_RXDV 3.3V SIO NGMAC GMAC Receive Enable
PA7 GMAC_RXD2 3.3V SIO NGMAC GMAC Receive Data 2
PA8 GMAC_RXD0 3.3V SIO NGMAC GMAC Receive Data 0
PA9 GND 0.0V G – – GND Ground
PA10 AP_MIPICSI_DNCLK 1.8V SIO NCSI MIPI CSI Data Negative Clock
PA11 AP_MIPICSI_DN0 1.8V SIO NCSI MIPI CSI Data Negative 0
PA12 AP_MIPICSI_DN1 1.8V SIO NCSI MIPI CSI Data Negative 1
PA13 AP_MIPICSI_DN2 1.8V SIO NCSI MIPI CSI Data Negative 2
PA14 AP_MIPICSI_DN3 1.8V SIO NCSI MIPI CSI Data Negative 3
PA15 NO BALL – – – – NO BALL –
PA16 AP_MIPIDSI_DNCLK 1.8V SIO NDSI MIPI DSI Data Negative Clock
PA17 AP_MIPIDSI_DN0 1.8V SIO NDSI MIPI DSI Data Negative 0
PA18 AP_MIPIDSI_DN1 1.8V SIO NDSI MIPI DSI Data Negative 1
PA19 AP_MIPIDSI_DN2 1.8V SIO NDSI MIPI DSI Data Negative 2
PA20 AP_MIPIDSI_DN3 1.8V SIO NDSI MIPI DSI Data Negative 3
PA21 GND 0.0V G – – GND Ground
PA22 AP_LVDS_TN0 1.8V S O N LVDS LVDS Transmit Channel 0 Negative
PA23 AP_LVDS_TN1 1.8V S O N LVDS LVDS Transmit Channel 1 Negative
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
25
PA24 AP_LVDS_TN2 1.8V S O N LVDS LVDS Transmit Channel 2 Negative
PA25 AP_LVDS_TNCLK 1.8V S O N LVDS LVDS Transmit Negative Clock
PA26 AP_LVDS_TN3 1.8V S O N LVDS LVDS Transmit Channel 3 Negative
PA27 AP_LVDS_TN4 1.8V S O N LVDS LVDS Transmit Channel 4 Negative
PA28 GND 0.0V G – – GND Ground
PA29 AP_HDMI_CEC 3.3V SIO NHDMI HDMI Consumer Electronics Control
PA30 AP_HDMI_TX2N 1.8V S O N HDMI HDMI Transmit Channel 2 Negative
PA31 AP_HDMI_TX1N 1.8V S O N HDMI HDMI Transmit Channel 1 Negative
PA32 AP_HDMI_TX0N 1.8V S O N HDMI HDMI Transmit Channel0 Negative
PA33 AP_HDMI_TXCN 1.8V S O N HDMI HDMI Transmit Negative Clock
PA34 GND 0.0V G – – GND Ground
PA35 AP_OTG_DM 3.3V SIO NUSB OTG USB OTG Data Minus
PA36 AP_USBH_DM 3.3V SIO NUSB
HOST
USB HOST Data Minus
PA37 AP_GPA13 3.3V SIO NGPIO Generic GPIO
PA38 AP_HSIC_STROBE 1.2V SIO NHSIC HSIC Strobe
PA39 AP_GPA14 3.3V SIO NGPIO Generic GPIO
PA40 AP_GPA9 3.3V SIO NGPIO Generic GPIO
PA41 AP_GPA15 3.3V SIO NGPIO Generic GPIO
PA42 AP_GPA12 3.3V SIO NGPIO Generic GPIO
PA43 GND 0.0V G – – GND Ground
PB1 GND 0.0V G – – GND Ground
PB2 GMAC_TXD0 3.3V SIO NGMAC GMAC Transmit Data 0
PB3 GMAC_TXD2 3.3V SIO NGMAC GMAC Transmit Data 2
PB4 GMAC_MDC 3.3V SIO NGMAC GMAC MDC
PB5 GMAC_RXCLK 3.3V SIO NGMAC GMAX Receive Clock
PB6 GMAC_RXD3 3.3V SIO NGMAC GMAC Receive Data 3
PB7 GMAC_RXD1 3.3V SIO NGMAC GMAC Receive Data 1
PB8 GMAC_MDIO 3.3V SIO NGMAC GMAC MDIO
PB9 GND 0.0V G – – GND Ground
PB10 AP_MIPICSI_DPCLK 1.8V SIO NCSI MIPI CSI Data Positive Clock
PB11 AP_MIPICSI_DP0 1.8V SIO NCSI MIPI CSI Data Positive 0
PB12 AP_MIPICSI_DP1 1.8V SIO NCSI MIPI CSI Data Positive 1
PB13 AP_MIPICSI_DP2 1.8V SIO NCSI MIPI CSI Data Positive 2
PB14 AP_MIPICSI_DP3 1.8V SIO NCSI MIPI CSI Data Positive 3
PB15 GND 0.0V G – – GND Ground
PB16 AP_MIPIDSI_DPCLK 1.8V SIO NDSI MIPI DSI Data Positive Clock
PB17 AP_MIPIDSI_DP0 1.8V SIO NDSI MIPI DSI Data Positive 0
PB18 AP_MIPIDSI_DP1 1.8V SIO NDSI MIPI DSI Data Positive 1
PB19 AP_MIPIDSI_DP2 1.8V SIO NDSI MIPI DSI Data Positive 2
PB20 AP_MIPIDSI_DP3 1.8V SIO NDSI MIPI DSI Data Positive 3
PB21 GND 0.0V G – – GND Ground
PB22 AP_LVDS_TP0 1.8V S O N LVDS LVDS Transmit Channel 0 Positive
Table 2. North Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
26
South Ball Array
PB23 AP_LVDS_TP1 1.8V S O N LVDS LVDS Transmit Channel 1 Positive
PB24 AP_LVDS_TP2 1.8V S O N LVDS LVDS Transmit Channel 2 Positive
PB25 AP_LVDS_TPCLK 1.8V S O N LVDS LVDS Transmit Positive Clock
PB26 AP_LVDS_TP3 1.8V S O N LVDS LVDS Transmit Channel 3 Positive
PB27 AP_LVDS_TP4 1.8V S O N LVDS LVDS Transmit Channel 4 Positive
PB28 GND 0.0V G – – GND Ground
PB29 AP_HDMI_HPD 3.3V S I N HDMI HDMI Hot Plug Detect
PB30 AP_HDMI_TX2P 1.8V S O N HDMI HDMI Transmit Channel 2 Positive
PB31 AP_HDMI_TX1P 1.8V S O N HDMI HDMI Transmit Channel 1 Positive
PB32 AP_HDMI_TX0P 1.8V S O N HDMI HDMI Transmit Channel 0 Positive
PB33 AP_HDMI_TXCP 1.8V S O N HDMI HDMI Transmit Positive Clock
PB34 GND 0.0V G – – GND Ground
PB35 AP_OTG_DP 3.3V SIO NUSB OTG USB OTG Data Plus
PB36 AP_USBH_DP 3.3V SIO NUSB
HOST
USB HOST Data Plus
PB37 AP_OTG_ID – S I N USB
HOST
USB HOST ID
PB38 AP_HSIC_DATA 1.2V SIO NHSIC HSIC Data
PB39 AP_GPA4 3.3V SIO NGPIO Generic GPIO
PB40 AP_GPA5 3.3V SIO NGPIO Generic GPIO
PB41 AP_GPA16 3.3V SIO NGPIO Generic GPIO
PB42 AP_GPA11 3.3V SIO NGPIO Generic GPIO
PB43 GND 0 G – – GND Ground
Table 3. South Ball Array
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
PAK1 AP_I2S0_DOUT 3.3V SIO NI2S0 I2S 0 Data Out
PAK2 AP_I2S0_BCLK 3.3V SIO NI2S0 I2S 0 Bit Clock
PAK3 AP_GPC11_SPI2_MISO 3.3V SIO NSPI2 SPI 2 Receive Data
PAK4 AP_GPC9_SPI2_CLK 3.3V SIO NSPI2 SPI 2 Clock
PAK5 AP_SPI0_MISO 3.3V SIO NSPI0 SPI 0 Receive Data *
PAK6 AP_SPI0_CLK 3.3V SIO NSPI0 SPI 0 Clock *
PAK7 AP_GPC14_PWM2 3.3V SIO NPWM PWM 2
PAK8 AP_GPD6_SCL2 3.3V SIO PU I2C I2C SCL 2
PAK9 AP_GPD4_SCL1 3.3V SIO PU I2C I2C SCL 1
PAK10 AP_GPD2_SCL0 3.3V SIO PU I2C I2C SCL 0
PAK11 AP_GPA23_HDMI_I2C_SCL 3.3V SIO N I2CHDMI I2C SCL *
PAK12 ZB_JTMS 3.3V SIO –ZIGBEE ZIGBEE JTAG TMS
PAK13 ZB_JTCK 3.3V SIO –ZIGBEE ZIGBEE JTAG TCK
PAK14 ZB_PC0 3.3V SIO –ZIGBEE ZIGBEE Control
Table 2. North Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
27
PAK15 ZB_PA4 3.3V SIO –ZIGBEE ZIGBEE Control
PAK16 GND 0.0V G – – GND Ground
PAK17 VCC3P3_SYS 3.3V P O – POWER VCC 3.3V Power: voltage reference only
PAK18 VCC3P3_SYS 3.3V P O – POWER VCC 3.3V Power: voltage reference only
PAK19 AP_nBATTF 3.3V – – N MISC Battery
PAK20 AP_GPE2 3.3V SIO NGPIO Generic GPIO
PAK21 AP_GPE1 3.3V SIO NGPIO Generic GPIO
PAK22 AP_UARTTX3 3.3V SIO NUART UART Transmit Data 3
PAK23 AP_UARTTX4 3.3V SIO NUART UART Transmit Data 4
PAK24 AP_UARTTX5 3.3V SIO NUART UART Transmit Data 5 *
PAK25 AP_GPB0_VID1_1_I2SLRCK1 3.3V SIO PU I2S1 I2S 1 Left Right Clock *
PAK26 AP_GPA28_I2SMCLK1 3.3V SIO NI2S1 I2S 1 Master Clock *
PAK27 AP_GPA30_VID1_0_I2SBCLK1 3.3V SIO PU I2S1 I2S 1 Bit Clock *
PAK28 AP_SD0_CMD 3.3V SIO NSD/MMC SD Command
PAK29 AP_SD0_D1 3.3V SIO NSD/MMC SD Data 1
PAK30 AP_SD0_CLK 3.3V SIO NSD/MMC SD Clock
PAK31 NO CONNECTION – – – – NC NA
PAK32 AP_GPB13_SD0_BOOT 3.3V S I PU BOOTING Select Booting Scenario
PAK33 AP_GPC17 3.3V SIO NGPIO Generic GPIO
PAK34 AP_GPC0 3.3V SIO NGPIO Generic GPIO
PAK35 AP_GPC26 3.3V SIO PU GPIO Generic GPIO
PAK36 AP_GPB8 3.3V SIO NGPIO Generic GPIO
PAK37 AP_GPB14 3.3V SIO NGPIO Generic GPIO
PAK38 AP_GPA20 3.3V SIO NGPIO Generic GPIO
PAK39 AP_GPA18 3.3V SIO NGPIO Generic GPIO
PAK40 AP_GPA21 3.3V SIO NGPIO Generic GPIO
PAK41 AP_GPA10 3.3V SIO NGPIO Generic GPIO
PAK42 AP_GPA6 3.3V SIO NGPIO Generic GPIO
PAK43 BT_PCM_D_IN 3.3V S I – BT PCM Data In
PAL1 AP_I2S0_DIN 3.3V SIO NI2S0 I2S 0 Data In
PAL2 AP_I2S0_MCLK 3.3V SIO NI2S0 I2S 0 Master Clock
PAL3 AP_GPC12_SPI2_MOSI 3.3V SIO NSPI2 SPI 2 Transmit Data
PAL4 AP_GPC10_SPI2_CS 3.3V SIO PU SPI2 SPI 2 Frame
PAL5 AP_SPI0_MOSI 3.3V SIO NSPI0 SPI 0 Transmit Data *
PAL6 AP_SPI0_CS 3.3V SIO NSPI0 SPI 0 Frame *
PAL7 AP_GPD1_PWM0 3.3V SIO NPWM PWM 0
PAL8 AP_GPD7_SDA2 3.3V SIO PU I2C I2C SDA 2
PAL9 AP_GPD5_SDA1 3.3V SIO PU I2C I2C SDA 1
PAL10 AP_GPD3_SDA0 3.3V SIO PU I2C I2C SDA 0
PAL11 AP_GPA24_HDMI_I2C_SDA 3.3V SIO N I2CHDMI I2C SDA *
PAL12 ZB_JTDI 3.3V – – – ZIGBEE ZIGBEE JTAG TDI
PAL13 ZB_JTDO 3.3V – – – ZIGBEE ZIGBEE JTAG TDO
Table 3. South Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
28
East Ball Array
PAL14 ZB_RSTn 3.3V SIO NZIGBEE ZIGBEE Reset
PAL15 ZB_PA5 3.3V SIO NZIGBEE ZIGBEE Control (for internal use only)
PAL16 GND 0.0V G – – GND Ground
PAL17 VCC3P3_SYS 3.3V P O – POWER VCC 3V3 Power: voltage reference only
PAL18 VCC3P3_SYS 3.3V P O – POWER VCC 3V3 Power: voltage reference only
PAL19 AP_VDDPWRON 3.3V S O N MISC VDD Power On
PAL20 AP_GPE3 3.3V SIO NGPIO Generic GPIO
PAL21 AP_GPE0 3.3V SIO NGPIO Generic GPIO
PAL22 AP_UARTRX3 3.3V SIO NUART UART Receive Data 3
PAL23 AP_UARTRX4 3.3V SIO NUART UART Receive Data 4
PAL24 AP_UARTRX5 3.3V SIO NUART UART Receive Data 5 *
PAL25 AP_GPD31 3.3V SIO NGPIO Generic GPIO
PAL26 AP_GPB9_I2SDIN1 3.3V SIO NI2S1 I2S 1 Data In *
PAL27 AP_GPB6_VID1_4_I2SDOUT1 3.3V SIO PD I2S1 I2S 1 Data Out *
PAL28 AP_SD0_D3 3.3V SIO NSD/MMC SD Data 3
PAL29 AP_SD0_D2 3.3V SIO NSD/MMC SD Data 2
PAL30 AP_SD0_D0 3.3V SIO NSD/MMC SD Data 0
PAL31 AP_GPB4_VID1_3_BOOT 3.3V S I PU BOOTING Select Booting Scenario
PAL32 AP_GPB15_SD1_BOOT 3.3V S I PD BOOTING Select Booting Scenario
PAL33 AP_GPD8 3.3V SIO NGPIO Generic GPIO
PAL34 AP_GPE30 3.3V SIO PU GPIO Generic GPIO
