BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
µµ
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PC2749TB
3 V, SUPER MINIMOLD SILICON MMIC
AMPLIFIER FOR MOBILE COMMUNICATIONS
DATA SHEET
The mark shows major revised points.
Document No. P13489EJ3V0DS00 (3rd edition)
Date Published March 2001 N CP(K)
DESCRIPTION
The
µ
PC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. Due to
wideband response at 2.9 GHz, this IC is recommendable for GPS receiver, wireless communication systems.
This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Supply voltage : VCC = 2.7 to 3.3 V
• Circuit current : ICC = 6.0 mA TYP. @VCC = 3.0 V
• Noise figure : NF = 4.0 dB TYP. @f = 1.9 GHz
• Power gain : GP = 16.0 dB TYP. @f = 1.9 GHz
• Saturated output power : PO(sat) = −6.0 dBm TYP. @f = 1.9 GHz
• Upper limit operating frequency : fu = 2.9 GHz TYP. @3 dB down below from gain at f = 0.9 GHz
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• GPS receiver
• Wireless LAN
ORDERING INFORMATION
Part Number Package Marking Supplying Form
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PC2749TB-E3 6-pin super minimold C1U • Embossed tape 8 mm wide
• 1, 2, 3 pins face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
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PC2749TB-A
Caution Electro-static sensitive devices
DISCONTINUED
Data Sheet P13489EJ3V0DS
2
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PC2749TB
PIN CONNECTIONS
Pin No. Pin Name
1 INPUT
2GND
3GND
4OUTPUT
5GND
3
2
1
4
C1U
(Top View)
5
6
4
5
6
3
(Bottom View)
2
1
6V
CC
PRODUCT LINE-UP (TA = +25°C, VCC = 3.0 V, ZS = ZL = 50 Ω
ΩΩ
Ω)
Part No. fu
(GHz)
PO(sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA) Package Marking
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PC2749T 6-pin minimold
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PC2749TB
2.9 −6.0 16 4.0 6.0
6-pin super minimold
C1U
µ
PC2745T 6-pin minimold
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PC2745TB
2.7 −1.0 12 6.0 7.5
6-pin super minimold
C1Q
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PC2746T 6-pin minimold
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PC2746TB
1.5 0 19 4.0 7.5
6-pin super minimold
C1R
µ
PC2747T 6-pin minimold
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PC2747TB
1.8 −7.0 12 3.3 5.0
6-pin super minimold
C1S
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PC2748T 6-pin minimold
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PC2748TB
0.2 to 1.5 −3.5 19 2.8 6.0
6-pin super minimold
C1T
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Caution The package size distinguishes between minimold and super minimold.
DISCONTINUED
Data Sheet P13489EJ3V0DS 3
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µµ
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PC2749TB
SYSTEM APPLICATION EXAMPLE
EXAMPLE OF GPS RECEIVER
B.P.F. B.P.F. IF Filter
PLL
PC2749TB PC2749TB
VCO
Loop Filter
Pre Amp. Unit RF Unit
RF Amp. Mixer
LNA
IF Amp.
µµ
: PC2749TB applicable
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DISCONTINUED
Data Sheet P13489EJ3V0DS
4
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PC2749TB
PIN EXPLANATION
Pin
No. Pin Name Applied
Voltage (V)
Pin
Voltage
(V)Note Function and Applications Internal Equivalent Circuit
1 INPUT – 0.82 Signal input pin. A internal
matching circuit, configured
with resistors, enables 50 Ω
connection over a wide band.
This pin must be coupled to
signal source with capacitor
for DC cut.
2
3
5
GND 0 – Ground pin. This pin should
be connected to system
ground with minimum
inductance. Ground pattern
on the board should be
formed as wide as possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.
4 OUTPUT – 2.87 Signal output pin. A internal
matching circuit, configured
with resistors, enables 50 Ω
connection over a wide band.
This pin must be coupled to
next stage with capacitor for
DC cut.
6V
CC 2.7 to 3.3 – Power supply pin. This pin
should be externally equipped
with bypass capacity to
minimize ground impedance.
6
4
1
23 5
Note Pin voltage is measured at VCC = 3.0 V.
