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Normal use of our High Temperature Masking Tape is for
masking or protective applications on printed circuit boards
not exceeding temperatures of 150°C (302°F) at a duration
under 45 minutes. If the tape is used for masking operations
or temporary protection, it should not be left on the product
for more than 24 hours. For best results, the tape should
not be exposed to ultraviolet rays or high temperature for
prolonged periods of time (beyond manufacturer’s specs).
This tape is non-staining under normal use as described
above.
Applications for High-Temp Masking Tape
• Silk screening applications
• Masking application in spray and brush painting,
non-staining
• Protective purposes in manufac turing processes, strips
clean
• For securing polyethylene sheeting to walls during painting
• For OEM repair shops
• Use in applications masking PCBs gold features for wave
soldering or soldering under 302°F (150°C)
• For best results, apply to board using a rubber roller.
• Thick conductive adhesive excellent for conformability to
protect critical PCB features
• Easily handles high temperatures of wave soldering
without leaving significant residue
• Handles temperatures found in test and burn-in ovens
Wescorp ESD High Temp Polyimide Tape
Technical Information for ESD High Temp Polyimide
Tape
Removal leaves little or no residue
Adhesive surface resistance: 1 x 102 to < 1 x 105 ohms per
ANI/ESD STM11.11
Max Temperature: 572°F (300°C) 10 seconds
Adhesive Strength: 1 N/cm (DIN), 5 oz/inch2 (ASTM)
Polyimide Film (DuPont’s Kapton® or equivalent)
Film Thickness: 1.0 mil (0.001") (0.0254 mm)
Conductive Silicone Adhesive
Overall Thickness: 1.4 mil (0.0014" (0.0356 mm)
Total Thickness: 2.4 mil (0.0024") (0.060 mm)
Color: Brown Opaque
Tensile Strength: 50 N/cm (DIN), 28 lbs/in2 (ASTM)
Elongation: 70% (DIN & ASTM)
Static Charge Generation (300 mm/min):
Removal from Core (23°C, 50% RH):
5 volts, Internal Test Method
Removal from stainless steel (50% RH):
5 volts, Internal Test Method
Passed flammability per NASA STD 6001, Test 1 and
Hypergol ignition and penetration testing for casual contact
per MTB-175-88
For best results, apply to board using a rubber roller.
Applications for High-Temp Polyimide Tape
• Ideal for masking gold leads and other components
on boards populated with sensitive integrated
circuits
• Thick conductive adhesive excellent for conformability to
protect critical PCB features
• Near zero voltage generation when tape unrolled from
roll [at 50% relative humidity]
• Near zero voltage generation when tape removed from
PCB [at 50% relative humidity]
• Masking off PCBs for IR reflow ovens or wave soldering
under 572°F (300°C) ~ 10 seconds
Note: ESD High Temp Polymide Tape with conductive
acrylic, adhesive (silicone free) is available as a special
order.
Applications for Aisle Marking Tape
• Use to mark off floors designating ESD Protective Areas
• Can be used as area signs
• Note: Aisle marking Tape has no ESD control properties
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Employee Owned
DESCO INDUSTRIES INC • 3651 Walnut Avenue, Chino, CA 91710 • (909) 627-8178 • Web Site: DescoIndustries.com