PAL35 AP_GPC27 3.3V SIO PU GPIO Generic GPIO
PAL36 AP_GPB22 3.3V SIO NGPIO Generic GPIO
PAL37 AP_GPB16 3.3V SIO NGPIO Generic GPIO
PAL38 AP_GPB23 3.3V SIO NGPIO Generic GPIO
PAL39 AP_GPA22 3.3V SIO NGPIO Generic GPIO
PAL40 AP_GPA19 3.3V SIO NGPIO Generic GPIO
PAL41 AP_GPA17 3.3V SIO NGPIO Generic GPIO
PAL42 AP_GPA3 3.3V SIO NGPIO Generic GPIO
PAL43 BT_PCM_CLK 3.3V SIO –BT PCM Clock
*. Functions as general-purpose GPIO by default
Table 4. East Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
PC1 GND 0.0V G – – GND Ground
PC2 NO BALL – – – – NO BALL –
PD1 GND 0.0V G – – GND Ground
PD2 NO BALL – – – – NO BALL –
Table 3. South Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
29
PE1 GND 0.0V G – – GND Ground
PE2 GND 0.0V G – – GND Ground
PF1 GND 0.0V G – – GND Ground
PF2 GND 0.0V G – – GND Ground
PG1 GND 0.0V G – – GND Ground
PG2 NO BALL – – – – NO BALL –
PH1 GND 0.0V G – – GND Ground
PH2 NO BALL – – – – NO BALL –
PJ1 GND 0.0V G – – GND Ground
PJ2 GND 0.0V G – – GND Ground
PK1 GND 0.0V G – – GND Ground
PK2 GND 0.0V G – – GND Ground
PL1 GND 0.0V G – – GND Ground
PL2 GND 0.0V G – – GND Ground
PM1 GND 0.0V G – – GND Ground
PM2 GND 0.0V G – – GND Ground
PN1 GND 0.0V G – – GND Ground
PN2 GND 0.0V G – – GND Ground
PP1 GND 0.0V G – – GND Ground
PP2 NO BALL – – – – NO BALL –
PR1 GND 0.0V G – – GND Ground
PR2 GND 0.0V G – – GND Ground
PT1 VCC1P8_LDO4 *1.8V P O – POWER LDO4: Do not use—voltage reference only
PT2 GND 0.0V G – – GND Ground
PU1 VCC1P8_LDO4 1.8V P O – POWER LDO4: Do not use—voltage reference only
PU2 NO BALL – – – – NO BALL –
PV1 VCC1P8_LDO4 1.8V P O – POWER LDO4: Do not use—voltage reference only
PV2 NO BALL – – – – NO BALL –
PW1 AP_ADC4 1.8V S I N ADC ADC Channel 4
PW2 AP_ADC5 1.8V S I N ADC ADC Channel 5
PY1 AP_ADC0 1.8V S I N ADC ADC Channel 0
PY2 AP_ADC1 1.8V S I N ADC ADC Channel 1
PAA1 AP_ADC2 1.8V S I N ADC ADC Channel 2
PAA2 AP_ADC3 1.8V S I N ADC ADC Channel 3
PAB1 GND 0.0V G – – GND Ground
PAB2 GND 0.0V G – – GND Ground
PAC1 AP_TCK 3.3V SIO NJTAG JTAG TCK
PAC2 AP_TMS 3.3V SIO NJTAG JTAG TMS
PAD1 AP_TDO 3.3V SIO NJTAG JTAG TDO
PAD2 AP_TDI 3.3V SIO NJTAG JTAG TDI
PAE1 AP_NTRST 3.3V SIO PD JTAG JTAG NTRST
PAE2 AP_AGP2_RTC_INT_N 3.3V SIO NKEY/
ALIVE
AliveGPIO
Table 4. East Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
30
West Ball Array
PAF1 AP_PWRKEY 3.3V SIO NKEY/
ALIVE
Power Key part of AliveGPIO
PAF2 AP_AGP1 3.3V SIO NALIVE AliveGPIO
PAG1 AP_NRESET 3.3V S I N †KEY Reset
PAG2 AP_GPA25 3.3V SIO NGPIO Generic GPIO
PAH1 AP_GPA26 3.3V SIO NGPIO Generic GPIO
PAH2 AP_GPA0 3.3V SIO NGPIO Generic GPIO
PAJ1 AP_I2S0_LRCLK 3.3V SIO NI2S0 I2S 0 Left Right Clock
PAJ2 AP_GPA27 3.3V SIO NI2S0 Generic GPIO
*. LDO4 should not be used to source power to any external components or devices. This LDO can only be used as a voltage
reference.
†. External 100k pull-up resistor required.
Table 5. West Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
PC42 GND 0.0V G – – GND Ground
PC43 GND 0.0V G – – GND Ground
PD42 VCC5P0_OTGVBUS – P I – POWER USB2.0 OTG BUS Power
PD43 VCC5P0_OTGVBUS 5.0V P I – POWER USB2.0 OTG BUS Power
PE42 NO CONNECTION – – – – NC –
PE42 VCC3P3_LDO7 *3.3V P O – POWER LDO7: Do not use—voltage reference only
PE43 VCC3P3_LDO7 *3.3V P O – POWER LDO7: Do not use—voltage reference only
PF42 VCC3P3_LDO7 *3.3V P O – POWER LDO7: Do not use—voltage reference only
PF43 GND 0 G – – GND Ground
PG42 GND 0.0V G – – GND Ground
PG43 GND 0.0V G – – GND Ground
PH42 VCC_LDO5 †0.6–3.5V P O – POWER LDO5: User available, 3.3V default, 30mA max
PH43 VCC_LDO5 †0.6–3.5V P O – POWER LDO5: User available, 3.3V default, 30mA max
PJ42 VCC_LDO5 †0.6–3.5V P O – POWER LDO5: User available, 3.3V default, 30mA max
PJ43 VCC_LDO2 †0.9–3.5V P O – POWER LDO2: User available, 3.3V default, 30mA max
PK42 VCC_LDO2 †0.9–3.5V P O – POWER LDO2: User available, 3.3V default, 30mA max
PK43 VCC_LDO2 †0.9–3.5V P O – POWER LDO2: User available, 3.3V default, 30mA max
PL42 GND 0.0V G – – GND Ground
PL43 GND 0.0V G – – GND Ground
PM42 VCC_LDO1 †0.9–3.5V P O – POWER LDO1: User available, 3.3V default, 30mA max
PM43 VCC_LDO1 †0.9–3.5V P O – POWER LDO1: User available, 3.3V default, 30mA max
PN42 VCC_LDO1 †0.9–3.5V P O – POWER LDO1: User available, 3.3V default, 30mA max
PN43 GND 0.0V G – – GND Ground
PP42 VCC1P2_LDO10 *1.2V P O – POWER LDO10: Do not use—voltage reference only
PP43 GND 0 G – – GND Ground
Table 4. East Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
31
Center Ball Array
PR42 VCC1P2_LDO10 *1.2V P O – POWER LDO10: Do not use—voltage reference only
PR43 VCC1P2_LDO10 *1.2V P O – POWER LDO10: Do not use—voltage reference only
PT42 VCC_LDO9 †0.6–3.5V P O – POWER LDO9: User available, 1.8V default, 20mA max
PT43 GND 0.0V G – – GND Ground
PU42 VCC_LDO9 †0.6–3.5V P O – POWER LDO9: User available, 1.8V default, 20mA max
PU43 VCC_LDO9 †0.6–3.5V P O – POWER LDO9: User available, 1.8V default, 20mA max
PV43 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PW42 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PW43 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PY42 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PY43 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PAA42 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PAA43 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PAB42 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PAB43 VIN 3.7~5.0V P I – POWER Main Power Supply for Module
PAC42 GND 0.0V G – – GND Ground
PAC43 GND 0.0V G – – GND Ground
PAD42 VCC3P3_LDO8 †0.6–3.5V P O – POWER LDO8: User available, 3.3V default, 10mA max
PAD43 VCC3P3_LDO8 †0.6–3.5V P O – POWER LDO8: User available, 3.3V default, 10mA max
PAE42 GND 0.0V G – – GND Ground
PAE43 VCC3P3_LDO8 †0.6–3.5V P O – POWER LDO8: User available, 3.3V default, 10mA max
PAF42 GND 0.0V G – – GND Ground
PAF43 GND 0.0V G – – GND Ground
PAG42 AP_GPB11 3.3V SIO NGPIO Generic GPIO
PAG43 AP_GPB18 3.3V SIO NGPIO Generic GPIO
PAH42 AP_GPC25 3.3V SIO PU GPIO Generic GPIO
PAH43 AP_GPE31 3.3V SIO PU GPIO Generic GPIO
PAJ42 BT_PCM_D_OUT 3.3V S O N BT PCM PCM Data Out
PAJ43 BT_PCM_LRCK 3.3V SIO NBT PCM PCM LR Clock
*. LDO7 and LDO10 should not be used to source power to any external components or devices. These LDOs can only be
used as a voltage reference.
†. The current consumption for user-available LDOs (LDO1, LDO2, LDO5, LDO8, and LDO9) should not exceed the maximum
limits specified in this table, as heavier usage may cause internal power sequencing issues, latch-up problems, or
overheating problems.
Table 6. Center Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
TP282 GND 0.0V NA – – GND Ground
TP283 GND 0.0V NA – – GND Ground
TP284 GND 0.0V NA – – GND Ground
Table 5. West Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
32
TP285 GND 0.0V NA – – GND Ground
TP286 GND 0.0V NA – – GND Ground
TP287 GND 0.0V NA – – GND Ground
TP288 GND 0.0V NA – – GND Ground
TP289 GND 0.0V NA – – GND Ground
TP290 GND 0.0V NA – – GND Ground
TP291 GND 0.0V NA – – GND Ground
TP292 GND 0.0V NA – – GND Ground
TP293 GND 0.0V NA – – GND Ground
TP294 GND 0.0V NA – – GND Ground
TP295 GND 0.0V NA – – GND Ground
TP296 GND 0.0V NA – – GND Ground
TP297 GND 0.0V NA – – GND Ground
TP298 GND 0.0V NA – – GND Ground
TP299 GND 0.0V NA – – GND Ground
TP300 GND 0.0V NA – – GND Ground
TP301 GND 0.0V NA – – GND Ground
Table 6. Center Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
33
FUNCTIONAL INTERFACES
This section shows the functional interfaces that are available at the pads of the ARTIK 710/710s Module. The
functions provided are related to the development environment used. Depending on your project you can always
choose to reprogram some of the GPIOs that are currently assigned to the predefined functional interfaces.
ADC
Booting
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
Bluetooth PCM
Table 7. ADC
Function Ball Loc. Ball Name Voltage I/O PU/PD
ADC Channel 0 PY1 AP_ADC0 1.8V I N
ADC Channel 1 PY2 AP_ADC1 1.8V I N
ADC Channel 2 PAA1 AP_ADC2 1.8V I N
ADC Channel 3 PAA2 AP_ADC3 1.8V I N
ADC Channel 4 PW1 AP_ADC4 1.8V I N
ADC Channel 5 PW2 AP_ADC5 1.8V I N
Table 8. Booting
Function Ball Loc. Ball Name Voltage I/O PU/PD
Booting Configuration 1 PAK32 AP_GPB13_SD0_BOOT 3.3V IPU
Booting Configuration 2 PAL32 AP_GPB15_SD1_BOOT 3.3V IPD
Booting Configuration 3 PAL31 AP_GPB4_VID1_3_BOOT 3.3V IPU
If a preferred boot device fails, the above pins select whether secondary and/or tertiary boot options are
available. For details, see Booting Selection.