DISCONTINUED
Data Sheet P13489EJ3V0DS 5
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PC2749TB
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Ratings Unit
Supply Voltage VCC TA = +25°C4.0V
Circuit Current ICC TA = +25°C15mA
Power Dissipation PDMounted on double-sided copper clad
50 × 50 × 1.6 mm epoxy glass PWB,
TA = +85°C
270 mW
Operating Ambient Temperature TA−40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Input Power Pin TA = +25°C0dBm
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 2.7 3.0 3.3 V
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25°C, VCC = 3.0 V, ZS = ZL = 50 Ω
ΩΩ
Ω)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current ICC No Signal 4.0 6.0 8.0 mA
Power Gain GPf = 1.9 GHz 13.0 16.0 18.5 dB
Saturated Output Power PO(sat) f = 1.9 GHz, Pin = –6 dBm –9.0 –6.0 –dBm
Noise Figure NF f = 1.9 GHz –4.0 5.5 dB
Upper Limit Operating
Frequency
fu3 dB down below flat gain at
f = 0.9 GHz
2.5 2.9 –GHz
Isolation ISL f = 1.9 GHz 25 30 –dB
Input Return Loss RLin f = 1.9 GHz 7 10 –dB
Output Return Loss RLout f = 1.9 GHz 9.5 12.5 –dB
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VCC = 3.0 V, ZS = ZL = 50 Ω
ΩΩ
Ω)
Parameter Symbol Test Conditions Reference Value Unit
Power Gain GPf = 0.9 GHz 14.5 dB
Noise Figure NF f = 0.9 GHz 3.2 dB
3rd Order Intermodulation
Distortion
IM3PO(each) = –20 dBm
f1 = 1.900 GHz, f2 = 1.902 GHz
–33 dBc
Gain 1 dB Compression Output
Power
PO(1 dB) f = 1.9 GHz –12.5 dBm
DISCONTINUED
Data Sheet P13489EJ3V0DS
6
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PC2749TB
TEST CIRCUIT
VCC
1 000 pF
1 000 pF
C1
C3
50Ω
IN
6
1
2, 3, 5
4C250Ω
1 000 pF
OUT
EXAMPLE OF APPLICATION CIRCUIT
1 000 pF
1 000 pF
C
4
C
5
50Ω
IN
6
1
2, 3, 5
4C
2
50Ω
1 000 pF
OUT
6
1
2, 3, 5
4
C
1
C
3
1 000 pF
V
CC
1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output
pins.
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
To get a flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF
capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 πfZs).]
DISCONTINUED
Data Sheet P13489EJ3V0DS 7
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PC2749TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
IN OUT
C
VCC
C1U
321
456
AMP-2
CC
Top View
Mounting Direction
Notes
1.
2.
3.
4.
30 × 30 × 0.4 mm double-sided copper clad polyimide board.
Back side: GND pattern
Solder plated on pattern
: Through holes
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).
COMPONENT LIST
Value
C 1 000 pF
DISCONTINUED
Data Sheet P13489EJ3V0DS
8
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µµ
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PC2749TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C)
No signal
V
CC
= 3.0 V
V
CC
= 3.0 V
CIRCUIT CURRENT vs. SUPPLY VOLTAGE CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
POWER GAIN vs. FREQUENCY POWER GAIN vs. FREQUENCY
Circuit Current I
CC
(mA)
Circuit Current I
CC
(mA)
Power Gain G
P
(dB)
Power Gain G
P
(dB)
Supply Voltage V
CC
(V) Operating Ambient Temperature T
A
(°C)
Frequency f (GHz)
NOISE FIGURE vs. FREQUENCY
0.1 0.3 1.0 3.0
1
2
3
4
5
6
Noise Figure NF (dB)
Frequency f (GHz)
Frequency f (GHz)
10
8
6
4
2
0
10
8
6
4
2
001234 – 60 – 40 – 20 0 +20 +40 +60 +80 +100
25
20
15
10
5
0
0.1 0.3 1.0 3.0
25
20
15
10
5
0
0.1 1.00.3 3.0
V
CC
= 3.3 V
V
CC
= 3.0 V
V
CC
= 2.7 V
V
CC
= 3.3 V
V
CC
= 3.0 V
V
CC
= 2.7 V
T
A
= +85°C
T
A
= – 40°C
T
A
= +25°C
No signal
DISCONTINUED
Data Sheet P13489EJ3V0DS 9
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PC2749TB
P
in
= –6 dBm
f = 1.9 GHz
V
CC
= 3.0 V
V
CC
= 3.0 VV
CC
= 3.0 V
f = 1.9 GHz
0.1 0.3 1.0 3.0
0
–10
–20
–30
–40
–50
0
–10
–20
–30
–40
–50
0.1 0.3 1.0 3.0
0
– 5
–10
–15
–20
–25
0.1 0.3 1.0 3.0
–50
–40
–30
–20
–10
0
–45
–35
–25
–15
– 5
–30 –28 –26 –24 –22 –20 –18 –16 –14 –12 –10
3rd Order Intermodulation Distortion IM3 (dBc)
Output Power of Each Tone P
O(each)
(dBm)
ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY
OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER
Isolation ISL (dB)
Output Power Pout (dBm)
Input Return Loss RL
in
(dB)
Output Return Loss RL
out
(dB)
Output Power Pout (dBm)
Frequency f (GHz) Frequency f (GHz)
Input Power P
in
(dBm)
SATURATED OUTPUT POWER vs.