Table 9. Bluetooth PCM
Function Ball Loc. Ball Name Voltage I/O PU/PD
PCM Clock PAL43 BT_PCM_CLK 3.3V IO N
PCM LR Clock PAJ43 BT_PCM_LRCK 3.3V IO N
PCM Data In PAK43 BT_PCM_D_IN 3.3V I N
PCM Data Out PAJ42 BT_PCM_D_OUT 3.3V O N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
34
MIPI CSI
MIPI DSI
GMAC
Table 10. MIPI CSI
Function Ball Loc. Ball Name Voltage I/O PU/PD
MIPI CSI Data Negative Clock PA10 AP_MIPICSI_DNCLK 1.8V IO N
MIPI CSI Data Negative 0 PA11 AP_MIPICSI_DN0 1.8V IO N
MIPI CSI Data Negative 1 PA12 AP_MIPICSI_DN1 1.8V IO N
MIPI CSI Data Negative 2 PA13 AP_MIPICSI_DN2 1.8V IO N
MIPI CSI Data Negative 3 PA14 AP_MIPICSI_DN3 1.8V IO N
MIPI CSI Data Positive Clock PB10 AP_MIPICSI_DPCLK 1.8V IO N
MIPI CSI Data Positive 0 PB11 AP_MIPICSI_DP0 1.8V IO N
MIPI CSI Data Positive 1 PB12 AP_MIPICSI_DP1 1.8V IO N
MIPI CSI Data Positive 2 PB13 AP_MIPICSI_DP2 1.8V IO N
MIPI CSI Data Positive 3 PB14 AP_MIPICSI_DP3 1.8V IO N
Table 11. MIPI DSI
Function Ball Loc. Ball Name Voltage I/O PU/PD
MIPI DSI Data Negative Clock PA16 AP_MIPIDSI_DNCLK 1.8V IO N
MIPI DSI Data Negative 0 PA17 AP_MIPIDSI_DN0 1.8V IO N
MIPI DSI Data Negative 1 PA18 AP_MIPIDSI_DN1 1.8V IO N
MIPI DSI Data Negative 2 PA19 AP_MIPIDSI_DN2 1.8V IO N
MIPI DSI Data Negative 3 PA20 AP_MIPIDSI_DN3 1.8V IO N
MIPI DSI Data Positive Clock PB16 AP_MIPIDSI_DPCLK 1.8V IO N
MIPI DSI Data Positive 0 PB17 AP_MIPIDSI_DP0 1.8V IO N
MIPI DSI Data Positive 1 PB18 AP_MIPIDSI_DP1 1.8V IO N
MIPI DSI Data Positive 2 PB19 AP_MIPIDSI_DP2 1.8V IO N
MIPI DSI Data Positive 3 PB20 AP_MIPIDSI_DP3 1.8V IO N
Table 12. GMAC
Function Ball Loc. Ball Name Voltage I/O PU/PD
GMAC MDC PB4 GMAC_MDC 3.3V IO N
GMAC MDIO PB8 GMAC_MDIO 3.3V IO N
GMAC Receive Clock PB5 GMAC_RXCLK 3.3V IO N
GMAC Receive Data 0 PA8 GMAC_RXD0 3.3V IO N
GMAC Receive Data 1 PB7 GMAC_RXD1 3.3V IO N
GMAC Receive Data 2 PA7 GMAC_RXD2 3.3V IO N
GMAC Receive Data 3 PB6 GMAC_RXD3 3.3V IO N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
35
The above signals can be reassigned by software to alternate functions; see Table 29 for details.
GPIO
GMAC Receive Enable PA6 GMAC_RXDV 3.3V IO N
GMAC Transmit Clock PA5 GMAC_GTXCLK 3.3V IO N
GMAC Transmit Data 0 PB2 GMAC_TXD0 3.3V IO N
GMAC Transmit Data 1 PA2 GMAC_TXD1 3V3 IO N
GMAC Transmit Data 2 PB3 GMAC_TXD2 3.3V IO N
GMAC Transmit Data 3 PA3 GMAC_TXD3 3.3V IO N
GMAC Transmit Enable PA1 GMAC_TXEN 3.3V IO N
Table 13. GPIO
Function Ball Loc. Ball Name Voltage I/O PU/PD *
Generic GPIO PAH2 AP_GPA0 3.3V IO N
Generic GPIO PAL42 AP_GPA3 3.3V IO N
Generic GPIO PB39 AP_GPA4 3.3V IO N
Generic GPIO PB40 AP_GPA5 3.3V IO N
Generic GPIO PAK42 AP_GPA6 3.3V IO N
Generic GPIO AP_GPA7 3.3V IO N
Generic GPIO AP_GPA8 3.3V IO N
Generic GPIO PA40 AP_GPA9 3.3V IO N
Generic GPIO PAK41 AP_GPA10 3.3V IO N
Generic GPIO PB42 AP_GPA11 3.3V IO N
Generic GPIO PA42 AP_GPA12 3.3V IO N
Generic GPIO PA37 AP_GPA13 3.3V IO N
Generic GPIO PA39 AP_GPA14 3.3V IO N
Generic GPIO PA41 AP_GPA15 3.3V IO N
Generic GPIO PB41 AP_GPA16 3.3V IO N
Generic GPIO PAL41 AP_GPA17 3.3V IO N
Generic GPIO PAK39 AP_GPA18 3.3V IO N
Generic GPIO PAL40 AP_GPA19 3.3V IO N
Generic GPIO PAK38 AP_GPA20 3.3V IO N
Generic GPIO PAK40 AP_GPA21 3.3V IO N
Generic GPIO PAL39 AP_GPA22 3.3V IO N
Generic GPIO PAG2 AP_GPA25 3.3V IO N
Generic GPIO PAH1 AP_GPA26 3.3V IO N
Generic GPIO PAJ2 AP_GPA27 3.3V IO N
Generic GPIO PAJ2 AP_GPA28 3.3V IO N
Generic GPIO PAK36 AP_GPB8 3.3V IO N
Generic GPIO PAG41 AP_GPB11 3.3V IO N
Generic GPIO PAK37 AP_GPB14 3.3V IO N
Table 12. GMAC (Continued)
Function Ball Loc. Ball Name Voltage I/O PU/PD
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
36
The above signals can be reassigned by software to alternate functions; see Table 29–Table 32 for details.
HDMI
Generic GPIO PAL37 AP_GPB16 3.3V IO N
Generic GPIO PAG42 AP_GPB18 3.3V IO N
Generic GPIO PAL36 AP_GPB22 3.3V IO N
Generic GPIO PAL38 AP_GPB23 3.3V IO N
Generic GPIO PAK34 AP_GPC0 3.3V IO N
Generic GPIO PAK33 AP_GPC17 3.3V IO N
Generic GPIO PAH42 AP_GPC25 3.3V IO PU
Generic GPIO PAK35 AP_GPC26 3.3V IO PU
Generic GPIO PAL35 AP_GPC27 3.3V IO PU
Generic GPIO PAL33 AP_GPD8 3.3V IO N
Generic GPIO PAL25 AP_GPD31 3.3V IO N
Generic GPIO PAL21 AP_GPE0 3.3V IO N
Generic GPIO PAK21 AP_GPE1 3.3V IO N
Generic GPIO PAK20 AP_GPE2 3.3V IO N
Generic GPIO PAL20 AP_GPE3 3.3V IO N
Generic GPIO PAL34 AP_GPE30 3.3V IO PU
Generic GPIO PAH43 AP_GPE31 3.3V IO PU
*. The GPIO lines can be pulled up or down by 100k internal registers under register control. By default, the pull-ups and
pull-downs are disabled. For details about reconfiguring the GPIO lines, refer to the ARTIK 530/710 System Design Guide.
Table 14. HDMI
Function Ball Loc. Ball Name Voltage I/O PU/PD
HDMI Consumer Electronics Control *
*. Alternate GPIO function that can be selected by software but is not selected by hardware at power-on. See Table 29 for
details.
PA29 AP_HDMI_CEC 3.3V IO N
HDMI Hot Plug Detect PB29 AP_HDMI_HPD 3.3V I N
HDMI Transmit Channel 0 Negative PA32 AP_HDMI_TX0N 1.8V O N
HDMI Transmit Channel 0 Positive PB32 AP_HDMI_TX0P 1.8V O N
HDMI Transmit Channel 1 Negative PA31 AP_HDMI_TX1N 1.8V O N
HDMI Transmit Channel 1 Positive PB31 AP_HDMI_TX1P 1.8V O N
HDMI Transmit Channel 2 Negative PA30 AP_HDMI_TX2N 1.8V O N
HDMI Transmit Channel 2 Positive PB30 AP_HDMI_TX2P 1.8V O N
HDMI Transmit Negative Clock PA33 AP_HDMI_TXCN 1.8V O N
HDMI Transmit Positive Clock PB33 AP_HDMI_TXCP 1.8V O N
Table 13. GPIO (Continued)
Function Ball Loc. Ball Name Voltage I/O PU/PD *
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
37
HSIC
I2C
I2S
Table 15. HSIC
Function Ball Loc. Ball Name Voltage I/O PU/PD
HSIC Data PB38 AP_HSIC_DATA 1.2V IO N
HSIC Strobe PA38 AP_HSIC_STROBE 1.2V IO N
Table 16. I2C
Function Ball Loc. Ball Name Voltage I/O PU/PD
HDMI I2C SCL *
*. Not selected by default by hardware at power-on. The signal can be reassigned by software. See Table 30 for details.
PAK11 AP_GPA23_HDMI_I2C_SCL 3.3V IO N
HDMI I2C SDA *PAL11 AP_GPA24_HDMI_I2C_SDA 3.3V IO N
I2C SCL 0 †PAK10 AP_GPD2_SCL0 3.3V IO PU
I2C SDA 0 †PAL10 AP_GPD3_SDA0 3.3V IO PU
I2C SCL 1 †PAK9 AP_GPD4_SCL1 3.3V IO PU
I2C SDA 1 †PAL9 AP_GPD5_SDA1 3.3V IO PU
I2C SCL 2 †
†. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
for details.
PAK8 AP_GPD6_SCL2 3.3V IO PU
I2C SDA 2 †PAL8 AP_GPD7_SDA2 3.3V IO PU
Table 17. I2S
Function Ball Loc. Ball Name Voltage I/O PU/PD
I2S 0 Bit Clock *
*. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
and Table 31 for details.
PAK2 AP_I2S0_BCLK 3.3V IO N
I2S 0 Data In *PAL1 AP_I2S0_DIN 3.3V IO N
I2S 0 Data Out *PAK1 AP_I2S0_DOUT 3.3V IO N
I2S 0 Left Right Clock *PAJ1 AP_I2S0_LRCLK 3.3V IO N
I2S 0 Master Clock *PAL2 AP_I2S0_MCLK 3.3V IO N
I2S 1 Bit Clock †PAK27 AP_GPA30_VID1_0_I2SBCLK1 3.3V IO PU
I2S 1 Data In †PAL26 AP_GPB9_I2SDIN1 3.3V IO N
I2S 1 Data Out †PAL27 AP_GPB6_VID1_4_I2SDOUT1 3.3V IO PD
I2S 1 Left Right Clock †PAK25 AP_GPB0_VID1_1_I2SLRCK1 3.3V IO PU
I2S 1 Master Clock †PAK26 AP_GPA28_I2SMCLK1 3.3V IO N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
38
JTAG
The above signals can be reassigned by software to alternate functions; see Table 31 for details.
AliveGPIO
LVDS
†. Alternate GPIO function that can be selected by software but is not selected by hardware at power-on. See Table 30 for
details.
Table 18. JTAG
Function Ball Loc. Ball Name Voltage I/O PU/PD
JTAG NTRST PAE1 AP_NTRST 3.3V IO PU
JTAG TCK PAC1 AP_TCK 3.3V IO N
JTAG TDI PAD2 AP_TDI 3.3V IO N
JTAG TDO PAD1 AP_TDO 3.3V IO N
JTAG TMS PAC2 AP_TMS 3.3V IO N
Table 19. Key
Function Ball Loc. Ball Name Voltage I/O PU/PD
AliveGPIO 1 PAF2 AP_AGP1 3.3V IO N
AliveGPIO 2 PAE2 AP_AGP2_RTC_INT_N 3.3V IO N
Power Key part of AliveGPIO PAF1 AP_PWRKEY 3.3V IO N
Table 20. LVDS
Function Ball Loc. Ball Name Voltage I/O PU/PD
LVDS Transmit Channel 0 Negative PA22 AP_LVDS_TN0 1.8V O N
LVDS Transmit Channel 0 Positive PB22 AP_LVDS_TP0 1.8V O N
LVDS Transmit Channel 1 Negative PA23 AP_LVDS_TN1 1.8V O N
LVDS Transmit Channel 1 Positive PB23 AP_LVDS_TP1 1.8V O N
LVDS Transmit Channel 2 Negative PA24 AP_LVDS_TN2 1.8V O N
LVDS Transmit Channel 2 Positive PB24 AP_LVDS_TP2 1.8V O N
LVDS Transmit Channel 3 Negative PA26 AP_LVDS_TN3 1.8V O N
LVDS Transmit Channel 3 Positive PB26 AP_LVDS_TP3 1.8V O N
LVDS Transmit Channel 4 Negative PA27 AP_LVDS_TN4 1.8V O N
LVDS Transmit Channel 4 Positive PB27 AP_LVDS_TP4 1.8V O N
LVDS Transmit Negative Clock PA25 AP_LVDS_TNCLK 1.8V O N
LVDS Transmit Positive Clock PB25 AP_LVDS_TPCLK 1.8V O N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
39
PWM
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
SD/MMC
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
SPI
Table 21. PWM
Function Ball Loc. Ball Name Voltage I/O PU/PD
PWM 0 PAL7 AP_GPD1_PWM0 3.3V IO N
PWM 2 PAK7 AP_GPC14_PWM2 3.3V IO N
Table 22. SD/MMC
Function Ball Loc. Ball Name Voltage I/O PU/PD
SD Clock PAK30 AP_SD0_CLK 3.3V IO N
SD Command PAK28 AP_SD0_CMD 3.3V IO N
SD Data 0 PAL30 AP_SD0_D0 3.3V IO N
SD Data 1 PAK29 AP_SD0_D1 3.3V IO N
SD Data 2 PAL29 AP_SD0_D2 3.3V IO N
SD Data 3 PAL28 AP_SD0_D3 3.3V IO N
Table 23. SPI
Function Ball Loc. Ball Name Voltage I/O PU/PD
SPI 0 Clock *
*. Alternate GPIO function that can be reassigned by software but is not selected by hardware at power-on; see Table 30 for
details.
PAK6 AP_SPI0_CLK 3.3V IO N
SPI 0 Frame *PAL6 AP_SPI0_CS 3.3V IO N
SPI 0 Receive Data *PAK5 AP_SPI0_MISO 3.3V IO N
SPI 0 Transmit Data *PAL5 AP_SPI0_MOSI 3.3V IO N
SPI 2 Clock †
†. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
for details.
PAK4 AP_GPC9_SPI2_CLK 3.3V IO N
SPI 2 Frame PAL4 AP_GPC10_SPI2_CS 3.3V IO PU
SPI 2 Receive Data PAK3 AP_GPC11_SPI2_MISO 3.3V IO N
SPI 2 Transmit Data PAL3 AP_GPC12_SPI2_MOSI 3.3V IO N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
40
UART
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
USB HOST/USB OTG
802.15.4 for Zigbee
Table 24. UART
Function Ball Loc. Ball Name Voltage I/O PU/PD
UART 3 Receive Data PAL22 AP_UARTRX3 3.3V IO N
UART 3 Transmit Data PAK22 AP_UARTTX3 3.3V IO N
UART 4 Receive Data PAL23 AP_UARTRX4 3.3V IO N
UART 4 Transmit Data PAK23 AP_UARTTX4 3.3V IO N
UART 5 Receive Data *
*. Assigned as a general-purpose GPIO by default.
PAL24 AP_UARTRX5 3.3V IO N
UART 5 Transmit Data *PAK24 AP_UARTTX5 3.3V IO N
Table 25. USB Host/USB OTG
Function Ball Loc. Ball Name Voltage I/O PU/PD
USB Host Data Minus PA36 AP_USBH_DM 3.3V IO N
USB Host Data Plus PB36 AP_USBH_DP 3.3V IO N
USB OTG ID PB37 AP_OTG_ID – I N
USB OTG Data Minus PA35 AP_OTG_DM 3.3V IO N
USB OTG Data Plus PB35 AP_OTG_DP 3.3V IO N
Table 26. 802.15.4
Function Ball Loc. Ball Name Voltage I/O PU/PD
ZIGBEE Control PA4 PAK15 ZB_PA4 3.3V IO -
ZIGBEE Control PA5 *
*. For internal use only.
PAL15 ZB_PA5 3.3V IO N
ZIGBEE Control PC0 PAK14 ZB_PC0 3.3V IO -
ZIGBEE JTAG TCK PAK13 ZB_JTCK 3.3V IO -
ZIGBEE JTAG TDI PAL12 ZB_JTDI 3.3V - -
ZIGBEE JTAG TDO PAL13 ZB_JTDO 3.3V - -
ZIGBEE JTAG TMS PAK12 ZB_JTMS 3.3V IO -
ZIGBEE Reset PAL14 ZB_RSTn 3.3V IO N
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
41
Miscellaneous
Power
Table 27. Miscellaneous
Function Ball Loc. Ball Name Voltage I/O PU/PD
Battery Fuel *
*. An interrupt signal from an external fuel gauge used to detect an external battery connection.
PAK19 AP_nBATTF 3.3V I N
Reset †
†. External 100k pull-up resistor required.
PAG1 AP_NRESET 3.3V I N
VDD Power On PAL19 AP_VDDPWRON 3.3V O N
Table 28. Power
Function Ball Loc. Ball Name Voltage I/O PU/PD
LDO1: User available, 3.3V default, 30mA max *
*. The current consumption for user-available LDOs (LDO1, LDO2, LDO5, LDO8, and LDO9) should not exceed the maximum
limits specified in this table, as heavier usage may cause internal power sequencing issues, latch-up problems, or
overheating problems.
PM[42,43],
PN42
VCC_LDO1 0.9–3.5 O –
LDO2: User available, 3.3V default, 30mA max *PJ43,
PK[42,43]
VCC_LDO2 0.9–3.5 O –
LDO4: Do not use—voltage reference only †
†. LDO4, LDO7, and LDO10 should not be used to source power to any external components or devices. These LDOs can
only be used as a voltage reference.
PT1, PU1, PV1 VCC1P8_LDO4 1.8V O –
LDO5: User available, 3.3V default, 30mA max *PH[42,43],
PJ42
VCC_LDO5 0.6–3.5 O –
LDO7: Do not use—voltage reference only †PE[42,43],
PF42
VCC3P3_LDO7 3.3V O –
LDO8: User available, 3.3V default, 10mA max *PAD[42,43],
PAE43
VCC3P3_LDO8 0.6–3.5 O –
LDO9: User available, 1.8V default, 20mA max *PT42,
PU[42,43]
VCC_LDO9 0.6–3.5 O –
LDO10: Do not use—voltage reference only †PP42,
PR[42,43]
VCC1P2_LDO10 1.2V O –
RTC LDO PE42 RTCLDO_OUT ? O –
3.3V System Power PAK[17,18]
PAL[17,18]
VCC3P3_SYS‡
‡. VCC3P3_SYS pads are not recommended as a current source; do not use them to drive external ICs.
3.3V O –
USB2.0 OTG Bus Power PD[42,43] VCC5P0_OTGVBUS 5.0V I –
Main Power Supply for Module PV[42,43]
PW[42,43]
PY[42,43]
PAA[42,43]
PAB[42,43]
VIN 3.7–5.0V I –
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
42
GPIO ALTERNATE FUNCTIONS
A number of the GPIOs can be programmed to have alternate functions beyond their default behavior using the
GPIO API provided in the SW development environment. Table 29–Table 32 provide the alternate functions of all
the GPIOs that are available on the PADs of the ARTIK 710/710s Module that can be user programmed.
In the following tables, the hardware power-up default functions are shown emboldened. Software may
subsequently select an alternate function.
Table 29. GPIO Alternate Functions—North Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PA1 GMAC_TXEN GPIOE11 GMAC_TXEN – – GMAC
PA2 GMAC_TXD1 GPIOE8 GMAC_TXD1 – – GMAC
PA3 GMAC_TXD3 GPIOE10 GMAC_TXD3 – – GMAC
PA5 GMAC_GTXCLK GPIOE24 GMAC_GTXCLK – – GMAC
PA6 GMAC_RXDV GPIOE19 GMAC_RXDV SPITXD1 –GMAC
PA7 GMAC_RXD2 GPIOE16 GMAC_RXD2 – – GMAC
PA8 GMAC_RXD0 GPIOE14 GMAC_RXD0 SPICLK1 –GMAC
PA29 AP_HDMI_CEC SA3 GPIOC3 HDMI_CEC SDnRST0 HDMI
PA37 AP_GPA13 GPIOA13 DISD12 – – GPIO
PA39 AP_GPA14 GPIOA14 DISD13 – – GPIO
PA40 AP_GPA9 GPIOA9 DISD8 – – GPIO
PA41 AP_GPA15 GPIOA15 DISD14 – – GPIO
PA42 AP_GPA12 GPIOA12 DISD11 – – GPIO
PB2 GMAC_TXD0 GPIOE7 GMAC_TXD0 VIVSYNC1 –GMAC
PB3 GMAC_TXD2 GPIOE9 GMAC_TXD2 – – GMAC
PB4 GMAC_MDC GPIOE20 GMAC_MDC – – GMAC
PB5 GMAC_RXCLK GPIOE18 GMAC_RXCLK SPIRXD1 –GMAC
PB6 GMAC_RXD3 GPIOE17 GMAC_RXD3 – – GMAC
PB7 GMAC_RXD1 GPIOE15 GMAC_RXD1 SPIFRM1 –GMAC
PB8 GMAC_MDIO GPIOE21 GMAC_MDIO – – GMAC
PB39 AP_GPA4 GPIOA4 DISD3 – – GPIO
PB40 AP_GPA5 GPIOA5 DISD4 – – GPIO
PB41 AP_GPA16 GPIOA16 DISD15 – – GPIO
PB42 AP_GPA11 GPIOA11 DISD10 – – GPIO
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
43
Table 30. GPIO Alternate Functions—South Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PAK1 AP_I2S0_DOUT GPIOD9 I2SDOUT0 AC97_DOUT –I2S0
PAK2 AP_I2S0_BCLK GPIOD10 I2SBCLK0 AC97_BCLK –I2S0
PAK3 AP_GPC11_SPI2_MISO SA11 GPIOC11 SPIRXD2 USB2.0OTG_DrvV
BUS
SPI2
PAK4 AP_GPC9_SPI2_CLK SA9 GPIOC9 SPICLK2 –SPI2
PAK5 AP_SPI0_MISO GPIOD0 SPIRXD0 PWM3 –SPI0
PAK6 AP_SPI0_CLK GPIOC29 SPICLK0 – – SPI0
PAK7 AP_GPC14_PWM2 SA14 GPIOC14 PWM2 VICLK2 PWM
PAK8 AP_GPD6_SCL2 GPIOD6 SCL2 – – I2C
PAK9 AP_GPD4_SCL1 GPIOD4 SCL1 – – I2C
PAK10 AP_GPD2_SCL0 GPIOD2 SCL0 ISO7816 – I2C
PAK11 AP_GPA23_HDMI_I2C_SCL GPIOA23 DISD22 – – I2C
PAK20 AP_GPE2 GPIOE2 VID0_6 TSIDATA1_6 –GPIO
PAK21 AP_GPE1 GPIOE1 VID0_5 TSIDATA1_5 –GPIO
PAK22 AP_UART_TX3 GPIOD21 UARTTXD3 SDnCD1 –UART
PAK23 AP_UART_TX4 SD13 GPIOB29 TSIDATA0_5 UARTTXD4 UART
PAK24 AP_UART_TX5 SD15 GPIOB31 TSIDATA0_7 UARTTXD5 UART
PAK25 AP_GPB0_VID1_1_I2SLRCK1 GPIOB0 VID1_1 SDEX1 I2SLRCLK1 I2S1
PAK26 AP_GPA28_I2SMCLK1 GPIOA28 VICLK1 I2SMCLK2 I2SMCLK1 I2S1
PAK27 AP_GPA30_VID1_0_I2SBCLK1 GPIOA30 VID1_0 SDEX0 I2SBCLK1 I2S1
PAK28 AP_SD0_CMD GPIOA31 SDCMD0 – – SD/MMC
PAK29 AP_SD0_D1 GPIOB3 SDDAT0_1 – – SD/MMC
PAK30 AP_SD0_CLK GPIOA29 SDCLK0 – – SD/MMC
PAK32 AP_GPB13_SD0_BOOT SD0 GPIOB13 – – BOOTING
PAK33 AP_GPC17 SA17 GPIOC17 TSIDP0 VID2_0 GPIO
PAK34 AP_GPC0 SA0 GPIOC0 TSERR0 –GPIO
PAK35 AP_GPC26 RDNWR GPIOC26 – – GPIO
PAK36 AP_GPB8 GPIOB8 VID1_5 SDEX5 I2SDOUT2 GPIO
PAK37 AP_GPB14 RnB0 RnB1 GPIOB14 –GPIO
PAK38 AP_GPA20 GPIOA20 DISD19 – – GPIO
PAK39 AP_GPA18 GPIOA18 DISD17 – – GPIO
PAK40 AP_GPA21 GPIOA21 DISD20 – – GPIO
PAK41 AP_GPA10 GPIOA10 DISD9 – – GPIO
PAK42 AP_GPA6 GPIOA6 DISD5 – – GPIO
PAL1 AP_I2S0_DIN GPIOD11 I2SDIN0 AC97_DIN –I2S0
PAL2 AP_I2S0_MCLK GPIOD13 I2SMCLK0 AC97_nRST –I2S0
PAL3 AP_GPC12_SPI2_MOSI SA12 GPIOC12 SPITXD2 SDnRST2 SPI2
PAL4 AP_GPC10_SPI2_CS SA10 GPIOC10 SPIFRM2 –SPI2
PAL5 AP_SPI0_MOSI GPIOC31 SPITXD0 – – SPI0
PAL6 AP_SPI0_CS GPIOC30 SPIFRM0 – – SPI0
PAL7 AP_GPD1_PWM0 GPIOD1 PWM0 SA25 –PWM
PAL8 AP_GPD7_SDA2 GPIOD7 SDA2 – – I2C
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
44
PAL9 AP_GPD5_SDA1 GPIOD5 SDA1 – – I2C
PAL10 AP_GPD3_SDA0 GPIOD3 SDA0 ISO7816 – I2C
PAL11 AP_GPA24_HDMI_I2C_SDA GPIOA24 DISD23 – – I2C
PAL14 ZB_RSTN SA8 GPIOC8 UARTnDTR1 SDnINT1 ZIGBEE
PAL20 AP_GPE3 GPIOE3 VID0_7 TSIDATA1_7 –GPIO
PAL21 AP_GPE0 GPIOE0 VID0_4 TSIDATA1_4 –GPIO
PAL22 AP_UART_RX3 GPIOD17 UARTRXD3 – – UART
PAL23 AP_UART_RX4 SD12 GPIOB28 TSIDATA0_4 UARTRXD4 UART
PAL24 AP_UARTRX5 SD14 GPIOB30 TSIDATA0_6 UARTTXD5 UART
PAL25 AP_GPD31 GPIOD31 VID0_3 TSIDATA1_3 –GPIO
PAL26 AP_GPB9_I2SDIN1 GPIOB9 VID1_6 SDEX6 I2SDIN1 I2S1
PAL27 AP_GPB6_VID1_4_I2SDOUT1 GPIOB6 VID1_4 SDEX4 I2SDOUT1 I2S1
PAL28 AP_SD0_D3 GPIOB7 SDDAT0_3 – – SD/MMC
PAL29 AP_SD0_D2 GPIOB5 SDDAT0_2 – – SD/MMC
PAL30 AP_SD0_D0 GPIOB1 SDDAT0_0 – – SD/MMC
PAL31 AP_GPB4_VID1_3_BOOT GPIOB4 VID1_3 SDEX3 I2SLRCLK2 BOOTING
PAL32 AP_GPB15_SD1_BOOT SD1 GPIOB15 – – BOOTING
PAL33 AP_GPD8 GPIOD8 PPM – – GPIO
PAL34 AP_GPE30 NSOE GPIOE30 – – GPIO
PAL35 AP_GPC27 NSDQM GPIOC27 – – GPIO
PAL36 AP_GPB22 SD6 GPIOB22 – – GPIO
PAL37 AP_GPB16 NNFOE0 NNFOE1 GPIOB16 –GPIO
PAL38 AP_GPB23 SD7 GPIOB23 – – GPIO
PAL39 AP_GPA22 GPIOA22 DISD21 – – GPIO
PAL40 AP_GPA19 GPIOA19 DISD18 – – GPIO
PAL41 AP_GPA17 GPIOA17 DISD16 – – GPIO
PAL42 AP_GPA3 GPIOA3 DISD2 – – GPIO
Table 30. GPIO Alternate Functions—South Part (Continued)
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
45
Table 31. GPIO Alternate Functions—East Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PAC1 AP_TCK TCLK GPIOE28 – – JTAG
PAC2 AP_TMS TMS GPIOE26 – – JTAG
PAD1 AP_TDO TDO GPIOE29 – – JTAG
PAD2 AP_TDI TDI GPIOE27 – – JTAG
PAE1 AP_NTRST NTRST GPIOE25 – – JTAG
PAG2 AP_GPA25 GPIOA25 DISVSYNC – – GPIO
PAH1 AP_GPA26 GPIOA26 DISHSYNC – – GPIO
PAH2 AP_GPA0 GPIOA0 DISCLK – – GPIO
PAJ1 AP_I2S0_LRCLK GPIOD12 I2SLRCLK0 AC97_SYNC –I2S0
PAJ2 AP_GPA27 GPIOA27 DISDE – – GPIO
Table 32. GPIO Alternate Functions—West Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PAG42 AP_GPB11 CLE0 CLE1 GPIOB11 –GPIO
PAG43 AP_GPB18 NNFWE0 nNFWE1 GPIOB18 –GPIO
PAH42 AP_GPC25 NSWAIT GPIOC25 SPDIFTX –GPIO
PAH43 AP_GPE31 NSWE GPIOE31 – – GPIO
All functions on the West Part are dedicated; there are no applicable alternate functions.