FREQUENCY
Saturated Output Power PO(sat) (dBm)
Frequency f (GHz)
3RD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
Input Power P
in
(dBm)
0
– 5
–10
–15
–20
–25
–30
0
– 5
–10
–15
–20
–25
–30
–40 –35 –30 –25 –20 –15 –10 –50 –40 –35 –30 –25 –20 –15 –10 –50
V
CC
= 3.3 V
V
CC
= 3.0 V
V
CC
= 2.7 V
RL
out
RL
in
V
CC
= 3.3 V
V
CC
= 3.0 V
V
CC
= 2.7 V
V
CC
= 3.3 V
V
CC
= 3.0 V
V
CC
= 2.7 V
T
A
= +85°C
T
A
= +85°C
T
A
= –40°C
T
A
= –40°C
T
A
= +25°C
T
A
= +25°C
f
1
= 1.900 GHz
f
2
= 1.902 GHz
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet P13489EJ3V0DS
10
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PC2749TB
S-PARAMETERS (TA = +25°C, VCC = 3.0 V)
S11-FREQUENCY
0.1 G
1.0 G
3.0 G
2.0 G
S22-FREQUENCY
0.1 G
3.0 G
1.0 G
2.0 G
DISCONTINUED
Data Sheet P13489EJ3V0DS 11
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PC2749TB
TYPICAL S-PARAMETER VALUES (TA = +25°C)
VCC = 3.0 V, ICC = 6.5 mA
FREQUENCY S11 S21 S12 S22 K
MHz MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
100.0000 0.021 13.0 4.096 –1.9 0.002 –1.1 0.024 165.8 66.82
200.0000 0.038 –30.5 4.216 –7.8 0.001 75.4 0.033 113.6 129.26
300.0000 0.034 –71.8 4.282 –15.5 0.001 141.5 0.064 96.1 90.16
400.0000 0.052 –120.5 4.403 –21.0 0.002 129.9 0.080 87.9 45.30
500.0000 0.062 –149.9 4.390 –26.6 0.002 134.1 0.103 76.9 57.58
600.0000 0.079 –169.7 4.399 –31.6 0.003 128.3 0.127 68.6 34.08
700.0000 0.097 173.6 4.566 –36.7 0.005 132.9 0.151 60.6 22.08
800.0000 0.116 160.5 4.667 –41.3 0.007 131.5 0.174 53.7 14.70
900.0000 0.134 149.3 4.843 –46.8 0.008 129.3 0.197 44.9 12.29
1000.0000 0.156 138.8 5.016 –52.6 0.009 124.6 0.220 36.1 10.00
1100.0000 0.178 128.5 5.305 –60.3 0.014 131.4 0.240 28.0 6.15
1200.0000 0.195 118.7 5.660 –67.1 0.016 122.5 0.262 17.3 5.13
1300.0000 0.214 108.7 5.835 –76.2 0.020 118.6 0.279 8.6 3.80
1400.0000 0.229 99.5 6.148 –84.5 0.022 114.4 0.287 –2.0 3.23
1500.0000 0.249 89.4 6.364 –93.8 0.025 107.7 0.294 –13.5 2.72
1600.0000 0.259 79.9 6.611 –103.6 0.028 104.3 0.294 –23.6 2.35
1700.0000 0.264 69.8 6.577 –113.5 0.032 96.8 0.283 –33.8 2.09
1800.0000 0.259 60.3 6.549 –123.4 0.034 91.8 0.272 –44.1 1.99
1900.0000 0.248 50.9 6.407 –132.9 0.036 83.3 0.256 –53.8 1.97
2000.0000 0.238 43.6 6.321 –140.8 0.037 78.5 0.234 –61.4 1.99
2100.0000 0.218 35.9 6.046 –148.8 0.038 75.1 0.213 –69.5 2.04
2200.0000 0.204 30.1 5.862 –156.5 0.039 70.4 0.193 –73.8 2.08
2300.0000 0.183 25.3 5.696 –163.2 0.040 68.3 0.174 –79.5 2.15
2400.0000 0.156 21.2 5.430 –170.5 0.041 60.7 0.164 –84.1 2.25
2500.0000 0.140 18.8 5.282 –176.3 0.042 61.6 0.152 –82.1 2.25
2600.0000 0.119 18.7 5.013 177.2 0.040 58.1 0.142 –84.5 2.53
2700.0000 0.095 21.2 4.849 170.9 0.042 55.1 0.146 –85.5 2.46
2800.0000 0.078 30.0 4.596 164.9 0.042 51.9 0.149 –83.9 2.62
2900.0000 0.066 44.5 4.446 158.1 0.042 44.7 0.154 –91.8 2.70
3000.0000 0.070 66.0 4.163 152.3 0.044 41.9 0.171 –92.8 2.73
3100.0000 0.082 78.1 3.966 145.3 0.042 37.1 0.181 –99.6 2.97
DISCONTINUED
Data Sheet P13489EJ3V0DS
12
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PC2749TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
0.9±0.1
0.7
0 to 0.1
0.15
+0.1
– 0.05
2.0±0.2
1.3
0.650.65
0.2
+0.1
– 0.05
2.1±0.1
1.25±0.1
0.1 MIN.
DISCONTINUED
Data Sheet P13489EJ3V0DS 13
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PC2749TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Soldering Conditions Recommended Condition Symbol
Infrared Reflow Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: NoneNote
IR35-00-3
VPS Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: NoneNote
VP15-00-3
Wave Soldering Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
WS60-00-1
Partial Heating Pin temperature: 300°C or below
Time: 3 seconds or less (per side of device)
Exposure limit: NoneNote
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
DISCONTINUED
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DISCONTINUED
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