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
46
BOOTING SELECTION
The ARTIK 710/710s Module supports a variety of booting scenarios as depicted in Table 33. The table describes the
values of the boot-configuration pad signals needed to initiate the booting scenarios. When nothing is done, the
default booting scenario is Configuration Option 1. In this case, the primary booting device is eMMC. If the primary
booting device fails, the secondary booting device (SD0) will attempt to boot the module. If the secondary booting
device fails, the tertiary booting device will boot the module.
Table 33. Boot Selection Configuration
Config.
Option
Boot Configuration Signals *
*. Internal pull-up and pull-down resistors automatically select Config Option 1 by default. External pull-up and pull-down
resistors are required to select configuration options 2 and 3. The recommended resistor value is 10k.
Primary
Booting
Device
Secondary
Booting
Device
Tertiary
Booting
Device
AP_GPB13_
SD0_BOOT
AP_GPB15_
SD1_BOOT
AP_GPB4_
VID1_3_BOOT
1High Low High eMMC SD0 USB OTG Device
2High Low Low SD0 USB OTG Device –
3Low High XUSB OTG Device – –
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
47
POWER SEQUENCE
Figure 4 below shows the ARTIK 710/710s Module Power-On Sequence (Timing).
Figure 4. ARTIK 710/710s Module Power-On Sequence (Timing) Diagram
1.004ms
1.008ms
1.010ms
1.012ms
7.8s
AP_PWRKEY
VCC1P2_LDO10
VCC1P8_LDO4
VCC3P3_LDO7
VCC3P3_SYS
VCC_LDO1,
VCC_LDO2,
VCC_LDO5,
VCC3P3_LDO8,
VCC_LDO9
AP_N_RESET
1.090ms
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
48
POWER STATES
Figure 5 shows the Power Management state diagram. In this diagram, the entry and WAKEUP conditions for each
power down mode are given.
Figure 5. ARTIK 710/710s Module Power Management State Diagram
The following Modes of operation can be distinguished:
• NORMAL Mode
– Everything is running, this is the normal mode of operation when applications are executed on the ARM cores
•IDLE Mode
– CPU clocks are turned off
– IDLE state can be initiated by CPU using Software API
– The following WAKEUP sources can be used to return to NORMAL Mode:
• GPIO Interrupt, RTC Interrupt, AliveGPIO Interrupt (see PAE2, PAF:[1,2]), External IRQ
•STOP Mode
– PLLs are turned off, DRAM goes into self-refresh
– STOP state can be initiated by CPU using Software API
– Certain WAKEUP sources or the ARTIK 710/710s Module AP_nBATTF signal can be used to transition to
NORMAL Mode
– The following WAKEUP sources can be used to return to NORMAL Mode:
• RTC Interrupt, AliveGPIO Interrupt
For more information on how to access discussed WAKEUP mechanisms like AliveGPIO interrupts, GPIO Interrupts,
RTC Interrupts and External Interrupts, refer to the Software User Guide.
Power-On
Reset
NORMAL
IDLE
CPU REQUEST
WAKEUP
STOP
CPU REQUEST
WAKEUP
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
49
ANTENNA CONNECTIONS
Two antennas are required to use the full set of radio communication links on the ARTIK 710/710s Module. One
supports the combination of Wi-Fi/Bluetooth, and the other is dedicated to Zigbee.
Figure 6. RF Connector for Bluetooth/Wi-Fi and Zigbee
The U.FL-R-SMT Hirose connector is used for both the Bluetooth/Wi-Fi and the Zigbee antenna connectors on the
ARTIK 710/710s Module.
The mechanical size of the connector (receptacle) is described in Figure 6. For suggestions on mating the plug and
more details on the connector, contact Hirose Electric Co., LTD.
AllDimensionsareinmm
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
50
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
The ratings given in this section are associated only with stress. It does not imply any functional operation of the
device. Exposure to the absolute-maximum rated conditions for long duration affects the reliability of the device.
Power Supply Operating Voltage Range
Table 34. Absolute Maximum Ratings
Parameter Symbol Condition Min Max Units
Main power supply VIN ––0.3 6.0 V
DC input/output voltage PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,3
1,32,33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,14,15,20,21,22,23,24,25,26,27,28,29
,30,31,32,33,34,35,36,37,38,39,40,41,42]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,42,43]
PAH:[1,2,42,43]
PAJ:[1,2]
3.3V Buffer –0.5 3.8
PAK:[43]
PAL:[43]
PAJ:[42,43]
3.3V Input/output buffer –0.5 3.8
PAK:[12,13,14,15]
PAL:[12,13,14,15]
3.3V Input/output buffer –0.3 3.6
PAF:[1] ––0.3 3.8
PAL:[19] ––0.3 6.3
DC Input output current PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,3
1,32,33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,14,15,20,21,22,23,24,25,26,27,28,29
,30,31,32,33,34,35,36,37,38,39,40,41,42]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,42,43]
PAH:[1,2,42,43]
PAJ:[1,2]
––20 20 mA
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
51
Power Supply Requirements
The power management of the ARTIK 710/710s Module as described in Figure 7 is controlled by the PMIC. This PMIC
contains four high-efficiency DC-DC converters and 10 LDO regulators (five of which are available for external use).
See Table 36 and Table 37 for details on voltage and current ranges and how they are used in the ARTIK 710/710s
Module.
Figure 7. ARTIK 710/710s Module Power Distribution
PMIC
NORTH BALL ARRAY
SOUTH BALL ARRAY
LDO 1
LDO 2
LDO 5
LDO 7
LDO 9
LDO 10
LDO 4
LDO 8
Wi-Fi/BT
MAIN SoC
VCC5P0_OTGVBUS
VIN
4GB FLASH ZIGBEE/
THREAD
PAL:[17,18],PAK:[17,18]
1GB DDR3
VCC1P5_DDR
DCDC4
DCDC1
ARM
DCDC2
SYSTEM
DCDC3
DCDC5
DDR3
PM:[42,43],PN42
PK:[42,43],PJ43
PH:[42,43],PJ42
PE:[42,43],PF42
PU:[42,43],PT42
PR:[42,43],PP42
PD:[42,43]
PV:[42,43]
PW:[42,43]
PY:[42,43]
PAA:[42,43]
PAB:[42,43]
PT1, PU1, PV1
PAD:[42,43],PAE[43]
LDO3
SYSTEM
LDO6
ALIVE
WEST
BALL
ARRAY
EAST
BALL
ARRAY
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
52
Table 36. DC-DC/LDOs Description
Buck/LDOs Powers Header Available Max
Current [mA] Default [V]
VCC3P3_SYS Internal use—voltage reference only PAL:[17,18],PAK:[17,18] –3.3
LDO1 User available PM:[42,43],PN42 30 3.3
LDO2 User available PK:[42,43],PJ43 30 3.3
LDO4 Internal use—voltage reference only PT1, PU1, PV1 –1.8
LDO5 User available PH:[42,43],PJ42 30 3.3
LDO7 Internal use—voltage reference only PE:[42,43],PF42 –3.3
LDO8 User available PAD:[42,43],PAE[43] 10 3.3
LDO9 User available PU:[42,43],PT42 20 1.8
LDO10 Internal use—voltage reference only PR:[42,43],PP42 –1.2
Use any available LDOs/DC-DC power sparingly. Any power use will increase the module heat
generation and may cause signal sequencing and latch-up problems.
Table 37. AC/DC Characteristics LDO1 and LDO2
Operating Conditions VIN=3.6V, COUT=4.7μF, TA=25°C unless otherwise specified
Symbol Parameter Condition Min Typ Max Unit
VIN Input Voltage Range –3.70 4.20 5.00 V
VOUT Output Voltage Range 50A < IOUT < IOUTMAX 0.90 –3.50 V
Voltage Setting Step Width – – 25 –mV
VACCU Output Voltage Accuracy VOUT = All Output Range, IOUT=1mA –1.50 –1.50 %
IOUTMAX Output Current available for
external use
– – – 30 mA
ILIM Limit Current –350 – – mA
VDIFF Dropout Voltage VOUT Setting=VIN, IOUT=IOUTMAX – – 0.20 V
VLINE Line Regulation 2.7 < VIN <5.5V, IOUT=1mA – – 0.20 %/V
VLOAD Load Regulation 100A < IOUT < IOUTMAX – – 30 mV
VTR Transient Response IOUT=100A <> IOUTMAX/2 –50 –mV
RR Ripple Rejection F=217 ~ 1kHz, IOUT=IOUTMAX/2, VDIFF > 0.6V –70 –dB
ONOISE Output Noise IOUT=IOUTMAX/2, BW=10Hz–100kHz –20 –Vrms
ISS Supply Current IOUT=0mA –100 –A
IOFF Standby Current IOUT=0mA – – 1 A
TR Rise Time VOUTx0.9, IOUT=0mA – – 500 s
TF Fall Time VOUTx0.1, IOUT=0mA – – 1 ms
COUT Output Capacitor – – 4.7 –F
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Table 38. AC/DC Characteristics LDO1 and LDO2 Eco Mode
Symbol Parameter Condition *
*. Operating conditions: VIN=3.6V, COUT=4.7F, TA=25°C unless otherwise specified.
Min Typ Max Unit
VIN Input Voltage Range –3.70 4.20 5.00 V
VOUT Output Voltage Range 50A < IOUT < IOUTMAX 0.90 –3.50 V
Voltage Setting Step Width – – 25 –mV
VACCU Output Voltage Accuracy VOUT = All Output Range, IOUT=1mA –1.50 –1.50 %
IOUTMAX Output Current available for
external use
Eco Mode – – 1.0 mA
ISS Supply Current – – 1 1.5 A
Table 39. AC/DC Characteristics LDO5
Symbol Parameter Condition *
*. Operating conditions: VIN=3.6V, COUT=1 F, TA=25°C unless otherwise specified.
Min Typ Max Unit
VIN Input Voltage Range –3.70 4.20 5.00 V
VOUT Output Voltage Range 50A < IOUT < IOUTMAX 0.60 –3.50 V
Voltage Setting Step Width – – 25 –mV
VACCU Output Voltage Accuracy VOUT = All Output Range, IOUT=1mA –1.50 –1.50 %
IOUTMAX Output Current available for
external use
– – – 30 mA
ILIM Limit Current –350 – – mA
VDIFF Dropout Voltage VOUT Setting=VIN, IOUT=IOUTMAX – – 0.30 V
VLINE Line Regulation 2.7 < VIN <5.5V, IOUT=1mA – – 0.20 %/V
VLOAD Load Regulation 100A < IOUT < IOUTMAX – – 30 mV
VTR Transient Response IOUT=100A <> IOUTMAX/2 –40 –mV
RR Ripple Rejection F=217 ~ 1kHz, IOUT=IOUTMAX/2, VDIFF > 0.6V –70 –dB
ONOISE Output Noise IOUT=IOUTMAX/2, BW=10Hz–100kHz –100 –V RMS
ISS Supply Current IOUT=0mA –20 –A
IOFF Standby Current IOUT=0mA – – 1 A
TR Rise Time VOUTx0.9, IOUT=0mA – – 500 s
TF Fall Time VOUTx0.1, IOUT=0mA – – 500 s
COUT Output Capacitor –1.0 –F
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
54
Table 40. AC/DC Characteristics LDO5 Eco Mode
Symbol Parameter Condition *
*. Operating conditions: VIN=3.6V, COUT=1 F, TA=25°C unless otherwise specified.
Min Typ Max Unit
VIN Input Voltage Range –3.70 4.20 5.00 V
VOUT Output Voltage Range 50A < IOUT < IOUTMAX 0.60 –3.50 V
Voltage Setting Step Width – – 25 –mV
VACCU Output Voltage Accuracy VOUT = All Output Range, IOUT=1mA –1.50 –1.50 %
IOUTMAX Output Current available for
external use
VIN > 2.7V – – 1.0 mA
1.7 ≤ VIN < 2.7V – – 0.5 mA
ISS Supply Current IOUT=0mA – 1 1.5 A
Table 41. AC/DC Characteristics LDO8 and LDO9
Symbol Parameter Condition *
*. Operating conditions: VIN=3.6V, COUT=1 F, TA=25°C unless otherwise specified.
Min Typ Max Unit
VIN Input Voltage Range –3.70 4.20 5.00 V
VOUT Output Voltage Range 50A < IOUT < IOUTMAX 0.60 –3.50 V
Voltage Setting Step Width – – 25 –mV
VACCU Output Voltage Accuracy VOUT = All Output Range, IOUT=1mA –1.50 –1.50 %
IOUTMAX Output Current available for
external use
– – – See †
†. 10mA available from LDO8; 20mA from LDO9.
mA
ILIM Limit Current –250 – – mA
VDIFF Dropout Voltage VOUT Setting=VIN, IOUT=IOUTMAX – – 0.40 V
VLINE Line Regulation 2.7 < VIN <5.5V, IOUT=1mA – – 0.20 %/V
VLOAD Load Regulation 100A < IOUT < IOUTMAX – – 20 mV
VTR Transient Response IOUT=100A <> IOUTMAX/2 –30 –mV
RR Ripple Rejection F=217 ~ 1kHz, IOUT=IOUTMAX/2, VDIFF > 0.6V –70 –dB
ONOISE Output Noise IOUT=IOUTMAX/2, BW=10Hz–100kHz, VOUT=1.2V –50 –V RMS
ISS Supply Current IOUT=0mA –20 –A
IOFF Standby Current IOUT=0mA – – 1 A
TR Rise Time VOUTx0.9, IOUT=0mA – – 500 s
TF Fall Time VOUTx0.1, IOUT=0mA – – 500 s
COUT Output Capacitor –1.0 –F
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
55
Power/Current Consumption
The values in this table are nominal. Measurements were taken on sample boards at room temperature using a 4.2V
system power supply.
Table 42. ARTIK 710/710s Module Power/Current Consumption
No. Category Scenario I (mA) Peak/Typ Condition
1Boot AP boot 950 Peak Peek current during boot-up
600 Typ Average current during boot-up
2Idle Idle 170 Typ Idle current
3Sleep Sleep 30 Typ Sleep current
4Storage Large file transfer eMMC to SD Card 210 Typ Copying 512MB test file from eMMC to SD
5SD Card to eMMC 240 Typ Copying 512MB test file from SD to eMMC
6
Connectivity
Bluetooth
Transmit 180 Typ Transfer test file using obexftp from the device
7Receive 180 Typ Receive test file using obexftp from the Android
phone
8Wi-Fi Transmit 420 Typ Transfer packet using iperf3 (802.11n)
9Receive 360 Typ Receive packet using iperf3 (802.11n)
10 802.15.4 for Zigbee Transmit 190 Typ Transfer packet using ember tool
11 Receive 190 Typ Receive packet using ember tool
12
Multimedia
Audio play 460 Typ Playback audio file using mplayer (pcm, 2ch,
48000Hz)
13 Recode audio 180 Typ Record audio using arecord (pcm, 2ch, 48000Hz)
14 Display picture 170 Typ Display picture (R/G/B, 720*1280)
15 Display video 210 Typ Playback movie clip (big_buck_bunny_720p_50mb)
16 Record video 350 Typ Record video using ffmpeg (1280*720, 3072k)
17 Live streaming from Camera 300 Typ Camera preview using ffmpeg (1280x960)
18 Live streaming over Wi-Fi 270 Typ Streaming video using ffserver/ffmpeg (640*480)
19 CPU Load
Running one core at 100% load 350
Typ Running while() loop
Running two cores at 100% load 450
Running three cores at 100% load 550
Running four cores at 100% load 650
Running five cores at 100% load 800
Running six cores at 100% load 950
Running seven cores at 100% load 1150
Running all cores at 100% load 1400
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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DC Electrical Characteristics
The DC characteristics for the GPIO pins of the ARTIK 710/710s Module are listed in Table 43. Use the parameters
from Table 43 to determine maximum DC loading and to determine maximum transition times for a given load.
Table 43. I/O DC Electrical Characteristics GPIO
GPIO Ball
Coordinates Parameter Condition *
*. Operating conditions: VDD = 3.3V, Vext = 3.0 to 3.6 V, Tj = –40 to 125 °C (Junction Temperature), 3.3V-tolerant
Min Typ Max Units
PA:[1,2,3,5,6,7,8,29,37,39,
40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,
42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,
20,21,22,23,24,25,26,27,28
,29,30,31,32,33,34,35,
36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,
20,21,22,23,24,25,26,27,
28,29,30,31,32,33,34,35,
36,37,38,39,40,41,42]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,42,43]
PAH:[1,2,42,43]
PAJ:[1,2]
VTOL Tolerant external voltage VDD Power Off & On – – 3.60 V
VIH High Level Input Voltage
CMOS Interface
–2.31 –3.60 V
VIL Low Level Input Voltage
CMOS Interface
VDD = 3.3V ± 10% –0.3 –0.70 V
VHysteresis Voltage –0.15 – V
IIH High Level Input Current
Input Buffer VIN = VDD VDD Power On –3 – 3 A
VDD Power Off & SNS =
0
–5 – 5
Input Buffer with pull-down VIN = VDD VDD = 3.3V ± 10% 15 40 80
IIL Low Level Input Current
Input Buffer VIN = VSS VDD Power On & Off –3 – 3 A
Input Buffer with pull-up VIN = VSS VDD = 3.3V ± 10% –15 –40 –110
VOH Output High Voltage IOH = -1.8mA, -3.6mA, -7.2mA, -10.8mA 2.64 –3.30 V
VOL Output Low Voltage IOH = -1.8mA, -3.6mA, -7.2mA, -10.8mA 0 – 0.66
IOZ Output Hi-Z current ––5 – 5 A
CIN Input capacitance Any input and bi-directional buffers – – 5 pF
COUT Output capacitance Any output buffer – – 5 pF
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Table 44. I/O DC Electrical Characteristics 802.15.4
Ball Coordinates Parameter Test Condition Min Typ Max Units
PAK:[12,13,14,15]
PAL:[12,13,14,15]
Low Schmitt switching threshold VSWIL
Schmitt input threshold
going from high to low
1.39 –1.65 V
High Schmitt switching threshold VSWIH
Schmitt input threshold
going from low to high
2.05 –2.64 V
Input current for logic 0 IIL – – –0.5 A
Input current for logic 1 IIH – – +0.5 A
Input pull-up resistor value RIPU 24 29 34 k
Input pull-down resistor value RIPD 24 29 34 k
Output voltage for logic 0 VOL
(IOL = 4mA for standard pads,
8mA for high current pads)
0 – 0.60 V
Output voltage for logic 1 VOH
(IOH = 4mA for standard pads,
8mA for high current pads)
2.71 –3.30 V
Output source current
(standard current pad)
IOHS – – 4 mA
Output sink current
(standard current pad)
IOLS – – 4 mA
Output source current high current
pad: BOT:[66]
IOHH – – 8 mA
Output sink current high current
pad: BOT:[66]
IOLH – – 8 mA
Total output current (for I/O Pads) IOH + IOL – – 40 mA
Table 45. I/O DC Electrical Characteristics PMIC
Ball
Coordinates Symbol Parameter Condition Min Typ Max Units
PAF:[1] VIL Low-level input voltage – – – 0.40 V
VIH High-level input voltage 2.31 –3.30 V
PAL:[19] VIL Low-level input voltage – – – 0.40 V
VIH High-level input voltage 1.40 –3.30 V
Table 46. I/O DC Electrical Characteristics PCM Signals
Ball Coordinates Symbol Parameter Condition Min Typ Max Unit
PAK:[43]
PAL:[43]
PAJ:[42,43]
VIH High-level input voltage –2.0 – – V
VIL Low-level input voltage – – – 0.8
VOH Output High voltage at 2mA 2.9 – – V
VOL Output Low voltage at 2mA – – 0.4
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Table 47. GPIO Pull-up Resistor Current
Ball Coordinates Pull Up Min Typ Max Unit
PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,31,32
,33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,31,32,
33,34,35,36,37,38,39,40,41,42]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,42,43]
PAH:[1,2,42,43]
PAJ:[1,2]
Enabled (where every GPIO has a 100k
internal pull-up resistor).
10 33 72 A
Disabled (default) – – 0.1 A
Table 48. Power-on Reset Timing Specifications
Symbol Description Min. Typ. Max. Unit
tRESW Reset assert time after clock stabilization 40 – – ns
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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AC Electrical Characteristics
AC characteristics covered in this section are preliminary and are likely to change.
SD/MMC AC Electrical Characteristics
Figure 8. High-Speed SD/MMC Interface Timing
The following table assumes VDDINT = 1.0V ± 5%, TJ = –25 to 85°C, VDDmmc = 3.3V ± 5 %, 2.5V ± 5%, 1.8V ± 5%
Table 49. High-Speed SD/MMC Interface Transmit/Receive Timing Constants
Symbol Parameter Min Typ Max Unit
tHSDCD SD command output delay time – – 4.0 ns
tHSDCS SD command input setup time 4.0 – –
tHSDCH SD command input hold time 0 – –
tHSDDD SD data output delay time – – 4.0
tHSDDS SD data input setup time 4.0 – –
tHSDDH SD data input hold time 0 – –
HS_SDCMD
(in)
HS_SDCLK
HS_SDDATA[7:0]
(in)
t
HSDCS
t
HSDCH
t
HSDDS
t
HSDDH
t
HSDCD
t
HSDDD
HS_SDDATA[7:0]
(out)
HS_SDCMD
(out)
AP_SD0_CLK
AP_SD0_CMD (out)
AP_SD0_CMD (in)
AP_SD0_D[3:0] (out)
AP_SD0_D[3:0] (in)
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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SPI AC Electrical Characteristics
Figure 9. SPI Interface Timing (CPHA = 0, CPOL = 1 (Format A))
XspiMOSI
(MO)
SPICLK
XspiMISO
(SO)
t
SPIMOD
XspiMISO
(MI)
XspiMOSI
(SI)
XspiCS
t
SPIMIS
t
SPIMIH
t
SPISOD
t
SPISIS
t
SPICSSD
t
SPICSSS
t
SPISIH
AP_SPIO_CLK
AP_SPI0_MOSI (MO)
AP_SPI0_MOSI (SO)
AP_SPI0_MISO (MI)
AP_SPI0_MISO (SO)
AP_GPC10_SPI2_CS
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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The following table assumes VDDINT = 1.0 V ± 5%, TJ = –25 to 85 °C, VDDext = 1.8 V ± 10%, load = 15pF.
Table 50. SPI Interface Transmit/ Receive Timing Constants with 15pF Load
Parameter Symbol Min. Typ. Max. Units
Ch 0 SPI MOSI Master Output Delay time tSPIMOD – – 5 ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 12 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 7 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 2 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –3 – –
SPI MISO Master Input Hold time tSPIMIH 5 – –
SPI MOSI Slave Input Setup time tSPISIS 2 – – ns
SPI MOSI Slave Input Hold time tSPISIH 5 – –
SPI MISO Slave Output Delay time tSPISOD – – 17
SPI nSS Master Output Delay time tSPICSSD 7 – –
SPI nSS Slave Input Setup time tSPICSSS 5 – –
Ch 1 SPI MOSI Master Output Delay time tSPIMOD – – 4
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 13 – – ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 8 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 3 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –2 – –
SPI MISO Master Input Hold time tSPIMIH 5 – –
SPI MOSI Slave Input Setup time tSPISIS 3 – –
SPI MOSI Slave Input Hold time tSPISIH 5 – – ns
SPI MISO Slave Output Delay time tSPISOD – – 18
SPI nSS Master Output Delay time tSPICSSD 7 – –
SPI nSS Slave Input Setup time tSPICSSS 5 – –
SPICLKout = 50 MHz
•t
SPIMIS,CH0 = 12 – (cycle period/4) × FB_CLK_SEL
•t
SPIMIS,CH1 = 13 – (cycle period/4) × FB_CLK_SEL
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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The following table assumes VDDINT = 1.0V ± 5%, TJ = –25 to 85°C, VDDext = 3.3V ± 10%, load = 30pF.
Table 51. SPI Interface Transmit/Receive Timing Constants with 30pF Load
Parameter Symbol Min. Typ. Max. Unit
Ch 0 SPI MOSI Master Output Delay time tSPIMOD – – 6 ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 13 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 8 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 3 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –2 – –
SPI MISO Master Input Hold time tSPIMIH 5 – –
SPI MOSI Slave Input Setup time tSPISIS 4 – – ns
SPI MOSI Slave Input Hold time tSPISIH 5 – –
SPI MISO Slave Output Delay time tSPISOD – – 18
SPI nSS Master Output Delay time tSPICSSD 8 – –
SPI nSS Slave Input Setup time tSPICSSS 6 – –
Ch 1 SPI MOSI Master Output Delay time tSPIMOD – – 5
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 14 – – ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 9 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 4 – –
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –1 – –
SPI MISO Master Input Hold time tSPIMIH 5 – –
SPI MOSI Slave Input Setup time tSPISIS 4 – –
SPI MOSI Slave Input Hold time tSPISIH 5 – – ns
SPI MISO Slave Output Delay time tSPISOD – – 19
SPI nSS Master Output Delay time tSPICSSD 8 – –
SPI nSS Slave Input Setup time tSPICSSS 6 – –
SPICLKout = 50 MHz
•t
SPIMIS,CH0 = 12 – (cycle period/4) × FB_CLK_SEL
•t
SPIMIS,CH1 = 13 – (cycle period/4) × FB_CLK_SEL
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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I2C AC Electrical Characteristics
Figure 10. I2C Interface Timing
The following table assumes VDDINT, VDDarm = 1.1V ± 5%, TJ = –25 to 85°C, VDDext = 3.3 V ± 10%
Table 52. I2C BUS Controller Module Signal Timing
Parameter Symbol Min. Typ. Max. Unit
SCL clock frequency FSCL – – std. 100
fast 400
kHz
SCL high level pulse width TSCLHIGH std. 4.0
fast 0.6
– – s
SCL low level pulse width TSCLLOW std. 4.7
fast 1.3
– –
Bus free time between STOP and START TBUF std 4.7
fast 1.3
– –
START hold time TSTARTS std. 4.0
fast 0.6
– –
SDA hold time TSDAH std. 0
fast 0
–std.
fast 0.9
SDA setup time TSDAS std. 250
fast 100
– – ns
STOP setup time TSTOPH std. 4.0
fast 0.6
– – s
Modes: std. refers to Standard Mode and fast refers to Fast Mode.
•I
2C data hold time (tSDAH) is minimum 0ns for standard/fast bus mode as defined in I2C
specification v2.1. Check whether the data hold time of your I2C device is 0ns or not.
•The I
2C controller supports I2C bus device only (standard/fast bus mode), and does not support a
C-bus device.
IICSCL
T
STOPH
IICSDA
T
BUF
T
STARTS
T
SDAS
T
SCLHIGH
T
SCLLOW
F
SCL
T
SDAH
AP_GPD2_SCLn
AP_GPD2_SDAn
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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RF Electrical Characteristics
All performance numbers related to 802.11 for Wi-Fi, Bluetooth, and 802.15.4 for Zigbee mentioned in this section are
preliminary and likely to change once module characterization has taken place.
Wi-Fi, 2.4GHz Receiver RF Specifications
Table 53. Wi-Fi, 2.4GHz Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –2400 –2500 MHz
Minimum receiver sensitivity in 802.11b mode (2.4GHz)
1Mbps PER < 8%,
Packet size = 1024 bytes
– – –92 dBm
2Mbps – – –80 dBm
5.5Mbps – – –76 dBm
11Mbps – – –83 dBm
Minimum receiver sensitivity in 802.11g mode (2.4GHz)
6Mbps PER < 10%,
Packet size= 1024 bytes
– – –82 dBm
9Mbps – – –81 dBm
12Mbps – – –79 dBm
18Mbps – – –77 dBm
24Mbps – – –74 dBm
36Mbps – – –70 dBm
48Mbps – – –66 dBm
54Mbps – – –65 dBm
Minimum receiver sensitivity in 802.11n mode (2.4GHz)
MCS 0 PER<10%,
Packet size= 4096 bytes,
GF, 800ns GI, Non-STBC
– – –82 dBm
MCS 1 – – –79 dBm
MCS 2 – – –77 dBm
MCS 3 – – –74 dBm
MCS 4 – – –70 dBm
MCS 5 – – –68 dBm
MCS 6 – – –65 dBm
MCS 7 – – –64 dBm
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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Wi-Fi, 2.4GHz Transmitter RF Specifications
Table 54. Wi-Fi, 2.4GHz Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Linear output power
Maximum output power in 802.11b mode As specified in
IEEE802.11
–16 –dBm
Maximum output power in 802.11g mode –12.5 –dBm
Maximum output power in 802.11n mode –13 –dBm
Transmit spectrum mask
Margin to 802.11b spectrum mask Maximum
output power
0 – – dBr
Margin to 802.11g spectrum mask 0 – – dBr
Margin to 802.11n spectrum mask 0 – – dBr
Transmit modulation accuracy in 802.11b mode
1Mbps As specified in
IEEE 802.11b
– – 35 %
2Mbps – – 35 %
5.5Mbps – – 35 %
11Mbps – – 35 %
Transmit modulation accuracy in 802.11g mode
6Mbps As specified in
IEEE 802.11g
– – –5 dB
9Mbps – – –8 dB
12Mbps – – –10 dB
18Mbps – – –13 dB
24Mbps – – –16 dB
36Mbps – – –19 dB
48Mbps – – –22 dB
54Mbps – – –25 dB
Transmit modulation accuracy in 802.11n mode
MCS7 As specified in
IEEE 802.11n
– – –27 dB
Transmit power-on and power-down ramp time in 802.11b mode
Transmit power-on ramp time from 10% to 90% output
power
– – – 2 s
Transmit power-down ramp time from 90% to 10%
output power
– – – 2 s
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
66
Wi-Fi, 5GHz Receiver RF Specifications
Table 55. Wi-Fi, 5GHZ Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –4900 –5845 MHz
Minimum receiver sensitivity in 802.11a mode
6Mbps PER < 10% – – –82 dBm
12Mbps – – –79 dBm
24Mbps – – –74 dBm
36Mbps – – –70 dBm
48Mbps – – –66 dBm
54Mbps – – –65 dBm
Minimum receiver sensitivity in 802.11n (HT-20) mode
MCS 0 – – – –82 dBm
MCS 1 – – –79 dBm
MCS 2 – – –77 dBm
MCS 3 – – –74 dBm
MCS 4 – – –70 dBm
MCS 5 – – –66 dBm
MCS 6 – – –65 dBm
MCS 7 – – –64 dBm
Minimum receiver sensitivity in 802.11n (HT-40) mode
MCS 0 PER<10% – – –79 dBm
MCS 1 – – –76 dBm
MCS 2 – – –74 dBm
MCS 3 – – –71 dBm
MCS 4 – – –67 dBm
MCS 5 – – –63 dBm
MCS 6 – – –62 dBm
MCS 7 – – –61 dBm
Minimum receiver sensitivity in 802.11ac (VHT-20) mode
MCS 0 PER<10% – – –82 dBm
MCS 1 – – –79 dBm
MCS 2 – – –77 dBm
MCS 3 – – –74 dBm
MCS 4 – – –70 dBm
MCS 5 – – –66 dBm
MCS 6 – – –65 dBm
MCS 7 – – –64 dBm
MCS 8 – – –59 dBm
Minimum receiver sensitivity in 802.11ac (VHT-40) mode
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
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MCS 0 PER<10% – – –79 dBm
MCS 1 – – –76 dBm
MCS 2 – – –74 dBm
MCS 3 – – –71 dBm
MCS 4 – – –67 dBm
MCS 5 – – –63 dBm
MCS 6 – – –62 dBm
MCS 7 – – –61 dBm
MCS 8 – – –56 dBm
MCS 9 – – –54 dBm
Minimum receiver sensitivity in 802.11ac (VHT-80) mode
MCS 0 PER<10% – – –76 dBm
MCS 1 – – –73 dBm
MCS 2 – – –71 dBm
MCS 3 – – –68 dBm
MCS 4 – – –64 dBm
MCS 5 – – –60 dBm
MCS 6 – – –59 dBm
MCS 7 – – –58 dBm
MCS 8 – – –53 dBm
MCS 9 – – –51 dBm
Maximum input level
Maximum input signal level in 802.11a mode PER < 10% –30 – – dBm
Maximum input signal level in 802.11n mode PER < 10% –30 – – dBm
Maximum input signal level in 802.11ac mode PER < 10% –30 – – dBm
Table 55. Wi-Fi, 5GHZ Receiver RF Specifications (Continued)
Parameter Conditions Min Typ Max Unit
Frequency Range – 4900 – 5845 MHz
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
68
Wi-Fi, 5GHz Transmitter RF Specifications
Table 56. Wi-Fi, 5GHz Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –4900 5845 MHz
Linear output power
Maximum output power in 802.11a mode 54M, UNII-2e –12.5 –dBm
Maximum output power in 802.11n mode HT20, MCS7, UNII-2e –12 –dBm
HT40, MCS7, UNII-2e –11 –dBm
Maximum output power in 802.11ac mode VHT20, MCS8, UNII-2e –12 –dBm
VHT40, MCS9, UNII-2e –11 –dBm
VHT80, MCS9, UNII-2e – 8 – dBm
Transmit spectrum mask
Margin to 802.11a spectrum mask Maximum output power 0 – – dBr
Margin to 802.11n spectrum mask 0 – – dBr
Margin to 802.11ac spectrum mask 0 – – dBr
Transmit constellation error in 802.11a mode
54Mbps As specified in IEEE
802.11n
– – –25 dB
Transmit constellation error in 802.11n (HT-20, HT-40) mode
MCS 7 As specified in IEEE
802.11n
– – –27 dB
Transmit constellation error in 802.11ac (VHT-20) mode
MCS 8 As specified in IEEE
802.11n
– – –30 dB
Transmit constellation error in 802.11ac (VHT-40, VHT-80) mode
MCS 9 As specified in IEEE
802.11n
– – –32 dB
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
69
Bluetooth RF Specifications
Table 57. Bluetooth Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –2402 –2480 MHz
Sensitivity (BER) GPSK, BER ≤0.1% – – –80 dBm
/4-DQPSK, BER ≤ 0.1% – – –80 dBm
BER ≤ 0.1%, 8DPSK – – –80 dBm
Maximum Input Level GPSK, BER ≤0.1% –20 – – dBm
/4-DQPSK, BER ≤ 0.1% –20 – – dBm
BER ≤ 0.1%, 8 DPSK –20 – – dBm
BDR
Intermodulation Performance – – – 0.1 %
Rx C/I Performance 1DH1 – – 0.1 %
1DH3 – – 0.1 %
1DH5 – – 0.1 %
EDR
Rx C/I Performance 2DH1 – – 0.1 %
2DH3 – – 0.1 %
2DH5 – – 0.1 %
3DH1 – – 0.1 %
3DH3 – – 0.1 %
3DH5 – – 0.1 %
Rx BER Floor Performance BER ≤ 0.001% – – –70 dBm
Table 58. Bluetooth Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –2402 –2480 MHz
Output Power (Average)
BDR (QPSK) 2440 MHz – 7 – dBm
EDR (/4-DQPSK) 2440 MHz – 3 – dBm
EDR (8DPSK) 2440 MHz – 3 – dBm
Table 59. Bluetooth Low Energy (BLE) RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range –2402 –2480 MHz
Rx Receiver Sensitivity PER At –70dBm – – 30.8 %
Rx C/I and Receiver Selectivity Performance PER – – – 30.8 %
Tx Power – – 7 – dBm
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
70
802.15.4 Receiver RF Specifications
The typical numbers indicated in Table 60 and Table 61 are one standard deviation below the mean, measured at
room temperature 25°C. The Min and Max numbers were measured over process corners at room temperature.
Table 60. 802.15.4 Receiver RF Specifications
Parameter Test Condition Min Typ Max Unit
Operating Frequency Range –2400 –2483.5 MHz
Receiver Sensitivity PER At –95dBm – – 1 %
Receiver Sensitivity Search At PER 1% – – –95 dBm
Receiver Interference Rejection PER At –2 Channel, Alternate Channel, 30dB – – 1 %
Receiver Interference Rejection PER At –1 Channel, Adjacent Channel, 0dB – – 1 %
Receiver Interference Rejection PER At +1 Channel, Adjacent Channel, 0dB – – 1 %
Receiver Interference Rejection PER At +2 Channel, Alternate Channel, 30dB – – 1 %
Error Vector Magnitude - RMS (EVM) At Target Power – – 30 %
Error Vector Magnitude - Offset (EVM) At Target Power – – 10 %
Receiver Maximum Input Level of Desired Signal At –20dBm Input – – 1 %
Table 61. 802.15.4 Transmitter RF Specifications
Parameter Test Condition Min Typ Max Unit
Maximum output power At highest normal mode power setting 6.5 –dBm
Minimum output power At lowest power setting ––55 –dBm
Error vector magnitude (Offset-EVM) As defined by IEEE 802.15.4-2003, which sets a
35% maximum
– – 10 %
Carrier frequency error ––40 –+40 ppm
PSD mask relative 3.5 MHz away (Normal) –20 – – dBm
PSD mask absolute 100 KHz BW –30 – – dBm
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
71
THERMAL AND ENVIRONMENTAL SPECIFICATIONS
Recommended Operating Conditions
The recommended operation of the ARTIK 710/710s Module is based on the operating conditions listed in Table 62.
Temperature Thresholds for Operating Frequency Throttling
The ARTIK 710/710s Module automatically performs frequency throttling under software control at the thresholds
indicated in the following table:
ESD Ratings
Table 62. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Operating Temperature TC0 – 70 °C
Storage Temperature TA––40 85 °C
Table 63. Application Processor Die Temperature vs Maximum Operating Frequency
AP Temperature *
*. AP Temperature is measured on the Application Processor Die. This temperature is highly dependent on your thermal
design and application load. It will be substantially above the case temperature particularly in cases of high processor
load.
Maximum Operating Frequency
<80°C 1.4 GHz
80° to 85°C 1.3 GHz
85° to 100°C 1.0 GHz
100° to 115°C 400 MHz
115°C Shutdown
Table 64. ESD Ratings
Symbol Min. Max. Units
ESD stress voltage Human Body Model – 1 kV
ESD stress voltage Charged Device Model –TBD V
Table 65. Shock and Vibration Ratings
Shock and Vibration Range
Shock Packing Drop 75cm (10~19.9Kg) / 91cm (<10Kg)
Vibration Packing Vibration 0.85Grms/2~200Hz (TTL Grms)
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
72
MECHANICAL SPECIFICATIONS
The ARTIK 710/710s Module supports PAD Balls and two RF connectors on a 49mm × 36mm footprint. Refer to
section Antenna Connections for RF connector details. Figure 11 shows the ARTIK 710/710s Module Component
Layout Top View. Figure 12 and Figure 13 show the ARTIK 710/710s Module Mechanical Dimensions Top View and
Bottom View.
Figure 11. ARTIK 710/710s Module Component Layout Top View
802.15.4 (for
Zigbee)
Antenna
Bluetooth and
802.11
(for Wi-Fi)
Antenna
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
73
Figure 12. ARTIK 710/710s Module Mechanical Dimensions Top View
Figure 13. ARTIK 710/710s Module Mechanical Dimensions Bottom View
1.13 (All Ball Pitches are identical)
0.65
0.77
1.05
15.5
10.25
11.6525.7
All Dimensions in [mm]
Bottom View
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
74
The inner pin locations on the pad, positioned in an L-shaped form, as depicted in Figure 14, are described in
Table 66.
For exact dimensions on ball locations, see Figure 13. The locations given in Table 66 are the absolute coordinates
measured from the edge of the ARTIK 710/710s Module to the center of each ball. All inner pads are ground (GND)
balls.
The inner pads are on a different grid from the outer pads as indicated with the dashed blue lines in
Figure 14.
Table 66. L-Shaped Ball Locations
Ball Name X-Location (mm) Y-Location (mm)
TP282 11.65 25.75
TP283 12.78 25.75
TP284 13.91 25.75
TP285 35.09 25.75
TP286 36.22 25.75
TP287 37.35 25.75
TP288 37.35 24.62
TP289 37.35 23.49
TP290 37.35 12.51
TP291 37.35 11.38
TP292 37.35 10.25
TP293 36.22 10.25
TP294 35.09 10.25
TP295 13.91 10.25
TP296 12.78 10.25
TP297 11.65 10.25
TP298 11.65 11.38
TP299 11.65 12.51
TP300 11.65 23.49
TP301 11.65 24.62
PC
1
PAJ
1
PAJ
2
PAH
1
PAH
2
PAG
1
PAG
2
PAF
1
PAF
2
PAE
1
PAE
2
PAD
1
PAD
2
PAC
1
PAC
2
PAB
1
PAB
2
PAA
1
PAA
2
PY
1
PY
2
PW
1
PW
2
PV
1
PU
1
PT
1
PT
2
PR
1
PR
2
PP
1
PN
1
PN
2
PM
1
PM
2
PL
1
PL
2
PK
1
PK
2
PH
1
PG
1
PF
1
PF
2
PE
1
PE
2
PD
1
PJ
1
PJ
2
PAL
1
PAL
2
PAL
3
PAL
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PAL
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PAL
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PAL
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PAK
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PB
1
PB
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PB
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PB
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PB
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PB
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PB
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PB
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PB
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PB
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PB
41
PA
1
PA
2
PA
3
PA
5
PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
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PA
4
PB
42
PA
42
PAL
43
PAK
43
PAL
42
PAK
42
PC
42
PAH
42
PAG
42
PAF
42
PAE
42
PAD
42
PAC
42
PAB
42
PAA
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PY
42
PW
42
PV
42
PU
42
PT
42
PR
42
PP
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PN
42
PM
42
PL
42
PK
42
PJ
42
PH
42
PG
42
PF
42
PE
42
PD
42
PAJ
42
PC
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PAH
43
PAG
43
PAF
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PAE
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PAD
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PAB
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PAA
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PY
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PW
43
PV
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PU
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PT
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43
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43
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TP
297
TP
296
TP
295
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294
TP
293
TP
292
TP
282
TP
283
TP
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TP
300
TP
285
TP
286
TP
287
TP
288
TP
289
TP
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TP
291
TP
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TP
298
TP282 TP283 TP284
TP301
TP300
TP287
TP288
TP289
TP286
TP285
TP299
TP298
TP297 TP296 TP295
TP290
TP291
TP292TP293TP294
Y
X
Originatbottom‐rightcornerofmodule
Figure 14. L-Shaped Pad Pins (Top View)
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
75
CERTIFICATIONS AND COMPLIANCE
Bluetooth
The ARTIK 710/710s Module is recognized as a qualified design as set out by the Bluetooth SIG.
Declaration ID: D032725
Qualified Design ID: 88390
CE
The ARTIK 710/710s Module is in compliance with the essential requirements and other relevant provisions of Article
3 of the Radio Equipment Directive 2014/53/EU. Compliance with the following standards was confirmed:
• Article 3.1a (Health and Safety) EN 60950-1:2006 + A2:2013
EN62311:2008
EN 62479: 2010
• Article 3.1.b (EMC) EN 301 489-1 V2.1.1, draft EN 301 489-3 V2.1.0
Draft EN 301 489-3 V2.1.1
EN 301 489-17 V3.1.1
• Article 3.2 (Radio spectrum use) EN 300 328 V2.1.1
EN 301 893 V1.8.1
EN 300 440 V2.1.1
• BABT file number: BABT-RED000471 i01
For a formal notified body statement of opinion contact your sales representative.
FCC
The ARTIK 710/710s Module complies with the following two sections (15C and 15E) of Part 15 of the FCC rules
namely:
• Spread spectrum transmitter (SST) compliance (15C):
– 2402–2480MHz frequency range, output power 0.0049W
• Digital transmission system (DTS) compliance (15C):
– 2402–2480MHz frequency range, output power 0.005W
– 2405–2475MHz frequency range, output power 0.006W
– 2412–2462MHz frequency range, output power 0.26W
• Unlicensed national information infrastructure TX compliance (15E) in the:
– 5180-5240MHz frequency range, output power 0.034W
– 5260-5320MHz frequency range, output power 0.029W
– 5500-5720MHz frequency range, output power 0.025W
– 5745-5825MHz frequency range, output power 0.021W
FCC Identifier: A3LSIP007AFS00
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
76
IC
The ARTIK 710/710s Module complies with the IC license–exempt RSS standard.
Radio certification number: 649E-SIP007AFS00
KCC
The ARTIK 710/710s Module complies with the standards set by the Korean communications commission (KCC).
ARTIK 710/710s Module KCC Identifier: MSIP-CRM-SEC-SIP007AFS00
Development kit KCC identifier: MSIP-REM-SEC-SIPKITNXE00
SRRC
Both the ARTIK 710/710s Module and the ARTIK 710/710s Development Kit comply with the standards set by the
People’s Republic of China.
CMIIT ID: 2017AJ2592 (M)(ARTIK 710/710s Module)
CMIIT ID: 2017AJ2658 (ARTIK 710/710s Development Kit)
HDMI Compliance
The ARTIK 710/710s Module passed the self-test, HDMI CTS version 1.4b on 6/30/2016 provided by HDMI Licensing
LLC.
RoHS Compliance
The ARTIK 710/710s Module complies with the hazardous substance limits of directive 2011/65/EU and the conformity
assessment procedure as outlined in Decision 768/2008/EC, Annex II, Module A, Point 2, as well as RoHS harmonized
standard EN 50581.
Report reference number: F690101/LF-CTSAYGU16-04652
FCC Regulatory Disclosures
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
77
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cm between the transmitter’s radiating
structure(s) and the body of the user or nearby persons.
This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance
with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must
comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely
responsible for certification and testing and labeling of its own products. In addition to any independently required
labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the
enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the
wording “Contains Transmitter Module FCCID: A3LSIP007AFS00”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines
for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or
modifications to this module not expressly approved by the manufacturer will void the warranty and the users’
authority to operate the equipment.
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
78
Industry Canada Regulatory Disclosures
Industry Canada Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opération est soumise aux
deux conditions suivantes:(1) cet appareil ne peut causer d'interférences, et (2) cet appareil doit accepter toute
interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil.
Industry Canada Radiation Exposure Statement and Limitations on Use
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
This equipment should be installed and must not be co-located or operating in conjunction with any other antenna
or transmitter.
This equipment is restricted to indoor use in the 5.15-5.25 GHz range. This equipment is not able to be operated at
5600-5650. In the United States and Canada, only Channel 1~11 can be operated and these channel assignments
deal only with the 2.4 GHz range.
The end product must be labeled to display the Industry Canada certification number of the module.
“Contains transmitter module IC: 649E-SIP007AFS00”
Le dispositif d'accueil doivent être étiquetés pour afficher le numéro de certification d'Industrie Canada du module.
“Contient module émetteur IC : 649E-SIP007AFS00”
EU Regulatory Disclosures
Statement*
The following statement must be supplied with each product but can be printed in the user manual, the packaging, or
provided as a separated leaflet.
Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other
relevant provisions of Article 3 of the Radio Equipment Directive 2014/53/EU and RoHS directive 2011/65/EU.
“The declaration of conformity may be consulted at [www.artik.io/certification]”
The 5150 - 5350 MHz and 5470 - 5725 MHz bands are for indoor use only.
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
79
Wi-Fi Interoperability
The ARTIK 710/710s Module is Wi-Fi Certified® by the Wi-Fi Alliance™. Wi-Fi Certifications provides an overview of
the certifications:
Certification IDs: WFA66780, WFA66781
Zigbee
The ARTIK 710/710s Module is ZigBee® certified. For more details on the boundaries of this certification contact your
sales representative.
Certification date: 07/25/2016
Certification ID number: ZIG16061ZHA25785-24
Table 67. Wi-Fi Certifications
Classification Program
Connectivity Wi-Fi Certified a, b, g, n, ac
WPA™ - Personal
WPA2™ - Personal
Optimization WMM®
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
80
ORDERING INFORMATION
For volume ordering of evaluation kits, contact a sales representative in your area or email sales@artik.io.
Item Order Number Description
ARTIK 710 Module SIP-007AFS001 –
ARTIK 710s Module SIP-007AFS002 –
ARTIK 710 Development Kit SIP-KITNXE001 ARTIK 710 Development Module
ARTIK 710/710s Interposer Board
Platform Board
Interface Board
Two Antennas (one 802.15.4, one BT/Wi-Fi)
ARTIK 710s Development Kit SIP-KITNXE002 ARTIK 710s Module Development Module
ARTIK 710/710s Interposer Board
Platform Board
Interface Board
Two Antennas (one 802.15.4, one BT/Wi-Fi)
Samsung Semiconductor, Inc. ARTIK 710/710s Module Datasheet
LEGAL INFORMATION
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT
AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER "SAMSUNG PRODUCTS"). NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT
THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT
AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND
ITS AFFILIATES (COLLECTIVELY, "SAMSUNG") ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT
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WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS
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SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS
WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR
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Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar
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application, or any governmental procurement to which special terms or provisions may apply.
This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand
names, trademarks and registered trademarks belong to their respective owners. For updates or additional
information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at
www.artik.io.
Copyright © 2018 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
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Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis,
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